CENTRE FOR INDUSTRIAL ELECTRONICS · 2019-07-16 · Centre for Industrial Electronics BACKGROUND 1 Global challenges and megatrends Energy consumption is growing exponen-tially, both

- a lighthouse for education, R&D and testing

CENTRE FOR INDUSTRIAL ELECTRONICS

Centre forIndustrialElectronics

Centre for Industrial

Electronics

CIE brochure 2017 2. udgave 2018

CIE - Centre for Industrial ElectronicsUniversity of Southern Denmark

Realisation, layout & designZora Rubahn

Mads Clausen Institute

PrintPrint & Sign, SDU

Centre forIndustrialElectronics


Electronics

BACKGROUND

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Global challenges and megatrends

Energy consumption is growing exponen-tially, both in Europe and worldwide. To meet this need and at the same time protect our climate, we increasingly rely on renewable energy sources. These sources are dominantly electrical and thus require further electrifica-tion of consumption including transport and heating. We must also curb consumption, which augments the needs for increased efficiency.

Production, wider electrification and increa-sed efficiency as well as automation and autonomy of production, mobility and services all rely on development of novel elec-trical components and systems.

The Centre for Industrial Electronics, CIE, at SDU Sønderborg, will provide leading know-ledge and competencies in the fields needed to develop such compact, smart and effi-cient electronics for use in industry, mobility and energy sectors.

Opportunities for the regional companies

Companies in Southern Denmark address the global challenges and megatrends on climate, automation and autonomy with innovative electrical products and systems for a broad range of industrial sectors.

While world leaders in a number of product lines, the companies do seek increasing numbers of qualified engineers and intimate R&D collaborations with the most talented researchers and their international networks. This to solidify and expand their leading positions in these rapidly devel-oping markets.

With the current trends, compa-nies in the region of Sønderborg will, already in 2020, be short of 800 academics and specialised engineers. Without action, this shortfall will grow. The educatio-nal programmes of CIE are targe-ting some of the most pressing needs for qualified staff. They will be run in close collaboration with relevant nearby industries, facilitating and anticipating that many of the graduates will find exciting jobs in this growing sector, locally and further afield.

Aim of the centre

CIE spans modelling, development, testing and investigation, from atomic to system scale, essential for the development of the electronics of the future based on first principles understanding.

CIE excels in � combined modelling, prototyping and

testing of electronic components, devices and systems including motor drives for electromobility and digitalisation (industry 4.0)

� developing intelligent products for the electronics industry of the future

� electromagnetic compatibility (EMC/EMI), lifetime testing and advanced failure analysis

� innovating hard and soft actuators with embedded electronic intelligence.

CIE’s objectives are to � create a new regional ecosystem with

excellent researchers, highly motivated students, research and development in close collaboration with industry and state-of-the-art laboratory facilities

� give companies access to new knowledge and competencies in industrial electro-nics, top quality resources and gradua-tes, and innovative solutions for improved competitiveness.

CIE takes advantage of � a strong partnership between SDU,

Danfoss A/S, LINAK A/S, the Region of Southern Denmark, Sønderborg Muni-cipality and the Bitten & Mads Clausen Fund

� innovative industry-academia partnerships.

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Centre for Industrial Electronics

Innovation, consultancy and entrepreneurship

The close collaboration of the centre with industry inspires the entrepreneurial spirit in the students and supports innovation proces-ses in industry and academia. The centre takes advantage of expertise in innovation at faculty and university level.

� Innovation in-company and in-centre � Product development and research colla-

borations between companies and CIE researchers

� In-company sabbaticals � Entrepreneurship: from patents to start-

ups � Commercial consultancy, analyses,

development and test activities.

Education

New electronics education programmes are developed in close dialogue with industry. Start planned for autumn 2018. The educa-tion will, from an early stage, involve the students in the research at the centre and development activities in partner industries. Intense supervision of student projects will be given by professors, PhD students and industrial developers, and the educational programmes will generally benefit from a high staff to student ratio.

� New Bachelor of Engineering in Electro-nics education from autumn 2018

� New Bachelor of Science in Electronics education from autumn 2018

� New Master of Science in Electronics education from autumn 2020 with specialisations in power electronics and digital electronics

� A few hundred electronics students are expected in 2030.

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CIE will be established at SDU’s campus Sønderborg, both in the existing buildings and in an additional 4000 m2 building to be finished end of 2018. CIE is thus an integrated part of the Mads Clausen Institute (MCI) at SDU and takes advantage of relevant research, development and test facilities, both existing and new.

A wide bandgap (WBG) laboratory uses thin-film deposition technologies in an ISO5 cleanroom such as chemical and physical vapour deposition as well as atomic layer deposition for electronic materials fabrication.

An advanced failure analysis (AFA) laboratory is based on a unique Helium ion microscope with built-in structure formation and a nanotomography facility with atomic resolution, fitting well to the characteristic sizes of modern transistors.

A flexible electronics laboratory handles an emerging field of electronic product generation, which gains importance with the increasing use of delocalised renewable energy sources, but also with the use of energy-efficient smart electronic products. The laboratory uses state-of-the-art microtechnology as well as roll- to-roll printing.

Further laboratories include electromagnetic compatibility (EMC) and motor testing, reliability studies, actuator fabrication as well as embedded electronics & control development.

Existing laboratories New laboratories

FACILITIES

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Electronics

CIE’S TOPIC AREAS

SiC, GaN or Si: materials for the power electronics components of the futureThe market for power electronics (PE) appli-cations is expected to steadily increase within the coming years. In addition to the overall expected increase in market share, the graph below shows some of the strongest growing market segments (in billion dollars).

Along the general aim of establishing world class research and a powerful ecosystem within industrial electro-nics, CIE will excel in a series of special topics, from advanced power electronics to digital electronics and sophisticated actuators. In what follows, these topics are briefly motivated. Anticipated specific research and development areas are high-lighted in dedicated blocks throughout the text.

Source: Yole report 2016

Traditionally, power electronics devices are made of Silicon. After many years of development, wafer-scale production of wide bandgap (WBG) semiconductors such as Silicon Carbide (SiC) or Gallium Nitride (GaN) has now come to a stage where compo-nents from these materials can be mass produced.

The graph above shows the advantages of WBG materials for power electronics applications. The outer numbers of the radar plot refer to 1: breakdown field; 2: electron velocity; 3: thermal conductivity; 4: melting point; 5: bandgap. Obviously, WBG devices excel for most parame-ters as compared to Si devices, especially at high temperatures, high switching frequencies or high voltages. These conditions are typical for devices in the automotive or renewable energy sectors.

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� Atomic layer deposition of WBG films for better defect control

� Development of new design architectures

� Reliability and lifetime studies

� Integration of components into systems

� Focus on components for electro mobility

� Focus on converter technology.

However, just substituting Si devices in existing circuits will not be most effective. It is neces-sary to adopt new designs for utilising the full potential of increased operational frequency, working temperature and redu-ced size of active devices.

In addition, the concentrations of defects in SiC and GaN substrates are still orders of magnitude larger compared to Si, resulting in reliability issues and limitations regarding upsca-ling of the basic wafers.

CONNECTED FACILITIES WBG laboratory

Reliability laboratory

AFA laboratory

For a given geometry, the voltage rating of power semiconductor devices depends on the bandgap [eV] and breakdown field [MV/cm]. At high voltages, SiC-based components excel because of their vertical device layout. GaN based components excel in the high frequency regime.

The thermal behaviour of semiconductor devices depends on the thermal conductivity of the material and its melting point. Here, at high temperatures, SiC holds more poten-tial. High-frequency operation depends on the saturated electron drift velocity [m/s] and here, both GaN and SiC are a factor 4 superior to Si.

It is expected that WBG-based power devices on the market will bring about and acce-lerate new developments in the areas of packaging, passive components (capacitors) and circuit and system design. Improvements in construction and operation of electric motors are also expected as, for example, high-frequency operation is utilised. In gene-ral, WBG semiconductor materials will enable a drastic increase of electric energy conver-sion efficiency and an increase in the power density of electric systems, resulting also in significant reduction of losses and system costs.

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CONNECTED FACILITIESWBG laboratory


AFA laboratory


Electronics

Packaging is critical for the successful im-plementation of advanced power electronics components. For example, the high parasitic inductance is an obstacle in the use of high switching frequencies because it slows down the switching. Mediocre thermal properties at layer interfaces counteract the thermal advantages of SiC. Bonding of components is an important prerequisite for optimised packaging and a source for significant losses. Depending on the losses, cooling then be-comes a critical factor for device lifetime and reliability.

� New packaging methods � New bonding methods � New cooling methods

including advanced liquid (multiphase) and solid state cooling

� Cooling applications for power electronics system development including motor drives for large compressor control, solar inverters, power stacks for wind turbine applications and inverters for electric and hybrid vehicles.

Bonding, packaging & cooling: advanced technologies


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Electronics

CONNECTED FACILITIESEMC & motor test laboratory


Embedded electronics & control laboratory

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Electric motor drives including industrial motor drives, elevators and escalators, heat pumps and air conditioning, home appliances and traction drives are estima-ted to account for 50 % of total electricity consumption in Europe.

To activate the energy savings capacity in motor drives, the whole system around the motor needs to be modelled, analysed and optimised.

For example, the energy savings capacity by introducing Variable Speed Drives (VSDs) is estimated to be 30 – 40 % for most appli-cations. The technical capacity for energy savings is relevant for about 40 – 50 % of all motors, depending on the application, and given that VSDs have already been applied to about 15 – 20 % of all motors, the remaining potential is estimated to be about 30 %. There is an additional energy saving of 20 % through the recuperation of electrical energy during braking, which is frequently used in elevators, traction application and electric vehicles. Combining all these figures, the total electrical energy savings capacity of VSDs is about 5 – 6 % of the overall electrical energy consumption.

� Multilevel drive topologies and circuit concepts for improved system efficiency and cost reduction

� Complete system modelling and control design

� Combination testing of high efficiency, sustainable and cost-effective motor drives and converters

� Scalable and modular design for circular economy

� Combination test of motor families and converters and drives.

Motor drives for a green future: research, development and test

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Electronics

A low failure rate is a must for commercial success of a given product line. Failures can happen on all levels, from component to system, and they will be induced by extrinsic factors. At a given stress level, any compo-nent, device or system will fail, and it is most important to find a quantitative description of the conditions under which this happens.

There is a large parameter space of external stressors and CIE will strive to quantify the most relevant of them for given industrial electronic components. In addition to perfor-ming well developed lifetime tests on the component and system level, CIEs aim is also to find the reasons for faults by going all the way down to the materials level and perfor-ming advanced microanalyses of break-downs. This knowledge builds the basis for highly improved reliability of industrial elec-tronics on all relevant levels of complexity.

� Fast variable and cross-coupled parameter accelerated lifetime testing of individual components and small systems

� Reliability of PE components and devices, including new semiconductor components

� Reliability test of packaging methods and microelectro-mechanical systems (MEMS)

� Chip thermography and measurement of switch losses

� Multiple environment over stress testing. Stressors: vibration, temperature, humidity, EM emissions

� HALT (highly accelerated lifetime) and HASS (highly accelerated stress screen) tests

� Tomographic failure analysis at component level

� Fast analysis at system level via combined modelling and measurements: model based fault analysis.

Failures, faults and reliability: lifetime tests and microanalysis of breakdowns

CONNECTED FACILITIESWBG laboratory

AFA laboratory

EMC & motor test laboratory


� EM (electromagnetic) emis-sion noise reduction for small and medium-sized electronic equipment

� EMC (electromagnetic compatibility) and EMI (electromagnetic immunity) improvement of coexisting equipment for avoiding interference

� Conducted and radiated emission testing for line filter design.

The goal of electromagnetic compatibility (EMC) studies is the correct operation, in a given electromagnetic environment, of different equipment which uses electromag-netic phenomena, and the avoidance of any interference effects. To achieve this, EMC pursues two different objectives. First, it sets strict limits on the EM emissions from each electric and electronic equipment to limit the EM pollution of its environment. Second, it sets the susceptibility requirements for this equipment, such that it can operate correctly in its environment. We aim at performing tests according to IEC61326-1, EN61000 series of standards.

EMC and EMI: quantitative testing and fast product improvement

CONNECTED FACILITIESEMC & motor test laboratory

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CONNECTED FACILITIESEmbedded electronics & control laboratory

Flexible electronics laboratory

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Electronics

Control is an important issue for reliability and performance of electronic devices and coupled device systems. Electronic compo-nents of the future need to have either inte-grated intelligence for control and communi-cation purposes or are controlled remotely via fast connection to a data cloud. Such remote control units need to be integrated into the overall electronic design. Modern fabrication methods such as printed electronics are well suited for becoming the foundation of that technology.

While it is more common to design control systems after the electromechanical struc-ture is set in place, doing things in a reverse fashion would increase performance and intelligence of the hardware (faster, more accurate), or alternatively reduce costs by reducing the design time on the electronics side. An automated design of electronics based on control theoretic properties might thus be envisioned.

Another important part of many control systems is model-based fault diagnosis, fault-tolerant control and fault prediction, which has the potential for significant costs reduction and safety improvement. Robust controllers, which function in a degraded environment, will help to avoid catastrophic failures.

Smart devices of the future: Local digital vs. cloud control

� Advanced control systems and their reliability

� Automated design of electronics based on control theories

� Cloud control � Adaptive learning strategies

including cooperative control and estimation

� Printed electronics.

Modern actuators often include integra-ted electronics for improving performance, accessibility and flexibility. In many systems, the mechanical actuator part is comple-mented by the electronics part to result in a sophisticated mechatronic system. This entanglement of components also means that optimisation can only be done by taking all components into consideration, and the response is often far from being linear. Typical examples are piezocomponent based actuators, which intimately couple electric and mechanic force fields. Another example are soft, polymer-based actuators, which challenge with vastly different response regimes.

CIE will be able to characterise actuators and their electronics quantitatively and qualita-tively with a high level of accuracy, and via modelling and experimental realisation it will help to develop new kinds of actuators from both hard and soft printable materials.

CONNECTED FACILITIESActuator & control laboratory

Flexible electronics laboratory


Smart actuators: flexible and intelligent

� Linear actuators � Vibration and reliability

measurements � Embedded intelligence-

controlled actuators � Soft and polymer actuators � Dielectric elastomer based

printed devices.

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CONNECTED FACILITYEMC & motor test laboratory

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Measurement and certification of noise levels. The spectral and temporal noise characteristics of electrical machines are assessed according to national and European standards. Sound design of devices and machines. Noise measurements and treatments of devices and machines focus on the overall acoustic energy level (dB) but removing some frequencies is often sufficient to make noise less stressful and harmful. For given appara-tus the frequency-dependent noise emissions will be finetuned, resulting in higher percei-ved quality. Advanced measurement and prediction of complex sound fields in production environ-ments. Noise of industrial machines is extre-mely diverse. Yet, to date there is neither an acoustic typology nor a database of machine noise. Together with local stakeholders, CIE will change that and develop a new metrics (besides dB) which, by integrating electrical engineering, acoustics and psychology, will measure harmfulness rather than loudness. This promises to be a path to new innovative products and the next generation of maps for complex sound fields.

Silencing the apparatus: machine noise quantification and elimination

Become part of the team For our strong research environment within industrial electronics, we are looking for highly skilled scientific staff to be part of an international leading research team.

Read more at http://www.sdu.dk/cie

BOUNDARY CONDITIONS

CONTACT

Prof.Dr. Horst-Günter RubahnHead of centre ad interimDirector, Mads Clausen InstituteAlsion 2DK-6400 Sonderborg

Phone: +45 [email protected]

CIE is situated at the science and culture centre of Southern Jutland, ‘Alsion’, both inside the main building and in an additional building on the southern side. Besides being the address of the University of Southern Denmark, Alsion also houses a research park, a business academy, a concert hall and the symphony orchestra of Southern Jutland. This provides unique possibilities for exten-ding the co-operation between university, business life and culture.

The town Sønderborg hosts a lively study environment, with young people from vari-ous educations within engineering, huma-nities and social sciences. The University of Southern Denmark is the largest educational institution in town with approximately 1.200 students. The town centre hums with life, while outside the centre, the sea, the beach and the forest tempt with countless possibili-ties of leisure time activities.

Sønderborg and Alsion are situated at the Flensburg fjord which marks the border to Germany. At present, the campus has students from more than 60 nations and is the most international campus in Denmark.

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http://www.sdu.dk/cie


Electronics

www.sdu.dk/cie

Documents

CENTRE FOR INDUSTRIAL ELECTRONICS · 2019-07-16 · Centre for Industrial Electronics BACKGROUND 1 Global challenges and megatrends Energy consumption is growing exponen-tially, both