CEDM ACTIVITIES

CEDM ACTIVITIESIMPROVING THE RELIABILITY OF ELECTRONICS

GEERT WILLEMS

CEDM EVENT 2014

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© IMEC 2014

CONTENT

1. cEDM: “The State of the Center”

2. Collective R&D: VIS-traject Prosperita

3. Improving Electronics’ Reliability

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CEDM EXPERTISE

▸ PBA – PCB – Packaging technology & reliability

▸ Design-for-Excellence: Manufacturability, Reliability, Test, Cost,...

▸ Over a century of electronics industry experience

Design – Industrialization – Production – Quality

▸ More than 50 years of electronics research expertise

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To support industry in the development of high quality, reliable

and cost-effective electronic modules (PBA) by means of knowledge

creation and sharing, scientifically sound methodologies and

collaboration throughout the electronic supply chain.

Collective

•Awareness creation

• Design Guidelines

• PBA development tools

• Seminars - training

Bilateral

• Consultancy

• Knowledge transfer

• Implementation

•Training

Better electronics at reduced cost through

science based design & production methodologies.

THE CEDM MISSION

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1. CEDM: “STATE OF THE CENTER”

cEDM is doing well!New members

Expanded offering

International collaboration

New projects

A larger team

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19 cEDM partners

I. CEDM PARTNERS

http://www.psicontrolmechatronics.com/

http://www.psicontrolmechatronics.com/

http://www.dzine.be/

http://www.dzine.be/

http://www.connectsystems.eu/index.php?q=index.html

http://www.connectsystems.eu/index.php?q=index.html

http://www.page.be/

http://www.page.be/

http://www.eurocircuits.com/

http://www.eurocircuits.com/

http://www.acb.be/

http://www.acb.be/

http://www.qpigroup.com/

http://www.qpigroup.com/

http://www.tbp.eu/

http://www.tbp.eu/

http://www.edna.eu/

http://www.edna.eu/

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1. MEMBERS

Over 130 companies

& organizations in

cEDM community

42 members

61 ass. MembersAnritsu A/S Lego System A/S

Asetek A/S Lodam electronics a/s

Bang & Olufsen A/S Lyngsø Marine A/S

Bang & Olufsen Medicom A/S MAN Diesel & Turbo

bb electronics A/S Micronsult

B-K Medical A/S Motorola Solutions A/S

Bolls Rådgivning NKT Photonics A/S

BOMBERG & CO. APS Novo Nordisk A/S

Brüel & Kjær Sound & vibration

measurement A/SO.J. Electronics A/S

Contex A/S Oticon A/S

Cryptera A/S PR Electronics A/S

Danfoss A/S Qualcon

Danfoss Power Electronics A/S Radiometer Medical A/S

Dansensor A/S Schneider Electric IT Denmark ApS

DEIF A/S Selektro A/S

DELTA Dansk Elektronik, Lys & Akustik Skaanning Quality & Certification

Emerson Climate TechnologiesSP Sveriges Tekniske

Forskningsinstitut A/S

Flextronics International Denmark A/S TDC A/S

Focon Electronic Systems A/S TERMA A/S

Foss Analytical A/S Thrane & Thrane A/S

Glunz & Jensen A/S UL International Demko A/S

GN A/S Unomedical A/S

GN Netcom A/S VELUX A/S

GN ReSound as Vestas Wind Systems A/S

Grundfos A/S Vestas Control Systems A/S

Gåsdal Bygningsindustri A/S Widex A/S

HIN Horsens A/S Ørsted-DTU (Associeret medlem)

Hybrico A/S Kongsberg Defence & Aerospace

Kamstrup A/S Secop GmbH

DeLaval International AB LaboTest AB

Gambro Lundia AB Tetra Pak Packaging Solutions AB

ADB airfield solutions

Adeon Software House (NL)

Agfa Gevaert

AimValley BV (NL)

Alcatel Lucent

Atlas Copco

ATOS Worldline

Autojet Technologies

AW Europe

Barco Kortrijk

Barco Silex

Benchmark (NL)

Cassidian

C-MAC

Dekimo

EnergyICT

ETAP

FEI (NL)

Grammer EiA Electronics

Halliburton

HMC International

Jabil Hasselt

Melexis Tessenderlo

Nexans

Niko

Ninix Technologies

OIP

OneAccess

OSRAM (I)

Prodrive (NL)

Protonic (NL)

Quad Industries

Septentrio

Renson Ventilation

Roam Chemie

SABCA

Solumatics

Taipro Engineering

Thales Belgium

TP Vision

Tremec

Tyco Electronics Oostkamp

© IMEC 2014

1. CEDM’S CROSS-DISCIPLINARY TEAM

Geert Willems – Group leader (1/7/2005)

- Dr. ir. Electronics Engineering - PhD

- 10 years research in micro-electronics: SOI, Integrated Ferro-electrics

- 10 years industrial experience: PBA technology, assembly, NPI

- 10 years of Design-for-Excellence consultancy

Alain Carton – Technical and Operations support (15/1/2008)

- Ing. Electronics Engineering

- >15 years of industrial PCB/PBA design experience

- IPC certified: CID – IPC-A-600 & IPC-A-610 inspector

Wesley Van Meensel – PBA information engineering (26/4/2010)

- ir. Chemical Engineering

- >3 years experience in PBA industrialisation and related automation

- Our IT & software wizard

Filip Ponsaerts – cEDM operations (18/7/2011)

- Ing. Electronics Engineering – Computer Science

- Master in Multi-Media Technology and Virtual Reality

- 10 years experience in electronics design

- 10 years experience in design, R&D and Q management in large and small enterprises.

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Boris Leekens – PCB/PBA DfX – Industrial projects (14/9/2011)

- Ing. Electronics engineering - MBA

- 20 years industrial experience in electronic assembly:

Functional test engineering, NPI project management and account management.

Bart Vandevelde – R&D project leader (1/4/2013)

- Dr. ir. Mechanical Engineering – PhD

- Package and PBA Reliability & Thermal Management of Electronic Systems

- Thermo-mechanical modeling and simulation

Riet Labie – R&D project leader (1/2/2014)

- Dr. ir. Material Science – PhD

- > 15 years research experience: Materials, Process Technology, Reliability, Failure

Analysis, Photo-Voltaics

Jan Bienstman – R&D project leader (10/3/2014)

- Dr. ir. Electronics engineering – PhD

- > 20 years experience in electromechanical micro systems design and modeling

- Multi-physics modeling and simulation - Packaging

Bridging the gap between research and industry

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1. CEDM’S CROSS-DISCIPLINARY TEAM

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1. NEW WEBSITE

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1. SPM COLLABORATION

For cEDM partners & members:

Free access to SPM reports and

SPM member webpages.

SPM is an association with

focus on electronics design,

production and testing that

establishes and maintains

professional networks,

disseminates information

and knowledge, and looks at

future technologies.

2. COLLECTIVE R&DVIS TRAJECT PROSPERITA 2011-2014

PBA realization: DfM-DfT

D0: Good Design-for-X Practice

D1: PCB Specification

D2: Component Specification

D3: Assembly material

D4: Design-for-Assembly

D5: PCB density classes

D6: PCB Layout

D7: Design-for-Test

D8: PBA Passport

D9: Signal Integrity

D10: Power integrity

PBA integration

I1: Mechanical interaction

I2: Thermal interaction

I3: EMC interaction

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Free accessible for

cEDM partners and members

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2. COLLECTIVE R&DVIS TRAJECT PROSPERITA: LAST QUARTER FOCUS

PCB thermal resistance model

- Fast evaluation of component T and ΔT

- Connectable to component thermal resistance model

Q

3D model2D 2D1D 1D

f(Sh

ape)

PCB

Environment

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71.6

16.9

6.9

0.5 4.00.1

PBA flow distribution

First Pass Yield

2 pass Manu. T./1 pass Func. T.



Unpredictableoutcome

Scrap


Assembly model and DfA evaluator

- Design impact on assembly flow and efficiency

- Integration in Bill of Materials

Product Input

Process Parameters

Virtual Assembly Line

31.7

73.3

20.27

95.9

95.8

96.8

34.3

58.2

75.0

80.0

50.00

98.0

83.3

95.2

70.0

75.0

SMD assemblyratio

Assemblyproductivity

Trouble-shootburden

Loss riskfraction

Assemblyoverhead

SMD lineoverhead

SMD line eff.top

SMD line eff.bottom

PBA Design KPI KPITarget

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Lay-up Load Lamin. Un-load De-stack

𝑡𝑙𝑎𝑚𝑖𝑛 = 3(𝑡𝑝𝑙𝑎𝑐𝑒+𝑡𝑐𝑜𝑙𝑙𝑒𝑐𝑡) + 𝑡𝑃_𝑝𝑢𝑛𝑐ℎ + 𝑡𝑃_𝑡𝑟𝑒𝑎𝑡 +𝑡𝑃_𝑙𝑎𝑦𝑢𝑝

#𝑝𝑎𝑛𝑒𝑙𝑠/𝑠𝑡𝑎𝑐𝑘+

𝑡𝑙𝑜𝑎𝑑_𝑙𝑎𝑚𝑖𝑛

#𝑝𝑎𝑛𝑒𝑙𝑠/𝑐𝑦𝑐𝑙𝑒

+𝑡𝑃_𝑙𝑎𝑚𝑖𝑛

#𝑝𝑎𝑛𝑒𝑙𝑠/𝑐𝑦𝑐𝑙𝑒+

𝑡𝑢𝑛𝑙𝑜𝑎𝑑_𝑙𝑎𝑚𝑖𝑛

#𝑝𝑎𝑛𝑒𝑙𝑠/𝑐𝑦𝑐𝑙𝑒+

𝑡𝑃_𝑑𝑒𝑠𝑡𝑎𝑐𝑘

#𝑝𝑎𝑛𝑒𝑙𝑠/𝑠𝑡𝑎𝑐𝑘+ 𝑡𝑃_𝑐𝑢𝑡

Place

panelCut edge

Collect

panel

𝑡𝑃_𝑙𝑎𝑚𝑖𝑛 =f(material)

Stack name Process step

Stack 1A & 1B Image - top

Image - bottom

Etch Cu

Strip image

Stack 2 Lamination prepreg (1)

Stack 3 Mechanical drill

Electroless plate + flash

Image - top

Image - bottom

Plating Cu

Strip image

Stack 4 Lamination buildup

Stack 5 Laser drill (top)

Laser drill (bottom)

Mechanical drill

Etc...

PCB manuf. model & DfM evaluator• Design impact on PCB manufacturing

• PCB module

Lamination model

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2. COLLECTIVE R&DAFTER VIS TRAJECT PROSPERITA

cEDM will keep on updating and

disseminating guidelines and tools▸ Free access for partners and members

▸ Accessible through www.cedm.be

▸ Offline tool availability

▸

▸ Consultancy and training

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2. COLLECTIVE R&DAFTER VIS TRAJECT PROSPERITA

VIS-traject Prosperita+ - 2 year extension▸ High density - high power/current – high speed PCB

▸ Flex and Flex-Rigid PCB

▸ Material identification on PBA (GreenElec)

▸ Coating and potting

▸ EMC/SI cabling

▸ System integration of electronics

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3. IMPROVING ELECTRONICS RELIABILITY

Reliability challenge!

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Why is reliability going down?- Dominating consumer oriented supply chain focused on

performance at lowest cost, not quality nor reliability.

- Highly complex, fragmented supply chain.

- New materials that have negative reliability impact: lead-free solder

and finishes, low CTE mold compounds, halogen-free,...

- Historical failure data is obsolete. Experienced based lifetime

prediction is flawed. Constant failure rate based reliability

assessment is obsolete (useful life MTTF/MTBF).

- Knowledge of Physics-of-Failure and the impact of design is missing.

- More and more electronics in “less benign” operational conditions.

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Is automotive doing better?

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Impact of material changes: lead-free solder

- Lead-free terminal finishes:

- Higher soldering temperatures

- Higher stress on solder joint surroundings

- More brittle PCB

Pad crateringTrack failureNiAu interface failureVia cracking

whiskers

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Impact of material changes: low CTE mold compounds

Si die: ~ 3 ppm/KCu leadframe: ~ 17 ppm/K

PCB: ~ 15 - 17 ppm/K

Mold

compound

15 ppm/K

7ppm/K

>85% silica

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Drivers:

Green: halogen-free & flame retardant

Lead-free: low MSL

Low cost

- High penetration level of highly filled MC

- All plastic components: SOIC, TSOP, QFN, BGA,...

- Customer notification is MISLEADING!

Solder joint reliability was not considered!?

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

Q1

2005

Q3

2005

Q1

2006

Q3

2006

Q1

2007

Q3

2007

Q1

2008

Q3

2008

Q1

2009

Q3

2009

(from a leading semiconductor supplier)

50%

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Impact of mold CTE: Life time (11ppm BGA) ~ 2.2 * Life time (8.5ppm BGA)

Impact of mold CTE is far greater than the chosen solder composition

2.4 mm PCB

BGA225

12x12 mm

0.5 mm pitch

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Heavily damaged solder joint especially at the corner/edge

area indicative for a large mismatch

2.4 mm PCB

0°C 100°C

2.4 mm PCB

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QFN’s with 7ppm/°C: (almost) all failed after 2000 cycles

QFN’s with 12 ppm/°C: no failures after 2000 cycles

QFN64

9x9 mm

0.5 mm pitch

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QFN64

9x9 mm

0.5 mm pitch

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0

1000

2000

3000

4000

5000

6000

5 10 15 20

MT

TF

(cycle

s)

CTE of mould compound (ppm/°C)

0.8 mm

1.6 mm

2.4 mm

No PCBflexing

Low CTE

0 to 100˚C

cycling

PBGA 27x27 area array

1.27mm pitch

SAC

Solder


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Conclusion:

Without proper Design-for-Reliability you cannot

assume that electronics will exceed consumer grade

lifetimes (2-3y) and have lower than consumer grade

failure rates (>>10%).

Unacceptable reliability for professional, industrial,

automotive and other high reliability applications.

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What to do?▸ Understand the Physics-of-Failure

▸ Identify the failure determining factors:

- The stressors e.g. thermal mismatch

- The failure mechanism: fatigue, brittle fracture,...

- The resistance to failure: material properties

▸ Quantification of the stress as a function of:

- Materials

- Dimensions & configuration

- Environmental and operational conditions

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What to do? Quantifying stress levels

0.33%SAC

1.37%SnPb

BGA: same conditions

J.-P. Clech

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What to do? Quantifying stress levels▸ Proper calculation of induced solder strain

▸ Taking into account package and PCB flexibility

▸ Analyticaly: f(design parameters, oper. conditions)

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Understanding Physics-of-Failure: a major opportunity

for faster and lower cost product development

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cEDM actions▸ Research partner in IWT O&O Rev-Up (started)

Review and Upgrading Reliability Testing

▸ Research partner in ICON Compact (submitted)Failure modeling and PoF integration in automotive product

development. (with SOC Maakindustrie: Flanders Drive + FMTC)

▸ Re-submission of VIS-traject InProVoLIntelligente Producten met Voorspelbare Levensduur

DfR Guidelines, tools, workshops, training,...

You can join the consortium – more info at cEDM

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Bringing WW know-how to your doorstep

iNEMI (www.inemi.org)

▸ Project lead

“Low CTE Mold Compound”

Alcatel-Lucent, Delphi, DfR Solutions,

Flextronics, Fraunhofer, imec, Sagem,

Winstron

▸ New project on

Automotive Electronic Material Challenges

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Bringing WW know-how to your doorstep

Collaboration with SPM

Member of IPC

Member of PLOT

Member of iMAPS

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© IMEC 2014

[email protected]

++32-498-919464

www.cedm.be

Thank you

Documents

CEDM ACTIVITIES