SCHOLARSHIP DETAILS AND APPLICATION: 2019 NEW ZEALAND SESOC CONFERENCE

This scholarship will be awarded to one SEAOC Member or Member S.E., 35 years or younger, to attend the 2019 SESOC Conference, August 19 & 20, 2019 in Auckland, New Zealand. The scholarship will reimburse travel and conference expenses up to $4,000.00.

The scholarship is intended to help establish a long-term bond between two of the world’s premier structural engineering societies, SESOC and SEAOC. Applicants should have interest in helping to develop and maintain these bonds through collaboration in technical, practice, and other related areas. Interaction in areas of engineering engagement and equity is also desired. The recipient will make a presentation at the SESOC Conference, and is requested to include a proposed abstract as part of the scholarship application.

Applicant shall be a SEAOC Member or Member S.E., 35 years old or younger (on August 19, 2019), to be eligible for the scholarship.

Please answer each question below in 150 words or fewer Provide an abstract of up to 500 words for a SESOC Conference presentation Return by May 6, 2019 to dschinske@seaoc.org Scholarship recipients will be notified by May 27, 2019

Name:Company:Degree(s), certification(s), license(s), etc.:Years in the structural engineering industry:SEAOC Member Organization (region):

1. Why did you choose to pursue a career in structural engineering?

2. What is your current involvement or interest in SEAOC, and how do you see yourself being involved in SEAOC in the future?

3. Do you or your company currently have offices or affiliations with offices in New Zealand? If so, what are the offices or affiliations?

4. Why are you interested in attending the SESOC Conference and what do you hope to gain by conference involvement?

5. How would SEAOC and/or SESOC benefit from your participation in the SESOC conference?

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