Microsoft Word - BPT-NP23C3.docAPPROVED PURCHASE MANUFACTURE QUALITY ENGINEERING
BRIGHT LED ELECTRONICS CORP. 19 3 3F., No.19, He Ping Road, Ban Qiao Dist., New Taipei City, Taiwan Tel: +886-2-29591090 Fax: +886-2-29547006/29558809 www.brtled.com
PAGE DATE 1 2 3 4 5 CONTENTS
2015/3/18 1.0 1.0 1.0 1.0 1.0 Initial Released
ISSUED APPROVED PREPARED
SAMPLES ATTACHED AREA
SIDE- LOOK PACKAGE
2. high sensitivity.
5. This product doesn't contain restriction
substance, comply RoHS standard
power point .
Operating Temperature -40~+85
Package Dimensions:
NOTES:
1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.25mm (0.01’’) unless otherwise specified. 3.Lead spacing is measured where the leads emerge from the package 4.Specifications are subject to change without notice
1. Emitter
2. Collector
Electrical Characteristics (TA=25 unless otherwise noted)
PARAMETER SYMBOL MIN TYP MAX UNITS TEST CONDITIONS Collector- Emitter Breakdown Voltage V(BR)CEO 30 - - V IC=1 mA Ee=0mW/cm2
Emitter-Collector Breakdown Voltage V(BR)ECO 5 - - V IR=0.1mA Ee=0 mW/cm2
Collector- Emitter Saturation Voltage VCE(SAT) - - 0.5 V IC=0.1 mA Ee=1.0mW/cm2
Rise Time Tr - 15 -
Fall Time Tf - 15 -
VCE=5V, IC=1mA, RL=1000
Collector Dark Current Id - - 0.5 uA VCE=10V Ee=0 mW/cm2
Light Current IC (ON) - 2.34 - mA VCE=5V Ee=1.0mW/cm2
Typical Optical-Electrical Characteristic Curves
1
0.01
Load Resistance
Ambient Temperature
Vcc=5V
F=100Hz
Ambient Temperature
P ow
er D
is si
pa tio
n P
100
R el
at iv
e C
ol le
ct or
C ur
re nt
0 0
Irradiance
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10 20 30 40 50 60 70 80 90 100 110 120
30 50
Dip Soldering
1. Please avoid any external stress applied to the lead-frames and
epoxy while the LEDs are at high temperature,especially during soldering 2. DIP soldering and hand soldering should not be done more than one time. 3. After soldering, avoid the epoxy lens from mechanical shock or
vibration until the LEDs are back to room temerature. 4. Avoid rapid cooling during temperature ramp-down process 5. Although the soldering condition is recommended above,
soldering at the lowest possible temperature is feasible for the LEDs IRON Soldering
300 Within 3 sec.,One time only.
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Tapping and packaging specifications(Units: mm)
Packaging Bag Dimensions
2All dimensions are in millimeters(inches).
3Specifications are subject to change without notice.
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Phototransistors Specification Commodity:Phototransistors
BIN CODE Min.(mA) Max.(mA)