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[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt1
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Bruce Mayer, PEDir. System Engineering
17Oct02
3x00 XY-StageTransit/Settling Time
Engr/Math/Phys 25
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt2
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Effecting Planer Motion
An XYStage
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt3
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Executive Summary Test Procedure
• Attach Accelerometer to 3xxx Stage• Move Stage in Short, Medium, Long Runs• Record Accelerometer OutPut With Oscope
Estimated SETTLING TIME: <15ms Olympus Stage Transit-Time Model
mS5.46mmmS37.4 dTt• d Travel Distance in mm • Tt Transit Time in mS
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt4
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Goals & Logistics
Goals → For 3xxx XY-Stage Determine• Typical AntiVibration-Table Settling Time• Model: Transit-Time vs. Transit-Distance
Logistics• Test Date = 15-Oct-2002• Experimenters = B. Mayer, CEE• Test System = YYY-3xxx
– Hi-Accuracy XY-Stage– Mechanical (i.e., spring-based)
AntiVibration Table
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt5
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Test Design Attach Accelerometer to XY-Stage Measure Accelerometer Output w/ Oscope Program System for Die Jumps on 200mm
wafer with KLARRF Map Die Patterns• X-Pitch = 7.8408280000e+03 µm (7.8408 mm)• Y-Pitch = 1.4138693000e+04 µm (14.1387 mm)
Die Jumps: L↔R, T↔B, UL↔LR, UR↔LL• Full Cross-Wafer (long) Moves• 4-Die Moves• Single-Die Moves
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt6
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
AcceleroMeter Mounting
Wafer & Chuck
OTA-3xxxStage
Major Axis = Z
Omega ACC-102 Accelerometer(100 mV/g)
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt7
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Instrumentation
Fluke-199 200 MHz ScopeMeter
Omega ACC-PS1AcceleroMeterPower Supply
Cables To/FromAcceleroMeter
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt8
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Stage-Move Profiles – 200mm WaferLEGEND
LONG MOVE4-DIE MOVESINGLE-DIE MOVE
174.4 mm
12.7mm50.9 mm
AVG. DISTANCE
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt9
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Results & Analysis - Plots on Next Slides
AntiVibe Table Settling Time 15ms• Time Beyond Motor-Stop• S-Curve Accel & Decel Improves Settling
Time mS5.46mmmS37.4 dTt Transit-Time Model Determined by
Linear-Regression:– d Travel Distance in mm – Tt Transit Time in mS
• Full Speed = 1/[4.37 mS/mm] = 229 mm/S• Very-Short Move Time Const 47 mS
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt10
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Results & Analysiscont.1
Max Z-Acceleration = 5.92g Y-Axis “Rattles” about 4-TIMES More
than the X-Axis• Suggests inquiry into the source of the
added Settling Time
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt11
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Transit-Time Test • Oct02
t = 4.3725d + 46.494
R2 = 0.9871
0
100
200
300
400
500
600
700
800
900
0 20 40 60 80 100 120 140 160 180
Stage Travel Distance (mm)
Sta
ge
Tra
ve
l Tim
e (
mS
)
Travel-Time (mS)
Linear (Travel-Time (mS))
file = OTA3200_Stage-Settling_Time_0210.XLS
Velocity/Slope = 229 mm/S
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt12
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • Long +X Move
-125
-100
-75
-50
-25
0
25
50
75
100
125
150
-0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
Vlo (Vdc)
Vhi (Vdc)
file = OTA3200_Stage-Settling_Time_0210.XLS
Ramp Up/Down
~ConstantVelocity
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt13
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • Single-Die UR-Diag Move
-350
-300
-250
-200
-150
-100
-50
0
50
100
150
200
250
300
350
400
-0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
Vlo (Vdc)
Vhi (Vdc)
file = OTA3200_Stage-Settling_Time_0210.XLS
Ramps Only
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt14
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • Single-Die +y Move
-250
-200
-150
-100
-50
0
50
100
150
200
250
-0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
Vlo (Vdc)Vhi (Vdc)Lt BoundaryRt boundary
file = OTA3200_Stage-Settling_Time_0210.XLS
Se
ttling
time
= ~
12
.8m
s
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt15
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • Single-Die +y Move
-200
-150
-100
-50
0
50
100
150
200
0.09 0.10 0.11 0.12 0.13 0.14
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
Vlo (Vdc)Vhi (Vdc)Lt BoundaryRt boundary
file = OTA3200_Stage-Settling_Time_0210.XLS
Settling time = ~12.8ms
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt16
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • Single-Die DIAG-LR Move
-250
-200
-150
-100
-50
0
50
100
150
200
250
-0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
Vlo (Vdc)Vhi (Vdc)Lt BoundaryRt boundary
file = OTA3200_Stage-Settling_Time_0210.XLS
Se
ttling
time
= ~
14
.4m
s
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt17
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • Single-Die DIAG-LR Move
-80
-60
-40
-20
0
20
40
60
80
0.110 0.115 0.120 0.125 0.130 0.135 0.140
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
Vlo (Vdc)Vhi (Vdc)Lt BoundaryRt boundary
file = OTA3200_Stage-Settling_Time_0210.XLS
Settling time = ~14.4
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt18
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
OTA-3220 Stage Settling • 4-Die Moves
-600
-500
-400
-300
-200
-100
0
100
200
300
400
500
600
-0.10 -0.05 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40
Time (s)
Ac
ce
lero
Me
ter
Ou
tpu
t (m
Vd
c)
4D +x Vlo 4D +x Vhi 4D -y Vlo
4D -y Vhi 4D LL=>UR Vlo 4D LL=>UR Vhi
file = OTA3200_Stage-Settling_Time_0210.XLS
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt19
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
All Done for the COURSE
See You in Fall 13
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt20
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
All Done for Today
An XYStage
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt21
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Bruce Mayer, PELicensed Electrical & Mechanical Engineer
Engr/Math/Physics 25
Appendix
6972 23 xxxxf tfyyy
735
masterjslave PxhPn
1
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt22
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
Bruce Mayer, PEDir. System Engineering
17Oct02
Settling TimeAPPENDIX
Engr/Math/Physics 25
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt23
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
AcceleroMeter Instrumentation
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt24
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
AcceleroMeter Specifications
[email protected] • ENGR-25_XY-Translation-Stage_CaseStudy.ppt25
Bruce Mayer, PE Engineering/Math/Physics 25: Computational Methods
KLARFF Map DetailsFileVersion 1 1;
FileTimestamp 08-22-02 13:33:54;
InspectionStationID "NONE" "BITMAP" "ORB102";
SampleType WAFER;
ResultTimestamp 08-22-02 10:14:55;
LotID "QT96B2815340_3";
SampleSize 1 200;
SetupID "T96B_UP" 05-08-02 07:02:28;
StepID "RTP_ANNEAL_2";
SampleOrientationMarkType NOTCH;
OrientationMarkLocation UP;
DiePitch 7.8408280000e+03 1.4138693000e+04;
DieOrigin 0.0000000000e+00 0.0000000000e+00;
WaferID "01";
Slot 1;
SampleCenterLocation 4.3974690000e+03 7.8404710000e+03;