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Preliminary Edition 2015 Microchip Technology Inc. page 1 BM23 Bluetooth ® Evaluation Board User s Guide

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Page 1: BM23 Bluetooth Evaluation Board User s Guideww1.microchip.com/downloads/en/DeviceDoc/BM23SPK... · BM23 BLUETOOTH EVALUTATION BOARD USER’S GUIDE 2015 Microchip Technology Inc. Preliminary

Preliminary Edition 2015 Microchip Technology Inc. page 1

BM23 Bluetooth®

Evaluation Board User’s Guide

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BM23 BLUETOOTH

EVALUTATION BOARD USER’S GUIDE

Preliminary Edition 2015 Microchip Technology Inc. page 2

Index

Preface ........................................................................................................................................ 4

1 OVERVIEW .............................................................................................................................. 6

1.1 INTRODUCTION................................................................................................................................................ 6 1.2 BM23 EVALUATION BOARD FEATURES ........................................................................................................ 7 1.3 BM23 EVALUATION BOARD CONTENTS ........................................................................................................ 8 1.4 BM23 EVB KIT CONTENTS ............................................................................................................................ 10

2. Getting Started ..................................................................................................................... 11

2.1 INTRODUCTION.............................................................................................................................................. 11 2.2 HARDWARE REQUIREMENTS ...................................................................................................................... 11

2.2.1 Hardware Setup ................................................................................................................. 11

2.2.2 Using Evaluation Board .................................................................................................... 11

2.3 APPLICATION DEMONSTRATION ................................................................................................................. 11 2.3.1 AUDIO DEMONSTRATION (A2DP) ............................................................................. 11

2.3.2 HSP/HFP DEMONSTRATION ........................................................................................ 13

2.4 SOFTWARE CUSTOMIZATION .................................................................................................................... 14 2.4.1 UI Tool .............................................................................................................................. 14

2.4.2 DSP TOOL ........................................................................................................................ 19

2.4.4 EEPROM Parameters Update ........................................................................................... 27

2.5 MODULE CONFIGURATION ........................................................................................................................... 29

APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS ....................................... 30

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Preliminary Edition 2015 Microchip Technology Inc. page 3

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip

products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and

enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via

E-mail at [email protected]. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.

Customer Notification System

Register on our web site at www.microchip.com to receive the most current information on all of our products.

Abbreviations List: AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile HFP: Hands-free Profile HSP: Headset Profile NFC: Near Field Communication SPP: Serial Port Profile

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Preliminary Edition 2015 Microchip Technology Inc. page 4

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

INTRODUCTION

This chapter contains general information that will be useful to know before using the

BM23. Items discussed in this chapter include:

Document Layout

Recommended Reading

The Microchip Web Site

Customer Support

Document Revision History

DOCUMENT LAYOUT

This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. The document is organized as

follows:

Chapter 1. “Overview” – This chapter introduces the BM23 Bluetooth Evaluation Board and provides an

overview of various features.

Chapter 2. “Getting Started” – This chapter describes

The hardware components and setup of the BM23 Bluetooth Evaluation Board.

The application demonstrations of the BM23 Bluetooth Evaluation Board.

Software/Utility Requirements of the BM23 Bluetooth Evaluation Board.

Appendix A. “BM23 Audio Evaluation Board Schematics” – This appendix includes a schematic of the

BM23 Bluetooth Evaluation Board.

RECOMMENDED READING

This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. Other useful documents are

listed below. The following Microchip documents are available and recommended as supplemental reference

resources:

STEREO Module Data Sheet (BM20/23 Data Sheet)

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MICROCHIP WEBSITE

Microchip provides online support via our web site at http://www.microchip.com. This website is used as a

means to make files and information easily available to the customers. Accessible by using your favorite

Internet browser, the website contains the following information:

Product Support – Data sheets and errata, application notes and sample programs, design resources,

user’s guides and hardware support documents, latest software releases and archived software

General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online

discussion groups, Microchip consultant programmer listing

Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of

seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

Distributor or Representative

Local Sales Office

Field Application Engineer (FAE)

Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.

Local sales offices are also available to help customers. A listing of sales offices and locations is included in

the back of this document. Technical support is available through the website at:

http://support.microchip.com

DOCUMENT REVISION HISTORY

Revision A (Aug 2015)

This is the initial released version of this document.

Revision 1.0 : Added details of V4 EVB

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1 OVERVIEW 1.1 INTRODUCTION This user’s guide describes the hardware and software setup for the BM23 Bluetooth

® Evaluation Board.

This board contains the hardware needed to evaluate the BM23 Bluetooth module. The BM23 module is

mounted to an evaluation board that demonstrates the module’s key features. The evaluation board contains:

PIC18 MCU and YAMAHA YDA174 DSP on board

12 push buttons to control audio playback

Status LEDs

The BM23 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP

A2DP stereo audio (Sink mode support for Sub-Band Coding (SBC)),

AVRCP media player remote control

HFP/HSP for accepting a phone call support.

For data sheet and other details related to BM23 module, refer to the Microchip website at

http://www.microchip.com/bm23.

This chapter discusses the following topics:

BM23 Evaluation Board Features

BM23 Evaluation Board Contents and Part Details

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1.2 BM23 EVALUATION BOARD FEATURES The BM23 Evaluation Board has the following features:

It includes a Bluetooth module (BM23), MCU (PIC18) and DSP (YDA174) on the board for easy

function and feature demonstration.

BM23 module is a fully qualified Bluetooth version 4.1, fully compatible with Bluetooth version 3.0, 2.0,

1.2.

Embedded BM23 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shielding

case)

Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP, Bluetooth SIG certified.

System gets power from 15V / 3A DC adapter for speaker application.

Environmentally friendly, RoHS compliant

Keypad matrix on board and controlled by MCU, easy for playback control (play/pause, Vol Up/Down,

forward/rewind, Next/previous track etc.).

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1.3 BM23 EVALUATION BOARD CONTENTS BM23 Evaluation Board contains the following components as shown in Figure 1-1 which describes the

evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation

board.

FIGURE 1-1: BM23 EVALUATION BOARD

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MIC (JP23) ICSP (J5)

Pin Description Pin Description

1 MIC_P1 1 Reset

2 AGND 2 ICD3 power

3 MIC_N1 3 GND

4 PGD

5 PGC

6 NC

TABLE 1-1:BM23 EVALUATION BOARD HARDWARE

Hardware Component Description

BM23 Bluetooth® 4.1 Module

YDA174 DSP with internal digital amplifier

PIC18F85J10 16 bit MCU with 32k byte flash and 2048 bytes SRAM.

MCP2200 UART-USB converter chip

Micro USB Connector USB to UART for EEPROM R/W for BM23.

15V Adapter Jack Connect to 15V adapter (P2) for main power source of whole system.

Amplifier Audio Out Audio connector (JP6 / 7) from YDA174

Audio In Audio 3.5 mm jack for Mono microphone input(P6) and AUX input(P8)

Status LEDs Red and Blue LEDs show the pairing/connection status

MFB Button Switch to turn on/off BM23 module (SW24)

Play/Pause Button Button to play or pause the audio playback (SW31)

Previous Track Button Button to skip track backwards (SW23)

Next Track Button Button to skip track forwards(SW45)

Volume Up Button Button to increase volume (SW27)

Volume Down Button Button to decrease volume (SW28)

Pairing Button Button to make BM23 into pairing mode (SW34)

Sound Effect Button Button to change sound effect (SW35)

Reset Button Reset BM23 (SW10); Reset MCU (SW1)

1 2 3 1 2 3 4 5 6

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1.4 BM23 EVB KIT CONTENTS BM23 EVB kit include: BM23 EVB board, 15V adapter, micro USB cable and 2 speaker cables as shown in

Figure 1-2.

FIGURE 1-2: BM23 EVB KIT

1) 15V adapter: main power source of the whole system.

2) USB cable: micro USB cable can connect to P3 of BM23 EVB board to do firmware update on

BM23.

3) Speaker cable: connect speaker to BM23 EVB J6 and J7.

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2. Getting Started 2.1 INTRODUCTION This chapter describes how the BM23 Evaluation Board works. Certain hardware and utilities are essential to

support the evaluation/development of demo applications. This chapter discusses the following topics:

Hardware Requirements

Software/Utility Requirements

Module Configuration

2.2 HARDWARE REQUIREMENTS

2.2.1 Hardware Setup To setup the evaluation hardware, perform the following steps:

1. Make sure pin 1 / 2 / 3 of “SW9” in “Off / Off / On” to make system in application mode.

2. Connect the speaker line to the amplifier output connector (J6 / 7).

2.2.2 Using Evaluation Board 1. Connect 15V adapter P2.

2. Connect speaker to J6 and J7.

3. Long press MFB button (SW24) to turn-on and enter pairing mode. The status LEDs will blink.

4. Press and hold Pairing button (SW34). Blue and Red LED will flash alternately. Release the Pairing

button. Now the BM23 Evaluation board is discoverable.

5. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device will

display a list of discoverable Bluetooth devices. Select the BM23-002 EVB and connect with it.

6. If the pairing with the device is successful, BM23 evaluation board is connect to the host device.

Once connected, BM23 evaluation board enables Advanced Audio Distribution Profile (A2DP) for

audio playback and Audio Video Remote Control Profile (AVRCP) for player control.

7. Play music and the host device and listen the music on the speaker. This will demonstrate A2DP.

8. If host device is cell phone, call you cell phone from another phone. Accept the incoming phone call

on your paired and connected cell phone. This will demonstrate HFP.

2.3 APPLICATION DEMONSTRATION

2.3.1 AUDIO DEMONSTRATION (A2DP) In this demonstration, user can play an audio stream on both BM23 evaluation boards using a computer or

smartphone. The following are the steps to perform the demonstration.

1. Connect BM23 evaluation board to a host device (PC or smartphone) that has an audio source.

2. Connect speakers to BM23 evaluation board J6 / 7.

3. Open the audio source on the host device. Microchip recommends using media player (e.g. Microsoft

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Media Player, iTunes, and Android).

4. Start the audio stream on the media player.

When BM23 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the

following audio control buttons can be used:

Control the volume of audio output (Vol+ (SW27), Vol- (SW28)).

Go to the previous track(SW23)

Go to the next track(SW45)

Start / stop playing the current track (SW31).

FIGURE 1-2: BM23 EVALUATION BOARD AUDIO CONTROL BUTTONS

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2.3.2 HSP/HFP DEMONSTRATION In this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a

paired smartphone. This demonstration requires a microphone. It would be good to use a PC

headset/microphone (with two-plugs). The following are the steps to perform the demonstration.

1. Connect the speakers / microphone to BM23 evaluation board’s audio out connector (J6/7) and MIC

input (P6) respectively.

2. Connect BM23 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetooth

profiles.

3. From another one phone, initiate a call to the smartphone that is paired with BM23 evaluation board. The

A2DP stream pauses and the ringtone plays on the speakers.

4. Click button “MFB” on BM23 evaluation board to accept the incoming call.

5. Once phone call is terminated, A2DP stream resumes.

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2.4 SOFTWARE CUSTOMIZATION User can customized UI and DSP settings according to their requirements. These settings can then be merged along with patch code to create IISC patch file (*.ipf). This patch file then programmed into EEPROM. Process of patch file creation is given below. Tools needed for customization

UI Tool: user can use this tool to create customize Bluetooth behavior like button functionality, Bluetooth name etc.

DSP Tool: user can use this tool to modify audio parameter.

MPET Tool: user can use this tool to merge UI, DSP and patch code. Details about Patch code will be provided latter section.

EEPROM Tool: user can use this tool to upgrade the merged parameter into EEPROM of BM23.

All these tools can be obtained from www.microchip.com/bm23 or through FAE.

2.4.1 UI Tool Step1. Open UI tool

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Step2. Load appropriate default UI setting (included in UI tool package) or previous saved file.

Step3. Click “Edit” to modify the settings.

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Step4. In the main settings, profile can be enabled/disabled by checking/unchecking the box as shown below.

Click “Next” for other setting.

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Step5. You can do system and functional setting in these pages.

Click “Help” you can get more detail information.

Step6. After finish parameter selection, click “Finish” button and a message will remind you check EEPROM

size on your system.

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Step7. Click “Save” button to save these UI parameters as a “.txt” file

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2.4.2 DSP TOOL Step1. Open DSP tool

Step2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2023S-002)

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Step3. You can setup all voice and audio function in these pages.

Step4. Click “Save” button to save these DSP parameters as a “.txt” file after finish all DSP

setting.

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2.4.3 MERGE TOOL Step1. Open MPET tool, click “Next” to set up.

Step2. Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.

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Step3. Select the bin file (full EEPROM table) and click “Next”

Step4. If the bin file includes UI/DSP/patch code, you can see them as shown in the above figure. If you want to keep any one of them in your customization, you can select that and use “pull down” button (2) to add them to merge list. For adding customized parameters, you can use add button (+) (3) to add new parameters (e.g. UI/DSP parameters), into tool to merge with EEPROM table.

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Step5. Select output path and choose a file name for the merged EEPROM table.

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Step6. Click “Next” and choose Merge Default Bin to Patch (Patch File, *.ipf) as shown in the following picture and then Click “Next”. “Generate” button to generate the new EEPROM table.

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Step7. Click Generate button

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Step8. Select all as shown below and then click Next.

Step9. Now you have a merged patch file (*.ipf file).

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2.4.4 EEPROM Parameters Update

Step1. Make sure SW9 in “ROM TEST” mode. Mode switch (1/2/3 – on/off/on) Step2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting. Step3. Run the E2PROM_tool.exe program and a window will be come up as below

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Step4. Specify the COM Port (1). Click IC/Module (2) Identify to know IC version of BM23. This is useful to

prevent IC version mismatch.

Step5. Press ”Browse” (3) to choose the *.ipf file (created in section 2.4.3) and click Write(4)

Step6. After data update is completed, remove USB cable and make SW9 to “ROM APP”(mode Switch 1/2/3 off/off/on) mode and power cycle.

EVB will be using new setting from EEPROM. Follow section 2.0 to see the effect of parameter

customization.

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2.5 MODULE CONFIGURATION

2.5.1 Mode Settings Setting in Mode Switch:

Mode SW9 Setting Switch 9 PIN Definition

ROM Test Mode

1: ON (P2_0: LOW) 2: OFF (P2_4: HIGH) 3: ON (EAN: HIGH)

Application Mode

1: OFF (P2_0: HIGH) 2: OFF (P2_4: HIGH) 3: ON (EAN: HIGH)

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APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS EVB block diagram

Key Button Matrix:

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MIC

_P

1

MIC1

C20

2.2

u/6

.3V

R11

1K

12

R13

1K

12

C22

2.2

u/6

.3V

MIC

_B

IAS

JP

23

JP

1x3

1 2 3C

27

220p/5

0V

R14

2K

12

C29

0.1

u/1

0V

C28

0.1

u/1

0V

P6

PJ-2

001-5

K

123 45

P2_0

EA

N

P2_4

RS

T_N

P1_5

P3_0

BA

T_IN

P0_0

C5

10u/1

6V

GD

S

Q1

STS

2301

13

2

5V

R6

1K

/1%

1 2

BA

T_IN

R119

20K

1 2

Break +3.3V to BAT_IN trace

When 5V insert.

AIL

MIC

_N

1M

IC_P

1

C59

10u/1

6V

CO

DE

C_V

O

C2

0.1

u/1

0V

C52

1u/1

6V

R29

1K

1 2

5V

SY

S_P

WR

RS

T_N

AIR P

1_5

C54

4.7

u/1

0V

MIC

_B

IAS

3V

3

VD

D_IO

SY

S_P

WRM

FB

RF

S0

SC

LK

0D

R0

DT0

PC

B1

FP

-BM

23

P0_0

1

RF

S0

2

TF

S0

3

SLK

04

DR

05

DT0

6

P0_4

7

EA

N8

MIC

1_P

9

MIC

1_N

10

MIC

_B

IAS

11

VD

DA

12

AIR

13

AIL

14

GN

D15

SYS_PWR25AMB_DET24BAT_IN23ADAP_IN22P0_121P1_520VDD_IO19NC18NC17RST16

GN

D40

P2_0

39

P3_0

38

P2_0

37

P2_7

36

P0_5

35

HC

I_R

XD

34

HC

I_TXD

33

P0_3

32

P0_2

31

P2_4

30

LE

D2

29

LE

D1

28

MF

B27

BK

_O

UT

26

TF

S0

JP

11

JP

1x21 2

DGND

HC

I_TXD

HC

I_R

XD

P3_0

LE

D2

LE

D1

F2

Footing

1

F4

Footing

1

F3

Footing

1

F1

Footing

1

Boar

d Na

me

Size

Title

Rev

Date

:Sh

eet

of

P/N

MA

IN C

IRC

UIT

4.0

BM

23 E

VB

B

48

Thurs

day

, O

cto

ber

01,

2015

0360

5F, N

o.5,

Indu

stry

E. R

d. V

II, H

sinc

hu S

cien

ce P

ark,

Hsin

chu C

ity

30078,

Taiw

an

TE

L.

886-3

-5778385

U7

G691L293

GN

D1

RS

T2

VC

C3

R64

1K

12

RESET

RS

T_N

SW

10

TS

08M

-PF

21

VD

D_IO

LED2

LED1

LE

D2

C7

0.1

u/1

0V

LE

D2

LE

D-H

R1

2

LE

D1

LE

D-B

12

LED3

SY

S_P

WR

LE

D1

LE

D3

LE

D-G

12

P2_4

C50

1u/1

6V

C38

1u/1

6V

R36

NP

-0402

R38 0

12 R

37

NP

-0402

R32 0

12

C51

NP

-0402

AIR

C47

NP

-0402

P3_0

AIL

LIN

E_L

LIN

E_R

LINE

INP

UT

C26

0.1

u/1

0V

P8

TS

H-3

865D

43 210

1

MIC

_N

1

Page 32: BM23 Bluetooth Evaluation Board User s Guideww1.microchip.com/downloads/en/DeviceDoc/BM23SPK... · BM23 BLUETOOTH EVALUTATION BOARD USER’S GUIDE 2015 Microchip Technology Inc. Preliminary

BM23 BLUETOOTH

EVALUTATION BOARD USER’S GUIDE

Preliminary Edition 2015 Microchip Technology Inc. page 32

VD

D_

IO

ON

SW

9

SW

-3B

IT

123

456

R9

4K

7

1 2

R8

4K

7

1 2

R7

10

12

EA

NP

2_4

P2_0

C1

21

u/1

6V

C1

81

0u

/16

V

VBUS

D-

D+

ID

GND

P3

UC

B0

2S

B3

021

-99

R 1 2 3 4 5

68 97

10 11

R6

91K

1 2

5V

D-

D+

D1

LE

D-H

R

1 2

D1

8

CD

SU

40

0B

12

Bo

ard

Na

me

Siz

eT

itle

Re

v

Da

te:

Sheet

of

P/N

HC

I IN

TE

RF

AC

E4

.0

BM

23 E

VB

A

58

We

dn

esd

ay

, Ju

ly 2

2,

20

15

0360

5F

, N

o.5

, In

dustr

y E

. R

d. V

II, H

sin

chu S

cie

nce P

ark

,

Hsin

ch

u C

ity

30

07

8,

Ta

iwa

nT

EL

.

88

6-3

-57

78

38

5

D-

D+

EXT

_3

V3

TX

RX

C1

91

2p

/50

V

C2

11

2p

/50

V

C2

40

.1u

/16

V

U1

0M

CP

22

00

VD

D1

OS

C1

2

OS

C2

3

RS

T4

GP

7/T

xL

ED

5

GP

6/R

xL

ED

6

GP

57

GP

48

GP

39

TX

10

RT

S11

RX

12

CT

S13

GP

214

GP

1/U

SB

CF

G15

GP

0/S

SP

ND

16

VU

SB

17

D-

18

D+

19

VS

S20

C6

20

.1u

/16

V

X1

X4

P-1

2M

HZ

4 13 2

R9

13K

12

R9

23K

12

HC

I_TX

D

HC

I_R

XD

EXT

_3

V3

5V

C2

30

.1u

/16

V

R2

010K

1 2

RS

T_

N

R2

1470

12

Page 33: BM23 Bluetooth Evaluation Board User s Guideww1.microchip.com/downloads/en/DeviceDoc/BM23SPK... · BM23 BLUETOOTH EVALUTATION BOARD USER’S GUIDE 2015 Microchip Technology Inc. Preliminary

BM23 BLUETOOTH

EVALUTATION BOARD USER’S GUIDE

Preliminary Edition 2015 Microchip Technology Inc. page 33

TP

11

TP

21

TP

31

TP

41

TP

51

TP

61

TP

71

TP

81

TP

91

TP

101

TP

111

TP

121

J6

HD

R 1

x2

1 2

U18

MC

P1824T

VIN

1

SH

DN

3A

DJ

4

VO

UT

5

GN

D2

J7

HD

R 1

x2

1 2

R124

3K

/1%

1 2

R125

10K

1 2 (0.41V)

(RT9179

pin compatible)

DS

P/M

CU

IN

TE

RF

AC

E

U17

AP

L1117-3

3V

C

ADJ/GND1

OUT2

IN3

3V

3

C15

10u/1

6V

C16

10u/1

6V

C14

10u/1

6V

C17

10u/1

6V

1V

8

G

G

X2

XTL571300-L

118-0

45

41

32

SLK

0_D

SP

DT0_D

SP

1V

8

C10

1u/5

0V

DS

P_IC

_N

OU

TM

L

R93

100K

1 2

C96

0.1

u/1

6V

R4

47K

1 2

C97

1u/5

0V

1V

8

1V

8

OU

TP

L

3V

3D

SP

_S

LE

EP

C98

0.1

u/1

6V

C6

1u/1

6V

R94

1M

1 2

R95

220

12

DS

P_P

RO

T_N

R15

4K

71 2

R97

4K

7

1 2

3V

3

DS

P_P

1_2

3V

3

C100

10u/1

6V

DC

_A

MP

DS

P_P

1_3

3V

3

C11

0.1

u/1

6V

DS

P_IR

Q_N

OU

TP

R

C101

10p/5

0V

C102

10p/5

0V

3V

3

R99

47K

1 2

3V

3

C1

0.1

u/1

6V

R100

47K

1 2

DS

P_M

UTE

C103

0.1

u/1

6V

OU

TM

R

P2

DC

-JA

CK

1 2 3

DGND

3V

3

YDA174A30

U2

YD

A174A

30

DV

DD

18

1

GP

IO6

2

GP

IO5

3

GP

IO4

4

GP

IO3

5

DV

SS

6

GP

IO2

7

GP

IO1

8

GP

IO0

9

PLLV

DD

10

IC_N

11

PLLV

SS

12

XIN13

XOUT14

IOVDD15

SCL16

SDA17

DVDD1818

IRQ_N19

OPEN20

PROT_N21

SLEEP_N22

MUTE_N23

TESTr24

OP

EN

36

PV

DD

PL

35

OU

TP

L34

PV

SS

L33

OU

TM

L32

PV

DD

ML

31

PV

DD

MR

30

OU

TM

R29

PV

SS

R28

OU

TP

R27

PV

DD

PR

26

OP

EN

25

EP49

GPIO748

IOVDD47

GPIO846

GPIO945

GPIO1044

GPIO1143

TESTb42

DVSS41

OPEN40

DVSS39

REFA38

AVSS37

R12

100K

1 2

DC

_A

MP

RF

S0_D

SP

+

C32

1000u/5

0V

1 2

DC

_A

MP

(15V)

OU

TM

L

OU

TP

L

SP

KO

UT

C25

0.1

u/5

0V

C106

0.1

u/5

0V

C107

0.2

2u/1

6V

C134

1u/5

0V

DC

_A

MP

C8

1u/5

0V DC

_A

MP

I2S

IN

TE

RF

AC

E

DT0_D

SP

RF

S0_D

SP

SLK

0_D

SP

DR

0_D

SP

R17

33

12

R118

33

12

TF

S0_D

SP

R22

33

12

R18

33

12

R19

33

12

Board

Nam

e

Siz

eTitle

Rev

Date

:S

heet

of

P/N

DS

P_Y

DA

174

4.0

BM

23 E

VB

B

68

Wednesday

, July

22,

2015

0360

5F, N

o.5,

Indu

stry

E. R

d. V

II, H

sinc

hu S

cien

ce P

ark,

Hsin

chu C

ity

30078,

Taiw

an

TE

L.

886-3

-5778385

RF

S0

SC

LK

0TF

S0

DR

0D

T0

D15

CD

SL4148

21

D14

CD

SL4148

21

DC

_A

MP

D17

CD

SL4148

21

D16

CD

SL4148

21

L4

L22uH

12

L3

L22uH

12

DS

P_P

RO

T_N

DS

P_M

UTE

DS

P_S

LE

EP

DS

P_IR

Q_N

DS

P_IC

_N

DS

P_M

UTE

DS

P_S

LE

EP

DS

P_IC

_N

DS

P_P

1_3

DS

P_P

1_2

DS

P_P

1_2

DS

P_P

1_3

DS

P_P

RO

T_N

DS

P_IR

Q_N

C104

0.1

u/5

0V

C105

0.1

u/5

0V

C30

0.2

2u/1

6V

OU

TM

R

OU

TP

R

L6

L22uH

12

L5

L22uH

12

+

C133

1000u/5

0V

1 2

Page 34: BM23 Bluetooth Evaluation Board User s Guideww1.microchip.com/downloads/en/DeviceDoc/BM23SPK... · BM23 BLUETOOTH EVALUTATION BOARD USER’S GUIDE 2015 Microchip Technology Inc. Preliminary

BM23 BLUETOOTH

EVALUTATION BOARD USER’S GUIDE

Preliminary Edition 2015 Microchip Technology Inc. page 34

MC

U_

P7

0M

CU

_P

71

R1

22

3K

12

R1

23

3K

12

HC

I_R

XD

HC

I_TXD

G

D

SQ2

STS

23

06

312

R1

26

2K

1 2

R1

27

1K

1 25V

RS

T_

N

RS

T_

PIC

18

G

D

SQ3

STS

23

06

312

ICD

3_P

WR

RS

T_

N

R1

28

1K

1 2

(Reset PIC18 when connect to USB)

(Reset BT when connect to ICD3)

JP

33

JP

1x2 1

2

PG

D

RE

SE

T

3V

3

PG

C

J5

JP

1x6

1 2 3 4 5 6 ICSP

Boa

rd N

am

e

Siz

eTitle

Re

v

Da

te:

Sheet

of

P/N

MC

U_P

IC18

4.0

BM

23 E

VB

B

78

We

dn

esd

ay

, Ju

ly 2

2,

201

5

0360

5F, N

o.5,

Indu

stry

E. R

d. V

II, H

sinc

hu S

cien

ce P

ark,

Hsin

ch

u C

ity

300

78

, Ta

iwa

nTE

L.

8

86

-3-5

77

83

85

ICD

3_P

WR

C4

10p

/50V

(MFB/RX_IND)

(TX_IND)

(UART_TXD)

(UART_RXD)

C1

25

0.1

u/2

5V

C1

26

0.1

u/2

5V

X4

XTA

L-3

2.7

68

KH

Z

12

3

DP

1D

P-4

21

C1

14

15p

/50V

C1

20

15p

/50V

T1

OS

O

T1

OS

I

DP

2D

P-4

21

C3

10p

/50V

PIC18F85J10

U1

3

PIC

18F

85J1

0

RH

2/A

18

1

RH

3/A

19

2

RE

1/A

D9

/WR

/P2C

3

RE

0/A

D8

/RD

/P2D

4

RG

0/E

CC

P3/P

3A

5

RG

1/T

X2

/CK

26

RG

2/R

X2

/DT2

7

RG

3/C

CP

4/P

3D

8

MC

LR

9

RG

4/C

CP

5/P

1D

10

VS

S11

VD

DC

OR

E/V

CA

P12

RF

7/S

S1

13

RF

6/A

N1

114

RF

5/A

N1

0/C

VR

EF

15

RF

4/A

N9

16

RF

3/A

N8

17

RF

2/A

N7

/C1

OU

T18

RH

7/A

N1

5/P

1B

19

RH

6/A

N1

4/P

1C

20

RH5/AN13/P3B21

RH4/AN12/P3C22

RF1/AN6/C2OUT23

ENVREG24

AVDD25

AVSS26

RA3/AN3/VREF+27

RA2/AN2/VREF-28

RA1/AN129

RA0/AN030

VSS31

VDD32

RA5/AN433

RA4/T0CKI34

RC1/T1OSI/ECCP2/P2A35

RC0/T1OSO/T13CKI36

RC6/TX1/CK137

RC7/RX1/DT138

RJ4/BA039

RJ5/CE40

RJ2

/WR

L60

RJ3

/WR

H59

RB

0/I

NT0

/FL

T0

58

RB

1/I

NT1

57

RB

2/I

NT2

56

RB

3/I

NT3

/EC

CP

2/P

2A

55

RB

4/K

BI0

54

RB

5/K

BI1

53

RB

6/K

BI2

/PG

C52

VS

S51

OS

C2

/CL

KO

50

OS

C1

/CL

KI

49

VD

D48

RB

7/K

BI3

/PG

D47

RC

5/S

DO

146

RC

4/S

DI1

/SD

A1

45

RC

3/S

CK

1/S

CL

144

RC

2/E

CC

P1/P

1A

43

RJ7

/UB

42

RJ6

/LB

41

RH1/A1780

RH0/A1679

RE2/AD10/CS/P2B78

RE3/AD11/P3C77

RE4/AD12/P3B76

RE5/AD13/P1C75

RE6/AD14/P1B74

RE7/AD15/ECCP2/P2A73

RD0/AD0/PSP072

VDD71

VSS70

RD1/AD1/PSP169

RD2/AD2/PSP268

RD3/AD3/PSP367

RD4/AD4/PSP4/SDO266

RD5/AD5/PSP5/SDI2/SDA265

RD6/AD6/PSP6/SCK2/SCL264

RD7/AD7/PSP7/SS263

RJ0/ALE62

RJ1/OE61

C1

27

0.1

u/2

5V

RE

SE

T

DS

P_

PR

OT_

ND

SP

_IR

Q_N

DSP_P1_3

MC

U_

P4

4M

CU

_P

45

MC

U_

P4

6

DSP_MUTE

DSP_P1_2

SW

1S

W-T

AC

T

12

34

RESET

3V

3

C1

28

0.1

u/2

5V

R1

12

100

/1%

12

DSP_SLEEP

MCU_P72

P77

DSP_IC_N

MF

B

P0_0

(Audio AMP Enable)

(RESET_n)

P3_0

P1_5

(LINE_IN_DET)

3V

3

3V

3

3V

3

X3

X4

P-1

6M

HZ

4132

C1

29

0.1

u/2

5V

3V

3P

GD

PG

C

P20

C1

30

0.1

u/2

5V

P17

C1

31

10u

/16V

R1

13

10K

/1%

12

RS

T_

PIC

18

T1OSOT1OSI

Page 35: BM23 Bluetooth Evaluation Board User s Guideww1.microchip.com/downloads/en/DeviceDoc/BM23SPK... · BM23 BLUETOOTH EVALUTATION BOARD USER’S GUIDE 2015 Microchip Technology Inc. Preliminary

BM23 BLUETOOTH

EVALUTATION BOARD USER’S GUIDE

Preliminary Edition 2015 Microchip Technology Inc. page 35

P77

SOUND

EFFECT

PAIRING

P77

R3

P77

MC

U_P

71

MC

U_P

71

MFB

VOL-

PLAY/PAUSE

VOL+

C1

BU

TT

ON

MC

U_P

45

MC

U_P

70

MC

U_P

72

R1

R0

R2

MC

U_P

71

MC

U_P

72

MC

U_P

70

R1141

0K

/1%

12

C61

1u/1

6V

MC

U_P

70

<< PRV

C0

MC

U_P

72

MC

U_P

44

C132

1u/1

6V

R116

10K

/1%

12

SW

22

TS

08M

-PF

21

SW

23

TS

08M

-PF

21

SW

24

TS

08M

-PF

21

SW

34

TS

08M

-PF

21

SW

27

TS

08M

-PF

21

SW

31

TS

08M

-PF

21

SW

28

TS

08M

-PF

21

SW

35

TS

08M

-PF

21

SW

39

TS

08M

-PF

21

SW

45

TS

08M

-PF

21

SW

40

TS

08M

-PF

21

SW

38

TS

08M

-PF

21

SW PT

P77

C2

MC

U_P

70

R1151

0K

/1%

12

MC

U_P

71

C63

1u/1

6V

FWD >>

MC

U_P

72

MC

U_P

46

3V

33V

33V

3

Board

Nam

e

Siz

eTitle

Rev

Date

:S

heet

of

P/N

MC

U_B

UT

TO

N4.0

BM

23 E

VB

A

88

Monday

, July

27,

2015

0360

5F

, N

o.5

, In

dustr

y E

. R

d. V

II, H

sin

chu S

cie

nce P

ark

,

Hsin

chu C

ity

30078,

Taiw

an

TE

L.

886-3

-5778385

Page 36: BM23 Bluetooth Evaluation Board User s Guideww1.microchip.com/downloads/en/DeviceDoc/BM23SPK... · BM23 BLUETOOTH EVALUTATION BOARD USER’S GUIDE 2015 Microchip Technology Inc. Preliminary

Worldwide Sales and Service

AMERICAS Corporate Office 2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

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Web Address:

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Tel: 678-957-9614

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Dallas Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit Novi, MI

Tel: 248-848-4000

Houston, TX Tel: 281-894-5983

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

New York, NY Tel: 631-435-6000

San Jose, CA Tel: 408-735-9110

Canada - Toronto Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2943-5100

Fax: 852-2401-3431

Australia - Sydney Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

China - Hangzhou

Tel: 86-571-8792-8115

Fax: 86-571-8792-8116

China - Hong Kong SAR

Tel: 852-2943-5100

Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8864-2200

Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-3019-1500

Japan - Osaka

Tel: 81-6-6152-7160

Fax: 81-6-6152-9310

Japan - Tokyo

Tel: 81-3-6880- 3770

Fax: 81-3-6880-3771

Korea - Daegu Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Taiwan - Kaohsiung Tel: 886-7-213-7830

Taiwan - Taipei Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Dusseldorf Tel: 49-2129-3766400

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany - Pforzheim Tel: 49-7231-424750

Italy - Milan Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Venice Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Poland - Warsaw

Tel: 48-22-3325737

Spain - Madrid Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

2015 Microchip Technology Inc. Advance Information page 32