bscmt

Maintenance

Base Station Controller

MMN:BSC

A30808-X3247-K220-4-7620

2 A30808-X3247-K220-4-7620

MMN:BSC MaintenanceBase Station Controller

! Important Notice on Product Safety

DANGER - RISK OF ELECTRICAL SHOCK OR DEATH - FOLLOW ALL INSTALLATIONINSTRUCTIONS.

The system complies with the standard EN 60950 / IEC 60950. All equipment connected to thesystem must comply with the applicable safety standards.Hazardous voltages are present at the AC power supply lines in this electrical equipment. Somecomponents may also have high operating temperatures.Failure to observe and follow all installation and safety instructions can result in seriouspersonal injury or property damage.Therefore, only trained and qualified personnel may install and maintain the system.

The same text in German:

Wichtiger Hinweis zur Produktsicherheit

LEBENSGEFAHR - BEACHTEN SIE ALLE INSTALLATIONSHINWEISE.

Das System entspricht den Anforderungen der EN 60950 / IEC 60950. Alle an das System angeschlo-ssenen Geräte müssen die zutreffenden Sicherheitsbestimmungen erfüllen.In diesen Anlagen stehen die Netzversorgungsleitungen unter gefährlicher Spannung. EinigeKomponenten können auch eine hohe Betriebstemperatur aufweisen.Nichtbeachtung der Installations- und Sicherheitshinweise kann zu schweren Körperverlet-zungen oder Sachschäden führen.Deshalb darf nur geschultes und qualifiziertes Personal das System installieren und warten.

Caution:This equipment has been tested and found to comply with EN 301489. Its class of conformity isdefined in table A30808-X3247-X910-*-7618, which is shipped with each product. This class alsocorresponds to the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference when theequipment is operated in a commercial environment.This equipment generates, uses and can radiate radio frequency energy and, if not installed and usedin accordance with the relevant standards referenced in the manual “Guide to Documentation”, maycause harmful interference to radio communications.For system installations it is strictly required to choose all installation sites according to national andlocal requirements concerning construction rules and static load capacities of buildings and roofs.For all sites, in particular in residential areas it is mandatory to observe all respectively applicableelectromagnetic field / force (EMF) limits. Otherwise harmful personal interference is possible.

Trademarks:

All designations used in this document can be trademarks, the use of which by third parties for their own purposescould violate the rights of their owners.

Copyright (C) Siemens AG 2002.

Issued by the Information and Communication Mobile GroupHofmannstraße 51D-81359 München

Technical modifications possible.Technical specifications and features are binding only insofar asthey are specifically and expressly agreed upon in a written contract.

A30808-X3247-K220-4-7620 3

MaintenanceBase Station Controller

MMN:BSC

IssuesChange indications (Ind.):

N = new; G = modified; 0 = deleted;

Document Title Page(s) Issue/Ind.

MMN:BSC . . . . . . . . . . . 1...250 4

4 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 5


MMN:BSC

Reason for UpdateSummary:

Fourth Edition for Release BR 6.0

Details:

Chapter/Section Reason for Update

4.8.14 Module PPXX jumpers setting without power supplycards

Issue HistoryIssue Date of Issue Reason for Update

1 06/2002 First Edition for New Release BR 6.0

2 9/2002 Second Edition for Release BR 6.0

3 11/2002 Third Edition for Release BR 6.0

4 05/2003 Fourth Edition for Release BR 6.0

6 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 7


MMN:BSC

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.1 Structure of the Maintenance Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.2 Symbols used . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141.3 Fault Clearance Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151.4 Fault Clearance Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161.5 Module Replacement Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181.6 Fault Management Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201.7 Procedures references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2 Tasklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

3 Fault Clearance Procedures for Modules and Interfaces . . . . . . . . . . . . . . 433.1 Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.2 DISK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473.3 DK40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533.4 IXLT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 573.5 MEMT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613.6 MPCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653.7 NTW Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 693.8 PLLH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713.9 PPCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 753.10 PPCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793.11 PPLD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813.12 PPXL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853.13 PPXU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 873.14 PWRS (PWRD or EPWR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 893.15 QTLP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 933.16 Remote Inventory Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 973.17 SN16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1053.18 SNAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1093.19 TDPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1133.20 UBEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

4 Hardware Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1214.1 Rack Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1294.2 Rack Connection for BC120-HC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1314.3 Fuse and Alarm Panel of the C20-X rack . . . . . . . . . . . . . . . . . . . . . . . . . 1344.4 Lamp Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1364.5 DC-Panel of the BC120-HC (C38-X rack). . . . . . . . . . . . . . . . . . . . . . . . . 1374.6 Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1384.7 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1394.8 Jumpers setting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

5 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1775.1 Alarm Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1775.2 Alarm Reporting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1795.3 Failure Event Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1835.4 General diagnostic structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

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5.5 NACK CAUSES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248

6 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249

A30808-X3247-K220-4-7620 9


MMN:BSC

IllustrationsFig. 1.1 Structure of the MMN:BSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Fig. 1.2 Used Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Fig. 1.3 Fault Clearance Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Fig. 1.4 ESD Symbol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Fig. 1.5 General Maintenance flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Fig. 3.1 Delete nob_Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Fig. 3.2 Create nob_Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Fig. 3.3 Edit nob_Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Fig. 3.4 Attach nob_RIU file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Fig. 4.1 Regular capacity BSC - Rack Layout and Size . . . . . . . . . . . . . . . . . . 122

Fig. 4.2 Regular capacity BSC frame for the GPRS feature . . . . . . . . . . . . . . . 123

Fig. 4.3 High Capacity BSC frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Fig. 4.4 High Capacity BSC in fire resistence cabinet version . . . . . . . . . . . . . 125

Fig. 4.5 High Capacity BC120HC (S30861-C36-X) . . . . . . . . . . . . . . . . . . . . . 126

Fig. 4.6 BSC Rack Connection Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

Fig. 4.7 RCAP in the BC120 - HC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Fig. 4.8 Alarm LEDs on the BSC Fuse and Alarm Panel . . . . . . . . . . . . . . . . . 134

Fig. 4.9 BSC Fuse and Alarm Panel, Part with Fuses . . . . . . . . . . . . . . . . . . . 136

Fig. 4.10 Lamp Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Fig. 4.11 Alarm LEDs for BC120 HC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Fig. 4.12 DC-Panel for BC120 HC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Fig. 4.13 BSC Power Supply Module Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

Fig. 4.14 Jumpers Setting for Module DK40. . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

Fig. 4.15 Jumpers Setting for Module DK40 V2 and V3 . . . . . . . . . . . . . . . . . . . 142

Fig. 4.16 Jumpers Setting for Module IXLT V3 and V4. . . . . . . . . . . . . . . . . . . . 143

Fig. 4.17 Jumpers Setting for Module IXLT V6 and V7. . . . . . . . . . . . . . . . . . . . 144

Fig. 4.18 Jumpers Setting for Module MEMT . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

Fig. 4.19 Jumpers Setting for Module MPCC V7 . . . . . . . . . . . . . . . . . . . . . . . . 146

Fig. 4.20 Front View of MPCC V7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

Fig. 4.21 Jumpers Setting for Module PLLH (75 Ohm). . . . . . . . . . . . . . . . . . . . 149

Fig. 4.22 Jumpers Setting for Module PLLH (120 Ohm). . . . . . . . . . . . . . . . . . . 150

Fig. 4.23 Jumpers Setting for Module PLLH V2 (75 Ohm) . . . . . . . . . . . . . . . . . 151

Fig. 4.24 Jumpers Setting for Module PLLH V2 (120 Ohm) . . . . . . . . . . . . . . . . 152

Fig. 4.25 Jumpers Setting for Module PPCC V2. . . . . . . . . . . . . . . . . . . . . . . . . 153

Fig. 4.26 Jumpers Setting for Module PPCC V3. . . . . . . . . . . . . . . . . . . . . . . . . 154

Fig. 4.27 Jumpers Setting for Module PPCU . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

Fig. 4.28 Jumpers Setting for Module PPLD V2 . . . . . . . . . . . . . . . . . . . . . . . . . 156

Fig. 4.29 Jumper setting for module PPLD V3 . . . . . . . . . . . . . . . . . . . . . . . . . . 157

Fig. 4.30 Jumpers Setting for Module QTLP (120 Ohm) . . . . . . . . . . . . . . . . . . 158

Fig. 4.31 Jumpers Setting for Module QTLP (75 Ohm) . . . . . . . . . . . . . . . . . . . 159

Fig. 4.32 Jumpers Setting for Module QTLP V2 (75 Ohm) . . . . . . . . . . . . . . . . . 160

Fig. 4.33 Jumpers Setting for Module QTLP V2 (100 Ohm) . . . . . . . . . . . . . . . . 161

Fig. 4.34 Jumpers Setting for Module QTLP V2 (120 Ohm) . . . . . . . . . . . . . . . . 162

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Fig. 4.35 PCM Monitoring Points for QTLP and QTLP V2. . . . . . . . . . . . . . . . . . 163

Fig. 4.36 Jumpers Setting for Module SN16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

Fig. 4.37 Jumpers Setting for Module TDPC V6 . . . . . . . . . . . . . . . . . . . . . . . . . 166

Fig. 4.38 Front View of TDPC V6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

Fig. 4.39 Jumpers Setting for Module UBEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

Fig. 4.40 Jumpers Setting for Module SNAP V1 . . . . . . . . . . . . . . . . . . . . . . . . . 170

Fig. 4.41 Jumpers Setting for Module PPXX (fed by EPWR power supply card) 171

Fig. 4.42 Jumpers Setting for Module PPXX (fed by internal power supply module)172

Fig. 4.43 Jumpers Setting for Module STLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

Fig. 5.1 The BSC Maintenance Entity Graph (MEG tree) for BSC Regular Capacity181

Fig. 5.2 The BSC Maintenance Entity Graph (MEG tree) for BSC High Capacity . .182

A30808-X3247-K220-4-7620 11


MMN:BSC

TablesTab. 1.1 Alarms list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Tab. 2.1 Fuse Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Tab. 3.1 List of nob_RIUs for BSC Standard . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Tab. 3.2 List of nob_RIUs for BSC High Capacity . . . . . . . . . . . . . . . . . . . . . . . 100

Tab. 4.1 Assignment of even and odd PCM Links to SUB-D 37 Connectors . . 130

Tab. 4.2 Cross references for PCM lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Tab. 4.3 Signal pin connector on SUB D37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Tab. 4.4 LED-Hardware Correspondence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Tab. 4.5 Anomaly Conditions identified by LEDs. . . . . . . . . . . . . . . . . . . . . . . . 140

Tab. 4.6 Description of QTLP and QTLP V2 Monitoring Points . . . . . . . . . . . . . 163

Tab. 4.7 Jumpers STLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174

Tab. 5.1 New Phase Identifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190

Tab. 5.2 Error Codes used by PWRS, MPCC, TDPC, MEMT Diagnosis . . . . . 197

Tab. 5.3 Error Codes used by NTW Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . 202

Tab. 5.4 Error Codes used by PPxx Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . 209

Tab. 5.5 Error Codes used by LICD Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . 214

Tab. 5.6 DK40: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221

Tab. 5.7 List of phases that are executed in the several conditions . . . . . . . . . 223

Tab. 5.8 IXLT: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227

Tab. 5.9 PPCU: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237

Tab. 5.10 PPXU: Test-id Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

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A30808-X3247-K220-4-7620 13


MMN:BSC

1 Introduction

1.1 Structure of the Maintenance Manual

The following diagram gives an overview of the structure of this manual and the purposeof its chapters.

Fig. 1.1 Structure of the MMN:BSC

Chapter 1

Chapter 2

Chapter 3

Chapter 5

Introduction– Basic information on this manual– Basic information on fault clearance– Guidelines– General replacement Instructions– Preparatory work if relevant

Chapter 6 Abbreviations

AppendixBasic required knowledge in more detail,e.g. fault messages

Chapter 4

Fault Clearance Procedures for Modulesand Interfaces– Fault clearance procedures for modules

and interfaces in alphabetical order– Concluding procedure “Remote Inventory

Data” that some fault clearanceprocedures require (if necessary, links areprovided to this concluding procedure)

Tables, Lists and Figures– Information on replaceable modules,

e.g. LEDs, connectors etc.– Overview of the HW architecture as

additional information

(Important information to make your workefficient and safe)

(Main Part for Fault Clearance Tasks)

(Reference Chapter)

(Reference Chapter)

(General Maintenance)

(Reference Chapter)

Chapter 4

Task ListInformation on routine tasks that need to becarried out

14 A30808-X3247-K220-4-7620


1.2 Symbols used

The following symbols are used throughout this manual:

Fig. 1.2 Used Symbols

Reference to another step in the procedure or to another procedure

Symbol Meaning

ESD (Electrostatic Sensitive Device) precautions to be taken

Note; important information

Warning; the notes given here are to be followed with care.

b

h

Use LMT to enter commands

☞ Reference to another chapter in the document or to another document

Reference to another procedure. Return after finishing.i

i

!Non-observance can lead to personal injury or property damage.

A30808-X3247-K220-4-7620 15


MMN:BSC

1.3 Fault Clearance Principle

The high system functionality of the Siemens base station system is achieved by meansof system-integrated routine tests. These routine tests continually check the correctfunctioning of the base station subsystems including the BSCs.

The fault clearance procedures in this manual are based on these routine tests. In mostcases, the results of these routine tests are sufficient to localize the fault and clear itimmediately at the BSC.

The modular design of the BSC allows you to clear a large percentage of faults in thesystem by replacing a defective module.

Sometimes, however, it may happen that faults do not result from defective modules,but from interface problems in general (for example interrupted cables). In this case,special trouble shooting procedures for interfaces are provided.

This maintenance concept guarantees a simple and fast fault clearance and leads tohigh operational efficiency.

16 A30808-X3247-K220-4-7620


1.4 Fault Clearance Guidelines

The following diagram gives an overview of the fault clearance procedure (detaileddescription below):

Fig. 1.3 Fault Clearance Overview

7.

Y

Y6.

AnotherProbableCause?

9. End of Fault Clearance : Faulty Modules are Sent to Repair Depot

Fault and TestManagement at the

OMC via RadioCommander

N

1. System Integrated Routine Test Detects a Fault

3.Local Fault

Clearance at theBSC Neces-

sary?

Y N

2. Fault Message Displayed at Radio Commander:Information for example on– probable cause– suspected modules(s)/interface(s)– location ...

Local FaultClearanceat the BSC

4. Fault Clearance Proce-dure for the Suspected

Module or Interface

8. CallTAC

5.Fault

ClearanceSuccess-

ful?

Content of this Manual

N

A30808-X3247-K220-4-7620 17


MMN:BSC

Fault Clearance Guidelines

(The numbering refers to the above diagram.)

1. The system integrated routine test detects a fault.

2. A fault message is displayed at the Radio Commander.

3. The fault and test management at the Operation and Maintenance Center (OMC)must verify whether a local fault clearance at the BSC is required (see RadioCommander documentation).

4. Interpret the fault message and go to the fault clearance procedure of the suspectedmodule or interface, localize the fault and clear it according to the correspondingprocedure in chapter "3 Fault Clearance Procedures for Modules and Interfaces".

5. As described in the corresponding procedure, verify whether the fault clearance wassuccessful:

– Was the outcome of the hardware test “pass”?

– Are there any relevant pending alarms?

– Do the LEDs signal normal operation?

6. If the fault should still exist and the replaced module was not the fault cause, checkwhether there is another probable cause.

7. If there is another probable cause, reinsert the recently replaced original module andgo to the corresponding fault clearance procedure for the next suspected module orinterface.

8. It should be possible to clear most faults that may occur in the BSC by following thefault clearance procedures described in this manual. However, if the fault should stillexist after considering all probable causes, contact the Technical Assistance Center(TAC). Here you will obtain help from specially trained troubleshooting experts.

9. End of fault clearance. Pack and tag all faulty modules for transport to a repair depot.Write a fault report in which the following information is given in detail:

– name and code of the site

– BSS area, cabinet and slot number

– name, code and serial number of the module

– description of the system response

– description of the fault

– name and phone number of the originator

iFor the local fault clearance at the BSC:Make sure that all spare parts that might be required to clear the fault are availableat the site.For general module replacement instructions see also "1.5 Module ReplacementInstructions".

18 A30808-X3247-K220-4-7620


1.5 Module Replacement Instructions

1.5.1 ESD Precautions

Fig. 1.4 ESD Symbol

All modules are to be handled with extreme care as each contains a number of electro-statically sensitive components.

All integrated modules may contain electrostatically sensitive devices (ESDs). Allmodules are marked with the ESD symbol.

The following precautions are to be taken:

– Personnel should avoid wearing synthetic clothing and shoes with plastic soles, asthese foster the build-up of electrostatic charges.

– Before handling modules, personnel should be freed of electrostatic charge. For thisreason personnel should always put on a grounded wrist strap before changing amodule.

Before touching modules, printed circuits or components, the wrist strap must beconnected to the ground potential of the rack by means of a flexible lead integrating ahigh-value discharge resistor. The discharging socket in the holder of the special tool forchanging modules must be used for connecting the wrist strap to the ground potential.This holder is located on the right vertical strut of the module side of the rack. Note thatthe conducting parts of the split pin should not be touched when plugging it in (by-passing the discharge resistor).

IMPORTANT:Modules with the ESD symbol are to be handled with extreme care. Static or externalvoltage can lead to long-term damage in the modules.

In general, the printed circuits and components of the modules should not be touched.Modules should be held only by their edges.

Removed modules are to be placed in covers made of conductive plastic (provided) andthen stored or sent off in special transport boxes or cases bearing the ESD symbol.

To prevent further damage, faulty modules are to be treated with as much care as newones.

All tools, measuring devices and metal objects that come in contact with removedmodules are to be discharged to the ground potential before being used.

To summarize:

a) ESDs should not be allowed to touch electrostatically charged or chargable objects.

A30808-X3247-K220-4-7620 19


MMN:BSC

b) ESDs should only come in contact with high-value discharging material ("gentle"discharging), i.e. should not undergo "harsh" discharging with, for example, a metalplate.

c) ESDs should be set down on grounded surfaces only (flexible bases with agrounding connection for servicing purposes).

d) ESDs should only be transported in authorised packaging. A grounded wrist strapmust be put on before removing ESDs.

e) ESDs should not be brought near strong DC electrical fields, e.g. cathode-raytubes/monitors (safety distance at least 10 cm (3.9”)).

f) Maintenance personnel should check the discharge resistance of the wrist straps atregular intervals.

g) Even discharges that are considerably lower than the detection limit can damage ordestroy ESDs!

1.5.2 Removing and Inserting Modules

Individual fault-clearance procedures given for each fault in the relevant manual mustbe followed when changing a suspect module.

Check whether the modules contain switches, jumpers or solder straps. If so, theirsettings must be checked and corrected if necessary, following the guidelines in themanual.

Modules are to be changed with extreme care. Inappropriate handling of modules candestroy contacts or printed circuits.

The conductive wrist strap must be put on before changing a module. It must then beconnected via the flexible lead to the discharging socket in the tool holder.

a) Removing a moduleThe module can now be pulled by hand from the guide rail in the frame.

b) Inserting a module

Push the replacement module into the guide rails in the frame. Check that the modulehas been correctly inserted into the lower rail as well as into the upper.

Push back the module in the guide rails until it encounters some resistance; this is over-come by lightly pressing by hand. The module's strip connectors (module connectors)are centered on the blade contact strips in the module frame.

The faceplate of the correctly inserted module must be level with those of the adjacentmodules.

20 A30808-X3247-K220-4-7620


1.6 Fault Management Procedure

The following list of test equipment is recommended for use in the trouble-shootingprocedures provided in this section. Make sure that equipment needed is on hand andproperly operating.

– Local Maintenance Terminal (LMT)

– Digital Multimeter - Fluke Model 8062A with Y8134 test lead kit, or equivalent; usedfor precision DC and AC measurement, requiring 4-1/2 digits.

– Antistatic wrist strap

– Miscellaneous hand tools.

Be aware of the fact that a copy of each suspected faulty module is available on the site.

A30808-X3247-K220-4-7620 21


MMN:BSC

Fig. 1.5 General Maintenance flow chart

22 A30808-X3247-K220-4-7620


In the following an explanation of the above diagram is given.

1. Test the Alarm Lamp IntegrityBefore performing any operation on the BSC rack, check for all alarm lamp integrity.Use the LAMP TEST switch located on the BSC front panel (see Hardware Equip-ment section).

2. Verify the Lamp StatusIlluminated lamps should be consistent with the suspected module signalled in theoriginal fault message.Therefore:

– the lamps on the lamp panel should signal an alarm condition; (see HardwareEquipment section)

– one or more lamps on the alarm panel should be on (see Hardware Equipmentsection)

3. Connect the LMT to the BSCPlug the LMT cable into the corresponding socket.Perform the LOGON procedure (see OGL:LMT).The LMT tree is now displayed on the screen.

4. Get the Equipment Alarms

The LMT shows the list of all the modules (possibly faulty modules) which issued anEquipment Failure Event; for each of them keep track of the related possible causeof fault.

iIf illuminated lamps are not consistent with the suspectedmodule signalled in the original fault message, this can dependon new alarms that occured after the first report. If no lamps areilluminated and an error condition is still present, the componentACKT of DK40 copy 0 (or the DK40 itself) which is responsiblefor the control of the alarm LEDs may be faulty. In this case,continue with the procedure described below. Only the equip-ment alarm lamps are relevant for the maintenance purposes.See section Hardware Equipment and section Alarm Reportingfor details about the meaning of the BSC rack lamps.

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE

Command: GATACTIVEALARMS BSCE

Name: BSCE:<instance>

Attributes: EVTYP = EQUIPMENT_FAILURE_EVENT

Submit

GATACTIVEALARMSBSCE:NAME=BSCE:<instance>,EVTYP=EQUIPMENT_FAILURE _EVENT;

A30808-X3247-K220-4-7620 23


MMN:BSC

5. Check the Possible Faulty ModulesFor all the possible faulty modules (from previous step), do the following from LMT:

GET <Module> STAT:NAME=<Module>:<Instance>Specify the module type by selecting it from the list. The LMT requests for the copynumber (<instance>) of the selected object. Do this operation for all the copies of thespecified module existing inside the rack (see OMN:BSC).

The LMT shows the state of each specified module. Keep track of the operationalstate and the availability status for each module.

6. Find the Suspected moduleKeeping in mind the output described above, take into account the modules forwhich:the OPERATIONAL STATE is DISABLEDthe PROBABLE CAUSE description includes the word Hardware in the Alarm EventListthe AVAILABILITY STATUS is FAILED .These modules are called “suspected modules”.

7. Replace the Suspected ModulesThe BSC rack is protected by a front cover. This must be removed in order to accessthe modules. To do this, remove the screws on the cover.

To remove a module, pull the levers on the module itself - pull up the top levers andpull down the bottom ones - then extract the module. To restore a removed moduleto its site, insert the module then push the levers - push down the top levers andpush up the bottom ones.

If the alarm originates from Line Interface Card (LICD) as QTLP, and the alarm is“LOSS OF SIGNAL” or “LOSS OF SIGNAL ON LINK A/B”, in detail “signal absent(LOS)”, LFA alarm present”, “eer alarm present (BER)”, “RAI alarm present”, checkthe jumpers on the faulty card are conforming the line impedence requirement (see"4.8 Jumpers setting") ; check also that the cable connector concerning the linenumber in failure state is correctly inserted and not damaged (see IMN:BSCmanual).These alarm conditions are shown by LINE/HWI led in the Lamp Alarm Panel andon the QTLP front led as the table of Fig. 4.34. If the alarm originates from InterfaceIXLT as “Communication Failure Event”, check the X25 cable connector (W3 on thetop rack) is correctly inserted and not damaged.

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> <Module>

Command: GET <Module> STAT

Name: <Module>:<instance>

Attributes: None

Submit

GET <Module> STAT:NAME=<Module>:<instance>;

24 A30808-X3247-K220-4-7620


After a check of cables and connectors, proceede with the replace of the suspectedmodules following the procedures described in the chapter 3.

1.7 Procedures references

The following table shows the BSC alarms in the first column, the relative severity in thesecond column and gives informations how to solve the problem.

FAULT PROBLEM SEV. FIRST CHECK OR STEP REPLACEMENT PROCE-DURE

Equipment failure

116 MEMT card failure major if the card is not extracted "3.5 MEMT"

143 NTW permanent failure major "3.7 NTW Procedure"

145 PLLH permanent failure major "3.8 PLLH"

151 LICD access problem minor if the card is not extracted "3.15 QTLP"related to the line number

117 LICD permanent error minor "3.15 QTLP"related to theline number

158 too many UBEX inter-rupt

warn. "3.20 UBEX"

144 Ubex permanent failure major "3.20 UBEX"

161 permanent comparisonalarm on SN

minor the version of thePLLH,SN,LICD

"3.1 Diagnostic Procedure"on PLLH,SN,LICD

163 wrong PCM parity fromLICD

minor "3.15 QTLP"otherwise"3.17 SN16"/"3.18 SNAP","3.8 PLLH"

155 SN16 permanent failure major "3.17 SN16"

171 DISK not formatted major "3.2 DISK"

172 DISK not aligned major the disk alignement is not inprogress

"3.2 DISK"

119 IXLT card not in frame major if the card is not extracted

120 IXLT SW LMT LINK ER warn. LMT connection

121 IXLT SW OMC LINKER

warn. OMC connections

122 IXLT FW not ready major SW reset is not in progress "3.4 IXLT"

186 IXLT SW bad restart warn. "3.4 IXLT"

187 IXLT SW bad command warn. "3.4 IXLT"

207 IXLT card corrupted major "3.4 IXLT"

Tab. 1.1 Alarms list

A30808-X3247-K220-4-7620 25


MMN:BSC

General card

212 HW failure diagnosticrequest

major "3.1 Diagnostic Procedure"

213 HW failure major "3.1 Diagnostic Procedure"

214 card reserved for test major Diagnostic procedure is running

215 card diagnostic failed major "3.1 Diagnostic Procedure"

PPLD/PPXU

217 peripheral card failurediagn.req.

minor Diagnostic procedure is running "3.1 Diagnostic Proce-dure"on the PPLD/PPXU

LICD/PPLD/PPXU

218 peripheral card HWfailure

minor "3.15 QTLP""3.11 PPLD","3.13 PPXU"

MPCC

254 ENVA registermismatch

minor MPCC version "3.6 MPCC"

PPXL/PPXU

320 inter processor commu-nication problem with TDPC

major "3.1 Diagnostic Procedure"on PPXL,PPXU

"3.12 PPXL","3.13 PPXU"

PPXL/PPCC,PPCU/PPXU

321 fatal HW error detectedby TDPC

major "3.1 Diagnostic Procedure"on PPXL/PPCC,PPCU/PPXU

"3.12 PPXL"/"3.9 PPCC""3.10 PPCU"/"3.13 PPXU"

PPXU/PPLD

328 peripheral card interprocessor comm.problemwith TDPC

minor "3.1 Diagnostic Procedure"on PPLD/PPXU

329 peripheral card fatalHW detected by TDPC


330 peripheral card diag-nostic failed


NTW

334 NTW recovery required major "3.7 NTW Procedure"

UBEX

335 UBEX recoveryrequired

major "3.1 Diagnostic Procedure"on UBEX

336 PLLH recovery required major automatic test result onthe"3.1 Diagnostic Procedure"



26 A30808-X3247-K220-4-7620


337 SN64 recovery required major automatic test result onthe"3.1 Diagnostic Procedure"

338 SN16 recovery required major automatic test result onthe"3.1 Diagnostic Procedure"

343 SNAP recoveryrequired

major automatic test result onthe"3.1 Diagnostic Procedure"

Line interface failure

189 loss of signal critical cables,connections

190 loss of signal on link A minor cables,connections

191 loss of signal on link B minor cables,connections

192 AIS alarm major problem in other station equipment(TRAU/BTS) :call TAC

193 AIS alarm on link A minor problem in other station equipment(TRAU/BTS) :call TAC

194 AIS alarm on link B minor problem in other station equipment(TRAU/BTS) :call TAC

257 L1CTS interruption major cables,connections

266 MPCC hot link failed major cables,connections

267 TDPC hot link failed major cables,connections

282 notified Loss of Signal major cables,connections from TRAUto BSC and LICD card (asQTLP, in BSC and BSCI inTRAU) (refer "Diagnostic proce-dure"chp.3.1 in MMN:TRAU"and "Diagnostic procedure"chp.3.4 in MMN:BSC

"3.1 Diagnostic Procedure"on LICD card

283 notified AIS alarm major "3.1 Diagnostic Procedure"on LICD (QTLP) card

291 notified AIS on link A minor "3.1 Diagnostic Procedure"on LICD card

292 notified AIS on link A minor "3.1 Diagnostic Procedure"on LICD card

307 notify PDT alignmentlost

warn. cables,connections,configuration between BSC and BTS

Link

68 AP connection failure warn. Call TAC

182 OMAL disconnected major IXLT version "3.4 IXLT"

183 X25 disconnected major IXLT version "3.4 IXLT"

184 CBCL disconnected major IXLT version "3.4 IXLT"

185 CBCL disc.for overload major IXLT version "3.4 IXLT"



A30808-X3247-K220-4-7620 27


MMN:BSC

269 link down major source code line "3.11 PPLD","3.12 PPXL"

271 NSVC connectionfailure

minor line number "3.10 PPCU"/"3.13 PPXU"

Synchronization

139 synchronism of PLLHerror

minor other alarms "3.4 IXLT"

140 sync link error minor

141 PLLH VCXO out ofnormal range

minor external syncronizationfrequency

"3.8 PLLH" master

142 synchronism failedmeasurement

warn. syncronization source require-ments

"3.8 PLLH" master

152 SYNE without signal minor cable/connector of the synchro-nization signal

"3.8 PLLH" master

153 PLLH not stable warn. external synchronization source "3.8 PLLH" master

159 PLLH not ready minor wait for PLLH warm up (15 min)

Transceiver problem

66 no call in cell within apredefined frame

minor problem in BTS : call TAC

70 no call in trx within apredefined time frame

minor problem in BTS : call TAC

Data base inconsistency

13 TDPC databas notconsistent

warn. SW processing problem : callTAC

176 LPDL link auditmismatch


18 status manager devicehandler audit mismatch


27 database inconsistencywarning


28 AP circuit pool mismatch warn. SW processing problem : callTAC

341 database not compat-ible with ESUSW


105 uncompatible BSCconfiguration

critical HW configuration/version

344 TRAU AMR but poolingdisabled

critical TRAU-HW configuration



28 A30808-X3247-K220-4-7620


File system call unsuc-cessful

4 file system operationfailure


Input parameter out ofrange

25 input parameter out ofrange warning


41 invalid specific problemin error call


42 invalid object identifier inerror call


54 AP A-bis timer fault warn. SW processing problem : callTAC

56 AP cell overflow warn. SW processing problem : callTAC

74 AP channel overflow warn. SW processing problem : callTAC

77 AP connection overflow warn. SW processing problem : callTAC

79 AP ID2MBIT overflow warn. SW processing problem : callTAC

87 AP mode overflow warn. SW processing problem : callTAC

99 AP trx overflow warn. SW processing problem : callTAC

100 AP terrestrial time slotoverflow


104 AP HW circuit identitycode overflow


275 AP BVC overflow warn. SW processing problem : callTAC

277 AP PCU overflow warn. SW processing problem : callTAC

279 AP PDT overflow warn. SW processing problem : callTAC

281 AP PCU timer fault warn. SW processing problem : callTAC

Invalid pointer



A30808-X3247-K220-4-7620 29


MMN:BSC

23 invalid pointer warning warn. SW processing problem : callTAC

24 invalid pointer full initial-ization


Message not expected

40 unexpected messagereceived error


47 received corruptedmessage


84 AP message length fault warn. SW processing problem : callTAC

85 AP mandatory elementfault


86 AP mandatory elementoverflow


88 AP message type fault warn. SW processing problem : callTAC

94 AP O&M discriminatorfault


95 AP optional elementoverflow


96 AP optional element fault warn. SW processing problem : callTAC

98 AP protocol discriminatorfault


177 invalid asub message warn. SW processing problem : callTAC

181 invalid abis message warn. SW processing problem : callTAC

245 AP trace error notifica-tion invalid parameter


262 invalid message toPCUC


305 ABIC invalid message warn. SW processing problem : callTAC

26 Message not initialized warn. SW processing problem : callTAC

32 Message out ofsequence




30 A30808-X3247-K220-4-7620


System call unsuccessful

2 databasa backup failed warn. SW processing problem : callTAC

3 function call unsuccessful warn. SW processing problem : callTAC

29 system call unsuc-cessful warning


30 system call unsuc-cessful prime task init


31 system call unsuc-cessful full init


34 command rejectedwarning


53 inaccessible DUAM error warn. SW processing problem : callTAC

33 Timeout expired warn. SW processing problem : callTAC

22 Variable out of range warn. SW processing problem : callTAC

Cooling system failure see “Environmental failureevent”

External equipment failure

134 operator defined alarm major operator defined alarms

External power supplyfailure

133 main power supplyalarm

major power supply units

Environmental failure event

125 air conditioning equip-ment alarm

major air temperature/detectors

128 Smoke detected major environment/detectors

18 fire detected critical environment/detectors

22 humidity unacceptable major environment/detectors

129 Intrusion detected major environment/detectors

External transmissiondevice failure



A30808-X3247-K220-4-7620 31


MMN:BSC

130 transmission equipmentalarm

major "3.1 Diagnostic Procedure" onLICD

System resource overload

132 CTR overload warn. Call TAC

188 MSC overload detected critical Call TAC

223 AP trace TDPC over-load

major Call TAC

243 BTS overload detected critical Call TAC

249 BSC overload detected critical Call TAC

Broadcast channel failure

113 BTS no BCCH available critical Call TAC

167 BCCH outage critical Call TAC

Invalid message received

108 invalid message toABIS/ASUB

warn. Call TAC

109 invalid message fromABIS/ASUB

warn. Call TAC

263 invalid message fromPCUC

warn. Call TAC

265 invalid readingmessage

warn. Call TAC

268 BSSGP invalidmessage

warn. Call TAC

Invalid MSU received

106 SCCP invalid MSUreceived

warn. wrong parameters received :callTAC

168 invalid MSU received warn. wrong parameters received :callTAC

Lapd link protocol failure

174 LPDL link unstable critical cables,connections towardsTRAU

175 LPDL link transition warn. Call TAC

331 BTSM unstable align-ment

critical cables,connections towardsBTSM

107 Routing failure warn. Call TAC

Remote alarm indicator



32 A30808-X3247-K220-4-7620


112 PCM unvailable remoteproblems

major Call TAC

204 remote alarm major cables,connections toward BTSand TRAU


205 remote alarm on link A minor cables,connections of link Atoward BTS and TRAU


206 remote alarm on link B minor cables,connections of link Btoward BTS and TRAU


286 notified remote alarm major cables,connections from TRAU "3.1 Diagnostic Procedure"on LICD card

297 notified remote alarmon link A

minor cables,connections of link Afrom TRAU


298 notified remote alarmon link B

minor cables,connections of link Bfrom TRAU


SS7 Protocol failure

169 SS7 Link activationfailure

warn.

219 unavailable SS7 linksthreshold minor

minor SS7 link cables,connector andinterface card (IXLT)

"3.1 Diagnostic Procedure"on IXLT card

221 unavailable SS7 linksthreshold major

major SS7 link cables,connector andinterface card (IXLT)


224 unavailable SS7 linksthreshold critical

critical SS7 link cables,connector andinterface card (IXLT)


252 SS7L failure minor "3.1 Diagnostic Procedure"on IXLT card

Transmission error

59 remote lower BERthreshold exceeded

warn.

201 higher BER thresholdexceeded

major cables,connections and LICDfrom TRAU/BTS


202 higher BER thresholdexceeded on link A

minor cables,connections and LICD oflink A from TRAU/BTS


203 higher BER thresholdexceeded on link B

minor cables,connections and LICD oflink B from TRAU/BTS


210 lower BER thresholdexceeded on link A

minor cables,connections and LICD oflink A from TRAU/BTS


211 lower BER thresholdexceeded on link B

minor cables,connections and LICD oflink B from TRAU/BTS




A30808-X3247-K220-4-7620 33


MMN:BSC

287 notified higher BERthreshold exceeded

minor cables,connections and LICDtoward TRAU/BTS


288 notified lower BERthreshold exceeded

minor cables,connections and LICDtoward TRAU/BTS


299 notified higher BERthreshold exceeded ol link A

minor cables,connections and LICD oflink A toward TRAU/BTS


300 notified higher BERthreshold exceeded ol link B

minor cables,connections and LICD oflink B toward TRAU/BTS


301 notified lower BERthreshold exceeded ol link A

minor cables,connections and LICD oflink A toward TRAU/BTS


302 notified lower BERthreshold exceeded ol link B

minor cables,connections and LICD oflink B toward TRAU/BTS


ISO probable causes

16 BTSM software versionnot defined

warn. call TAC

17 TRAU software versionnot defined

warn. call TAC

55 AP BTS Identifier fault warn. call TAC

57 AP cell not configured warn. call TAC

58 AP channel not config-ured

warn. call TAC

67 AP TRX not configured warn. call TAC

72 AP air timer fault warn. call TAC

73 AP cell global identifica-tion not present

warn. call TAC

75 AP cell identification notpresent

warn. call TAC

81 AP location area codecell identification notpresent

warn. call TAC

82 AP location area codenot present

warn. call TAC

83 AP location area identifi-cation not present

warn. call TAC

89 AP no adjacent cell warn. call TAC

90 AP no cell present warn. call TAC

93 AP no terrestrial channel call TAC



34 A30808-X3247-K220-4-7620


103 AP HW circuit identitycode not configured

warn. call TAC

110 unespected LPDLestablished

warn. call TAC

135 AP BTS without allBBSIG44 CARDS

warn. call TAC

157 Invalid type of SN major SNxx type/version

160 invalid type of PLLH minor PLLL version

162 Invalid type of LICD minor LICD type/version

270 configuration mismatch minor line configuration call TAC

276 AP BVC not configured warn. card not equipped : call TAC

278 AP PCU not configured warn. card not equipped : call TAC

280 AP PDT not configured warn. card not equipped : call TAC

3067 AP routing area codenot present

call TAC

Congestion

43 start throttling error minor error collector on MPCC/TDPCtoo busy :call TAC

273 overflow of commandstables

warn. call TAC

Corrupt data

147 invalid message to RTE warn call TAC

5 check on file contentsfailed

warn wrong format file :call TAC

264 invalid access to data warn logical_PPXX table corrupted "3.1 Diagnostic Procedure"on PPXXD card

304 Invalid message length warn call TAC

308 invalid destinationmailbox

warn call TAC

333 memory buffercorrupted

warn "3.1 Diagnostic Procedure"on MEMT card

345 invalid DUAM index warn "3.1 Diagnostic Procedure"on PPXX,TDPC card

127 Enclosure door open minor door/open sensor

File error

170 error in prepairing file warn call TAC



A30808-X3247-K220-4-7620 35


MMN:BSC

216 file too long warning warn call TAC

Loss of frame

195 loss of frame alignment minor cables,connections and LICD

196 loss of frame alignmenton link A

minor cables,connections of link Aand LICD

197 loss of frame alignmenton link B

minor cables,connections of link Band LICD

198 loss of CRC alignment major LICD, PLLH, SNxx

199 loss of CRC alignmenton link A

minor LICD, PLLH, SNxx

200 loss of CRC alignmenton link B

minor LICD, PLLH, SNxx

208 slip alarm on link A minor PLLH, synchronization source inBTS,BSC,TRAU

209 slip alarm on link B minor PLLH, synchronization source inBTS,BSC,TRAU

284 notified loss of framealignment

major problem in TRAU:call TAC

293 notified loss of framealignment on link A

minor problem in TRAU:call TAC

294 notified loss of framealignment on link B


308 notified loss of CRCalignment

major problem in TRAU:call TAC

295 notified loss of CRCalignment on link A


296 notified loss of CRCalignment on link B


Out of memory

39 full init requested warn SW processing problem : callTAC

45 memory not available warn SW processing problem : callTAC

48 error messagesdiscarded

minor SW processing problem : callTAC

60 AP memory messagefault

warn SW processing problem : callTAC



36 A30808-X3247-K220-4-7620


91 AP no memory warn SW processing problem : callTAC

114 Duam memory overflow major "3.1 Diagnostic Procedure"on TDPC card

232 dynamic memory pooloverflow uppinit

warn call TAC

311 dynamic memory pooloverflow lowinit

warn call TAC

312 memory overflowlowinit

warn call TAC

313 memory overflowuppinit

warn call TAC

Software error

1 command full initializationrequired

warn call TAC

9 file transfer aborted bynetwork element

warn call TAC

10 file transfer failed onnetwork element

warn call TAC

11 file transfer refused bynetwork element

warn call TAC

12 status manager data-base not aligned

warn call TAC

15 generic SW error warn call TAC

19 unable to run test warn call TAC

20 wrong connectionrequest

warn call TAC

21 connection requestrejected

warn call TAC

35 mailbox not allocatederror

warn call TAC

36 unsuccessful responsefrom status manager error

warn call TAC

37 spare to prime initializa-tion

warn call TAC

38 prime to full initialization warn call TAC

46 message discarded warn call TAC

51 deleted current task warn call TAC



A30808-X3247-K220-4-7620 37


MMN:BSC

52 system restart warn call TAC

69 AP error report warn call TAC

71 AP error indication warn call TAC

76 AP connection not active warn call TAC

78 AP connection statusfault

warn call TAC

80 AP inconsistency warn call TAC

92 AP no radio channel warn call TAC

101 AP not updated warn call TAC

111 AP confusion warn call TAC

115 MEMT semaphorelocked

major "3.1 Diagnostic Procedure"on PPXX,TDPC card

131 CTR Generic message warn call TAC

136 invalid message toPSOS

warn call TAC

137 invalid send message inRTE

warn call TAC

138 invalid receivedmessage in RTE

warn call TAC

148 PSE error warn call TAC

149 invalid send message warn call TAC

150 invalid stream output warn call TAC

154 invalid close warn call TAC

178 TRAU alignment failed critical call TAC

179 BTSM failed alignment critical call TAC

220 bad software on periph-eral card

minor PPXL/PPXU/PPCU/PPCC/PPLD firmware/version

222 AP Trace error notifica-tion

warn call TAC

229 bring up activerequested

warn restart request

240 report incompleted warn call TAC

248 PPXX device handlerinter processor communica-tion semaphore locked

minor "3.1 Diagnostic Procedure"on PPXX card



38 A30808-X3247-K220-4-7620


250 IMSI trace genericmessage

warn call TAC

255 full initializationoccurred

warn call TAC

256 bring up initializationoccurred

warn call TAC

274 PCU alignment failure critical "3.1 Diagnostic Procedure"on MPCC card

303 notified GBIC configu-ration mismatch

warn call TAC

309 AP nofree PDT warn call TAC

310 notified GPRS prehem-tion

warn call TAC

314 deleted current tasklowinit

warn call TAC

315 deleted current taskuppinit

warn call TAC

322 SDSM SM databasenot aligned

warn call TAC

323 SDSM database notaligned

warn call TAC

324 another operation is inprogress

warn call TAC

326 download failed warn call TAC

327 file unusable warn call TAC

332 wrong processor copy warn call TAC

339 file missing minor call TAC

319 invalid status warning warn call TAC

340 buffer not found warn call TAC

SW program abnormallyterminated

14 task aborted by system warn call TAC

238 unable to initialize critical "3.1 Diagnostic Procedure"on MPCC card

246 AP trace error notifica-tion abnormal termination

warn call TAC

Storage capacity error



A30808-X3247-K220-4-7620 39


MMN:BSC

6 intereworking commandtable error

warn call TAC

123 Temperature unaccept-able

major environment/detectors

Underlying resource notavailable

warn call TAC

8 file already in use warn call TAC

61 AP no channel present warn call TAC

62 AP no free channels warn call TAC

63 AP no free connections warn call TAC

64 AP no free instance warn call TAC

65 AP no handover refer-ence

warn call TAC

104 unavailable radiosignalling channelsthreshold minor

minor SDCCH channels out ofservices: call TAC

118 unavailable radiosignalling channelsthreshold major

major call TAC

156 unavailable radiosignalling channelsthreshold critical

critical call TAC

164 unavailable abis TCHthreshold minor

minor call TAC

165 unavailable abis TCHthreshold major

major call TAC

166 unavailable abis TCHthreshold critical

critical call TAC

225 unavailable AINTT TCHthreshold minor

minor call TAC

226 unavailable AINTT TCHthreshold major

major call TAC

227 unavailable AINTT TCHthreshold critical

critical call TAC

230 MPCC outage critical power supply cards "3.6 MPCC"

231 TDPC outage critical power supply cards "3.19 TDPC"

233 MEMT outage critical power supply cards "3.5 MEMT"

234 DISK outage critical power supply cards "3.2 DISK"



40 A30808-X3247-K220-4-7620


235 IXLT outage critical power supply cards "3.4 IXLT"

236 NTW outage critical power supply cards "3.7 NTW Procedure"

241 EPWR outage critical power supply cards "3.14 PWRS (PWRD orEPWR)"

242 PPCC outage critical power supply cards "3.9 PPCC"

244 AP trace error notifica-tion unavailability

warn call TAC

247 functionality lost critical BTS object in DISABLE state :call TAC

251 syne outage critical external synchronisation signal "3.8 PLLH"

253 SS7S failure minor "3.9 PPCC"/"3.12 PPXL"

258 OMAL outage critical power supply cards

259 CBCL outage critical

260 X25 outage critical x25 links "3.4 IXLT"

Version mismatch

7 software not aligned critical SW version

288 IXLT card reset critical SW version



A30808-X3247-K220-4-7620 41


MMN:BSC

2 Tasklist

2.1 Preventive Maintenance

No preventive maintenance is required for the BSC.

2.2 Cleaning the RackDust and dirt can cause troubles to the hardware. Make sure that the contents of the BSC rack are clean.Use a dry brush to remove dust.

2.3 Replaceable FusesElectrical data of fuses that can be replaced are the following:

Mechanical dimensions are the same for all types of fuses: 5 mm (0.2”) (diameter) x 20 mm (0.79”)(length)

DATA TYPE OF FUSE

Rated Current 1 A 10A

Voltage Drop 200 mV 200 mV

Breaking Capacity 35 A/ 250 V / 50 Hz 500 A / 250 V / 50 Hz

Fuse Type quick quick

Rated Voltage 250 Vmax 250 Vmax

Tab. 2.1 Fuse Electrical Data

42 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 43


MMN:BSC

3 Fault Clearance Procedures for Modules andInterfaces

44 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 45


MMN:BSC

3.1 Diagnostic Procedure

Start Test Procedure (this procedure is called by several of the xxx procedures).

The Start Test command activates the diagnostics on the referred object. As a result, upto four potentially faulty modules are specified. These are indicated as xxx Module n inthe reported test output. The first reported module has a 95 % likelihood originating thefault.

1 Lock the module (i.e MPCC module)

b Enter the following command:

System Response:LOCK MPCC ACK:NAME=MPCC:<Instance>

iThe object under test must be in Locked state (except Power module)

The

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> MPCC

Command: LOCK MPCC

Name: MPCC:<instance>

Submit

LOCK MPCC:NAME=MPCC:<instance>;

46 A30808-X3247-K220-4-7620


2 Start the Test


It is possible to perform a test on the single module. The LMT tree is thefollowing:

If the test has been activated on a faulty moduleOtherwise return to the calling procedure.

h...5

3 System Response 1 - Faulty Module

START TEST FAIL: Go to “Replace Module xxx” procedure

4 System Response 2 - Working Module

START TEST PASS: Exit to calling

5 Record the Reported Additional Info

The Additional Info fields report data useful to the factory to locate the faultycomponent on the substituted board.

END


Command: PERFTEST BSCE


Attributes: MORT = <pathname> where path-name=DISK,DK40,EPWR,IXLT,LICD,LICDS,MEMT,MPCC,NTW,PPCC,PPCU,PPLD,PPXU,PPXL,PWRD,TDPC

Submit

Perftest BSCE:NAME=<instance>,MORT=<pathname>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> module wheremodule=DISK,DK40,EPWR,IXLT,LICD,LICDS,MEMT,MPCC,NTW,PPCC,PPCU,PPLD,PPXU,PPXL,PWRD,TDPC,

Command: PERFTEST module

Name: module:<instance>

Submit

Perftest module:NAME=<module>:<instance>;

iThe System output depends on the fact that the test is activated on a faulty (Response1) or working (Response 2) module.

A30808-X3247-K220-4-7620 47


MMN:BSC

3.2 DISK

1 Lock the Module before Substitution


System Response:LOCK ACK DISK:NAME=DISK:<Instance>

2 Lock the card related DK40 or MPCC in which the disk takes place


System Response:LOCK ACK DK40/MPCC:NAME=DK40/MPCC:<Instance>

3 Lock the PWRS (Module Y) Corresponding to the Module to Replace


!If you add one or more cards without EPROM on board, the file containing thenob_RIU objects must be modified, by means of the IDF Editor Tool, and then down-loaded by the LMT (see "3.16 Remote Inventory Data").

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DISK

Command: LOCK DISK

Name: DISK:<instance>

Submit

LOCK DISK:NAME=DISK:<instance>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40/MPCC

Command: LOCK DK40 orLOCK MPCC

Name: DK40/MPCC:<instance>

Submit

LOCK DK40/MPCC:NAME=DK40/MPCC:<instance>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PWRD/EPWR

Command: LOCK PWRD orLOCK EPWR

Name: PWRD/EPWR:<Y>

Attributes: None

48 A30808-X3247-K220-4-7620


System Response:LOCK ACK:NAME=PWRS:Y

4 Pull down the OFF REQ Switch on the PWRS Module Y

System Response:SYSTEMINFOREPORT:NAME=PWRS:YINFORMATION IDENTIFIER=POWER KEYLOCK SWITCH OFF

The red LED on module PWRS is switched on, if power is switched off.

5 Replace the Module

6 Pull up the OFF REQ Switch on PWRS Module Y

System Response:SYSTEM INFOREPORT:NAME=PWRS:YINFORMATIONIDENTIFIER:POWER KEYLOCK SWITCH ON

7 Unlock the PWRS (Module Y) Corresponding to the Module to Replace


Submit

LOCK PWRD/EPWR:<Y>;

iThe modules connected to the PRWS-Y which has been switched off are put into the"disabled" state.

iIf the PWRS module Y is not in the locked state, it will not switch off.

!Follow the recommended instructions (see "1.5 Module ReplacementInstructions") and according to the rack structure (see "4 Hardware Equip-ment")

iThe modules connected to PWRS-Y (which has been switched on) remain in a"disabled dependency" state because PWRS-Y is LOCKED.


Command: UNLOCK PWRD orUNLOCK EPWR

Name: PWRD/EPWR:<instance>

Attributes: None

A30808-X3247-K220-4-7620 49


MMN:BSC

System Response:UNLOCK ACK:NNAME=PWRS:Y

8 Start the Test on DISK Module



If the start test pass. h...10

If the test result is FAIL and another module is in alarmed status and notreplaced yet, reinsert the old replaced module, because it’s possible the fault isin other part. h...END

Submit

UNLOCK PWRD/EPWR:NAME=<instance>;

iAfter the PWRS-instance is “unlocked” the system puts into an “enabled” state allmodules connected to the PRWS-Y into an “enabled” state and executes the crosscopyof MPCC, TDPC and DISK and the loading of IXLT (Load from disk).




Attributes: MORT = DISK:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<DISK:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> DISK

Command: PERFTEST DISK


Submit

Perftest DISK:NAME=DISK<copy>;

50 A30808-X3247-K220-4-7620


9 Start the Test on DK40/MPCC Module





10 Unlock the DISK


System Response:UNLOCK ACK DISK:NAME=DISK:<Instance>

Result:The hard disk is formatted, crosscopied and unlocked automatically by thesystem.




Attributes: MORT = DK40/MPCC:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<DK40/MPCC:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> DK40/MPCC

Command: PERFTEST DK40/MPCC


Submit

Perftest DK40/MPCC:NAME=DK40/MPCC<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DISK

Command: UNLOCK DISK


Attributes: None

Submit

UNLOCK DISK:NAME=DISK:<instance>;

A30808-X3247-K220-4-7620 51


MMN:BSC

11 Unlock the DK40/MPCC


System Response:UNLOCK ACK DK40/MPCC:NAME=DK40/MPCC:<Instance>

Result:The hard DK40/MPCC is formatted, crosscopied and unlocked automatically bythe system.

12 Update the RI file

Edit the RI-data by the IDF Editor Tool , update the Nob_Riu object file, exportand then download into BSC. h... "3.16 Remote

Inventory Data"

END. Return to the calling procedure.

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40/MPCC

Command: UNLOCK DISK


Attributes: None

Submit

UNLOCK DK40/MPCC:NAME=DK40/MPCC:<instance>;

52 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 53


MMN:BSC

3.3 DK40

This procedure is for the DK40 card without the disc (the disc takes place in MPCCcard).

If the disc is on the DK40 refer to DISK procedure.



System Response:LOCK ACK DK40:NAME=DK40:<Instance>





LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40

Command: LOCK DK40

Name: DK40:<instance>

Submit

LOCK DK40:NAME=DK40:<instance>;



Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;


54 A30808-X3247-K220-4-7620

















Attributes: None

Submit



A30808-X3247-K220-4-7620 55


MMN:BSC

7 Start the Test on DK40 Module





8 Unlock the DK40


System Response:UNLOCK ACK DK40:NAME=DK40:<Instance>

Result:The hard disk is formatted, crosscopied and unlocked automatically by thesystem.




Attributes: MORT = DK40:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<DK40:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> DK40

Command: PERFTEST DK40


Submit

Perftest DK40:NAME=DK40<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> DK40

Command: UNLOCK DK40


Attributes: None

Submit

UNLOCK DK40:NAME=DK40:<instance>;

56 A30808-X3247-K220-4-7620



Edit the RI-data by the IDF Editor Tool , update the Nob_Riu object file, exportand then download into BSC. h..."3.16 Remote

Inventory Data"


A30808-X3247-K220-4-7620 57


MMN:BSC

3.4 IXLT

1 Check the cables



System Response:Lock ACK IXLT:NAME=IXLT:<Instance>




!If the alarm originates from Line Interface Card (LICD) as DTLP or QTLP, and thealarm is “LOSS OF SIGNAL” or “LOSS OF SIGNAL ON LINK A/B”, in detail “signalabsent (LOS)”, LFA alarm present”, “eer alarm present (BER)”, “RAI alarm present”,check the jumpers on the faulty card are conforming the line impedence requirement(see "4.8 Jumpers setting") ; check also that the cable connector concerning the linenumber in failure state is correctly inserted and not damaged (see IMN:BSC manual).These alarm conditions are shown by LINE/HWI led in the Lamp Alarm Panel and onthe QTLP front led as the table of Fig. 4.34. If the alarm originates from Interface IXLTas “Communication Failure Event”, check the X25 cable connector (W3 on the toprack) is correctly inserted and not damaged

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> IXLT

Command: LOCK IXLT

Name: IXLT:<instance>

Submit

Lock IXLT:NAME=IXLT:<instance>;



Name: PWRD/EPWR:<Y>

Attributes: None

58 A30808-X3247-K220-4-7620











Submit

LOCK PWRD/EPWR:<Y>;








Attributes: None

A30808-X3247-K220-4-7620 59


MMN:BSC


8 Start the Test on IXLT Module





Submit






Attributes: MORT = IXLT:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<IXLT:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> IXLT

Command: PERFTEST IXLT


Submit

Perftest IXLT:NAME=IXLT<copy>;

60 A30808-X3247-K220-4-7620


9 Unlock the Module after Substitution


System Response:UNLOCK ACK IXLT:NAME=IXLT:<Instance>


LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> IXLT

Command: UNLOCK IXLT


Attributes: None

Submit

UNLOCK IXLT:NAME=IXLT:<instance>;

IXLT software upload will take about 3 4 min.

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MMN:BSC

3.5 MEMT



System Response:LOCK ACK MEMT:NAME=MEMT:<Instance>





!If you add one or more cards without EPROM on board, the file containg the nob_RIUobjects must be modified, by means of the IDF Editor Tool, and then downloaded bythe LMT (see "3.16 Remote Inventory Data").

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MEMT

Command: LOCK MEMT

Name: MEMT:<instance>

Submit

LOCK MEMT:NAME=MEMT:<instance>;



Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;



62 A30808-X3247-K220-4-7620




4 Disconnect the hot link and the hard disk connections between MPCCcopy 0 and copy 1


6 Connect the hot link and the hard disk connections between MPCC copy 0and copy 1










Attributes: None

Submit



A30808-X3247-K220-4-7620 63


MMN:BSC


9 Start the Test on MEMT Module








Attributes: MORT = MEMT:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<MEMT:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> MEMT

Command: PERFTEST MEMT


Submit

Perftest MEMT:NAME=MEMT<copy>;

64 A30808-X3247-K220-4-7620



In this phase, there's an alignment between the two MEMTs that will take about5 seconds.


System Response:UNLOCK ACK MEMT:NAME=MEMT:<Instance>


LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MEMT

Command: UNLOCK MEMT


Attributes: None

Submit

UNLOCK MEMT:NAME=MEMT:<instance>;

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MMN:BSC

3.6 MPCC

This procedure is for the MPCC card without the disc (the disc takes place in DK40card).

If the disc is on the MPCC refer to DISK procedure.



System Response:LOCK ACK MPCC:NAME=MPCC:<Instance>





LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MPCC

Command: LOCK MPCC


Submit

LOCK MPCC:NAME=MPCC:<instance>;



Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;


66 A30808-X3247-K220-4-7620






Before extracting the module, the hot link cable must be unplagged and tuckedout of the way.











Attributes: None

Submit



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MMN:BSC


7 Start the Test on MPCC Module








Attributes: MORT = MPCC:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<MPCC:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> MPCC

Command: PERFTEST MPCC


Submit

Perftest MPCC:NAME=MPCC<copy>;

68 A30808-X3247-K220-4-7620




After the unlock command has been executed the system starts the MPCCcrosscopy (it will take about 5 min). In case of system fault after the crosscopy,try to repeat Step 5.

System Response:UNLOCK ACK MPCC:NAME=MPCC:<Instance>



Inventory Data"


LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> MPCC

Command: UNLOCK MPCC


Attributes: None

Submit

UNLOCK MPCC:NAME=MPCC:<instance>;

A30808-X3247-K220-4-7620 69


MMN:BSC

3.7 NTW Procedure

(This procedure is called by several of the xxx procedures).

NTW element is a logical object including the following modules:

– PLLH

– UBEX

– SN16 or SNAP

If one of these modules is faulty, the whole NTW element is alarmed. Further troubleson any of the above modules (same copy) are not notified, since the NTW element oper-ates as a unit from the maintenance point of view. Perform the following steps.

1 Lock the NTW


System Response:LOCK NTW ACK:NAME=NTW:<Instance>

2 Start the Test on NTW Module



LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> NTW

Command: LOCK NTW

Name: NTW:<instance>

Submit

LOCK NTW:NAME=NTW:<instance>;




Attributes: MORT = NTW:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<NTW:copy>;


Command: PERFTEST NTW


70 A30808-X3247-K220-4-7620


3 Result of Diagnostic

If the suspected module is PLLH h...PROC: PLLH

If the suspected module is UBEX h...PROC: UBEX

If the suspected module is SN16 h...PROC: SN16

If the suspected module is SNAP h...PROC: SNAP

END of NTW Procedure

Submit

Perftest NTW:NAME=NTW<copy>;

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MMN:BSC

3.8 PLLH

This procedure requires execution of the NTW Procedure as a preliminary step.

Otherwise enter a lock NTW command before replacing the module.











Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;



!Follow the recommended instructions (see "1.5 Module Replacement Instructions") andaccording to the rack structure (see "4 Hardware Equipment")

72 A30808-X3247-K220-4-7620







6 Wait at least 15 minutes (warming-up period) before going to next step.

The same precaution must be taken in the event of recovery after a powersupply failure.





Attributes: None

Submit



A30808-X3247-K220-4-7620 73


MMN:BSC





h...PROC: NTWProcedure





Submit





Submit


iIf the test result is FAIL repeat the following step:- power off the PWRS module- reinsert the old replaced module- power on the PWRS module- go to step 3 of the NTW Procedure

74 A30808-X3247-K220-4-7620


8 Unlock the NTW


System Response:UNLOCK ACK NTW:NAME=NTW:<Instance>


LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> NTW

Command: UNLOCK NTW


Attributes: None

Submit

UNLOCK NTW:NAME=NTW:<instance>;

A30808-X3247-K220-4-7620 75


MMN:BSC

3.9 PPCC

1 Lock the SS7L Link before locking the Module


System Response:LOCK ACK SS7L:NAME=SS7L:<Instance>



System Response:LOCK ACK PPCC:NAME=PPCC:<Instance>



LMT tree: MANAGED-ELEMENT--> BSS-FUNCTIONAL--> BSC--> SS7L

Command: LOCK SS7L

Name: SS7L:<instance>

Submit

LOCK SS7L:NAME=SS7L:<instance>;

iIf PPCC is disabled, this step is not necessary since the link is already out of service.Before entering the command, use the LMT command GETSUBO to verify that theSS7L is subordinate to the PPCC.

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCC

Command: LOCK PPCC

Name: PPCC:<instance>

Submit

LOCK PPCC:NAME=PPCC:<instance>;


76 A30808-X3247-K220-4-7620


4 Start the Test on PPCC Module





PPCC software upload will take about 30 sec.



System Response:UNLOCK ACK PPCC:NAME=PPCC:<Instance>




Attributes: MORT = PPCC:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<PPCC:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPCC

Command: PERFTEST PPCC


Submit

Perftest PPCC:NAME=PPCC<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCC

Command: UNLOCK PPCC


Attributes: None

Submit

UNLOCK PPCC:NAME=PPCC:<instance>;

A30808-X3247-K220-4-7620 77


MMN:BSC

6 If the SS7L has been locked, unlock it


System Response:UNLOCK ACK SS7L:NAME=SS7L:<Instance>



Inventory Data"


LMT tree: MANAGED-ELEMENT--> BSS-FUNCTIONAL--> BSC--> SS7L

Command: UNLOCK SS7L

Name: SS7L:<instance>

Attributes: None

Submit

UNLOCK SS7L:NAME=SS7L:<instance>;

78 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 79


MMN:BSC

3.10 PPCU

1 Lock the Module before Subsitution


System Response:LOCK ACK PPCU:NAME=PPCU:<instance>


!If you add one or more cards without EPROM on board, the file containing the nob-RIUobjects must be modified, by means of the IDF Editor Tool, and then downloaded bythe LMT (see "3.16 Remote Inventory Data").

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCU

Command: LOCK PPCU

Name: PPCU:<instance>

Submit

LOCK PPCU:NAME=PPCU:<instance>;


80 A30808-X3247-K220-4-7620


3 Start the Test on PPCU Module





PPCU FW self-test will take about 10 seconds; the software load will take about2 minutes.



System Response:UNLOCK ACK PPCU:NAME=PPCC:<Instance>





Attributes: MORT = PPCU:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<PPCU:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPCU

Command: PERFTEST PPCU


Submit

Perftest PPCU:NAME=PPCU<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPCU

Command: UNLOCK PPCU


Attributes: None

Submit

UNLOCK PPCC:NAME=PPCC:<instance>;

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MMN:BSC

3.11 PPLD



System Response:LOCK ACK PPLD:NAME=PPLD:<Instance>



LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPLD

Command: LOCK PPLD

Name: PPLD:<instance>

Submit

LOCK PPLD:NAME=PPLD:<instance>;


82 A30808-X3247-K220-4-7620


3 Start the Test on PPLD Module





The PPLD software upload will take about 30 sec.



System Response:UNLOCK ACK PPLD:NAME=PPLD:<Instance>




Attributes: MORT = PPLD:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<PPLD:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPLD

Command: PERFTEST PPLD


Submit

Perftest PPLD:NAME=PPLD:<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPLD

Command: UNLOCK PPLD


Attributes: None

Submit

UNLOCK PPLD:NAME=PPLD:<instance>;

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MMN:BSC



Inventory Data"


84 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 85


MMN:BSC

3.12 PPXL



System Response:LOCK ACK PPXL:NAME=PPXL:<Instance>



LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXL

Command: LOCK PPXL

Name: PPXL:<instance>

Submit

LOCK PPLD:NAME=PPXL:<instance>;


86 A30808-X3247-K220-4-7620


3 Start the Test on PPXL Module







System Response:UNLOCK ACK PPXL:NAME=PPXL:<Instance>





Attributes: MORT = PPXL:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<PPXL:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPXL

Command: PERFTEST PPXL


Submit

Perftest PPXL:NAME=PPXL<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXL

Command: UNLOCK PPXL


Attributes: None

Submit

UNLOCK PPXL:NAME=PPXL:<instance>;

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MMN:BSC

3.13 PPXU



System Response:LOCK ACK PPXU:NAME=PPXU:<Instance>



LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXU

Command: LOCK PPXU

Name: PPXU:<instance>

Submit

LOCK PPXU:NAME=PPXU:<instance>;


88 A30808-X3247-K220-4-7620


3 Start the Test on PPXU Module







System Response:UNLOCK ACK PPXU:NAME=PPXU:<Instance>





Attributes: MORT = PPXU:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<PPXU:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> PPXU

Command: PERFTEST PPXU


Submit

Perftest PPXU:NAME=PPXU:<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> PPXU

Command: UNLOCK PPXU


Attributes: None

Submit

UNLOCK PPXU:NAME=PPXU:<instance>;

A30808-X3247-K220-4-7620 89


MMN:BSC

3.14 PWRS (PWRD or EPWR)

Notes:

• PWRS refers to the Power Supply module to be replaced; From a hardware point ofview, the four power suppliers in the BSC Rack are referred to as PWRS modules.From a software point of view (LMT interface), the power suppliers in the BSC Rackare called:

– PWRD 0..1 (PWRS modules for the Base Rack)

– EPWR 0..1 (PWRS modules for the Extension Rack)it can be either a PWRD or a EPWR module, depending on the rack area - Base orExtended that it belongs to.

• If an EPWR is alarmed, first check whether the opposite IXLT is working (the HWsense points supervising the EPWR are residing on the opposite IXLT copy). If theIXLT copy is inaccessible, the opposite copy of EPWR cannot be initialized after aFULL INIT.If the IXLT copy is inaccessible and the opposite EPWR is powered down, it is notrecognized by the system because the sense points on the IXLT cannot be read andthe EPWR remains in the enabled state even though it is powered off. Avoidpowering off an EPWR when the opposite IXLT is faulty.







Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;


90 A30808-X3247-K220-4-7620





3 Switch off the PWRS Module by pressing the red button. Use a pointedtool such as a pencil

System Response:1. All the lamps on the module switch off.


5 Switch on the PWRS module by pressing the black "OI" switch

System Response:The red lamp on the module switches on.











Attributes: None

A30808-X3247-K220-4-7620 91


MMN:BSC




Inventory Data"


Submit



92 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 93


MMN:BSC

3.15 QTLP

1 Check the cables



System Response:LOCK ACK LICD:NAME=LICD:<Instance>



!If the alarm originates from Line Interface Card (LICD) as DTLP or QTLP, and thealarm is “LOSS OF SIGNAL” or “LOSS OF SIGNAL ON LINK A/B”, in detail “signalabsent (LOS)”, LFA alarm present”, “eer alarm present (BER)”, “RAI alarm present”,check the jumpers on the faulty card are conforming the line impedence requirement(see "4.8 Jumpers setting") ; check also that the cable connector concerning the linenumber in failure state is correctly inserted and not damaged (see IMN:BSC manual).These alarm conditions are shown by LINE/HWI led in the Lamp Alarm Panel and onthe QTLP front led as the table of Fig. 4.34. If the alarm originates from Interface IXLTas “Communication Failure Event”, check the X25 cable connector (W3 on the toprack) is correctly inserted and not damaged

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> LICD

Command: LOCK LICD

Name: LICD:<instance>

Submit

LOCK LICD:NAME=LICD:<instance>;


94 A30808-X3247-K220-4-7620


4 Start the Test on LICD Module







System Response:UNLOCK ACK LICD:NAME=LICD:<Instance>




Attributes: MORT = LICD:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<LICD:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> LICD

Command: PERFTEST LICD


Submit

Perftest LICD:NAME=LICD<copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> LICD

Command: UNLOCK LICD


Attributes: None

Submit

UNLOCK LICD:NAME=LICD:<instance>;

A30808-X3247-K220-4-7620 95


MMN:BSC



Inventory Data"


96 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 97


MMN:BSC

3.16 Remote Inventory Data

For every rack, the RLC provides one floppy disk which includes an inventory data filethat contains all the inventory objects belonging to the rack.The file name is composed of the serial number of the rack (where “/” is replaced by “_”)with the extension “IDF”.

In case of a nob_RIU, the inventory data can be directly managed by the Operator usingthe IDF Editor and performing the following action:

– Delete nob_RIU record (see Fig. 3.1)

– Create nob_RIU record (see Fig. 3.2)

– Edit nob_RIU record (see Fig. 3.3)

– Attach a nob_RIU file (see Fig. 3.4)

Fig. 3.1 Delete nob_Record

iIn case of a new ob_RIU object installation, the system automatically provides theinventory data after the physical recovery of the module. No inventory data administra-tion is reguired. Upload the latest version of the IDF for backup purposes.

98 A30808-X3247-K220-4-7620


Fig. 3.2 Create nob_Record

Fig. 3.3 Edit nob_Record

A30808-X3247-K220-4-7620 99


MMN:BSC

Fig. 3.4 Attach nob_RIU file

The nob_RIU available for BSC are listed in the following table:

FunctionalAddress

FunctionalAddress Type

BSC-FRAME_0 F:BSCB

BSC-FRAME_1 F:BSCEB

BSC-RACK R:BSC

DK40-0 M:DK40

EARTHQUAKE-0 MK:EQ4

EPWR-0 M:PWRS

EPWR-1 M:PWRS

FIREPROT-0 MK:FG

MKNEWBSC-0 MK:NEWBSC

MKOLDBSC-0 MK:OLDBSC

MPCC-0 M:MPCC

MPCC-1 M:MPCC

PPCC-0 M:PPCC

PPCC-1 M:PPCC

PPLD-0 M:PPLD

Tab. 3.1 List of nob_RIUs for BSC Standard

100 A30808-X3247-K220-4-7620


PPLD-1 M:PPLD

PPLD-10 M:PPLD

PPLD-11 M:PPLD

PPLD-12 M:PPLD

PPLD-13 M:PPLD

PPLD-14 M:PPLD

PPLD-2 M:PPLD

PPLD-3 M:PPLD

PPLD-4 M:PPLD

PPLD-5 M:PPLD

PPLD-6 M:PPLD

PPLD-7 M:PPLD

PPLD-8 M:PPLD

PPLD-9 M:PPLD

PWRS-0 M:PWRS

PWRS-1 M:PWRS

FunctionalAddress


Tab. 3.1 List of nob_RIUs for BSC Standard

FunctionalAddress


BSC-FRAME_0 F:BSCB

BSC-FRAME_1 F:BSCEB

BSC-RACK R:BSC

EARTHQUAKE-0 MK:EQ4

FANB FANB

FIREPROT-0 MK:FG

MKNEWBSC-0 MK:NEWBSC

MKOLDBSC-0 MK:OLDBSC

MPCC-0 M:MPCC

MPCC-1 M:MPCC

PWRS-0 M:PWRS

PWRS-1 M:PWRS

Tab. 3.2 List of nob_RIUs for BSC High Capacity

A30808-X3247-K220-4-7620 101


MMN:BSC

1 Upload local IDT from the BSC

The user must enter the "Upload local idf file" command in order to create alocal copy of the file on the local LMT.


2 Open IDT File

Start the IDF Editor from the LMT window and open the uploaded IDT file byselecting "File --> Open" menù.

To delete a nob_Record h...3To create a new nob_Record h...4To attach a nob_RIU file h...5To edit the RI-data from the replaced Unit h...6

3 Delete a nob_Record

Select the S-Record, open the "Delete" dialog box by clicking the right mousebutton to delete the S-Record.

☞ ......Fig. 3.1

If no additional modifications are necessary h...7

4 Create a new nob_Record

Select the N-Record, open the "Create" dialog box by clicking the right mousebutton and create a new nob_RIU object.

☞ ......Fig. 3.2

If no additional modifications are necessary h...7

LMT tree: MANAGED-ELEMENT--> BSS EQUIPMENT--> REMINV

Command: UPLLIDF REMINV

Name REMINV=<instance>

Attributes: DESTDIR = <..\idf\upload>

FILE = bsc.idt

OVERWRITE = <overwrite>

Submit

UPLLIDF REMINV:NAME=<instance>DESTDIR=<destdir>,FILE=”bsc01_1.idt”,OVERWRITE=YES;

102 A30808-X3247-K220-4-7620


5 Attach nob_RIU file to actually loaded IDF or IDT

b To create a new nob_RIU file coming from the RLC disk, enter the followingcommand:

☞ ......Fig. 3.4

6 Edit the RI-data from the replaced Unit

Start the IDF-Editor and open the uploaded IDT file by selecting <File: Open>.

The following window appears, and all the RI-records are displayed. Thenob_RIU records are shown in bold letters.

Move the mouse cursor to the I-record to be updated and press the right mouse-button. The edit functionality is activated.

☞ ......Fig. 3.3

7 Remove all redundant nob_RIUs

After importing IDFs coming from the RLC or after replacing a card originally anob_RIU against another card, now having inventory data on board, the sameboard would be reported twice.


This command can be applied only for IDFs with inventory of only one BSC. Itcannot be used for central IDF´s.

Command: <File: Attach>

Input: <NOB file to be attached>

Result: The inventory objects of the <NOB file to be attached> areattached to the actually loaded IDF or IDT. The number ofattached objects is displayed after command execution.

Command: <File: Remove nob_RIUs>

Input: <none>

A30808-X3247-K220-4-7620 103


MMN:BSC

8 Export nob_RIU file


A copy of this NOB file is saved in the C:\LMT_root\..\idf\download directory,where it can be accessed only by the LMT during execution of the "Downloadnob_RIU" command.

The command is only applicable for IDFs with an inventory of one NE. It cannotbe applied to central IDFs. The filename is BSCNRIU for the BSC.

9 Download of the nob_RIU file

This step must be executed to transfer the file modified on the local LMT to theBSC.


END

Command: <Export: NOB>

Input: <new filename>(default filename is retained from the "SalesUniqueName" field ofthe IDF)

Result: nob_RIU part of the modified IDF/IDT is saved for furtherprocessing

LMT tree: MANAGED-ELEMENT--> BSS EQUIPMENT--> BSCE --> REMINV

Command: DNLIDFD REMINV

Name: REMINV=<instance>

Attributes: SRCDIR = <..\idf\download>

Submit

DNLIDFD REMINV:NAME=REMINV:<instance>,SRCDIR=<..\idf\download>;

104 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 105


MMN:BSC

3.17 SN16


Otherwise add a lock NTW command before replacing the module.








!If you add one or more cards without EPROM on board, the file containig the nob_RIUobjects must be modified, by means of the IDF Editor Tool, and then downloaded bythe LMT (see "3.16 Remote Inventory Data").



Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;




106 A30808-X3247-K220-4-7620











Attributes: None

Submit



A30808-X3247-K220-4-7620 107


MMN:BSC






7 Unlock the NTW







Submit





Submit




Command: UNLOCK NTW


Attributes: None

Submit


108 A30808-X3247-K220-4-7620




Inventory Data"


A30808-X3247-K220-4-7620 109


MMN:BSC

3.18 SNAP


Otherwise enter the lock NTW command before replacing the module.











Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;




110 A30808-X3247-K220-4-7620


4 Disconnect the hot link and the hard disk connections between TDPCcopy 0 and copy 1






7 Connect the hot link and the hard disk connections between TDPC copy 0and copy 1





Attributes: None

Submit



A30808-X3247-K220-4-7620 111


MMN:BSC










Submit





Submit



112 A30808-X3247-K220-4-7620


9 Unlock the NTW





Command: UNLOCK NTW


Attributes: None

Submit


A30808-X3247-K220-4-7620 113


MMN:BSC

3.19 TDPC



System Response:LOCK ACK TDPC:NAME=TDPC:<Instance>




iAt least one MEMT copy must be enabled; therefore, activation might be necessaryprior to starting this procedure. For the second TDPC, the usual procedure can beapplied, see below.


LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> TDPC

Command: LOCK TDPC

Name: TDPC:<instance>

Submit

LOCK TDPC:NAME=TDPC:<instance>;



Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;


114 A30808-X3247-K220-4-7620





4 Replace the module

Before extracting the module the hot link cable must be unplugged and tuckedout of the way.

5 Pull up the OFF REQ Switch on PWRS (Module Y) Corresponding to theModule to Replace


6 Unlock the PWRS module Y








Attributes: None

Submit



A30808-X3247-K220-4-7620 115


MMN:BSC


7 Start the Test on TDPC Module








Attributes: MORT = TDPC:copy

Submit

Perftest BSCE:NAME=<instance>,MORT=<TDPC:copy>;

LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE --> TDPC

Command: PERFTEST TDPC


Submit

Perftest TDPC:NAME=TDPC:<copy>;

116 A30808-X3247-K220-4-7620




After the unlock command has been executed, the system starts the TDPCcrosscopy (it will take about 5 min). In the event of system fault after the cross-copy, repeat Step 5.

System Response:UNLOCK ACK TDPC:NAME=TDPC:<Instance>


LMT tree: MANAGED-ELEMENT--> BSS-EQUIPMENT--> BSCE--> TDPC

Command: UNLOCK TDPC


Attributes: None

Submit

UNLOCK TDPC:NAME=TDPC:<instance>;

A30808-X3247-K220-4-7620 117


MMN:BSC

3.20 UBEX


Otherwise, enter the lock NTW command before replacing the module.











Name: PWRD/EPWR:<Y>

Attributes: None

Submit

LOCK PWRD/EPWR:<Y>;




118 A30808-X3247-K220-4-7620











Attributes: None

Submit



A30808-X3247-K220-4-7620 119


MMN:BSC










Submit





Submit



120 A30808-X3247-K220-4-7620


7 Unlock the NTW





Command: UNLOCK NTW


Attributes: None

Submit


A30808-X3247-K220-4-7620 121


MMN:BSC

4 Hardware Equipment

BSC rack layout

The BSC is available in the following configuration:

base subrack (BSCB) and expansion subrack (BSCE).

Fig. 4.1 identifies the regular capacity BSC rack image, both for the base and the exten-sion subracks.

Fig. 4.2 identifies the regular capacity BSC rack image for the GPRS feature.

Fig. 4.3 identifies the high capacity BSC rack image, both for the base and the exten-sion subracks.

Fig. 4.4 identifies the high capacity BSC rack image in fire resistence version, both forthe base and extension subracks.

Fig. 4.5 identifies the high capacity BSC - 120 channels rack image, both for the baseand the extension subracks.

The expansion subrack is shown in the maximum configuration.

122 A30808-X3247-K220-4-7620


Fig. 4.1 Regular capacity BSC - Rack Layout and Size

18 23 27 42 46 50 54 58 62

PPLD14

PPLD13

PPLD12

PPLD11

PPLD10

PPLD9

18 23 27 42 46 50 54 58 62

PPLD7

PPLD6

PPLD5

PPLD4

PPLD3

P

WRS

0

P

WRS

1

3 31 35 71

18

PPLH

25 29 43 48 53 58 63 71

0

12

IXLT

17 25 3944 54586368

0

UBEX0

P

WRS

0

2 3034 71

D

K40

0

P

WRS

1

PPCC

38333

10

PPCC0

PPLD2

PPLD1

PPLD0

PLLH1

SNXX0

TDPC0

MEMT0

MPCC0

MPCC1

MEMT1

TDPC1

SNXX1

UBEX1

IXLT1

20 49

2000600

Rack dimensions:

Width

Volume

=

300mmmm

mm

Card dimensions:

220 x 278 mm

Weight = 128 Kg

Notes:s= spare, for N+1 redundancy

SNXX = SN16

Height

Depth

=

==

0,260 m3

= QTLP

T

A

B

C

E

D

G

LP

BSCE

BFAP

BSCB

O

F

A

F

OPDS

LICD8

LICD7

LICD6

LICD5

LICD4

LICD3

LICD2

LICD

PPLD8

LICD1

LICD0

LICDS

S1

LICD

A30808-X3247-K220-4-7620 123


MMN:BSC

Fig. 4.2 Regular capacity BSC frame for the GPRS feature

18 23 27 42 46 50 54 58 62

PPCU1

18 23 27 42 46 50 54 58 62

PPLD6

PPLD5

PPLD4

PPLD3

P

WRS

0

P

WRS

1

3 31 35 71

18

PLLH

25 29 43 48 53 58 63 71

0

12

IXLT

17 25 3944 54586368

0

UBEX0

P

WRS

0

2 3034 71

D

K40

0

P

WRS

1

PPCC

38333

1

PPCC0

PPLD2

PPLD1

PPLD0

PLLH1

SNXX0

TDPC0

MEMT0

MPCC0

MPCC1

MEMT1

TDPC1

SNXX1

UBEX1

IXLT1

20 49

38

PPCU0

18 23 27 42 46 50 54 58 62

PPCU1

PPCU3

18 23 27 42 46 50 54 58 62

PPCU2

PPLD6

PPLD5

PPLD4

PPLD3

P

WRS

0

P

WRS

1

3 31 35 71

18

PLLH

25 29 43 48 53 58 63 71

0

12

IXLT

17 25 3944 54586368

0

UBEX0

P

WRS

0

2 3034 71

D

K40

0

P

WRS

1

PPCC

38333

1

PPCC0

PPLD2

PPLD1

PPLD0

PLLH1

SNXX0

TDPC0

MEMT0

MPCC0

MPCC1

MEMT1

TDPC1

SNXX1

UBEX1

IXLT1

20 49

38

PPCU0

PPLD8

PPLD7

PPLD10

PPLD9

OPDSOPDS

LI

CD8

LICD7

LICD6

LICD5

LICD4

LICD3

LI

CD2

LI

CDS1

LICD1

LI

CD0

LI

CDS0

LICD1

LI

CD0

LI

CDS0

LICD5

LICD4

LICD3

LI

CD2

LI

CDS1

LI

CD8

LICD7

LICD6

124 A30808-X3247-K220-4-7620


Fig. 4.3 High Capacity BSC frame

18

QTLP

23 27 42 46 50 54 58 62

8

QTLP7

QTLP6

18

QTLP

23 27 42 46 50 54 58 62

5

QTLP4

QTLP3

QTLP2

QTLPS1

P

WRS

0

P

WRS

1

3 31 35 71

18

PLLH

25 29 43 48 53 58 63 71

0

12

IXLT

17 25 3944 54586368

0

UBEX0

P

WRS

0

2 3034 71

D

K40

0

P

WRS

1

PPXL

QTLPS

38333

10

QTLP0

QTLP1

PPXL0

PLLH1

SNAP0

TDPC0

MEMT0

MPCC0

MPCC1

MEMT1

TDPC1

SNAP1

UBEX1

IXLT1

20 49

38

PPXU0

PPXU1

PPXU2

PPXU3

PPXU5

PPXU4

T

A

B

C

E

G

LP

BSCE

BFAP

BSCB

O

F

A

F

D

H

OPDS

A30808-X3247-K220-4-7620 125


MMN:BSC

Fig. 4.4 High Capacity BSC in fire resistence cabinet version

18

QTLP

23 27 42 46 50 54 58 62

8

QTLP7

QTLP6

18

QTLP

23 27 42 46 50 54 58 62

5

QTLP4

QTLP3

QTLP2

QTLPS1

P

WRS

0

P

WRS

1

3 31 35 71

18

PLLH

25 29 43 48 53 58 63 71

0

12

IXLT

17 25 3944 54586368

0

UBEX0

P

WRS

0

2 3034 71

D

K40

0

P

WRS

1

PPXL

QTLPS

38333

10

QTLP0

QTLP1

PPXL0

PLLH1

SNAP0

TDPC0

MEMT0

MPCC0

MPCC1

MEMT1

TDPC1

SNAP1

UBEX1

IXLT1

20 49

38

PPXU0

PPXU1

PPXU2

PPXU3

PPXU5

PPXU4

T

A

B

C

E

G

LP

BSCE

BFAP

BSCB

O

F

A

F

D

H

OPDS

126 A30808-X3247-K220-4-7620


Fig. 4.5 High Capacity BC120HC (S30861-C36-X)

TLP7

STLP5

STLP4

STLP3

STLPS1

PLLH0

IXLT0

UBEX0

PWRS0

PWRS1

PPXL

STLPS 10

STLP0

STLP1

PPXL0

PLLH1

SNAP0

TDPC0

MEMT0

MPCC0

MPCC1

MEMT1

TDPC1

SNAP1

UBEX1

IXLT1

PPXU1

PPXU3

PPXU5

PPXU6

PPXU1

PPXU8

T

A

B

C

E

G

LP

BSCEB

BFAP

BSCB

F

D

STLP8

STLP9

STLP6

S PPXU1

PPXU9

PPXU7

01

PPXU2

PPXU4

PPXU0

STLP2

H

BC120 HC

A30808-X3247-K220-4-7620 127


MMN:BSC

!PWRS V4 is considered mandatory inside the BSC Expansion Rack in case of upgradeto High Capacity or in case of a new BSC HC field installation.

!It is implicitly assumed the usage of QTLP V2; this type of LICD indeed allows themaximum flexibility in the availability of PCM ports.

128 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 129


MMN:BSC

4.1 Rack Connections

Fig. 4.6 identifies the rack connection blocks.

Fig. 4.6 BSC Rack Connection Blocks

Tab. 4.1 identifies the correspondence between the connector pins for the PCM line(120 Ohm) and the PCM line wires, identified by the number of the line within a QTLPboard, receiving or transmitting side, wire A or B.

Y0

Y1

Y3

Y2

W40W26

to GND-48 + -48 +

to GND

W2W3

PP0 PP1

Y4

Y5

Y6

Y7

RAS

PM2

RGB

PM3W20

W10

Temp. Sensors

GND bold

130 A30808-X3247-K220-4-7620


* Pins not used into connectors Y1 and Y0.

Nr. PINSUB-D37

EVEN PCM link ODD PCM link

1/20 PCM0 Input Link A/B PCM1 Input Link A/B

2/21 PCM0 Output Link A/B PCM1 Output Link A/B

3 Ground Ground





26 Ground Ground



10 Ground Ground

11/29* PCM0 Input Link A/B PCM1 Input Link A/B

12/30* PCM0 Output Link A/B PCM1 Output Link A/B



33 Ground Ground



17 Ground Ground



Tab. 4.1 Assignment of even and odd PCM Links to SUB-D 37 Connectors

ithe even PCM link is assigned to SUB-D 37 connnectors W20, Y7, Y5, Y2, Y1the odd PCM link is assigned to SUB-D37 connectors W10, Y6, Y4, Y3, Y0

A30808-X3247-K220-4-7620 131


MMN:BSC

4.2 Rack Connection for BC120-HC

The Fig. 4.7 shows the rack connection blocks for the BC120-HC.

Fig. 4.7 RCAP in the BC120 - HC

+ +

W10B

W200B

W20B

Y3B

Y4B

W200A

Y4A

Y3A

Y5A

Y5B

Y6B

Y7B

Y9B Y9A

48VGNDGND

RC

AP

DE

XR

CA

P S

IN

W3

W26

W40

RAS

PM2

PM3

W2

Y7A

Y8AY8B

W10A

W20A

PP0Y6A

PP110A10A

48V

132 A30808-X3247-K220-4-7620


SHELF CARD Top rack connectorsRx/Tx PCM lines 0...5

Top rack connectorsRx/Tx PCM lines 6...11

LOW STLP0 W10B W10A

STLP1 W20B W20A

STLP2 W200B W200A

UPPER STLP3 Y3B Y3A

STLP4 Y4B Y4A

STLP5 Y5B Y5A

STLP6 Y6B Y6A

STLP7 Y7B Y7A

STLP8 Y8B Y8A

STLP9 Y9B Y9A

Tab. 4.2 Cross references for PCM lines

Pin Signal PCM line on type Bconnectors

side PCM line on type Aconnectors

side

120

LIA0LIR0

PCM 0 Input Rx PCM 6 Input Rx

221

LOA0LOR0

PCM 0 Output Tx PCM 6 Output Tx

3 GND

422

LIA1LIR1


523

LOA1LOR1

PCM 1 Output Tx PCM7 0 Output Tx

17 GND

624

LIA2LIR2


725

LOA2LOR2


26 GND

827

LIA3LIR3


928

LOA3LOR3


10 GND

Tab. 4.3 Signal pin connector on SUB D37

A30808-X3247-K220-4-7620 133


MMN:BSC

1129

LIA4LIR4


1230

LOA4LOR4


1331

LIA5LIR5

PCM 5Input Rx PCM 11 Input Rx

1432

LOA5LOR5


33 GND

Pin Signal PCM line on type Bconnectors

side PCM line on type Aconnectors

side

Tab. 4.3 Signal pin connector on SUB D37

134 A30808-X3247-K220-4-7620


4.3 Fuse and Alarm Panel of the C20-X rack

Fig. 4.8 and Fig. 4.9 show the complete layout of the fuse and alarm panel. Three Ledsare located on each power supply panel and 24 on the fuse and alarm panel; relays areassociated to 8 of them.

Fig. 4.8 shows only the LED alarm panel while Fig. 4.9 shows the fuse and the connec-tion with the LMT.

Fig. 4.8 Alarm LEDs on the BSC Fuse and Alarm Panel

On the alarm panel, LEDs are colored as follows:

– green LEDs are used for localizing equipment status;

– yellow LEDs are used to signal minor severity alarms;

– red LEDs are used to signal major and critical severity alarms.

The rack is enclosed by front doors: therefore, the alarm panel is not visible duringnormal operation; however, three summary LEDs also extend (in parallel) to lampslocated outside the rack. These external lamps illuminate when a critical, major or minoralarm (all BSC alarms OR-ed) is present.

Three LEDs perform this display function on the alarm panel: one red LED for criticalalarms, one orange LED for major alarms and one yellow LED for minor alarms.

LEDs located on the fuse and alarm panel can be subdivided in the following groups:

GLOBAL ALARM:

– illuminated red LED for CRITICAL alarm

– illuminated orange LED for MAJOR alarm

– illuminated yellow LED for MINOR alarm

SYSTEM ALARM:

– illuminated red LED and not flashing for MAJOR alarm

– red LED flashing for CRITICAL alarm

– illuminated yellow LED for MINOR alarm

ENV

SAIPAI

MINORALARM

S/WRUN

NEW

OLD

EQUIPMENT STATUS

MPCC TDPC PPXX

LINE NTW CLOCK

TRAUBTSDISKHWIOMC

COMMUNICATION

GLOBALALARM

MIN

EQP

COM

QOS

SYSTEM ALARM

CRT

MJR

A30808-X3247-K220-4-7620 135


MMN:BSC

EQUIPMENT STATUS - COMMUNICATION:

– green illuminated LED for no alarm

– green LED flashing for alarm

Tab. 4.4 describes the correspondence between the LEDs on the fuse and alarm paneland the related objects in the Equipment and Communication areas. The first columnreports the LEDs; the second column contains the list of the physical objects that willswitch on in the event of fault.

S/W RUN (NEW and OLD):

– S/W RUN LEDs are normally switched off. They illuminate only during the changeversion procedure.

– When a LED is illuminated, it indicates which software version is currently running.

– These LEDs switch off when the operator enters the appropriate command (end ofchange version).

MINOR ALARM:

SAI PAI

– alarm related to PCMS lines

– alarm related to PCMB lines

ENV

– illuminated and not flashing indicates a MINOR alarm;

– slow flashing indicates a MAJOR alarm;

– fast flashing indicates a CRITICAL alarm.

ENV LED switches on when there's an enviromental alarm such as smoke, intrusion, fireor temperature.

LED - LocalizationQueue

Corresponding modules/objects

MPCC MPCC, PWRD

TDPC TDPC, MEMT

PPXX PPLD, PPCC, PPCU, PPXL, PPXU

LINE PCMA, SS7L, TSLA

NTW SN16, UBEX, PLLH, SNAP

CLOCK SYNC, SYNE

OMC OMAL, X25A, X25D, CBCL

HWI IXLT, LICD, LICDS, EPWR

DISK DK40, DISK

BTS BTSM, BTS, TRX, CHAN

TRAU TRAU

Tab. 4.4 LED-Hardware Correspondence

136 A30808-X3247-K220-4-7620


Fig. 4.9 BSC Fuse and Alarm Panel, Part with Fuses

4.4 Lamp Panel

The lamp panel shown in Fig. 4.10 is mounted on the highest part of BSC rack; eachlamp is the OR of BSC alarms with the related severity regardless of the event type. Thismeans that the rack alarm lamp is switched on when the first failure with the relatedseverity is issued; each alarm lamp is switched off when the last failure event withrelated severity is cleared.

Fig. 4.10 Lamp Panel

ALARM PANEL

1 AF

EXPANSION MODULE

POWER 0 POWER 1

10 AF

LAMPTEST

BASE MODULE

COPY 0 COPY 1

10 AF

LOCALTERMINAL

CRITICAL

ALARM

MAJOR

ALARM

MINOR

ALARM

A30808-X3247-K220-4-7620 137


MMN:BSC

4.5 DC-Panel of the BC120-HC (C38-X rack)

Fig. 4.11 and Fig. 4.12 show the complete layout of the alarm panel and DC-Panel forthe BC120 High Capacity.

The philosophy of the lamp panel is the same of the BSC standard (4.3).

Fig. 4.11 Alarm LEDs for BC120 HC

Fig. 4.12 DC-Panel for BC120 HC

SAIPAI

MINORALARM

S/WRUN

NEW

OLD

EQUIPMENT STATUS

MPCC TDPC PPXX

LINE NTW CLOCK

TRAUSTSDISKHWIOMC

COMMUNICATION

GLOBALALARM

MIN

EQP

COM

QOS

SYSTEM ALARM

CRT

MJR

LAMPTEST

LOCALTERMINAL

BSC BASE BSC EXP FAN BOX ALARMPANEL

138 A30808-X3247-K220-4-7620


4.6 Temperature Sensors

Two Temperature sensors are mounted on the top of the rack (see Fig. 4.6): each oneof them controls a copy of the Power Suppliers.

When the temperature increases, the temperature sensor contact closes and the rele-vant supplier goes out of service (OFF).

If during normal operating status, the equipment internal temperature reaches the 72˚Cthreshold, Copy 0 temperature sensor contacts close and the suppliers of the relevantcopy go out of service (OFF).

Copy 0 will restore (opening of TS contacts and suppliers returning in service (ON))when the temperature returns to 63˚C threshold.

If the temperature keeps increasing and reaches a 78˚C threshold, Copy 1 temperaturesensor contacts close and the suppliers of the relevant copy go out of service (OFF).

At this point there is no power supply in the whole equipment and Copy 0 and Copy 1will restore (operning of TS contacts and soppliers returning in service (ON)) when thetemperature returns to 63˚C threshold.

Each Temperature Sensor is tested singularly by means of a heating board adjusted to:

A tester can be used to verify whether the contact is open or closed.

Copy 0 TS 72˚C close Suppliers OFF

Copy 1 TS 78˚C close Suppliers OFF

72˚C for Copy 0 power suppliers78˚C for Copy 1 power suppliers63˚C the contact reopens

A30808-X3247-K220-4-7620 139


MMN:BSC

4.7 Power Supply

On the power panel three LEDs, a switch and two keys (red and black) are provided(Fig. 4.13, pos. 1 and pos. 2).

Fig. 4.13 BSC Power Supply Module Panel

The LEDs indicate the following:

– The IS green LED is on whenever the power supply is on and the provided voltageis correct;

– The OS AL red LED will switch on in the event of an "out of service" or anomaly inthe power supplied;

– The ON green LED is on whenever the power supply is on.

The OFF REQ switch controls the on/off status of the regulated output voltages, and itmust be in the upper position in order to allow the system to work.

IS

OSAL

ON

OFFREQ

1

M1+12,3

M2 + 5,3

M3 PPW

ON

RED

BLACK

2

3

140 A30808-X3247-K220-4-7620


The buttons indicate the following (Fig. 4.13, pos 2):

– The red button controls the magnetothermic switch, and must be pressed to interruptthe primary power supply; to avoid undesiderable manual interruptions, the usermust use a pointed device to switch the red button.

– The black button must be pressed to switch on the primary power.

Normal power (secondary power) control (emergency breaker in ON position (blackbutton pushed)):.

Primary and secondary power control:

To switch on the power supply:

1. Press the black button. The OS AL LED will switch on.

2. Set the OFF REQ key in the upper position. The IS and ON LEDs will switch on andthe OS AL LED will switch off.

To switch off the power supply:

1. Set the OFF REQ key in down position. The OS AL LED will switch on, and the ISand ON LEDs will switch off:

2. Press the red switch. The OS AL LED will switch off.

Tab. 4.5 summarizes the anomaly conditions notified by the LED settings.

See Switch-off and Switch-on Procedures for powering OFF and ON.

To switch on the power supply:1. Set the OFF REQ key in the upper position. The IS and ON LEDs will switch on

and OS AL LED will switch off.To switch off the power supply:1. Set the OFF REQ key in down position. The OS AL LED will switch on, and the IS

and the ON LEDs will switch off.

MEANING LED’S CONDITIONS

IS ALL/OS ON

Out of service (manual off request), orOut range of the input battery, orOutput below the nominal voltage, orOutput over the nominal voltage

OFF ON OFF

Emergency break in off condition(manual or automatic)

OFF OFF OFF

Output overload or short circuit OFF ON ON

Tab. 4.5 Anomaly Conditions identified by LEDs

A30808-X3247-K220-4-7620 141


MMN:BSC

4.8 Jumpers setting

4.8.1 Module DK40

Fig. 4.14 Jumpers Setting for Module DK40

321SEZ5

3

21

SEZ0

SEZ0

SEZ0

SEZ0

SEZ07

SEZ09

2 3 1 4

SEZ08

SEZ11

SEZ06

SEZ10

iThe configuration of jumpers SEZ01..SEZ04 is relevant to the RS232 interface. For theV11 interface, these jumpers must be set in the position 2-3.

142 A30808-X3247-K220-4-7620


Fig. 4.15 Jumpers Setting for Module DK40 V2 and V3

SZ04

TR1

TR6

123

TR4123

SZ01123

TR7

SZ03123

TR5

3

21

SZ0212

3

TR2321

TR3TR121

23

TR1132

TR812

1

3

A30808-X3247-K220-4-7620 143


MMN:BSC

4.8.2 Module IXLT

Fig. 4.16 Jumpers Setting for Module IXLT V3 and V4

TR22

TR20

TR3123

TR8TR18

TR2812

3

TR19

TR26

3 2 1

TR24

1 2 3TR25

1 2 3 TR1

TR21

TR4

TR5

TR7

TR6

TR27

1 2 3

144 A30808-X3247-K220-4-7620


Fig. 4.17 Jumpers Setting for Module IXLT V6 and V7

TR18

TR19

TR28

3 2 1TR4

TR22

3 2 1

TR7123

TR6123

TR9123

TR8123

TR23

TR16 TR15

3 2 1

TR5

TR3321

A30808-X3247-K220-4-7620 145


MMN:BSC

4.8.3 Module MEMT

Fig. 4.18 Jumpers Setting for Module MEMT

TR1TR2

146 A30808-X3247-K220-4-7620


4.8.4 Module MPCC

Fig. 4.19 Jumpers Setting for Module MPCC V7

TR16

TRWDT

3

21

TRBF2

TR1

TRMMXTR_FW

TR_BIST

TR_FLASH

A30808-X3247-K220-4-7620 147


MMN:BSC

Fig. 4.20 Front View of MPCC V7

: : : :

: : :

: : :

: :

MPCCV7

A

B

C

D

E

F

G

: : :

::::::

::::::

::::::

::::::

::::::

R

Y

G

H

I

::::::

::::

. . . .

148 A30808-X3247-K220-4-7620


A Serial EPROM signals interface J11 connector.B USB0 connector.C Pentium emulator J5 connector.D USB1 connector.E RS232 link signals J10 connector.F LEDs (1)G JHOT_LINK High speed link interface control.(2)H JHOT_COM High speed link auxiliary link control.(2)I J_HTF Hard disk connector.(2)

i(1) The Red LED is illuminated for the following reasons: the fuse of card is broken,WDT alarm active or forced from the software by an ESCC2 control point.The Yellow LED indicates the operation of the hard disk.The Green LED is under the software control by a control point and is used to point outthe closing of the file system.

(2) The hot link connectors (G and H) and the hard-disk connector (I) of the MPCCV7copy 0 must be connected with the same connectors of the MPCC V7 copy 1 with theappropriate cables:- (G) V7442-C32-R2- (H) V7441-A33-R12- (I) V7440-B37-R1

A30808-X3247-K220-4-7620 149


MMN:BSC

4.8.5 Module PLLH

Fig. 4.21 Jumpers Setting for Module PLLH (75 Ohm)

SZ4

T11812

3

3V051

12

F098

SZ10 D01212

3

SZ6

SZ15

K08612

3

SZ3

SZ1

SZ2

SZ16

3 2 1

H038

3 2 1

SZ7

SZ05

SZ08 SZ11

1Q009

32

1R009

32

SZ13

SZ121

P009

32

3M009

12

150 A30808-X3247-K220-4-7620


Fig. 4.22 Jumpers Setting for Module PLLH (120 Ohm)

SZ4

T11812

3

3V051

12

F098

SZ10 D01212

3

SZ6

SZ15

K08612

3

SZ3

SZ1

SZ2

SZ16

3 2 1

H038

3 2 1

SZ7

SZ05

SZ08 SZ11

1Q009

32

1R009

32

SZ13

SZ121

P009

32

3M009

12

iThe PLLH local tuning must be done after any replacement of the PLLH module. Thisoperation can be carried out only if a syncronization source signal from the MSC is avail-able and the PLLH module has been powered for at least 12 hours.

A30808-X3247-K220-4-7620 151


MMN:BSC

Fig. 4.23 Jumpers Setting for Module PLLH V2 (75 Ohm)

SZ4

T11812

3

3V051

12SZ10 D012

12

3

SZ6

SZ15

K08612

3

SZ3

SZ1

SZ2

SZ16

H038

3 2 1

SZ7

SZ05

SZ08 SZ11

1Q009

32

1R009

32

SZ13

SZ121

P009

32

3M009

12

152 A30808-X3247-K220-4-7620


Fig. 4.24 Jumpers Setting for Module PLLH V2 (120 Ohm)

SZ4

T11812

3

3V051

12SZ10 D012

12

3

SZ6

SZ15

K08612

3

SZ3

SZ1

SZ2

SZ16

H038

3 2 1

SZ7

SZ05

SZ08 SZ11

1Q009

32

1R009

32

SZ13

SZ121

P009

32

3M009

12

iThe PLLH local tuning must be done after any replacement of PLLH module. This oper-ation can be carried out only if a syncronization source signal from the MSC is availableand the PLLH module has been powered for at least 12 hours.

iThe PLLH V2 is mandatory for the USA. When used in the US, the Jumpers setting isthe one provided by default from the factory (120 Ohm).

A30808-X3247-K220-4-7620 153


MMN:BSC

4.8.6 Module PPCC

Fig. 4.25 Jumpers Setting for Module PPCC V2

SZ3

TR1

12

3

3

TR31

2

SZ2

TR432

1

SZ05

SZ6

1TR2

32

SZ1

iClose to TR4, SZ4 could be found as in the PPLD module. However the presence orabsence of the correspondig jumper is not relevant.

154 A30808-X3247-K220-4-7620


Fig. 4.26 Jumpers Setting for Module PPCC V3

SZ8

SZ4

SZ06

SZ5

3

TR212

SZ1

SZ7

SZ9

iThe presence or absence of SZ9 is issue dependent.

iThe PPCC V3 is mandatory for the USA.

A30808-X3247-K220-4-7620 155


MMN:BSC

4.8.7 Module PPCU

Fig. 4.27 Jumpers Setting for Module PPCU

P14

32

1

P18

P16

P12P13

P17

P15

P10 P9

156 A30808-X3247-K220-4-7620


4.8.8 Module PPLD

Fig. 4.28 Jumpers Setting for Module PPLD V2

SZ3

TR1

12

3

3

TR31

2

SZ2

TR4

32

1SZ05

SZ6

1TR2

32

SZ1

Z4

A30808-X3247-K220-4-7620 157


MMN:BSC

Fig. 4.29 Jumper setting for module PPLD V3

iThe presence or absence of SZ9 is issue dependent.

iThe PPLD V3 is mandatory for the USA.

TR2

3

1

2

SZ4

SZ5

SZ1

SZ6

SZ8 SZ7

SZ9

158 A30808-X3247-K220-4-7620


4.8.9 Module QTLP

Fig. 4.30 Jumpers Setting for Module QTLP (120 Ohm)

SZ35SZ3SZ4SZ34SZ1SZ2


SZ52


SZ13SZ14

SZ40

SZ41SZ15SZ16SZ43SZ19SZ20SZ42SZ18SZ17

SZ44SZ21SZ22

SZ23SZ24

SZ45

SZ27SZ28

SZ25SZ46

SZ47

SZ26


SZ54

SZ53

SZ50

SZ33

SZ51

A30808-X3247-K220-4-7620 159


MMN:BSC

Fig. 4.31 Jumpers Setting for Module QTLP (75 Ohm)



SZ52


SZ13SZ14

SZ40

SZ41SZ15SZ16SZ43SZ19SZ20SZ42SZ18SZ17

SZ44SZ21SZ22

SZ23SZ24

SZ45

SZ27SZ28

SZ25SZ46

SZ47

SZ26


SZ54

SZ53

SZ50

SZ33

SZ51

160 A30808-X3247-K220-4-7620


Fig. 4.32 Jumpers Setting for Module QTLP V2 (75 Ohm)

SZ19SZ20 SZ50

SZ2

SZ1

SZ4

SZ3

SZ6

SZ5

SZ8

SZ7

SZ10

SZ9

SZ13

SZ11

SZ15

SZ12

SZ14

SZ17SZ18

SZ24

SZ22SZ21

SZ23

SZ28

SZ26SZ25

SZ27

SZ32

SZ31SZ29

SZ30

SZ36

SZ34SZ33

SZ35

SZ40

SZ39SZ37

SZ38

SZ44

SZ42SZ41

SZ43

SZ48

SZ47SZ45

SZ46

3

21

TR4

3

21

TR5

3

21

TR6

3

21

TR7

3

21

TR8

3

21

TR9

3

21

TR10

3

21

TR11321 TR1

SZ51

SZ16

A30808-X3247-K220-4-7620 161


MMN:BSC


SZ19SZ20 SZ50

SZ2

SZ1

SZ4

SZ3

SZ6

SZ5

SZ8

SZ7

SZ10

SZ9

SZ13

SZ11

SZ15

SZ12

SZ14

SZ17

SZ18

SZ24

SZ22

SZ21

SZ23

SZ28

SZ26

SZ25

SZ27

SZ32

SZ31

SZ29

SZ30

SZ36

SZ34

SZ33

SZ35

SZ40

SZ39

SZ37

SZ38

SZ44

SZ42

SZ41

SZ43

SZ48

SZ47

SZ45

SZ46

3

21

TR4

3

21

TR5

3

21

TR6

3

21

TR7

3

21

TR8

3

21

TR9

3

21

TR10

3

21

TR11321 TR1

SZ51

SZ16

iThe QTLP V2 is mandatory for the USA.

162 A30808-X3247-K220-4-7620



On the QTLP module front there are eight plugs to monitor the 2Mbit/s PCM lines (seeFig. 5.14.6). Each line has a monitoring point on both the transmitting side and thereceiving side (see Tab. 5.14.1)

SZ19SZ20 SZ50

SZ2

SZ1

SZ4

SZ3

SZ6

SZ5

SZ8

SZ7

SZ10

SZ9

SZ13

SZ11

SZ15

SZ12

SZ14

SZ17

SZ18

SZ24

SZ22

SZ21

SZ23

SZ28

SZ26

SZ25

SZ27

SZ32

SZ31

SZ29

SZ30

SZ36

SZ34

SZ33

SZ35

SZ40

SZ39

SZ37

SZ38

SZ44

SZ42

SZ41

SZ43

SZ48

SZ47

SZ45

SZ46

32

1TR4

32

1TR5

3

21

TR6

3

21

TR7

3

21

TR8

321

TR9

32

1TR10

32

1

TR11321 TR1

SZ51

SZ16

A30808-X3247-K220-4-7620 163


MMN:BSC

Fig. 4.35 PCM Monitoring Points for QTLP and QTLP V2

Two LEDs (yellow and red) are equipped for each PCM line on the QTLP V2 module .A single red LED represents the board status. The function of these LEDs is shown inthe following table:

QTLP

A

B

TXRXTXRX

C

D

TXRXTXRX

E

F

TXRXTXRX

G

H

TXRXTXRX

QTLP

A

B

TXRXTXRX

C

D

TXRXTXRX

E

F

TXRXTXRX

G

H

TXRXTXRX

V2

LED Functions Yellow LED Red LEDLOS (loss of signal) off onLFA or MFA (loss of frame/multiframe) off onBER Upper Threshold Exceeded off onAIS (alarm indication signal) blink blinkRAI (remote alarm indication) on offfaulty module single red LED on

A Line 0, Port A

B Line 0, Port B

C Line 1, Port A

Tab. 4.6 Description of QTLP and QTLP V2 Monitoring Points

164 A30808-X3247-K220-4-7620


D Line 1, Port B

E Line 2, Port A

F Line 2, Port B

G Line 3, Port A

H Line 3, Port B

Tab. 4.6 Description of QTLP and QTLP V2 Monitoring Points

A30808-X3247-K220-4-7620 165


MMN:BSC

4.8.10 Module SN16

Fig. 4.36 Jumpers Setting for Module SN16

TR2

TR4

TR1

TR3

166 A30808-X3247-K220-4-7620


4.8.11 Module TDPC

Fig. 4.37 Jumpers Setting for Module TDPC V6

TR16

TRWDT

1

23

TRBF2

TR1

TRMMX

TR_FLASHTR_FW

TR_BIST

A30808-X3247-K220-4-7620 167


MMN:BSC

Fig. 4.38 Front View of TDPC V6

: : : :

: : :

: : :

: :

TDPCV6

A

B

C

D

E

F

G

: : :

H

::::::

::::

. . . .

168 A30808-X3247-K220-4-7620


A Serial EEPROM signals interface J11 connector.B USB0 connector.C Pentium emulator J5 connector.D USB1 connector.E RS232 link signals J10 connector.F LED (1)G JHOT_LINK High speed link interface control.(2)H JHOT_COM High speed link auxiliary link control.(2)

i(1) A major hardware alarm is sent from the TDPC toward the MPCC by the MEMTevery time deteced a processor fault is detected (NMI interrupt not cleared) or when atthe start-up the self test process of the card fails.

(2) The hot link connectors of the TDPCV6 copy 0 must be connected with the sameconnectors of the TDPC V6 copy 1 with the appropriate cables:- (G) V7442-C32-R1- (H) V7441-A33-R13

A30808-X3247-K220-4-7620 169


MMN:BSC

4.8.12 Module UBEX

Fig. 4.39 Jumpers Setting for Module UBEX

TR1

170 A30808-X3247-K220-4-7620


4.8.13 Module SNAP (for BSC High capacity)

Fig. 4.40 Jumpers Setting for Module SNAP V1

TR2

A30808-X3247-K220-4-7620 171


MMN:BSC

4.8.14 Module PPXX (for BSC High capacity)

Fig. 4.41 Jumpers Setting for Module PPXX (fed by EPWR power supply card)

P34P35

JJ3JJ2

P13

PP35

0

P41

P40

P42

P14

P4

P38

P36P37

P39

172 A30808-X3247-K220-4-7620


Fig. 4.42 Jumpers Setting for Module PPXX (fed by internal power supply module)

P34P35

JJ3JJ2

P13

PP35

0

P41

P40

P42

P14

P4

P38

P36P37

P39

A30808-X3247-K220-4-7620 173


MMN:BSC

4.8.15 Module STLP (for BSC High capacity)

Fig. 4.43 Jumpers Setting for Module STLP

SZ6

SZ5

SZ8

SZ7

SZ10

SZ9

SZ11

SZ12

SZ18

SZ17

SZ20

SZ19

SZ22

SZ21

SZ24

SZ23

SZ30

SZ29

SZ32

SZ31

SZ34

SZ33

SZ36

SZ35

SZ60

SZ4TR12

TR7

TR8

SZ13TR21

TR13

TR14

SZ16TR24

TR19

TR20

SZ25TR33

TR25

TR26

SZ27TR35

TR29

TR30

SZ1TR9

TR1

TR2SZ2TR10

TR3

TR4

SZ3TR11

TR5

TR6

SZ14TR22

TR15

TR16

SZ15TR23

TR17

TR18

SZ26TR34

TR27

TR28

SZ28TR36

TR31

TR32

SZ41

SZ45

SZ40

SZ52 SZ51

SZ50

SZ44

SZ37SZ38SZ39

174 A30808-X3247-K220-4-7620


75 Ohm 100 Ohm 110 Ohm 120 Ohm

SZ1 OPENTR9 1:2SZ6 CLOSETR1 1:2TR2 1:2SZ5 CLOSE

SZ1 OPENTR9 2:3SZ6 OPENTR1 2:3TR2 2:3SZ5 OPEN

SZ1 CLOSEDTR9 OPENSZ6 OPENTR1 2:3TR2 2:3SZ5 OPEN

SZ1 OPENTR9 OPENSZ6 OPENTR1 1:2TR2 1:2SZ5 OPEN













SZ13 OPENTR21 1:2SZ18 CLOSETR13 1:2TR141:2SZ17 CLOSE



SZ13 OPENTR21 OPENSZ18 OPENTR13 1:2TR141:2SZ17 OPEN






SZ15 OPENTR23 2:3SZ22 2:3TR17 2:3TR18 2:3SZ21 OPEN

SZ15 CLOSEDTR23 OPENSZ22 2:3TR17 2:3TR18 2:3SZ21 OPEN


Tab. 4.7 Jumpers STLP

A30808-X3247-K220-4-7620 175


MMN:BSC



SZ16CLOSEDTR24 OPENSZ24 OPENTR19 2:3TR20 2:3SZ23 OPEN


















SZ37 CLOSESZ38 CLOSESZ39 CLOSESZ40 OPENSZ41 CLOSESZ45 OPENSZ60 OPENSZ51 OPENSZ52 OPENSZ44 OPENSZ50 OPEN

75 Ohm 100 Ohm 110 Ohm 120 Ohm

Tab. 4.7 Jumpers STLP

176 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 177


MMN:BSC

5 Appendix

5.1 Alarm Handling

An alarm notifies the Operation and Maintenance Center (OMC) of fault conditions.Alarms can occur at any point in the BSC subsystem provided with a hardware (hard-ware) or software (SW) detector to recognize the fault, and with an event-generatingsoftware.

Following the general alarm philosophy, alarm reports specify:

– the fault severity level;

– the anomaly type.

Fault Severity Levels

The BSC subsystem provides five different severity levels:

– Critical ;

– Major ;

– Minor ;

– Warning ;

– Cleared .

The Critical level is reached when the subsystem is out of order.

The Major level specifies the presence in the subsystem of a fault that makes thesubsystem itself drop significantly. The immediate intervention of an operator is requiredto clear the fault and resume the service.

The Minor level specifies that the fault in the subsystem does not lower its functionality(for instance, the backup unit is not working). In other words, a section of the subsystemis lowered, but it is still able to work without effects on the service. Operator interventionis required, but it is not urgent, either because the quality of the service is still acceptableor because an automatic reconfiguration has been made.

The Warning level specifies the presence within the subsystem of an error that does notcause traffic or hardware failure.

The Cleared level specifies that a previous error condition is now cleared.

Anomaly Types

Five types of anomalies are defined, depending on the functional part of the subsystemthat is actually damaged:

– Quality of Service

– Communication

– Equipment

– Processing

– Environment

A Quality of Service alarm refers to a service downgrading. Such an alarm is gener-ated, for instance, from the level 3 radio when the quality of the service provided to themobile user drops to the attention threshold.

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Communication alarms refer to the procedures/processes that are devoted to thecommunication exchange between subsystem elements. Generally speaking, thefollowing failures are taken into account:

– system link (SS7, LAPD, X.25) faults;

– faults of the connection network that do not originate from the hardware;

– level 3 radio anomalies.

Equipment alarms refer to hardware failures. Alarms of this kind are notified and anal-ized by the maintenance procedures in order to clear them by means of the providedredundancy. In this case, the alarm display reports the generating function together withthe related severity.

With each of these types of anomolies, software tails (System Tails) are associated thatcontain a brief outline description of various error messages relating to the errorconcerned.

Processing alarms refer to software faults; they could be just warning messages whenthey do not cause failure, otherwise they can generate a reload of the software on theboard.

Environment alarms are associated with environmental events such as fire, water andso on.

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5.2 Alarm Reporting

Every system of the PLMN network reports any malfunction occurring in its operation toa local operator and to a remote control center (OMC) . These malfunctions include alarge variety of types, from hardware faults to recurrent software errors and from aircondition faults to back-up battery faults.

The BSC system is a network element of the PLMN and can be remotely controlled viathe OMC, therefore the Alarm Reporting activity, by means of which the BSC keepsOMC informed on its own malfunction-related events, plays a key role. In the BSC, theAlarm Reporting function has been developed taking into account the specific peculiar-ities of this equipment.

The SBS BSC Alarm Reporting feature handles two different event types: fault detec-tion and fault ceased detection .

The fault detector detects a fault and sends:

1. The related alarm message to alarm reporting.This task extracts information from the centralized data base, sends the "OutputMessage" to OMT/LMT and, if needed, sends a message to the status handler torequest a state change of the object generating the alarm and an alarm panelupdate.

2. The related alarm ceased message to alarm reporting.As in the previous case, this block forwards the message to OMC/LMT, activates thestatus handler if needed and deletes the ceased alarm from the internal queue.

The State used on the SBS-BSC system is derived from the one proposed by GSM stan-dards. The model used includes three fields as follow:

ADMINISTRATIVE STATE: is the only state that the operator can alter by usingmaintenance commands.

LOCKED: the object is not allowed to perform its functions withoutthe intervention of the operator.

UNLOCKED: the object can freely perform all of its functions.SHUTTING_DOWN: the object is graduaully changing its administrative state

from UNLOCKED to LOCKED.

OPERATIONAL STATE: is used to indicate whether an object is able to work ornot. It specifies the object's operability.

ENABLED: the object is in service. It may be used or not, dependingon system needs.

DISABLED: the object is out of service. It cannot be used to performits operations.

USAGE STATE: is used to describe the object’s current use. It may besplit into the following three groups of logically indepen-dent values.

IDLE: In this state, the object is not currently in use.BUSY: In this state, the object is completely used.ACTIVE: In this state,the object is partially used.

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The BSC system is logically structured as a tree (see Fig. 5.2 and Fig. 5.1). The nodesindicate the objects (logical and physical) in which the system itself is sub-divided. Thestructure in particular indicates the functional and operational dependency of severalobjects (sub-ordinate objects) from others (for example, with reference to Fig. 5.2 andFig. 5.1, the TDPC telephone processor depends on the MEMT module on which it isinstalled and the PWRD object which represents the power supply of the system).

The autodiagnostic procedures of the BSC system are able to identify the defectivemodule and the possible malfunctioning objects. The same procedures can place theobjects into the operational DISABLE state. As a consequence of this action, the sub-ordinate objects are also placed in the DISABLE state. This allows for the illumination ofthe appropriate LED on the alarm panel. The operator must pay attention to this, and bymeans of the procedure shown in the following chapter, look at the MEG tree in order toidentify the source of the error.

BSC's MAINTENANCE ENTITY GRAPH (MEG) is shown in Fig. 5.2. and Fig. 5.1.Performing a service removal command (LOCK or DISABLE) the Status Manager firstremoves from service leaf objects, then level by level all the superordinates. Thecommand ends when, at least, the target object is put out of service.The command STATE CHANGED EVENT REPORT is sent only if the object's state isreally changed.Exceptions to this rule are due to the dynamic management of most 1+1 redundantobjects (MPCC, MEMT, TDPC, IXLT, NTW, EPWR), n+1 redundant objects (LICD) andn+m redundant objects (PPLD).1+1 redundant objects subordinates are DISABLED for DEPENDENCY only in theevent of the superordinate outage.

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Fig. 5.1 The BSC Maintenance Entity Graph (MEG tree) for BSC Regular Capacity

When an LICD is put out of service the PCM lines created on the above circuits areDISABLED only if the associated spare module (LICDS-0 for LICD-0 and LICD-1,LICDS-1 for the others LICD) is out of service or is already providing service.

The Fig. 5.2 shown the MEG for BSC high capacity.

PWRD

MPCC MEMT DK40 IXLT NTW

PPCC

TDPC

PPLD

DISK

EPWR

LICDS

PCMB

LPDLRLPDLMLPDLS

TRAU BTSM

PCMA BTSSYNC

TSLATRX

CHAN

LICD

OMAL

ONLY IF IN EXTENDED RACK

SS7L X25D X25A

CBCL

NUC

PPCU

PCMGPCMS

PTPPKF

FRL

NSVC

PCU

ONLY IF TCH or TCHSD

SS7SBSC

CTRCO

CTRSCHED

ENVATRACEBSCESUSW

GPRSTRX

BSCESUDB NEYESUSW RSUSWLH SYNE

RSUEXE RSUPCH RSUDB REMIN SCA

SCAN_BSC SCAN_BTS SCAN_BTSLHDO SCAN_BTSOHDOINT SCAN_BTSOHDONGH SCAN_SS7L SCAN_BTSM

CHAN

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Fig. 5.2 The BSC Maintenance Entity Graph (MEG tree) for BSC High Capacity

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5.3 Failure Event Message

This type of message is sent to the I/O device (OMT and/or LMT), if any exist, when anerror occurs. The message is formatted taking information, partly from the messagereceived from the error collector and partly from the protected database of the ErrorTask. More specifically, the failure event message to be sent to the I/O module (in otherwords to the OMT and/or to the LMT) will include the following information:

Date/TimeNAMEEvent TypeEvent TimeProbable CauseSpecific ProblemsSeverityTrend IndicationNotification IdentifierCorrelated Notification

IdentifierRelated MO

Proposed Repair ActionsAdditional TextOriginatorAdditional WordsSoftware Version

Here is a description of the above information.NAME: <object mnemonic+object address>

This field identifies the object. Note that the mnemonic isfollowed by a structured numbering (address) that univocallyidentifies an object in the BSC.

- Event Type: this parameter categorizes the alarm. Five basic categories ofalarm are specified:

Communication Failure Event (COM LED) : a failure event of this typeconcerns the procedure and/or processes that are used to transport informa-tion from one point to another. In principle, the following communicationfailure event is communicated: malfunctions related to all links of the BSCsystem (SS7, LAPD and X.25); problems resulting in blocking the switchingnetwork (not due to hardware causes); and malfunctions resulting in blockingof at least one level 3 radio function. These malfunctions are generated bythe protocols of their respective links whenever they detect a problem, by thelevel 3 radio function and/or by the function controlling the network connec-tions whenever a block is detected in call establishment.According to this definition, for example, the objects of the protocol links andthe level 3 radio manager object are objects generating this failure event.

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Quality of Service Events (QOS LED) : a failure event of this type concernsthe degradation of the quality of service in the BSC. Such a failure event willbe generated by level 3 radio whenever the quality of service offered to themobile user drops below the preset warning threshold. It is not easy to iden-tify the objects that could generate such a failure event, because they don'tmake reference to any specific physical object.For example, the process that manages level 3 radio could be regarded asthe object that can generate this type of event. Together with the event, thestatus of the function that experienced the abormal situation could also bespecified.Equipment Failure Events (EQP LED) : an event of this type is associatedwith hardware faults and is the most traditional form. It appears in the form ofhardware malfunctions that are reported and analyzed by the maintenanceprocedures in order to take the necessary remedies based on the redundan-cies which the BSC system is equipped with. As far as the local display isconcerned, for these failure events information on their severity are given aswell as information enabling the location of the faulty unit that generatedthem.For example, there is a lamp to indicate a network unit (the NTW LED) andanother one to indicate an LICD line module unit (the LINE LED), andanother to indicate the processing units. All of these failures are equipmentfailure events and, for every unit, the object shall select the related lamp.Processing Failure Event: this category of failure events includes all soft-ware-type errors. These errors are due to programming errors. These failureevents and the information reported by them are necessary to remove theerror.Environmental Failure Events (ENV LED): this type of failure event isassociated with environmental problems on the site where the BSC islocated. The BSC has the capabilty of detecting these causes via a numberof sense points connected to environmental sensors.

Event Time: This attribute identifies the time of detection of the fault.ProbableCause:

This parameter defines further qualifications as to the probablecause of the alarm.

SpecificProblem:

This Failure Event attribute provides further refinement to the“Probable Cause” attribute.

Severity: this parameter defines five severity levels. The five levels, fromthe least to most severe, are:

Cleared: this severity level indicates the clearing of one or more previouslyreported alarms. This alarm clears all alarms for this managed object thathave the same Alarm Type and Probable Cause. It is reported as an "ErrorCeased Message".Warning: this level indicates that the object has reported a potential orpending "error" that has not yet affected the functionality of the BSC. It is justa prompt to take the necessary actions to diagnose and correct the problemas soon as possible before it becomes more severe. For a failure event ofsuch a low severity, an end-of-alarm event might be unnecessary; in anycase, neither the status nor the instance having generated it are retained (itcould not be polled by OMC), nor will it be displayed by any visual indicator(i.e., LEDs).

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Minor: this level indicates that the object has reported an error that does notdegrade functionality (for example, its backup has been switched intoservice) or, better, indicates that a functional part of the BSC is degraded,but is still in a position to perform its functions without significantly affectingthe service.Major: this level indicates that the object has reported such an error as torender it severly degraded or, better, indicates that a functional part of theBSC system is severly degraded.Critical: this level indicates that the object reported such an error as to put ittotally out of service or, better, indicates that a functional part of the BSC iscompletely unavailable.

- Trend Indica-tion:

this parameter indicates how the degradation of the features ofa component part of the system is evolving, following themalfunction just reported. Its value can be the followings:the Not Applicable trend indication is printed if the associatedseverity for the object in question is INDETERMINATE orWARNING.the NoChange trend indication is printed if the associatedseverity for the object in question isn’t changed from theseverity of those associated to previously reported FailureEvent relevant the same object and still active (i.e. no relatederror ceased message was generated).the LessSevere trend indication is printed if the associatedseverity for the object in question is less severe of the severityof those associated to previously reported Failure Events rele-vant the same object and still active (i.e. no related error ceasedmessage was generated).the LessSevere-noChange trend indication is printed if theassociated severity for the object in question is less severe or ofequal severity of those associated to previously reported FailureEvents relevant the same object and still active (i.e. no relatederror ceased message was generated).the MoreSevere trend indication is printed if the associatedseverity for the object in question is more severe of those asso-ciated to previously reported Failure Events relevant the sameobject and still active (i.e. no related error ceased message wasgenerated).

- NotificationIdentifier:

this attribute identifies unambiguously the Failure Event.

CorrelatedNotification:

this attribute identifies the notification to which this Failure Eventis considered to be correlated. Since the failure Event Reportsare “father event” for the Notification Identifier correlations, theCorrelated Notification information are shown only for theFailure Enet Report output during an Alarm Alignment (OMC) ora Get Pending Alarm Command (LMT)

ProposedRepairActions:

this attribute identifies the repair action suggested to the oper-ator for the fault resolution.

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AdditionalText:

For the alarms generated by the ENVA objects, the operatorshall be able to define “his own alarm text” and also to define“the severity associated to each ENVA” objects instanceindipendent from the alarm text. The Additional Text stringdefined by the operator represents a description of the environ-mental event. This field is always present in a Failure EventReport, but is meaningful only for the ENVIRONMENTALFailure Events: in all other type of failure events is output as“Null String”.

Originator: It is an integer number that identifies the software module origi-nating the Failure Event.

- AdditionalWords:

aaaa-oooo are hex values that are helpful for a detailed descrip-tion of the error. This part is of particular usefulness for the soft-ware designer to analyse the error cause and so take properactions to solve the problem.

- SoftwareVersion:

It’s the BSC software version files (if we are on BSC LocalTerminal).

The following is a real example of error message:ALARM REPORTING --> SYSTEM BROADCAST16:00:03 17/02/200021:34:24 17/02/2000*** INFORMATION ***FAILURE EVENT REPORT:

NAME=DISK:1Event Type = Equipment Failure EventEvent Time = 17/02/2000 16:00:03Probable Cause: Disk ProblemSpecific Problems = 181-DISK not AlignedSeverity: MajorTrend Indication: More SevereNotification Identifier = 05Proposed Repair Actions = 1 NoActionAdditional Text = Null StringOriginator: 4305Additional Words =H’003c H’0335 H’0000 H’0000 H’0000H’0000 H’0000 H’0000 H’0000 H’0000H’0000 H’0000 H’0000 H’0000 H’0000Additional Info:Software Version: 02-06-01-01-00-00_10-05-00

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5.4 General diagnostic structure

When the operator enters an asyncronous test command from Local MaintenanceTerminal or O&M Center, or the system itself automatically diagnoses a device, twoactivities are performed: a "status consistency check" and a "phase controller activa-tion". The former involves the initial conditions control, while the latter is involved inmonitoring the execution of the diagnosis sections called "phases".

A diagnostic is subdivided into phases: the single phase is a test on hardware sectionfunctionality. It can be executed individually and can provide an indication of what theproblem is as precisely as possible.

The result of the phase considers both the particular hardware components inspectedby the phase and the general interface of the diagnostic tests.

Some phases will be always present and common to all diagnostics:

The other hardware diagnostic phases are referred to as "working phases". They arecontainers for the group of test routines forcing the single function, the single alarm or aparticular internal hardware interface.The soft termination, contrary to the abort termination, has an operator origin, and canhave two managements: if the diagnosis is still waiting for activation, an immediatecancellation of the asynchronous test request is enough, while if the diagnosis is alreadyactive, the current working phase is completed and the end phase is executed.

The target units considered as maintenance objects on BSC for a generic diagnostic testare as follows:

– PWRS (power supplies)

– MPCC (microprocessor control complex)

– TDPC (telephonic and distributor processor circuit)

– MEMT (memory of TDPC and DUAL PORT Memory between MPCC and TDPC)

– NTW (cross connection network, composed of three elements: PLLH, SN andUBEX)

– PPLD (peripheral processors for LAPD protocols)

– PPCC (peripheral processors for CCS#7 protocols)

– PPCU (peripheral packet Control Unit)

– LICD (line card)

– LICDS (line card spare)

– DK40 (led alarm panel control)

– DISK (physical disk)

– PPXL (peripheral processor LAPD/SS7

– PPXU (peripheral processor used at PPCU evolution)

– IXLT (interface X25 and bcal terminal)

start phase to correctly set the card to support the rest of diagnostic tests;end phase: to restore working conditions of the hardware to the previously

executed phase.it will be always performed as the last phase, unless an abortoccurred, and if the termination is induced by an operator.

abort phase: resets the hardware without depending on what was currentlyexecuted. Its actions depend on the running phase.

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From a maintenance point of view, the primary advantage of the diagnosis feature is thecapability to provide a list of the suspected modules at once. Up to four modules can belisted as the possible origin of any fault. This is important in the event of fault of thenetwork (NTW) object. This is the only case in which the correspondence between thelogical and the physical objects involved is not immediately clear. Another aspectconcerns the capability of the diagnosis to provide information about the specific compo-nents on the module responsible for the fault. Although this information is not immedi-ately readable, it is contained in the additional info field reported by the test output.

5.4.1 Hardware Diagnostics

Introduction

Diagnostics are provided to check the functionality of hardware units and to locate hard-ware faults.

They achieve this by:

a) applying inputs to a hardware device;

b) comparing resulting outputs with expected outputs;

c) using the failing phase as the basis for fault resolution;

A diagnostic can be triggered by the following events:

a) manual request to test a particular device (typically during the repair or installationprocedure);

b) system request in case the system wants to start a diagnostics on a device declaredfaulty: if the diagnostic passes, the device is carried back in service; if it fails, thedevice is left out of service.

Every diagnostic is structured in the same way: it is divided into PHASES and eachphase into TESTS.

A TEST is a software routine that verifies the functionality of a specific hardware circuit.

A PHASE is a stand alone set of test routines, executed in a sequential manner, thatverify the same hardware device.

Every diagnostics must have:

– a "start phase" to correctly initialize the device to be tested;

– an "end phase" to re-establish the conditions in which the device was before thediagnostic;

– an "abort phase" to clean up the system configuration in case of an abort of the diag-nostics;

– a variable number of "working phases" (the core of any diagnostic); each workingphase has been designed to point out a least replaceable unit (LRU).

As general rule:

– each diagnostics is destructive (the object has to be locked before starting a test)with the exception of the PWRS;

– the diagnostics of a specific board is incompatible with the diagnostics of the sametype of board (i.e., the diagnostics of LICD-0 is incompatible with the diagnostics ofLICD-1);

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MMN:BSC

– the operator can request to perform several diagnostics on different hardware units;the maximum number of diagnostics that can run in parallel are 8, moreover they canbe executed only if compatible with the ones in progress. If the requested diagnosticis incompatible or 8 different diagnostics are already running, a queuing procedureis implemented and it will be executed when possible. Otherwise it is activated atonce. The “incompatible” diagnostics are indicates in the following table:

Each type of hardware unit has its specific diagnostics. The results of a diagnostic of acertain phase are different for every kind of diagnostics: normally for each test there isa bit which indicates if the test passed or failed and the meaning of the bits depend onthe hardware device under test.

If the diagnostics runs successfully in output will be indicated just the list of the phaseswhich has been executed.

If the diagnostics fails in the output will indicate such and list the executed phases and,for each failed phase 8 words which detail the type of failure.

The failure of a phase can have different degrees of severity. In particular, it may happenthat the prohibits any further diagnostic test on the device (for instance if the object orsome part of it is not accessible, or if the processor on board does not answer). In thiscase, all the remaining phases (except for the end phase) will be skipped. In other failurecases, the diagnosis will continue in spite of the bad test result. In both cases, the testoutcome will be “fail” . The termination of the diagnosis when a phase fails is decidedat run time by the hardware diagnostic.

If the test starts on an object in enable state, the object will turn back enable if theexecuted phases passed, otherwise the object will remain in disable state. If the teststarts on an object in disable state, the object will remain disable even if all executedphases passed.

Unit Incompatible withMPCC MPCC TDPC MEMTDK40 DK40TDPC TDPC MPCC MEMTMEMT MEMT MPCC TDPCNTW NTW PPCC PPLD PPCUIXLT IXLTPPCC PPCC PPLD NTW PPCUPPLD PPLD PPCC NTW PPCULICD LICDLICDS LICDSPWRD PWRD EPWREPWR EPWR PWRDPPCU PPCU PPCC PPLD NTWDISK DISK MPCCPPXU PPXL PPXU NTWPPXL PPXU PPXL NTW

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5.4.2 Phase Identifier

In order to provide a better interpretable information, the following table shows at theOperator, in the form of character strings, new Phase Identifiers that are specific for thehardware object under test. The Phase Identifier are defined starting from the currentWorking Phase.

In general, when a phase fails the next ones are skipped. In some cases, depending onthe hardware architecture of the board under test, a phase can be carried on even if theprevious one has failed. The phases that have this characteristic are marked with an *.

MOT New Phase Identifier Old Phase

PPCC Preliminary Tests Start Phase

Memory Test* WP1

LCS7 Test* WP2

Loopback Test* WP3

R/W Loopback Register test* WP4

Force Alarm test* WP5

Alarm Test (TDPC side)* WP6

End Test End Phase

PPLD Preliminary Tests Start Phase

Memory Test* WP1

HSCX Test* WP2

Loopback Test* WP3

R/W Loopback Register test* WP4

Force Alarm Test* WP5

Alarm Test (TDPC side)* WP6

End Test End Phase

PPCU Preliminary Tests Start Phase

MPCC and TDPC DUAM Test* WP1

ABIC Test* WP2

GBIC software Test* WP3

End Test End Phase

IXLT Accessibility Tests Start Phase

Address Bus Test* WP1

Alarm Register Test* WP2

DUAM Test* WP3

firmware Internal Test* WP4

Tab. 5.1 New Phase Identifiers

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End Test End Phase

PWRD Power on Test Start Phase

Basic Maintenance Test WP1

Full Maintenance Test WP2

End Test End Phase

EPWR Power on Test Start Phase

Basic Maintenance Test WP1

Full Maintenance Test WP2

End Test End Phase

DISK Preliminary Tests Start Phase

Accessibility Test WP1

Autodiagnostic Test WP2

Remote Accessibility WP3

Remote Autodiagnostic WP4

File system check WP5

End Test End Phase

DK40 Accessibility Test Start Phase

Force Alarm Test WP1

DUAM Test WP2

Firmware RAM/DPR/SCC Tests WP3

Firmware Hard Disk Test WP4

Alarm Panel Test WP5

End Test End Phase

MPCC Accessibility Test Start Phase

ESSC2 & Alarm Test WP1

Firmware card & hot link Test WP2

MPCC firmware update WP3

End Test End Phase

MEMT Accessibility Test Start Phase

DUAM Test (MPCC side) WP1

DUAM Test (TDPC side) WP2

End Test End Phase

TDPC Accessibility Test Start Phase

Test MEMT availability WP1



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5.4.3 PWRS Diagnostics

From a hardware point of view the four power supplies in the BSC Rack are namedPWRS modules. From a software point of view (LMT interface) the power supplies in theBSC Rack are named:

– PWRD 0..1 (PWRS modules for the Base Rack)

– EPWR 0..1 (PWRS modules for the Extension Rack)

Test Alarm circuit via MEMT WP2

Test Alarm circuit via TDPC WP3

End Test End Phase

NTW Accessibility Tests* Start Phase

UBEX Force Alarm Test WP1

PLLH Force Alarm Test WP2

PLLH Firmware Self Test WP3

SN Force Alarm Test WP4

SN Speech RAM Address Parity Test WP7

SN Speech RAM Data Parity Test WP8

SN Control RAM Data Parity Test WP9

SN channel loop-test WP10

End Test End Phase

LICD Accessibility Test and card reset Start Phase

Firmware protocol and processor Test WP1

Firmware Self Test* WP2

Check Alarm Status WP3

End Test End Phase

PPXL Board reset and FW self-test Start Phase

MPCC and TDPC DUAM tests WP1

Internal circuit testAccess test WP2

End Test End Phase

PPXU Board reset and FW self-test Start Phase

MPCC and TDPC DUAM tests WP1

Internal circuit testAccess test WP2

ABIC Test WP3

End Test End Phase



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The BSC power supply provides two regulated power voltages (+5,3V and +12,3V) withline regulation of about 2%; the DC input voltage can be an unregulated office batteryranging from -36V to -72V.

The PWRS diagnostics have been implemented with two working phases (see para-graph 5.4.2).

a) PWRS diag start phaseThis phase verifies that Power is on (meaningful only for PWRD card).OUTPUT if start phase fails:No additional info (if this phase fails, PWRD is not powered on).

b) PWRS diag phase 1This phase verifies if the IXLT card controlling the PWRD/EPWR is working andperforms a basic hardware maintenance test (register test).OUTPUT if phase 1 fails:

c) PWRS diag phase 2This phase performs the maintenance test on PWRD/EPWR.OUTPUT if phase 2 fails:

d) PWRS diag end phaseThis phase is meaningless for PWRS diagnostics.

5.4.4 MPCC Diagnostics

The MPCC is the main controller of the BSC and provides the following functions:

– Implements a microprocessor circuit based on a CPU Intel Pentium© .

– Provides a total of 64 Mbytes of SDRAM and 512 Kbytes of Flash EPROM.

– Provides two programmable serial communication channels.

– Provides a high speed serial link.

– Allows the handling of 12 sources of interrupts by two programmable interruptcontroller.

– Provides maintenance circuitry for fault detection of microprocessor device andassociated circuits.

– Allows the handling of the external alarms coming from the peripheral boards.

word[0] Line in the code where the diag failure is issued

word[1] Software item where the failure has been detected

word[2] Software line in the code where the error has been detected

word[3] Type of the detected error (1) (see Tab. 5.2)



word[2] Softwareline in the code where the error has been detected


word[4] IXLT card alarm register

word[5] IXLT card sense point register

word[6] IXLT card loopback register

word[7] IXLT card control point register

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– Houses the configuration control logic that selects the active copy of MPCC board.

MPCC diagnostics have been implemented with 3 working phases (see paragraph5.4.2).

a) MPCC diag start phaseThis phase consists of the check of the power supplier card.OUTPUT if start phase fails:

b) MPCC diag phase 1This phase consists of check of the alarm circuit of the card and its subsequentreset.OUTPUT if phase 1 fails:

c) MPCC diag phase 2This phase consists of firmware card and hot link diagnostics.OUTPUT if phase 2 fails:

d) MPCC diag phase 3This phase consists of verifying if the firmware must be updated. The third phase isexecuted only if the card has a firmware version to be updated; the decision is takenby the Processor Complex Device Handler by querying the software Handling. It’s tobe noticed that, in the negative event that the firmware does not work well, theMPCC diagnostic is considered failed and the additional information reported to theoperator will highlight the cause. At this point, the operator must replace the card putout of service for firmware problems. A subsequent diagnostic does not recover thesituation: it immediately will not succeed because the firmware test will not pass atthe second phase.OUTPUT if phase 3 fails:

word[0] Line in the code where the diag failure is issued.




word[0] Software line in the code where the error has been reported




word[4] The signal subtype used to invoke the firmware

word[5] The firmware response

word[0] Software line in the code where the error has been reported



word[3] Type of the detected error (1).(see Tab. 5.2)ERR_firmware_STATEERR_firmware_TMOUTERR_firmware_CODE

word[4] The Operating System response

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e) MPCC diag end phaseThis phase is meaningless.

5.4.5 TDPC Diagnostics

The TDPC is responsible for exchanging messages with the other network entities viathe LAPD and the SS7 processors. It handles all signalling functions above MTP layer2 and all application processes related to call control, radio resource management andmobility management.

The TDPC card is implemented with a 1+1 redundancy (active and stand-by copy).

The TDPC board provides the following functions:

– Implements a microprocessor circuit based on a CPUIntel Pentium©.

– Provides a total of 64 Mbytes of SDRAM and 512 Kbytes of Flash EPROM.

– Provides two programmable serial communication channels.

– Provides a high speed serial link.

– Allows the handling of 12 sources of interrupts by two programmable interruptcontroller.

– Provides maintenance circuitry for fault detection of microprocessor device andassociated circuits.

– Provides a double interface toward the MEMT, PPXL boards by means of duplicatedaddress, data and control busses.

– Allows the handling of the external alarms coming from MEMT, PPXL boards.

– Allows the handling of two external reset and interrupt sources coming from MPCC.

– Provides the or-function for sixteen external interrupts coming from PPXL boards.

– Provides eighteen programmable selection board signals used for the PPXL boards.

TDPC diagnostics have been implemented with 3 working phases (see paragraph5.4.2).

a) TDPC diag start phaseThis phase consists in the check of the power supplier of the card.OUTPUT if start phase fails:

b) TDPC diag phase 1This phase checks that at least one MEMT copy is available to perform the diag-nostic.OUTPUT if phase 1 fails:

c) TDPC diag phase 2This phase consists in the check of the alarm circuit of the card and its subsequentreset.OUTPUT if phase 2 fails:See previous phase.



196 A30808-X3247-K220-4-7620


d) TDPC diag phase 3This phase consists of the check of the alarm circuit of the card by means of a cardreset and subsequent result of the autotest by the TDPC firmware (phase meaning-less in the event of TDPC outage).OUTPUT if phase 3 fails:

e) TDPC diag end phaseThis phase is meaningless.

5.4.6 MEMT Diagnostics

The MEMT cards are used only as a communication vehicle between the MPCC and theTDPC cards (DUAM functionality).

The MEMT implements:

– 4kx16 semaphored Dual Port Ram (DPMT) which implements the communicationsbetween the TDPC and the MPCC;

– two sixteen bit registers for a fast communication (interrupt handled) between MPCCand TDPC.

The selection of the active copy of the TDPC is under control of the MPCC.

MEMT diagnostics have been implemented with 2 working phases (see paragraph5.4.2).

a) MEMT diag start phaseThis phase consists on the check of the power supplier of the card.OUTPUT if start phase fails:

b) MEMT diag phase 1Full check of the address/data buses from/to the MPCC card, read/write accesscheck (DUAM only), alarm forcing test.OUTPUT if phase 1 fails:

c) MEMT diag phase 2Full check of the address/data buses from/to the TDPC, read/write access check(DUAM only), alarm forcing test.OUTPUT if phase 2 fails:





word[4] Command sent to the TDPC firmware that failed (2) (see Tab. 5.2)

word[5] Debug data from TDPC firmware






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MMN:BSC

d) MEMT diag end phaseThis phase is meaningless.





LEGEND

(1) error code management

MEANING ERR. CODE

ERR_PRNMI 0x0A

ERR_PRLOOP 0x0B

ERR_NMIINT 0x0C

ERR_MOUTAGE 0x0D

ERR_INVCONF 0x0E

ERR_IPLOOP 0x10

ERR_AFORCE 0x11

ERR_PCSMT 0x14

ERR_INVCONT 0x15

ERR_PATTERN 0x17

ERR_INVCFG 0x18

ERR_INCONSIST 0x19

ERR_LOCKSEM 0x1A

ERR_DIFF_SENSE 0x1C

ERR_TMOUT 0x1D

ERR_TDPC_MEM 0x1F

ERR_FW_STATE 0x20

ERR_FW_TMOUT 0x21

ERR_FW_CODE 0x22

ERR_TDPC_STALL 0x23

ERR_HW_RESET 0x24

ERR_INV_ADDR 0x25

ERR_INV_ACC 0x26

ERR_MULTI_NMI 0x27

Tab. 5.2 Error Codes used by PWRS, MPCC, TDPC, MEMT Diagnosis

198 A30808-X3247-K220-4-7620


5.4.7 NTW Diagnostics

The NTW object refers to three different cards:

– UBEX: Universal Bus EXtender. It allows the MPCC to access the peripheral boardsand collects the interrupt signals coming from them;

– PLLH: Phase Lock Looped High performance board. It delivers clock and synchro-nization signals to all BSC devices. It can work in free-running or synchronized froman external source (SYNC or SYNE).

– SNxx: Switching Matrix at 64/16/8 Kbit/s. It performs, under the MPCC control, theswitching functionality among the channel from/to the line interface cards (LICD) andperipheral processor boards (PPXX).

NTW diagnostics has been implemented with 10 working phases (see paragraph 5.4.2).

a) NTW diag start phaseThis phase performs a basic init of UBEX, PLLH, SN.

OUTPUT if start phase fails:

ERR_INV_CODE 0x28

ERR_INV_LEN 0x29

ERR_TINIT_REQ 0x2A

ERR_RTE 0x2B

ERR_MPCC_RESP 0x2D

ERR_TDPC_STATUS 0x2E

ERR_PR_BIST 0x2F

(2) failure of the TDPC FW

T81_FW_40_PROTOCOL_MODE 12

T81_FW_CLEAR_INT_MEMORY 13

T81_FW_START_FULL_DIAG 10

LEGEND

Tab. 5.2 Error Codes used by PWRS, MPCC, TDPC, MEMT Diagnosis

word[0] Internal error code(1).

word[1] Code for faulted device(2).

word[2] UBEX alarm register (3).

word[3] PLLH alarm register (4).

word[4] Cause of PLLH interrupt (12).

word[5] control alarm register of SN16(6) or SNAP(6).

word[6] input alarm register of SN16(8) or SNAP(13).

word[7] output alarm register of SN16(10) or SNAP(14).

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MMN:BSC

b) NTW diag phase 1This phase, after repetition of basic init of the UBEX, forces all of the UBEX alarmsto see that they arise correctly.OUTPUT if phase 1 fails:

c) NTW diag phase 2This phase, after repetition of basic init of the PLLH, forces all the PLLH alarms tosee that they arise correctly. Finally, it checks if there are not timing alarms on theSN introduced by the PLLH.OUTPUT if phase2 fails :

d) NTW diag phase 3This phase schedules the self-diagnostic test executed by the residing firmware ofPLLH.OUTPUT if phase 3 fails:The same of phase 2.

e) NTW diag phase 4This phase, after repetition of basic init of SN, forces all the alarms of SN to see ifthey arise correctly.OUTPUT if phase 4 fails:For SN16

FOR SNAP



word[2] UBEX alarm register(3).



word[2] PLLH alarm register(3).

word[3] Cause of PLLH interrupt(12).


word[1] SNxx global alarm register(2).

word[2] Mask of the parity alarm of the incoming PCM lines at 8Mb/s n˚ 16...23

word[3] Mask of the parity alarm of the incoming PCM lines at 8Mb/s n˚ 0...15

word[4] Mask of the parity alarm of the incoming PCM lines at 2Mb/s n˚ 0..3

word[5] Mask of the comparision alarm of the outgoing PCM lines at 8Mb/sn˚16...23

word[6] Mask of the comparision alarm of the outgoing PCM lines at 8Mb/sn˚0...15

word[7] Bit mask of the other SNxx alarms(11).

word[0] Internal error code(1)

word[1] Snap Control Block Alarm register.

word[2] Snap Input Block Alarm register.

word[3] Ubex Address Bus register (bit 8...15).UBEX data bus register (bit 0...7)

200 A30808-X3247-K220-4-7620


f) NTW diag phase 5 and phase 6: these two phases are skipped because they arereserved to an hardware not supported.

g) NTW diag phase 7SN16/SNAP: writes for diagnostics an address with a wrong parity, one by one, ineach location of the speech RAM, and checks that the alarm is detected by the gatearray.OUTPUT if phase 7 fails:For SN16The same of phase 4.

For SNAP (if SNAP drivers failed).

h) NTW diag phase 8SN16/SNAP: writes for diagnostic a datum with a wrong parity, one by one, in eachlocation of the speech RAM, and checks that the alarm is detected by the gate array.OUTPUT if phase 8 fails:The same of phase 4.

i) NTW diag phase 9SN16/SNAP: a wrong parity is written one by one in all the locations of the controlRAM to see if the alarm is detected by the gate array.OUTPUT if phase 9 fails:The same of phase 4.

j) NTW diag phase 10SNAP: it performs a loop-test for all the channels, with pattern insertion at input andverification that the same pattern is transmitted in output.OUTPUT if phase 10 fails:

If test fails

word[4] Input alarm register of SN16(8) or SNAP(13)

word[5] Bank of Speech RAM Alarmed - Trapped Control RAM Address forSpeech RAM Data error(15).

word[6] Bank of Speech RAM Alarmed - Trapped Control RAM Address forSpeech RAM Address error(15).

word[7] Bank of Control RAM Alarmed - Trapped Control RAM Address forControl RAM Data error(15).


word[1] Line number of the module where error occurred.

word[2] Name of the module where error occurred.

word[3] FF

word[4] FF

word[5] FF

word[6] FF

word[7] FF

word[0] iSNAP Control Block Alarm Register.

word[1] SNAP Input Block Alarm Register.

word[2] SNAP Output Block Alarm Register.

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MMN:BSC

If Snap drivers fails

k) NTW diag end phaseThis phase is meaningless.

word[3] Trapped value on 8Mb/s input line, before pattern insertion-Patterninserted on 8 Mb/s input line-Trapped value on 8 Mb/s output line.

word[4] Number of physical input line.

word[5] Number of time slot at 8 Kb/s on physical input line.

word[6] Number of physical output line.

word[7] Number of time slot at 8 Kb/s on physical output line.


word[1] Line number of the module where error occurred.

word[2] Name of the module where error occurred.

word[3] FF

word[4] FF

word[5] FF

word[6] FF

word[7] FF

LEGEND

(1) The possible error codes issued by NTW diagnostic are listed

ERR. CODE MEANING

1 loop back test failed

2 parity error on UBEX bus

3 an unexpected alarm is found active

5 forcing an alarm has no effect

6 (only PLLH) CRC error in the firmware protocol

7 (only PLLH) state inconsistency of the firmwareprotocol

8 time out occurred in the hardware/firmware oper-ation

17 the hardware has been found in unexpected state(typical for PLLH: it is found master whenexpected slave)

18 a connection in SNxx has been performed incor-rectly by the hardware

Tab. 5.3 Error Codes used by NTW Diagnostics

202 A30808-X3247-K220-4-7620


19 (only SNxx): an unexpected value, different froma test pattern previously inserted, has beentrapped in an incoming PCM channel

20 (only SNxx): an unexpected value, different froma test pattern previously inserted, has beentrapped in an outgoing PCM channel

21 (only SNxx): interference between the valuestransmitted on outgoing channels

22 (only SNxx): interference between the datawritten in 2 different locations of the controlmemory, after performing connections for testpurposes

23 (only PLLH): failure of a firmware auto-diagnose

26 (only SNxx): the type of switching matrix isdifferent from the one required by the BSC database

30 an unexpected NMI has arisen while accessing tothe hardware

(2) Code indicating the faulted device. Generally it should be consistent with the cardindicated in the proposed repair action

1 error on UBEX

2 error on PLLH

4 error on SN16

5 error on SNAP

(3) UBEX alarm register

Bit n˚ Meaning

7 If 1, there is an alarm forcing in progress

6 0

5 0

4 0

3 0

2 Chip select error

1 Data parity error

0 Address parity error

LEGEND


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MMN:BSC

(4) PLLH alarm register

Bit n˚ Meaning

7 WDT alarm of local CPU

6 UBEX bus data parity error

5 UBEX bus address parity error

4 PLLH 0 and 1 not synchronization (it is normal ifthe other PLLH is failed)

3 Lack of the signal on the maintenance selector (itis normal, if no synch. Source is under test)

2 Lack of outgoing signal

1 Lack of external synchronism (it is normal if thePLLH is not synchronized master)

0 If 1, PLLH outputs its signal, otherwise the signalsof other PLLH

(6) SN16/SNAP control alarm register

Bit n˚ Meaning

7 Lack of synchronism to the control gate array

6 Lack of clock to the control gate array

5 Generic internal alarm of the control gate array

4 Wrong parity in some control RAM location

3 FIFO error

2 PLL alarm



(8) SN16 input alarm register

Bit n˚ Meaning

7 Lack of synchronization to the input gate array

6 Lack of clock to the input gate array

5 Generic internal alarm of the input gate array


3 PCM parity error on some line from LICD

2 PCM parity error on some line from PPXX

LEGEND


204 A30808-X3247-K220-4-7620




(10) SN16 output alarm register

Bit n˚ Meaning

7 Lack of synchronization to the input gate array

6 Lack of clock to the input gate array

5 Output block general alarm


3 Comparison alarm

2 PCM parity error on the internal parallel bus



(11) Summarization of some important alarms

Bit n˚ Meaning

7 0

6 0

5 0

4 0

3 Unspecified internal alarm

2 SN: cyclic test alarm

1 UBEX data or address parity error

0 Timing problems

(12) PLLH alarm register description

0x0008 checksum failed

0x0009 fault on DAC or ADC

0x000a phase comparator fault

0x000c generic protocol error

(13) SNAP input alarm register

7 0

6 0

LEGEND


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MMN:BSC

5 Internal timing error/Reroute in matrix error

4 Logic OR of the CRAM data and address parityerror

3 0

2 Parity alarm on one or more of 8Mb PCM inputlines

1 0

0 0

(14) SNAP output alarm register

7 0

6 0

5 Output block general alarm


3 Comparison alarm

2 Parity alarm on the internal parallel bus

1 0

0 0

(15) Meaning of output diagnostics for SNAP card, in case of failure of phase n.4

4 Bit 0-15: Address that occured when a parityaddress or data alarm was detected on UBEXbus. This word contains a valid data as long as bit0 or bit 1 of word [0] are set.

5 Bit 0-13: Control RAM address location at whichoccured a parity alarm on the Speech RAM databusBit 14-15: Bank of the Speech RAM memoryalarmed. Data contained in this word are validonly if the bit in position 2 of word [2] is set to 1.

6 Bit 0-13: Control RAM address location at whichoccured a parity alarm on the Speech RAMaddress busBit 14-15: Bank of the Speech RAM memoryalarmed. Data contained in this word are validonly if the bit in position 2 of word [2] is set to 1.

LEGEND


206 A30808-X3247-K220-4-7620


5.4.8 PPLD/PPCC Diagnostics

The PPLD is responsible for handling the layer 2 of LAPD protocol. The card is basedon an INTEL CPU 80C186 running at 20 MHZ. The card architecture allows the down-load of the code.

The MPCC controls, for operating and maintenance purposes, the PPLD via the UBEX;the TDPC exchanges messages with the PPLD through a 8Mbyte dual port RAM; theselection of the active copy of the TDPC is under the control of the MPCC.

The LAPD circuit interfaces the switching matrix by means of a duplicated 2Mbit/s link;up to 8 physical channels can be interfaced both at 64kbit/s and 16kbit/s. An"n+m"redundancy concept is used for the cards that implement this function.

The PPCC board is responsible for handling the MTP layer 1 and 2 of the CommonChannel Signalling System #7 (CCSS#7) protocol used for signalling on the A interface.The hardware implementation of the PPCC is the same of the PPLD.

PPXX diagnostics has been implemented with 6 working phases (see paragraph 5.4.2).

a) PPXX diag start phaseThis phase checks on NTW outage and TDPC outage, loopback test, CPU reset,firmware autodiagnose, alarm-forcing test, software load.OUTPUT if start phase fails:

b) PPXX diag phase 1This phase executes memory tests (RAM, TDPC-PPXX DUAM, checksum verifica-tion of EPROM content).OUTPUT if phase 1 fails for hardware/firmware problems in diagnosticcommand execuion:

7 Bit 0-13: Control RAM address in case the outputgate array detects a data parity alarm on the databus of the control RAM itself.Data contained in this word are valid only if the bitin position 4 of word [2] is set to 1.

LEGEND


word[0] source item(1)

word[1] source code line

word[2] error code(2)

word[3] additional information(3)




word[7] additional information(7).

word[0] error source item (1)

word[1] error line inside source code

word[2] error code (2)

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MMN:BSC

OUTPUT if phase 1 fails because of unsuccessful answer coming fromPPLD/PPCC software:

c) PPXX diag phase 2This phase checks the HSCX (PPLD) and the LCS7 (PPCC) channels.OUTPUT if phase 2 fails:

See previous phase. As relating to the correspondence between the PPLD/PPCCsoftware internal phases and the diagnostic phases managed by the PPxx hardwarediagnostic routines: hardware diag phase 2 consists of internal phase 3 having themeaning of checking correct LCS7 (on PPCC) or HSCX (on PPLD) programming.

d) PPXX diag phase 3This phase performs loopback tests inside EXPI, HCSX test for PPLD or LCS7 testfor PPCC.OUTPUT if phase 3 fails :

See diag phase 1. As relating to the correspondence between the PPLD/PPCC soft-ware internal phases and the diagnostic phases managed by the PPxx hardwarediagnostic routines: hardware diag phase 3 consists of internal phases 4 and 5having the following meaning:4 --> HSCX (on PPLD) or LCS7 (on PPCC) loopback test5 --> EXPI (Gate Array) loopback test

e) PPXX diag phase 4This phase performs the W test on the EXPI loopback register.

word[3] meaningless (0x0)





word[0] error code (2)

word[1] first byte coming from card software (0x13 if OK)

word[2] second byte coming from card software (0x80 if diag failed)

word[3] third byte coming from card software (bit mask of failed internal softwarephases belonging to range 0-7). The correspondence between thePPLD/PPCC software internal phases and the diagnostic phasesmanaged by PPxx hardware diagnostics routines is:

hardware diagnostics phase 1 consists of internal phases 0,1,2 havingthe following meaning:

0 --> RAM test

1 --> PPxx_TDPC DUAM test

2 --> EPROM checksum test

word[4] fourth byte coming from card software (bit mask of failed internal soft-ware phases belonging to range 8-15)




208 A30808-X3247-K220-4-7620


OUTPUT if phase 4 fails:

See diag phase 1. As relating to the correspondence between the PPLD/PPCC soft-ware internal phases and diagnostic phases managed by the PPxx hardware diag-nostics routines: hardware diag phase 4 consists of internal phase 6 having thefollowing meaning:6 --> R/W test on EXPI loopback register

f) PPXX diag phase 5This phase performs parity alarm forcing, EPROM compatibility, WDT alarm arisingin the event of missing reset operation, the missing clock alarm forcing and internalloopback test (checking FIFO queues inside the LCS7 or the HSCX).OUTPUT if phase 5 fails

See diag phase 1. As relating to the correspondence between the PPLD/PPCC soft-ware internal phases and diagnostic phases managed by the PPxx hardware diag-nostics routines: hardware diag phase 5 consists of internal phases 7, 8, 10 havingthe following meaning:7 ----> hardware alarms forcing8 ----> card/EPROM compatibility10 --> HSCX internal loopback testIf one or more tests fail, bit mask with notification of unsuccessful internal phases isinside word [3] for phase 7 and inside word [4] for phases 8 and 10.

g) PPXX diag phase 6This phase checks on the TDPC side (PPCC/PPLD DUAM) concerning NMI (NonMaskable Interrupts) and card access test (routine activated by MPCC message).OUTPUT if phase 6 fails

h) PPXX diag end phaseThis phase is meaningless.

word[0] 0 - if phase result is good or DUAM problems are detected.

error code if an operating system or tasks communication problem tookplace

error code - if an operating system or tasks communication problemtook place

word[1] source code item identifier (see Start Phase) in case of card problemdetected on DUAM side

word[2] source line number

word[3] error code(2) showing PPLD/PPCC fault





LEGEND

(1) identifier of source item where problem took place

Tab. 5.4 Error Codes used by PPxx Diagnostics

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MMN:BSC

1 DHXXDCCH

2 DHXXDCDE

3 DHXXDCEH

4 DHXXDCSA

5 DHXXDCSM

6 DHXXDCTH

7 DHXXDDDI

8 DHXXDDHD

9 DHXXGSUT

10 DHXXININ

11 DGHDXXDP

(2) error code description

NTW_outage_test 0001h

TDPC_outage_test 0002h

loop_test 00e3h (access to loopback reg.)

00e4h (NMI)

FW_diagnose_test 00e2h (firmware self test failed)

008ah (firmware time out)

alarm_test 00a1h (forcing failed)

00a0h (alarm persists)

SW_load_test 000ch (load failed)

0014h (file system problem)

operating system problems 000ah (mailbox creation failed, null DH answer)

tasks interface problems 000bh (PPxx DH-time-out during load function)

software start 0080h (sw nack answer) or 008ah (sw time out)

forcing Out Of Service Idle status 008ch (software nack answer) or 008ah (sw timeout)

alarm raising during card access 008ch (time-out expired in command sending)

00a0h (alarm detected during reading operationof software answer)

LEGEND


210 A30808-X3247-K220-4-7620


problems during command tocard

00a3h (writing error on MPCC-PPXX interface)0082h (negative software answer, different fromDiag Executed)0090h (Diag Failed answer inside softwaresecond byte)

loopback test 00e4h if NMI problem00e3h if card access problem

(3) additional information; in details:

NTW/TDPC outage, operatingsystem problem, software time-out, firmware diagnosis failure,software start/Force

If card access for report is successful:high byte=parity alarm cause (if any)low byte=mask of alarms not causing interrupts

OOS failure, load failure If card access for report fails: source code item(1)

other causes mask of alarms causing interrupts (high byte);mask of alarms not causing interrupts (low byte)


NTW/TDPC outage, operatingsystem problem, software time-out, firmware diagnosis failure,software start/Force OOS failure,load failure

If card access for report is successful:high byte = mask of alarms causing interruptslow byte = circuits enabled to transmit (to NTW) ifcard access (for report) fails: source line number

other causes trapped PCM channel address (parity error) (highbyte); control mask of alarms towards UBEX (lowbyte)



If card access for report is successful:high byte = first card control registerlow byte = second card control register. If cardaccess (for report) fails: error code (2)

other causes trapped PCM channel data


LEGEND


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MMN:BSC

5.4.9 LICD Diagnostics

The LICD is an object that represents the QTLP (Quad Trunk Line peripheral).The LICDrealizes the interconnection with the PCM30/PCM24 links on the Asub and Abis inter-faces. Submultiplexed time slots coming from the BTS and the TRAU must be extractedand rate adapted to the rate of the switching network and vice versa for outgoing timeslots. An "n+1"redundancy concept is used for the cards that implement this function.

LICD diagnostics has been implemented with 3 working phases (see paragraph 5.4.2).

a) LICD diag start phaseThis phase checks the compatibility of the LICD with the database, executes a teston PDALARM forcing and some LOOPBACK tests on the card.OUTPUT if start phase fails :

b) LICD diag phase 1This phase executes twice the cardcheck firmware command to verify that the cardis working properly.OUTPUT if phase 1 fails:


If card access for report is successful:high byte = card reset register (0011h no reset inprogress 00efh reset in progress)low byte = semaphore PPxx -> DH on MPCC


firmware diagnosis failure,software Start/Force OOS failure

Negative firmware autodiagnostic result soft-ware/firmware negative answer

Unsuccessful software load: Load failure nack cause:

3=Failed11=No File Found16=Card Problem19=Load In Progress

NTW/TDPC outage, operatingsystem problem, software time-out

no add info

other causes trapped PCM channel data (parity error)

LEGEND



word[1..6] 0

word[7] LICD type required by DBA (low byte); physical LICD type reallypresent (high byte).1=QTLP V1;2=QTLP V2

212 A30808-X3247-K220-4-7620


The same as start phase.

c) LICD diag phase 2This phase performs the card reset, test network copy programming and executesdiagnostic checks on the specified card.OUTPUT if phase 2 fails:

d) LICD diag phase 3This phase performs card reset, test network copy programming and executes diag-nostic check on specified card.OUTPUT if phase 3 fails:

e) LICD diag end phaseThis phase is meaningless.OUTPUT if end phase fails:


word[1] firmware diagnose report(2)



word[4..6] 0

word[7] LICD type required by DBA (low byte);physical LICD type actually present(high byte).1=QTLP V1;2=QTLP V2

word[0] = error code(1); word[1-6] = 0 if card access fails OR

word[0-3]=; word[4-6] = 0 OR

word[7] = as word[7] of phase SP, WP

word[0] error code(1) ALARM REPORT(3)

word[1..6] 0 ALARM REPORT(3)

word[7] 0 ALARM REPORT(3)

word[0] = error code(1) if access card fails; word[1-7] = 0 OR

word[0-7]= ALARM REPORT(3)

The same as start phase.

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MMN:BSC

LEGEND

(1) The possible error codes issued by the LICD diagnostic are listed

ERROR CODE MEANING

FFFD parity data alarm is raised

FFFC NMI has occurred

FFFB inconsistent firmware response

FFFA timeout for card response has expired

FFF9 request incompatible with previous set

FFF8 firmware mismatched the command

FFF7 wrong data read from DUAM

FFF6 a reset has occurred

FFF5 card not inserted or fuse burned

FFF4 diagnostic has started

FFF3 stack overflow

FFF2 command not correctly understood

FFF1 queue buffer is full

FFF0 relay fuse burned

FFEF requested reset has not performed

FFED DUAM write/read loop error

FFD8 loopback test failed

FFD7 parity err force not working

(2) Firmware diagnose report

QTLP V1 (bit code)

word[0] xxxxxxxxxxxxxxxxxy y = 1 means board diagnose failed

word[1] xxxxxxxxxxxxxxxcba a = 1 means RAM1 failed

b = 1 means RAM2 failed

c = 1 means timer0 interrupt problem

word[2] xxxxxxxxxkhqrsvgp p = 1 means diagnose DTIOM0 failed

g = 1 means diagnose DTIOM1 failed

v = 1 means diagnose DTIOM2 failed

s = 1 means diagnose DTIOM3 failed

Tab. 5.5 Error Codes used by LICD Diagnostics

214 A30808-X3247-K220-4-7620


r = 1 means diagnose DTIOM4 failed

q = 1 means diagnose DTIOM5 failed

h = 1 means diagnose DTIOM6 failed

k = 1 means diagnose DTIOM7 failed

word[3] xxxxxxxxxxxxxxxnm m = 1 diagnostic parity checker

n = 1 diagnostic multiplexer

QTLP V2 (bit code)

word[0] xxxxxxxxxxxxxxxxxy y = 1 means board diagnose failed

word[1] xxxxxxxxxxedcbxxxa a = 1 means RAM1 failed

b = Internal alarm simulation test

c = MPCC Dual port RAM test

d = Flash EPROM checksum test

e = FPGA (Field Programmable Gate Array)loopback test

word[2] xxxxxxxxxkhqrsvgp p = 1 line alarm n˚0 simulation test failed

g = 1 line alarm n˚1 simulation test failed

v = 1 line alarm n˚2 simulation test failed

s = 1 line alarm n˚3 simulation test failed

r = 1 line alarm n˚4 simulation test failed

q = 1 line alarm n˚5 simulation test failed

h = 1 line alarm n˚6 simulation test failed

k = 1 line alarm n˚7 simulation test failed

word[3] xxxxxxxxxxxxonmxx m = 1 ESCC2 channel n˚0 test failed

n = 1 ESCC2 channel n˚1 test failed

Watch Dog Timer simulation test failed

(3) ALARM REPORT

word[0] xxxxxxxxxxxxxxxxxa a = 1 at least one internal alarm is active

word[1] xxxxxxlkjihgfedcba ab = 0: no alarm;ab = 2: transient alarm on SN interface;ab = 3: permanent alarm on SN interface

LEGEND


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MMN:BSC

5.4.10 DK40 Diagnostics

The copy 0 of DK40 device is used for the change version procedure from BR5.5 toBR6.0. It provides the following functions:

– MPCC interface: it receives the addresses and data busses from the second copyof the MPCC and selects the signals relevant to the active copy; maintenancecircuitry for fault detection is provided.

– Clock processor: it is implemented by a 80C186 microprocessor which acts as co-processor of the MPCC as fas as it concerns the disk file system functions.

– 4K words dual port RAM: it provides the intercommunications between the MPCCand the disk processor.

– Winchester Embedded Disk: it implements the mass storage memory.

– Synchronous data link for cross-wired connection to opposite copy: it is provided formaintenance purposes.

The copy 0 of DK40 unit also implements the control of the Alarm Panel circuit (ACKT).

DK40 diagnostic have been implemented with 5 working phases; phase 4 tests of theDK40 disk (see paragraph 5.4.2).

a) DK40 diag start phase

This phase is defined in order to initialize the hardware. It executes the followingtests:

– check of the “power on” of the card;

– verify if the card is in the rack;

– test the loop back register;

– reset the local microprocessor.OUTPUT if start phase fails:

c = 1 relay power supply off

d = 1 detected parity alarm in read cycle

e = 1 multiplexer alarmed (QTLP V1, V2 only)

h = 1 Queue buffer full (QTLP V1 only)

i = 1 board reset alarm (QTLP V1, V2 only)

j = 1 stack overflow (QTLP V1 only)

k = 1 data parity alarm upon read access onmpcc dual port (QTLP V1 only)

l = 1 data parity alarm of the FPGA controlmemory (QTLP V2 only)

word[2] xxxxxxxxxhgfedcba a-h = alarmed state of lines 0-7

word[3] Not meaningful

LEGEND


216 A30808-X3247-K220-4-7620


word[0] 0x0001 POWER_ON_TEST

word[1] 0x8004 card_not_powered

word[2] MPCC_sense_point_register

word[0] 0x0002 INSERTION_TEST

word[1] 0x8005 card_not_inserted


word[0] 0x0002 INSERTION_TEST

word[1] 0x8006 NMI_1st_access

word[0] 0x0003 ACCESS_DETECTOR_TEST

word[1] 0xf000 nmi_after_alarm_reset


word[1] 0xf002 nmi_after_sem_lock



word[1] 0xf003 sem_not_locked

word[2] maintenance_semaphore_lock_result+alarm_semaphore_lock_result


word[1] 0x8007 nmi_wr_word1



word[1] 0x8008 w1_comp_failed

word[2] value written to the PCS loopbackregister


word[1] 0x8009 nmi_wr_word0



word[1] 0x800a w0_comp_failed

word[2] value written to the PCS loopbackregister


word[1] 0xf004 sem_not_released

word[2] nmi_after_micro_reset

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b) DK40 diag phase 1This phase tests the DK40 internal alarm register to verify that the data and theaddressing parity alarm is correctly recognized.OUTPUT if phase 1 fails:

word[0] 0x0004 MICRO_RESET_TEST


word[2] nmi_after_micro_reset


word[1] 0x800b nmi_after_micro_reset


word[1] 0x800c unsuccessful_micro_reset

word[2] DPR location 03CEh content

word[3] DPR location 03D0h content

word[4] DPR location 03D2h content


word[1] 0x800d polling_interrupted

word[2] nmi_after_alarm_reset


word[1] 0x800e disk_not_available

word[2] DPR location 03DCh content


word[1] 0x800f timeout_expired

word[2] DPR location 03DCh content

word[0] 0x0005 ALARM_REGISTER_TEST

word[1] 0xf000 nmi_after_alarm_reset



word[1] 0x8010 no_nmi_after_al_forcing



word[1] 0xf001 alarm_not_reset

word[2] DK40 internal alarm register


word[1] 0x8011 alarm_not_forced


218 A30808-X3247-K220-4-7620


c) DK40 diag phase 2This phase tests the Dual Port RAM.OUTPUT if phase 2 fails:

d) DK40 diag phase 3This phase consists of calling to the internal diagnostics provided by the firmware inorder to test the RAM, the DPR, the SCC and the parity check circuit.

word[0] 0x0006 DPR_TEST

word[1] 0xf002 nmi_after_sem_lock


word[3] not locked semaphore index


word[1] 0x8012 nmi_wr_idx0


word[3] DPR offset


word[1] 0x8014 nmi_wr_idx1


word[3] DPR offset


word[1] 0x8016 nmi_clear_dpr


word[3] DPR offset





word[1] 0x8013 i0_comp_failed

word[2] DPR offset

word[3] pattern read back from DPR


word[1] 0x8015 i1_comp_failed

word[2] DPR offset



word[1] 0x8017 clear_dpr_failed

word[2] DPR offset


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e) DK40 diag phase 4This phase consists of calling the internal diagnostics provided by the firmware inorder to test the hard disk.OUTPUT if phase 4 fails:

f) DK40 diag phase 5This phase is defined in order to diagnose the alarm panel interface: it consists oftesting the lamp numbered 8..23 and the lamp numbered 0..7 corresponding to therelay drivers.OUTPUT if phase 5 fails:

g) DK40 diag end phaseThis phase is meaningless in the DK40 diagnostics.

word[0] 0x0007 FW_TEST

word[1] xxxxxxxxxxxxxxxxxxdcba a = 1 means RAM fault

b = 2means DPR fault

c = 3means SCC fault

d = 4means parity check ckt fault

word[2] DK40 internal alarmregister

word[0] 0x0008 DISK_TEST

word[1] xxxxxxxxxxxxxxxxbxxxxa a = 1 means disk fault

b = 1 means disk not ready

word[2] DK40 internal alarmregister

word[0] 0x0009 ALARM_PANEL_TEST

word[1] 0x8018 lamps_not_turned_off

0x8019 set_lamp_failed

0x801a get_lamp_failed


word[3] not working lamp state (high byte) + notworking lamp number

word[4] RELAY_DRIVERS_LAMP_TEST

word[5] 0x8018 lamps_not_turned_off

0x8019 set_lamp_failed

0x801a get_lamp_failed


220 A30808-X3247-K220-4-7620


LEGEND

TEST-ID VALUE

POWER_ON_TEST 0x0001

INSERTION_TEST 0x0002

ACCESS_DETECTOR_TEST 0x0003

MICRO_RESET_TEST 0x0004

ALARM_REGISTER_TEST 0x0005

DPR_TEST 0x0006

FW_TEST 0x0007

DISK_TEST 0x0008

ALARM_PANEL_TEST 0x0009

RELAY DRIVERS_LAMP_TEST 0x000a

Defines for each phase/test results

card_not_powered 0x8004

card_not_inserted 0x8005

NMI_1st_access 0x8006

nmi_wr_word1 0x8007

w1_comp_failed 0x8008

nmi_wr_word0 0x8009

w0_comp_failed 0x800a

nmi_after_micro_reset 0x800b

unsuccessfull_micro_reset 0x800c

polling_interrupted 0x800d

disk_not_available 0x800e

timeout_expired 0x800f

no_nmi_after_al_forcing 0x8010

alarm_not_forced 0x8011

nmi_wr_idx0 0x8012

i0_comp_failed 0x8013

nmi_wr_idx1 0x8014

i1_comp_failed 0x8015

Tab. 5.6 DK40: Test-id Values

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MMN:BSC

5.4.11 DISK on MPCC Diagnostics

The disk device realizes the mass storage of the SBS. The disks are housed on andaccessible from the MPCC cards. It is possible, through a flat cable that connects thetwo MPCC cards, to access from an MPCC to the disk of the other MPCC.

DISK diagnostic has been implemented with 5 working phases (see paragraph 5.4.2).

a) DISK diag start phase

This phase is meaningless.

b) DISK diag phase 1This phase verifies the disk accessibility. It performs an hardware reset to the diskunit and waits the result.OUTPUT if phase 1 fails:

c) DISK diag phase 2This phase issues to the disk the command that performs the internal diagnostictests implemented by the disk itself.OUTPUT if phase 2 fails:

d) DISK diag phase 3This phase verifies the disk accessibility through the flat cable. It performs an hard-ware reset to the disk unit and waits the result.OUTPUT if phase 3 fails:

nmi_clear_dpr 0x8016

clear_dpr_failed 0x8017

lamps_not_turned_off 0x8018

set_lamp_failed 0x8019

get_lamp_failed 0x801a

nmi_after_alarm_reset 0xf000

alarm_not_reset 0xf001

nmi_after_sem_lock 0xf002

sem_not_locked 0xf003

sem_not_released 0xf004

LEGEND

Tab. 5.6 DK40: Test-id Values

word[0] Disk status register

word[1] Disk error register





222 A30808-X3247-K220-4-7620


e) DISK diag phase 4This phase issues to the disk (through the flat cable) the command that performs theinternal diagnostic tests implemented by the disk itself.OUTPUT if phase 4 fails:

f) DISK diag phase 5This phase verifies the consistency of the system structures of the File System. Ifany inconsistences are found during the check, they will will be removed and thestructures rebuilt.OUTPUT if phase 5 fails:

g) DISK diag end phaseThis phase is meaningless.

During the execution of a disk test, it never occurs that all the above phases areperformed. It depends on MPCC status and if the request diag is for the local or remotedisk. The table below shows in detail which phases are executed in the several condi-tions.

5.4.12 IXLT Diagnostics

IXLT (Interface X.25 and Local Terminal) allows the MPCC to be connected to the OMC(by a X.25 protocol) and to the LMT via a proprietary HDLC protocol with V.11 interface.It implements the following functions:

– MPCC interface: it receives the addresses and data busses from the second copyof the MPCC and select the signals relevant to the active one;





word[2] Error counter






LOCAL DISK REMOTE DISK,MPCC HOT_STBY

REMOTE DISK, MPCC in Firmware

Start Start Start

WP 1 WP 1 WP 3

WP 2 WP 2 WP 4

WP 5 WP 3 WP 5

End WP 5 End

End

Tab. 5.7 List of phases that are executed in the several conditions

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MMN:BSC

– 8 Kbytes Dual Port Ram: it implements the intercommunications path between theMPCC and the IXLT;

– Two link controllers: they provide level 1 and level 2 both for the OMC and for theLMT;

The IXLT processor is built around a 386 SX microprocessor, running at 16MHZ, with3/4/6 Mbyte (depending on the card version) of RAM and 256 kbyte of EPROM (boot-strap); it is able to handle the full OSI stack.

With BR 5.0 the last version IXLTV6 can be used. It has the following features:

– Implements a microprocessor circuit based on CPU Intel 486SXLC-40 running at 20MHz.

– Provides a total of 6 MByte of static ram memory, parity protected, and 512 KByteof EPROM.

– Receives the address and data busses from the second copy of the administrativeprocessors (MPCC) and selects the signals relevant to the active copy.

– Provides a 6 K or 8 K word Dual Port Ram, parity protected, that implements theintercommunications path between IXLTV6 and the administrative processor(MPCC).

– Allows the administrative processor to reset directly the IXLTV6 processor andcontrol the V.11 interfaces.

– Provides three programmable 16 bit timers.

– Allows to handle 8 source of INTR interrupt by a programmable interrupt controller.

– Provides 128x16 bit word of serial EPROM to store card identification data.

It implements the following interfaces via two ESCC2:

– a 64 Kbit/s embedded in a 2 Mbit line torward the OMC via the MSC

– a V.11-X.21 (DTE) link toward OMC via PSPDN

– a V.11 (DCE) toward LMT

– a V.28 toward a debugger terminal

IXLT diagnostics has been implemented with 4 working phases (see paragraph 5.4.2).

a) IXLT diag start phase

This phase is defined in order to check the card availability. It executes the followingtests:

– verify if the card is powered

– control if the card is in the rackOUTPUT if start phase fails:

b) IXLT diag phase 1This phase tests the address bus with the walking one method and reset of the localmicroprocessor.OUTPUT if phase 1 fails:

word[0] 0x0001 TEST_ID _POWER_ON

word[1] 0x8003 CARD_NOT_POWERED

OR

word[0] 0x0002 TEST_ID _INSERTION

word[1] 0x8004 CARD_ACCESS_FAILED

224 A30808-X3247-K220-4-7620


c) IXLT diag phase 2This phase tests the internal alarm register to verify that the data and the addressingparity alarms are recognized correctly .OUTPUT if phase 2 fails:

d) IXLT diag phase 3This phase tests the entire DPR.OUTPUT if phase 3 fails:

e) IXLT diag phase 4This phase call to the internal diagnostic provided by the firmware.OUTPUT if phase 4 fails:

word[0] 0x0003 TEST_ID_ACCESS_DETECTOR

word[1] 0x8004 CARD_ACCESS_FAILED

OR

word[0] 0x0003 TEST_ID_ACCESS_DETECTOR

word[1] 0x8009 ALARM_NOT_RESET

OR

word[0] 0x0004 TEST_ID_MICRO_RESET

word[1] 0x8005 UNSUCCESSFUL_MICRO_RESET

OR


word[1] 0x8007 UNSUCCESSFUL_FW_READY

word[2] IXLT alarm register

word[3] IXLT sense point register

word[4] IXLT loopback register

word[5] IXLT control point register

word[6] IXLT DUAM interrupt register

OR


word[1] 0x8006 UNSUCCESSFUL_DUAM_INIT






word[0] 0x0006 TEST_ID_ALARM_REGISTER

word[1] 0x8008 ALARM_NOT_FORCED

word[2] ERR_ALRMERR_NONMIERR_FORCE

word[0] 0x0005 TEST_ID_DPR

word[1] 0x800a UNSUCCESSFUL_DPR_TEST

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MMN:BSC

f) IXLT diag end phaseThis phase gives a reset to the microprocessor to delete card settings.

word[0] 0x0007 TEST_ID_FW

word[1] 0x800b MBX_ERROR

0x800c MSG_ERROR

0x800d TIMER_ERROR

0x800e TIMEOUT_ERROR

0x800f FW_READY_OK

0x8010 FW_READY_NOK






226 A30808-X3247-K220-4-7620


LEGEND

TEST-ID VALUE

MDGHD_IXLT 0x0000

TEST_ID_POWER_ON 0x0001

TEST_ID_INSERTION 0x0002

TEST_ID_ACCESS_DETECTOR 0x0003

TEST_ID_MICRO_RESET 0x0004

TEST_ID_DPR 0x0005

TEST_ID_ALARM_REGISTER 0x0006

TEST_ID_FW 0x0007

Defines for each phase/test results

INVALID_CARD_MNEMONIC 0x8000

COPY_OUT_OF_RANGE 0x8001

INVALID_PHASE_NUMBER 0x8002

CARD_NOT_POWERED 0x8003

CARD_ACCESS_FAILED 0x8004

UNSUCCESSFUL_MICRO_RESET 0x8005

UNSUCCESSFUL_DUAM_INIT 0x8006

UNSUCCESSFUL_FW_READY 0x8007

ALARM_NOT_FORCED 0x8008

ALARM_NOT_RESET 0x8009

UNSUCCESSFUL_DPR_TEST 0x800a

MBX_ERROR 0x800b

MSG_ERROR 0x800c

TIMER_ERROR 0x800d

TIMEOUT_ERROR 0x800e

FW_READY_OK 0x800f

FW_READY_NOK 0x8010

Tab. 5.8 IXLT: Test-id Values

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MMN:BSC

5.4.13 PPCU Diagnostics

The PPCU card is a peripheral processing board which allows the GPRS feature in theSBS. Its basic functions are channel resource allocation and protocol conversionbetween the Abis and the Gb interface.

One BSC can be equipped with 4 PPCU board. The boards are subdivided into two pairswith redundancy 1+1. Each pair of redundant PPCUs identifies a PCU serving an inde-pendent GPRS area.

The perform-test command is addressed to a PPCU x, where x is the absolute numberof the PPCU: the first two copies refer to the first PCU, the last two to the second one.

The MPCC controls the PPCU via the UBEX, for operating and maintenance purposes;the TDPC exchanges messages with the PPCU through a 8 Kbyte dual port RAM; theselection of the active copy of the TDPC is under the control of the MPCC.

One PCU (a couple of 1+1 redounded PPCU) has access to a whole 2 Mb/s flux towardsSN16. This bandwidth, composed of 32 time slots at 64 Kb/s, is shared by the four DSPsof the ABIC processor (which work on 16 Kb/s time slots connected to the BTS) and bythe GbIC (connected via frame relays at 64 Kb/s to the SGSN). The PPCU under test,however, and in general the PPCU that is not providing service, is disconnected fromthe SN.

PPCU diagnostics have been implemented with 5 working phases (see paragraph5.4.2). The phases 1, 2, 3 are in effect performed by the PCUC software, but arerequested by the MPCC software via a unique command (MPCC DUAM). The outputresult towards MPCC (about 230 bytes) contains the information regarding all these 3phases. The MPCC diagnostic software splits this information up and formats it for theoutput result.

a) PPCU diag start phaseThis phase checks NTW outages and TDPC outages, loopback tests, CPU resets,firmware auto-diagnosis, software loads.OUTPUT if start phase fails :

word[0] Source item (1)

word[1] Source code line

word[2] Error code (2)

228 A30808-X3247-K220-4-7620


word[3] Cases:a) Firmware autodiagnostics failure(meaning of possible bit values):0 = test failure of Pentium RAM (64 MB);1 = test failure of DSP 0 internal RAM (64KB);2 = test failure of DSP 1 internal RAM (64KB);3 = test failure of DSP 2 internal RAM (64 KB);4 = test failure of DSP 2 internal RAM (64 KB);5 = test failure concerning RAM on Motorola (2MB);6 = test failure of TDPC-PPCU DUAM)

b) Unsuccessful Start / Force Out of Service Command toPCUC:Low byte -> Byte 0 of PCUC answer = 0x36 (Start/Force Outof Service Code);High byte -> Byte 1 = 0x2 (unsuccessful)

c) Unsuccessful software executable load: cause of failure(possible nack causes:3 = Failed11 = No File Found16 = Card Problem19 = Load In Progress)

d) Unsuccessful patches load: list of possible nack causes:3 = Failed (patch file probably corrupted)19 = Another Load In Progress21 = File System failure23 = Load Aborted

e) Time out during a MPCC - PCUC command, TDPCoutage and all other causes of error:UBEX Register "mirror" (stored copy of last written values)(low byte)Saved bit mask of PPCU last alarms read on UBEX register (ifany) (high byte)

word[4] Cases: firmware diagnostics failure, unsuccessful Start /Force Out Of Service command to PCUC:Byte 2 of PCUC answer (low byte);Byte 3 of PCUC answer (high byte)

In case of time out during a MPCC - PCUC command, TDPCoutage and all other causes of error:software semaphore (MPCC -> PCUC) on MPCC-PCUCDUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte)

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MMN:BSC

b) PPCU diag phase 1This phase tests the hardware circuitry that can be interfaced by the PCUC. Itperforms a read/write check on the TDPC and MPCC DUAM (checks for parityalarms). It performs a fast access test of the Qspan, (checks for access alarms).Notice that the phase 3, which checks the GbIC, indirectly performs a test of theQspan. The Qspan is the Bus Bridge which allows communication between thePCUC and the GbIC.OUTPUT if phase 1 fails:

word[5] Cases: firmware diagnostics failure, unsuccessful Start /Force Out Of Service command to PCUC:Byte 4 of PCUC answer (low byte);Byte 5 (high byte)

In case of time out during a MPCC - PCUC command, TDPCoutage and all other causes of error:Second byte of PPCU DH command to PPCU Agent onPCUC (low byte);Third byte of PPCU DH command to PPCU Agent on PCUC(high byte)


In case of time out during a MPCC - PCUC command, TDPCoutage and all other causes of error:software semaphore (PCUC -> MPCC) on MPCC-PCUCDUAM (low byte);first byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)


In case of time out during a MPCC - PCUC command, TDPCoutage and all other causes of error:Second byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Third byte of PPCU Agent answer to PPCU DH on MPCC(high byte)

230 A30808-X3247-K220-4-7620


word[0] If a problem was detected by diagnostic test:Bit mask showing problem area:00000100 means MPCC DUAM failure;00001000 means TDPC DUAM failure.

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Source item (high byte) and error code (low byte).

word[1 If a problem was detected by diagnostic test:Stored copy of last value written on UBEX register (low byte)and stored copy of last alarms (if any) read on UBEX register(high byte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Source code line

word[2] If a problem was detected by diagnostic test:software semaphore (MPCC -> PCUC) on MPCC-PCUCDUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Stored copy of last value written on UBEX register (low byte)and stored copy of last alarms (if any) read on UBEX register(high byte)

word[3] If a problem was detected by diagnostic test:Second byte of PPCU DH command to PPCU Agent onPCUC (low byte);third byte of PPCU DH command to PPCU Agent on PCUC(high byte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):software semaphore (MPCC -> PCUC) on MPCC-PCUCDUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte)

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MMN:BSC

c) PPCU diag phase 2This diagnostic phase checks the AbIC, verifying whether all the DSPs are correctlysending the communication interrupt to the PCUC.OUTPUT if phase 2 fails:

word[4] If a problem was detected by diagnostic test:software semaphore (PCUC -> MPCC) on MPCC-PCUCDUAM (low byte);first byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Second byte of PPCU DH command to PPCU Agent onPCUC (low byte);third byte of PPCU DH command to PPCU Agent on PCUC(high byte)

word[5] If a problem was detected by diagnostic test:Second byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Third byte of PPCU Agent answer to PPCU DH on MPCC(high byte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):software semaphore (PCUC -> MPCC) on MPCC-PCUCDUAM (low byte);first byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)

word[6] If a problem was detected by diagnostic test:Fourth byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Fifth byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Second byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Third byte of PPCU Agent answer to PPCU DH on MPCC(high byte)

word[7] If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Fourth byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Fifth byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)

232 A30808-X3247-K220-4-7620


word[0] If a problem was detected by diagnostic test:Bit mask showing problem area:00000001 means AbIC failure.0x0020 means loop test on AbIS interface of DSP processorsfailed: more in details, one or more AbIC received someuncorrect PCU Frames from PLD closed in loop mode.


word[1] If a problem was detected by diagnostic test:a) if AbIS loop test failed: Bit mask of failed DSP (for example,0x0005 means DSP-0 (0X01) and DSP-2 (0x04)).b) otherwise: stored copy of last value written on UBEXregister (low byte) and stored copy of last alarms (if any) readon UBEX register (high byte)


word[2] If a problem was detected by diagnostic test:a) if AbIS loop test failed: Bit mask of PDT channels involvedin failure (AbIC-0 -->PDT 0-15)b) otherwise: software semaphore (MPCC -> PCUC) onMPCC-PCUC DUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte)


word[3] If a problem was detected by diagnostic test:a) if AbIS loop test failed: Bit mask of PDT channels involvedin failure (AbIC-1 -->PDT 16-31)b) otherwise: second byte of PPCU DH command to PPCUAgent on PCUC (low byte);third byte of PPCU DH command to PPCU Agent on PCUC(high byte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):software semaphore (MPCC -> PCUC) on MPCC-PCUCDUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte).

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MMN:BSC

word[4] If a problem was detected by diagnostic test:a) if AbIS loop test failed: Bit mask of PDT channels involvedin failure (AbIC-2 --> PDT 32-47).b) otherwise: software semaphore (PCUC -> MPCC) onMPCC-PCUC DUAM (low byte);first byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)


word[5] If a problem was detected by diagnostic test:a) if AbIS loop test failed: Bit mask of PDT channels involvedin failure (AbIC-3 --> PDT 48-63).b) otherwise: second byte of PPCU Agent answer to PPCUDH on MPCC (low byte)Third byte of PPCU Agent answer to PPCU DH on MPCC(high byte)


word[6] If a problem was detected by diagnostic test:a) if AbIS loop test failed: word not usedb) otherwise:Fourth byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Fifth byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)


word[7] a) if AbIS loop test failed: word not usedb) otherwise: If a fault was detected during MPCC-PCUCinterface (concerning hardware or firmware or TDPC-PPCUDUAM):Fourth byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Fifth byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)

234 A30808-X3247-K220-4-7620


d) PPCU diag phase 3This phase tests the performance of the GbIC software and obtains the result of theself-tests that are done by the GbIC software after it has been started by the PCUC.OUTPUT if phase 3 fails:

word[0] If a problem was detected by diagnostic test:Bit mask showing problem area:00000010 means GBIC failure;00010000 means QSPAN failure.


word[1] If a problem was detected by diagnostic test:stored copy of last value written on UBEX register (low byte)and stored copy of last alarms (if any) read on UBEX register(high byte)


word[2] If a problem was detected by diagnostic test:software semaphore (MPCC -> PCUC) on MPCC-PCUCDUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte)


word[3] If a problem was detected by diagnostic test:Second byte of PPCU DH command to PPCU Agent onPCUC (low byte);third byte of PPCU DH command to PPCU Agent on PCUC(high byte)

If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):software semaphore (MPCC -> PCUC) on MPCC-PCUCDUAM (low byte)First byte of PPCU DH command to PPCU Agent on PCUC(high byte)

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MMN:BSC

e) PPCU diag end phaseThe only role of this phase is to put the PPCU in the off-line state. It does not containany diagnostic information.(1) identifier of source item where problem took place:

word[4] If a problem was detected by diagnostic testsoftware semaphore (PCUC -> MPCC) on MPCC-PCUCDUAM (low byte);first byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)


word[5] If a problem was detected by diagnostic test:Second byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Third byte of PPCU Agent answer to PPCU DH on MPCC(high byte)


word[6] If a problem was detected by diagnostic test:Fourth byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Fifth byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)


word[7] If a fault was detected during MPCC-PCUC interface(concerning hardware or firmware or TDPC-PPCU DUAM):Fourth byte of PPCU Agent answer to PPCU DH on MPCC(low byte)Fifth byte of PPCU Agent answer to PPCU DH on MPCC (highbyte)

236 A30808-X3247-K220-4-7620


LEGEND

(1) Identifier of source item where problem occurred

1 DHXXDCCH

2 DHXXDCDE

3 DHXXDCEH

4 DHXXDCSA

5 DHXXDCSM

6 DHXXDCTH

7 DHXXDDDI

8 DHXXDDHD

9 DHXXGSUT

10 DHXXININ

11 DGHDXXDP

12 DHXXDDPU

(2) Error code description

NTW_outage_test: 0001h

TDPC_outage_test: 0002h

Loop_test: 00e3h (access to loopback reg.)00e4h (NMI)

FW_diagnose_test: 00e2h (diagnosis failed)008ah (firmware time out)

SW_load_test: 000ch (load failed)0014h (file system problem)

Operating system problems: 000ah (mailbox creation failed, null DH answer)

Tasks interface problems: 000bh (PPxx DH time-out during load function)

Software start: 0080h (software nack answer) or 008ah (softwaretime out)

Forcing Out Of Service idlestatus:

0081h (software nack answer) or 008ah (softwaretime out)

Alarm raising during cardaccess:

008ch (time-out expired in command sending)00a0h (alarm detected during reading operation ofsoftware answer)

Tab. 5.9 PPCU: Test-id Values

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MMN:BSC

5.4.14 PPXL Diagnostics (for BSC High Capacity)

The PPXL card is a peripheral processing board, introduced in the BSC to handle allSS7 and LAPD links. A unique PPXL is able to handle up to 256 links: then one boardcan handle all the LAPD (240) and SS7L (8) links. The redundancy approach chosen isto spread signalling links on both boards having both in service. When both PPXLs arein service, each of them brings half of the configured LAPD’s and SS7L’s.

The PPXL is realised with a standard Intel Pentium processor architecture. The hostprocessor used is the Mobile Pentium III feature on-die 256 kbyte L2 cache and the hostbus runs at 100Mhz. The equipment of Pentium III includes the Intel 440BX AGPset,which consists of the 82443BX Host Bridge Controller (BX) and the 82371AB PCI ISAIDE Accelerator (PIIX4E). At On the PCI bus is located an HDLC controller (fromCONEXANT) that handles L2 protocol handling manages the LAPD/SS7 links. TheHDLC controller has the capability to handle up to 256 physical channels; up to 240LAPD can be handled (e.g. 78 channels at 64 kbit/s and 162 channels at 16 kbit/s + 8SS7 channels). The same bandwidth can be used with a smaller number of channelsbut at higher bit rate; the super-channeling is supported in hardware by the HDLCcontroller itself, for the LAPD/SS7 application the device is always connected to theSNAP.

From the MPCC point of view, the hardware/software interface is structured by severalregister accessible by PPXL Device Drivers.

Control points:

– Active TDPC selection

– Active SNAP/PLLH selection

– Connection/Disconnection of PCM output from SNAP

– Alarm reset

– CPU reset

Sense points:

– Timing alarm (missing clock from PLLH)

– Address parity alarm on UBEX bus

– Data parity alarm on UBEX bus

– Wrong parity from SNAP

The rest of the 256 byte MPCC DUAM is used for message exchange between theMPCC software and the PPXL software.

PPXL diagnose has been implemented with 4 working phases (see paragraph 5.4.2).

a) PPXL diag start phaseThis phase resets the card checking the result asks the System Download Task toload it, then verifies that the software answers correctly, check the alarm presence.OUTPUT if start phase fails :

Wordnumber

Byte Possiblevalues

Meaning

word[0] Item

word[1] Line

word[2] Error Code

238 A30808-X3247-K220-4-7620


b) PPXL diag phase 1

– MPCC-PPXU DUAM (the test reads and rewrites each MPCC duam location tofix memory parity errors).

– TDPC-PPXU DUAM (the test reads and rewrites each TDPC duam location to fixmemory parity errors)


c) PPXL diag phase 2

– FPGA loopback

– MUSYCC tests

– MUSYCC loop

– MUSYCC alarmsOUTPUT if phase 2 fails:

word[3] Register 4&7 Dump.If ErrorCode=0xC, this word contains theerror_cause, defined in sdbaincl (CSD_)

word[4] Register 8&11 Dump




Wordnumber

Byte Possiblevalues

Meaning

wordnumber

byte possiblevalues

meaning

word[0] low 0x03 MPCC DUAM check failure(writing/reading)

word[0] high

word[0] low 0x05 NMI during MPCC DUAM access

word[0] high bit mask:0001 0000

0010 00000100 00001000 0000

Source of NMI:Transmission conflicts towards SNAP(DSP/MUSYCC)Watch dogData parity error in read operation from DUAMParity error on PCI bus

word[0] low 0x04 TDPC DUAM check failure

word[0] high

word[0] low 0x07 Lack of PCU power (1.8 V)

word[0] high

word[0] low 0x06 NMI during TDPC DUAM access

word[0] high bit mask:0001 0000

0000 00100000 01000000 1000

Data parity alarm on bits 0-7(reading operation)Data parity alarm on bits 8-15Data parity alarm on bits 16-23Data parity alarm on bits 24-31

word[1...7] low/high not used not used

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MMN:BSC

d) PPXL diag end phaseThe only role of this phase is to put the PPXL in service.

5.4.15 PPXU Diagnostics (for BSC High Capacity)

The PPXU card is a peripheral processing board, introduced in the BSC high capacityto allow the GPRS feature. Its basic functions are channel resource allocation andprotocol conversion between Abis and Gb interface. One BSC can be equipped with 6PPXU boards. 5 boards have to be considered in service simultaneously, the redun-dancy scheme chosen is load balancing in order to have all boards in service.Theperform-test command is addressed to a PPXU x, where x is the absolute number ofPPXU.

The PPXU board is composed of several parts:

– The PCUC (PCU Control Processor): it is realised with a standard Intel Pentiumprocessor architecture. The host processor used is the Mobile Pentium III running ateither 400 MHz or 500 MHz, depending on the equipped component. The MobilePentium III feature on-die 256 Kbyte L2 cache and the host bus runs at 100 MHz.The equipment of Pentium III includes the Intel 440BX AGPset, which consists of the82443BX Host Bridge Controller (BX) and the 82371AB PCI ISA IDE Accelerator(PIIX4E). At On the PCI bus is located an HDLC controller (from CONEXANT) that,on the GPRS application handles. The HDLC controller has the capability to handleup to 256 physical channels but, in GPRS application, a reduced number is required(max 127; 64 to Abis interface and 63 to Gb interface). The same bandwidth can beused with a smaller number of channels but at higher bit rate; the super-channelingis supported in hardware by the HDLC controller itself. The device, for the GPRSapplication, is connected to the SNAP.

– The ABIC (Abis interface controller): it is composed of 4 DSPs TMS320C5410 fromTexas Instruments, each one with its three integrated serial communication control-lers. They internally run with a 100 MHz clock, and work together exchangingpackets on Abis. They operate via a DSP controller (PLD UART - Universal Asyn-chronous Receiver/Transceiver) on ISA bus that on its turn, through the PIIX4Bridge, can communicate with the PCI bus.

wordnumber

byte possiblevalues

meaning

word[0] low 0x01 Failure of FPGA loopback access test

word[0] high

word[0] low 0x08 MUSYCC initialization problem

word[0] high S

word[0] low 0x09 Problem during MUSYCCinternal loop(pattern sending/receiving)

word[0] high

word[0] low 0x0A Presence of SERR alarm(address parity error) on MUSYCC

word[0] high

word[1...7] low/high not used not used

240 A30808-X3247-K220-4-7620


– External Telephony and Administration Bus interface: it includes 2 Dual Port RAM’sone with size 8 Kb by 18 bits for data exchange with TDPC, and the other with size256 bytes by 9 bits for data exchange with MPCC.

– The integrated PCI bus interface: it is clocked at 33.3 or 30 MHz and allows commu-nication among PIIX4, QSpan and MTXC

PPXU diagnose has been implemented with 5 working phases (see paragraph 5.4.2).

a) PPXU diag start phaseThis phase resets the card checking the result asks the System Download Task toload it, then verifies that the software answers correctly, check the alarm presence.OUTPUT if start phase fails :

b) PPXU diag phase 1

– CPU power (the test verifies 1.8 V voltage)

– MPCC-PPXU DUAM (the test reads and rewrites each MPCC duam location tofix memory parity errors).

– TDPC-PPXU DUAM (the test reads and rewrites each TDPC duam location to fixmemory parity errors).


Wordnumber

Byte Possiblevalues

Meaning

word[0] Item

word[1] Line

word[2] Error Code

word[3] Register 4&7 Dump.If ErrorCode=0xC, this word contains theerror_cause, defined in sdbaincl (CSD_)





Wordnumber

Byte Possiblevalues

Meaning

0 low 0x07 CPU power lack

0 low 0x03 MPCC DUAM check failure (writing/reading)

0 high -

0 low 0x05 NMI during MPCC DUAM access

0 high bit mask:0001 0000

0010 00000100 00001000 0000

sources of NMITransmission conflicts towards SNAP(DSP/MUSYCC)Watch Dogdata parity error in read operation from DUAMparity error on PCI Bus

0 low 0x04 TDPC DUAM check failure

0 high -

A30808-X3247-K220-4-7620 241


MMN:BSC

possible specific problems (first add info in test report); see Tab. 5.10.

c) PPXU diag phase 2

– FPGA loopback

– MUSYCC tests

– MUSYCC loop

– MUSYCC alarmsOUTPUT if phase 2 fails:


d) PPXU diag phase 3

– MUNICH internal loop

– MUNICH - DSP loop

– MUNICH - FPGA loopOUTPUT if phase 3 fails:

0 low 0x06 NMI during TDPC DUAM access

0 high bit mask:0000 00010000 00100000 01000000 1000

Data parity alarm on bits 0-7 (reading operation)Data parity alarm on bits 8-15 (reading)Data parity alarm on bits 16-23 (reading)Data parity alarm on bits 24-31 (reading)

1..7 low /high

Not used Not used

Wordnumber

Byte Possiblevalues

Meaning

Wordnumber

Byte Possiblevalues

Meaning

0 low 0x01 Failure pf FPGA loopback access test

0 high -

0 low 0x08 MUSYCC Initialization problem

0 high -

0 low 0x09 Problem during MUSYCC internal loop(patterns sending/receiving)

0 high -

0 low 0x0A Presence of SERR alarm (address parity error)on MUSYCC

0 high -

1..7 low /high

Not used Not used

242 A30808-X3247-K220-4-7620


Wordnumber

Byte Possible values Meaning

0 low 0x20 MUNICH Initialization problem duringinternal MUNICH loop or MUNICH-DSPloop

1 high /low

Range 0x000 -0xFFFF

Number of source code line

2 low 0x00

0x010x020x03

Uncorrect input argument of MUNICH InitroutineMUNICH reset failurePort configuration failureChannel Init failure

0 low 0x23 Failure during MUNICH internal loop test

0 high - Number of faulted channels

1 low - -

1 high - -

2 low - -

2 l high - -

3 low - -

3 high - -

4 low Bit mask 0000 0001--> problem on channel 00000 0010 --> problem on channel 10000 0100 --> problem on channel 2................................1000 0000 --> problem on channel 7

4 high Bit mask 0000 0001--> problem on channel 80000 0010 --> problem on channel 90000 0100 --> problem on channel 10................................1000 0000 --> problem on channel 15

5 low Bit mask 0000 0001--> problem on channel 160000 0010 --> problem on channel 170000 0100 --> problem on channelel 18................................1000 0000 --> problem on channel 23

5 high Bit mask 0000 0001--> problem on channel 240000 0010 --> problem on channel 250000 0100 --> problem on channel 26................................1000 0000 --> problem on channel 31

6 low bit mask 0000 0001--> problem on channel 320000 0010 --> problem on channel 330000 0100 --> problem on channel 34................................1000 0000 --> problem on channel 39

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MMN:BSC

6 high bit mask 0000 0001--> problem on channel 400000 0010 --> problem on channel 410000 0100 --> problem on channel 42................................1000 0000 --> problem on channel 47

7 low bit mask 0000 0001--> problem on channel 480000 0010 --> problem on channel 490000 0100 --> problem on channel 50................................1000 0000 --> problem on channel 55

7 high bit mask 0000 0001--> problem on channel 560000 0010 --> problem on channel 570000 0100 --> problem on channel 58................................1000 0000 --> problem on channel 63NOTE:Other information (if any) about channelsproblems are reported inside System Inforeport issued by PPXU Device Handler onMPCC (info id=... and originator=...)

0 low 0x25 Failure of DSP setting to MUNICH-DSPloop mode (case a) or: failure ofMUNICH-DSP loop test (case b)

0 high Case a:2->DSPaddress=0x80024->DSPaddress=0x8004

Case a: Location where an uncorrect valuewas readCase b: 0xFF (meaningless)

1 High/low

Range 0x00 -0xFFFF

Cases a, b: number of source code line

2 low Case a: bit mask0000 0001 DSP-00000 0010 DSP-10000 0100 DSP-20000 1000 DSP-3Case b:range 1-256

Case a: Faulty DSP during loop settingCase b: number of faulty channels

2 high not used not used

Wordnumber


244 A30808-X3247-K220-4-7620


3 low bit mask:0000 0001 AbIC-00000 0010 AbIC-10000 0100 AbIC-20000 1000 AbIC-30001 0000 AbIC-40010 0000 AbIC-50100 0000 AbIC-61000 0000 AbIC-7

Case a: Faulty AbIC (DSP cores) duringloop settingCase b: not used

3 high bit mask:0000 0001 AbIC-80000 0010 AbIC-90000 0100 AbIC-100000 1000 AbIC-110001 0000 AbIC-120010 0000 AbIC-130100 0000 AbIC-141000 0000 AbIC-15

4 high/low

Case a: value read on AbIC-0Case b: bit mask of faulty channels (0-15)

5 high/low


6 high/low


7 high/low


NOTE:Other information (if any) about channelsproblems are reported inside System InfoReport issued by PPXU Device Handler onMPCC (info id=... and originator=...)

0 low 0x26 Failure of DSP setting to MUNICH-FPGAloop mode (case a) or:failure of MUNICH-FPGA loop test (caseb)

0 high Case a:2--> DSPaddress=0x80024--> DSPaddress=0x8004

Case a: Location where an uncorrect valuewas readCase b: 0xFF (meaningless)

1 low /high

Range 0x00-0xFFF Cases a,b:Number of souce code line

Wordnumber


A30808-X3247-K220-4-7620 245


MMN:BSC


e) PPXU diag end phaseThe only role of this phase is to put the PPXU in service.

2 low Case a:Bit mask:0000 0001 DSP-00000 0010 DSP-10000 0100 DSP-20000 1000 DSP-3Case b:range 1-256

Case a: Faulty DSP during loop settingCase b: number of fauty channels

2 high not used not used

3 low Bit mask:0000 0001 AbIC-00000 0010 AbIC-10000 0100 AbIC-20000 1000 AbIC-30001 0000 AbIC-40010 0000 AbIC-50100 0000 AbIC-61000 0000 AbIC-7


3 high Bit mask:0000 0001 AbIC-80000 0010 AbIC-90000 0100 AbIC-100000 1000 AbIC-110001 0000 AbIC-120010 0000 AbIC-130100 0000 AbIC-141000 0000 AbIC-15


4 low /high

Case a: Value read on AbIC-0Case b: bit mask of faulty channels (0-7)

5 low /high


6 low /high


7 low /high


Wordnumber


246 A30808-X3247-K220-4-7620


LEGEND

(1) Possible specific problems

PPXUAGDC_NMI_MPCC_DUAM_ERR

0x05 (NMI during access to DUAM)

PPXUAGDC_MPCC_DUAM_ERR

0x03 (error in writing/reading DUAM)

PPXUAGDC_NMI_TDPC_DUAM_ERR_DUAM

0x06 (NMI during access to TDPC-PPXU)

PPXUAGDC_TDPC_DUAM_ERR

0x04 (error in writing/reading DUAM)

PPXUAGDC_FPGA_LOOPB_ERR

0x01

PPXUAGDC_MUSYCC_LOOP_ERR

0x09

PPXUAGDC_MUSYCC_ALARM_ERR

0x0A

PPXUAGDC_MUNICH_INIT_ERR

0x20 (MUNICH Init problems)

PPXUAGDC_MUNICH_DIAG_ERR

0x23 (internal loop problems)

PPXUAGDC_MUNICH_INIT_ERR

0x20

PPXUAGDC_DSP_LOOP_ERR

0x25 (loop problems)

PPXUAGDC_DSP_FPGA_LOOP_ERR

0x26

PPXUAGDC_CPU_POWER_ERR

0X07 (CPU power lack)

PPXUAGDC_MUSYCC_INT_ERR

0x08 (MUSYCC Init problems)

Tab. 5.10 PPXU: Test-id Values

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MMN:BSC

5.5 NACK CAUSES

- unsuccessful wrong meid the objects addressed are not correct.- object not equipped the MOT is not created.- other tests running maximum number of tests are already queued

or running. No more tests are acceptable.- MOTS_NOT_LOCKED the MOT is not locked.

The following are the nack causes directly reported by DH:

- T_Resource_Currently_Busy- T_Invalid_Command_Parms- Unsuccessful_Ntv_Outage- Unsuccessful_Object_Notequipped- Unsuccessful_Invalid_Status- Unsuccessful_Power_Off- Unsuccessful_Other_Copy_Powered_Down

248 A30808-X3247-K220-4-7620


A30808-X3247-K220-4-7620 249


MMN:BSC

6 AbbreviationsACTM ACT for the Base Rack/Shelter

BSS Base Station System

BTS Base Transceiver Station

BTSE Base Transceiver Station Equipment

DH Device Handler

DISK physic disk

DK40 Led Alarm Panel Control

DUKIT Duplex Combiner Kit

EMI Electro Magnetic Interference

ESD Electrostatic Sensitive Device

GSM Global System for Mobile Communications

HMOI Hardware Managed Object

HW Hard Ware

HW Hardware

ITMN Installation & Test Manual

IXLT Interface X.25 and Local Terminal Interface

LAPD Link Access Procedure on the D-Channel

LED Light Emitting Diode

LICD Line Card

LICDS Line Card Spare

LMT Local Maintenance Terminal

MEMT Memory of Telephone Processor

MOT Managed Object Under Test

MPCC Main Processor Control Circuit

N No

nob-RIU Not On Board Remote Inventory Unit

NTW Network

ob_RIU On Board Remote Inventory Unit

OMC Operation and Maintenance Center

OS Operating System

PCM Pulse Code Modulation

PLLH Phase Locked Loop Oscillator High Perfor-mance

PLMN Public Land Mobile Network

PPCC Peripheral Processor Common Channel

PPCU Peripheral packet Control Unit

PPLD Peripheral Processor LAPD

PPXL Peripheral processor LAPD/SS7

PPXU Peripheral processor used at PPCU evolu-tion

250 A30808-X3247-K220-4-7620


PPXX Peripheral Processor

PWRD Power Distributor

RC Radio Commander

SBS Siemens Base Station

SN16 Switching Network at 16 Kbit/s

SS7 CCITT Common Channel Signalling No.7

SW Software

SYNC Synchronization Source

SYNE External Synchronization Source

TAC Technical Assistance Center

TDPC Telephony and Distributor Processor Circuit

TRAU Transcoder and Rate Adaption Unit

UBEX Universal Bus Extender

Y Yes

Documents

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