Business of Cleans - Linx Consulting · 2018. 11. 20. · Business of Cleans ‘Challenges of the Future’ April 9, 2018 Jagan Srinivasaraghavan Supply Chain R&D Engineer Intel Corporation

Business of Cleans‘Challenges of the Future’

April 9, 2018

Jagan Srinivasaraghavan

Supply Chain R&D Engineer

Intel Corporation

Co-Author:

Archita Sengupta

Senior Technologist & Rel. MCSC Program Manager

Intel Corporation

Semiconductor Industry on the upswing

Source: Strategy Analytics, McKinsey AnalysisMcKinsey on Semiconductors, Issue 6, 2017

Source: McKinsey Global Institute AnalysisMcKinsey on Semiconductors, Issue 6, 2017

Automotive (AI) Internet of Things

Semi Industry is reorienting itself to IOT, Cloud & AI

Data Center, VR & Cloud

© Intel Corporation 2018 jagannathan@[email protected]

Moore’s law on track

Patterning and clean chemical demand and complexities increase to keep up with Moore’s law

World Semiconductor Trade Statistics (WSTS)

Source:

https://www.semiconductors.org/clientuploads/GSR/January_

2018_GSR_table_and_graph_for_press_release.pdf

Source: Intel


Advanced Materials and Cleaning requirements

Source: Linx Consulting, Cleaning and Surface Preparation 2017

Expecting increases in general cleaning demand&

The number of materials it needs to interact with

Source: ASM


Clean Volume

0

20

40

60

80

100

120

140

$-

$1,000

$2,000

$3,000

$4,000

$5,000

$6,000

$7,000

SS3DN 10nm ASIC 10nm MPU 16nmDRAM

3DXPT

Processed Wafer Cost and # Cleans Steps

$/Wafer # Cleans Steps




Delivering the Clean Technology of Tomorrow

• Narrowing Dimensions lead to complex cleaning needs

• Increasing Volume demand with greater qualification sensitivity

• Enhanced Quality Control expectations for clean chemicals

• Better Selectivity

• “Remove X, Y, Z without damaging A,B,C”

• ‘Smaller’ particle sizes are now ‘significant’

• Enhanced Purity

• New look at trace level contaminants

• Advanced characterization techniques

• Reduced variability at all levels of supply chain

• Environmental Factors

14 nm 10 nm 7nm5nm

‘nm’ Countdown

Environmental Factors


Co$t of Excursions

1. Excursions are expensive, for everyone

2.Contaminated raw material impacts finished goods quality

3. Factory uses material for several weeks before detection

4.Earlier Detection Lowers Impact to Finished Goods

Customers cannot afford excursions because one issue can have a very large financial impact

Small problems not prevented early

increase exponentially in impact

as value is added in the supply chain.


Clean Expectations

• Cleans are ‘the finishing touch’

• The bar is high

• Cleaning without a trace

• No residue

• No interactions with environment

• No undesired by-products

• A wide array and increasingly newer material combinations

• Narrower surface flow paths putting Clean Chemicals to the test

• Tortuous channels and near surface effects

• Highly re-entrant with multiple patterning steps

• Control the final ‘result’ post cleans


All the Links in the Chain

• Focus on all stages of the process – Vertical Integration

• Purification and filtration are key

• Intermediate Processing is also critical Is it ready for the advanced nodes ?

• Raw material sources can still impact semiconductor processing

• Nothing is inert, everything interacts Can you See it?

Raw Material Ind. Process Filtration / Pkg. Transportation

“You don’t get results by focusing on results. You get results by focusing on the actions that produce results.”Mike Hawkins

Purification


Process ‘Blind Spot’ Monitoring

• Am I looking? Monitoring / Sample Location

• Can I see what I am looking for? Effective metrology / resolution

• How Often? Continuous / Sampling Frequency

• Are the data being collected? Data Collection

• What do I do with the collected Data? Review/ Monitor

• Do I know the Impact of trends? FMEA

• Do I incorporate feedback from end user ? How ?

• Business continuity / Back-up planned capacity

CAUTION

YOU MAY BE IN A

BLIND SPOT

Business continuity / Back-up planned capacity


Control Our Destiny

• Control the Visible

• Particles

• Known impurities

• Purification

• Filtration

• Packaging

• Deliver to a Spec/COA

• Define process boundaries

• Evaluate Changes

• DOE

• Statistically

• Control Impact

• Phased Implementation

• Explore back out strategy

• Educate Upstream Supply Chain

Product Control Process Control Change Control

• COA/ Spec is not sufficient

• Control the Invisible

• Particles

• Impurities

• Statistical Process Control

• All stages of Production

• Data Mining

• Correlate Customer Feedback

• Variability

• Identification (detect unintentional changes)

• Reduction

• Advanced Metrology © Intel Corporation 2018 jagannathan@[email protected]

• Filtration is still a critical step in controlling final product

• Filtration also reduces variability

• Leverage the enhancements made by our Industry partners in the filtration realm & apply to the entire supply chain from raw material to final packaging

• Filters must:

• Remove & Retain contaminants

• Not add contaminants

• Not react with the process streams

Product Control via Filtration


Filtration continues to be critical...Polymer Selection

Surface Technology

Pore sizes Membrane Morphology

Enhance performance of Surface Technology for optimized contaminants retention

Shrinking Pore size

Develop more retentive membrane structures

Cleanliness

Improve filter cleanliness using enhanced cleaning techniquesSlide Courtesy : Entegris

Thomas Phely-BobinDirector, Applications Development and Metrology Group, Micro-contamination Control Division, Entegris Inc.


Select unique polymer materials for clean, highly efficient membranes

Develop unique morphologies for optimized performance

Retention mechanism using enhanced and tailored surface energy modification

• All contaminants have a distinct surface energy and interact with filtration media

• Tailored Surface energy modification to preferentially retain contaminants across the pH range and in pure solvent or formulations (purification and filtration)

• Filters can remove fine particles well below the “pore size” rating by surface interactions –Combinations of attractive and repulsive forces

Gold nanoparticles on the surface of a membrane

Reduction of defects by over 70% with Surface Functionalization Courtesy of Entegris


Slide Courtesy : EntegrisThomas Phely-BobinDirector, Applications Development and Metrology Group, Micro-contamination Control Division, Entegris Inc.

• A key tool for the next gen cleans industry

• Process control can minimize unpleasant/costly surprises

• Avoids uncontrolled exploration of ‘unchartered territory’

Process Control


Process Control: Raw Material example

Root Cause:Lack of statistical scrutiny on RM

END RESULT:Product level Spec Violation

Control incoming raw materials with same criteria as outgoing finished goods

&Respond to Outliers

A control limit would have prevented...


Defect Monitor

Process Control: Inline metrics

Root Cause:Lack of statistical scrutiny in sub-supplier Process variables

END RESULT:Inline Defect Issue at End-User

• Manage sub-supplier processes with the same 3 sigma criteria

• Respond to Outliers

• Process variables should be bounded on both sides

• No upper or lower bounds to the process• Data Collected but no statistical review in place


Process Control - Variability reduction

• IN PROCESS parameter running on Target?

• Statistical 3 sigma limits?

• 3 sigma is not enough...... Why is there a periodic dip?

• Identify the ‘driver’ for the cyclic trending (PM, valve open?)

• Understand the process to isolate and eliminate the variation

• Why is this critical?


Metrology Readiness

• Low Variability

• Tight Control

• What does it say about your metrology?

• Need better metrology resolution / detection limits

What if my Chart looks like this?


Raw Materials

In Line Parameters

End of Line Parameters

Active Process Control

Metrology Accuracy and

PrecisionProcess controls

must be relevant

and capture

normal

variability

Metrology must be

capable of

detecting any

trends or

excursions in data

Any abnormal

results must be

acted upon

immediately

Process Control


Advanced Metrology

• Standard COA / Spec compliance is ‘Necessary’ but ‘not Sufficient’

• Partnering with new/ advanced metrology techniques is imperative

• Continuous improvement in detection limits

• Advanced Characterization

EQUIPMENT/SPARESMATERIALS

IC MANUFACTURING

METROLOGY


Newer Techniques - CharacterizationBroad Analytical Fingerprinting Beyond the COA

• TOC – Improved Resolution

• ‘ppb level’ detection

• In matrix solutions

• ICPMS

• Low res to high resolution ICPMS (QQQ)

• Single Particle – ICP-MS - Characterize non-ionic metal contaminants

• Next Gen Particle counters

• < 30nm bin size

• <10nm bin size. (beyond light scattering)

• Assay

• Spectroscopic versus titrations

• Chromatography

• 2D & High resolution techniques for impurity profiling© Intel Corporation 2018 jagannathan@[email protected]

Metrology Evaluation

Leading Edge

“Fingerprinting”

Capabilities SPC - Control Charts

Long Term StabilityCapability

Key Message: Without capable and stable metrology, all decisions are flawed. Process sensitivities increase with every technology advancement. Supplier metrology capability will be stretched to its limits...

Metrology development, instrument maintenance, and instrument stability are all key to a healthy quality control program.

Gauge Repeatabilityand Reproducibility

(GR&R)

Instrument & MethodDetection Limits

(IDL, MDL)

Accuracy and Linearity


•How & when do we deviate from a beaten path

• Continually Improve vs change control

Change Control


Leveraging Copy Exactly for Change Control• Why reinvent the wheel?

• Copy Exactly across the supply chain

• Control / Copy what you can

• Document and regulate the areas of differences

• Identify commonalities within differences

• Learn the differences and their impacts (Deep Dive)

• Lock-in the learnings

• Equilibrate / Feed back learnings

• Reduce/ Eliminate unexpected failure modes

• $$$ Saving

• Copy Exactly as a ramp enabler & BCP

• Modularize

• Reasonable economics of scaleTime

Ram

p V

olu

me

180nm130nm 90nm 65nm 45nm 32nm 22nm 14nm

New

Materials


Change Control Expectations• Build the ‘Control of Change’ mindset

• Communicate to all stake holders across the supply chain

• Evaluate Mitigation techniques

• Build High Confidence data without affecting HVM

• Explore metrology options that can monitor transition Preferably something that can be modulated

• Regulate the impact

• Point of use monitoring & feedback

• Data Collection & Analytics

• Traceability

• Avoid disconnect between ‘Continuous’ & ‘Batch’

• Trace End user effects all the way to ‘source’

• Disburse the learnings‘TRACEABILITY’ IS KEY :How do we connect a batch signal to a continuous process at our supplier


End-User process detected a negative shift in performance with a consumable provided by a supplier.

Traced the issue to a

mechanical sub-component of the

part.

The sub-supplier had

intentionally shifted the target dimension of the

sub-component to improve their CpK.

Even though End-User had not previously run parts of this dimension, the supplier did not

notify end-user because the dimension was IN SPEC.

Suppliers with effective change control protect their customers from unintended consequences of changes in the supply chain.

Maintain

change control

Improvements are alsoCHANGES.

An Example


• Time is Right The Industry is headed in a positive direction

• Control our destiny by effectively using product, process and change control methodology

• Team effort / Collaboration is key for the challenges ahead continually improve

• Invest proactively in understanding and securing the entire supply chain

• Reduce Total cost of ownership

• Be the Partner of Choice

Summary


AcknowledgementsA Special Thanks is due to the following people for their technical input,

valuable comments, guidance and support.

From Intel: Mark Denney, Mike Matragrano, Max Heckscher, Jeff Hemphill, Vani Thirumala, Bjorn Sundstrom, David Sauer, Kevin Koga, Richard Rudberg,

John Schneider, Prema Gangadhara & Satish Bedge

From Entegris: Thomas Phely-Bobin

From Linx- Consulting: Mike Corbett & Iqbal Ali

• To All Intel Suppliers: Thank You for Your Valued Partnership

• To the Linx-Consulting group, THANK YOU for the opportunity to present


Disclaimer / Risk FactorsThe above statements and any others in this document that refer to plans and expectations for the first quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters. Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products. Intel is in the process of transitioning to its next generation of products on 22nm process technology, and there could be execution and timing issues associated with these changes, including products defects and errata and lower than anticipated manufacturing yields. The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; product mix and pricing; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets. The majority of Intel’s non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to Intel’s investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. Intel’s results could be affected by the timing of closing of acquisitions and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting us from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the annual report on Form 10-K for the fiscal year ended December 31, 2011.



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Business of Cleans - Linx Consulting · 2018. 11. 20. · Business of Cleans ‘Challenges of the Future’ April 9, 2018 Jagan Srinivasaraghavan Supply Chain R&D Engineer Intel Corporation