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SSV Summit November 2013 Cadence Tempus™ Timing Signoff Solution

Cadence Tempus™ Timing Signoff Solution

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Cadence Tempus™ Timing Signoff Solution . SSV Summit November 2013. Industry needs for n ext g eneration signoff. Signoff closure up to 40% of the design flow Need faster runtimes Capacity for +100M cell designs with 100s of timing views Better accuracy to reduce pessimism, power, area. - PowerPoint PPT Presentation

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Page 1: Cadence Tempus™ Timing Signoff Solution

SSV SummitNovember 2013

Cadence Tempus™ Timing Signoff Solution

Page 2: Cadence Tempus™ Timing Signoff Solution

2 © 2013 Cadence Design Systems, Inc. All rights reserved

• Signoff closure up to 40% of the design flow

• Need faster runtimes

• Capacity for +100M cell designs with 100s of timing views

• Better accuracy to reduce pessimism, power, area

Industry needs for next generation signoff

65nm 40nm 28nm 20nm

Design Flow ComponentsSignoff P&R Front End

Technology NodeD

esig

n C

ycle

Dis

trib

utio

n %

Page 3: Cadence Tempus™ Timing Signoff Solution

3 © 2013 Cadence Design Systems, Inc. All rights reserved

The Tempus™ Timing Signoff Solution

Tempus – It’s about TIME

• Up to 10X reduction in closure time• Placement and routing aware• Unlimited MMMC capacity

CLOSURE• Massively parallelized computation• Scalable to 100s of CPUs• Optimized data structures

PERFORMANCE

• Up to 10X faster path-based analysis (PBA)• Advanced process modeling• TSMC-certified accuracy

ACCURACY

Page 4: Cadence Tempus™ Timing Signoff Solution

4 © 2013 Cadence Design Systems, Inc. All rights reserved

• Optimized multi-threading

• Distributed processing

• Incremental & hierarchical analysis

• Concurrent multi-mode multi-corner analysis

• Parallelized path based analysis

Performance backgroundStacked performance enablement

MMMCConcurrency

Incremental Analysis

Distributed Processing

Flat Single View (Multi-Threading)

Technology

Page 5: Cadence Tempus™ Timing Signoff Solution

5 © 2013 Cadence Design Systems, Inc. All rights reserved

• Combines multi-threading with distribution

• Simple setup– User specifies desired resources

• Parallelization transparent to user

• Up to 50M cells analyzed in one hour

• Low memory footprint

Performance metrics Parallelized processing

MMMCConcurrency

Incremental Analysis

Distributed Processing

Flat Single View (Multi-Threading)

Page 6: Cadence Tempus™ Timing Signoff Solution

6 © 2013 Cadence Design Systems, Inc. All rights reserved

• Analyzes all modes and corners in one timing session

• Runs on one compute server

• More than 2X faster with same hardware– Less than 20% memory overhead

per additional timing view

• Reduces hardware resource requirement

Concurrent MMMC view analysis

MMMCConcurrency

Incremental Analysis

Distributed Processing

Flat Single View (Multi-Threading)

Page 7: Cadence Tempus™ Timing Signoff Solution

7 © 2013 Cadence Design Systems, Inc. All rights reserved

• Graph based analysis is fast but inherently pessimistic

• Path based analysis is slow but reduces pessimism– Accurate transitions and

derates

• Tempus solves PBA reporting runtimes– Parallelized computation

Path-based analysis (PBA)Reduced pessimism and runtime

0 100 200 300 400 500 600

-0.1

-0.09

-0.08

-0.07

-0.06

-0.05

-0.04

-0.03

-0.02

-0.01

0

PBA reduces pessimism

AOCV PBA Slack

AOCV Graph Based

Path Number

Path

Sla

ck

Pessimismreduction

Page 8: Cadence Tempus™ Timing Signoff Solution

8 © 2013 Cadence Design Systems, Inc. All rights reserved

• Full timing/optimization solution

• Delay and SI

• Distributed MMMC

• Physically aware

• Setup/hold/DRV/leakage optimization– Path or graph based

Tempus timing closure

TempusDistributed

MMMC delay

calculationand STA

Physically-aware

optimization

Hold, DRV, setup,

leakage

Place and route

Timing closed

2-3Iteration

Physicalview(LEF/ DEF)

Physicallyaware ECO

Page 9: Cadence Tempus™ Timing Signoff Solution

9 © 2013 Cadence Design Systems, Inc. All rights reserved.

Tempus resonates with users

What we said…

Community feedback (courtesy of DeepChip)…

Page 10: Cadence Tempus™ Timing Signoff Solution

10 © 2013 Cadence Design Systems, Inc. All rights reserved

• Presented at ARM® TechCon 2013

• Cortex®-A12 testchip– 28nm SLP Technology

• Close collaboration– ARM, Global Foundries,

Cadence• Full Cadence flow

– Final signoff with Tempus!• Key Tempus technologies

– MMMC analysis– Physically aware optimization

Global Foundries tapeout success

Page 11: Cadence Tempus™ Timing Signoff Solution

11 © 2013 Cadence Design Systems, Inc. All rights reserved.

• Cadence is solving the design complexity challenge– Eliminating the signoff bottleneck – Enables power, performance and time-to-market goals

• Tempus™ accelerates timing analysis and closure by weeks– As much as 10x faster – Handles 100’s of millions of cells– Optimizes timing across hundreds of views

• Strong customer demand– Multiple evaluations and customers

• Early tapeout success

In summary

More to come!

Page 12: Cadence Tempus™ Timing Signoff Solution

12 © 2013 Cadence Design Systems, Inc. All rights reserved

"Cadence, Encounter, Tempus, Virtuoso and the Cadence logo are trademarks of Cadence Design Systems, Inc.  All other trademarks and logos are the property of their respective holders."