Ceramics Introduction

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    Introduction to Ceramics

    Dr. Ashutosh S. Gandhi

    Metallurgical & Materials EngineeringIndian Institute of Technology Madras

    [email protected]

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    Taxonomy of Ceramics

    Glasses Clayproducts Refractories Abrasives Cements Advancedceramics

    -optical-compositereinforce

    -containers/household

    -whiteware-bricks -bricks forhigh T

    (furnaces)-sandpaper-cutting-polishing

    -composites-structural -engine-rotors

    -valves-bearings

    Adapted from Fig. 12.1 and discussion in

    Section 12.2-6,

    Callisters Materials Science and

    Engineering, Adapted Version..

    -electronics-sensors

    Mainly based on Callisters Materials Sceince & Engineering

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    Structural Ceramics

    Oxides, carbides and nitrides

    Alumina (Al2O3), zirconia (ZrO2), silicon carbide (SiC),

    tungsten carbide (WC), silicon nitride (Si3N4), titanium

    nitride (TiN)

    Oxynitrides: SiAlON

    Borides and silicides

    Zirconium diboride (ZrB2), titanium diboride (TiB2),

    molybdenum disilicide (MoSi2)

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    Need a material to use in high temperature furnaces.

    Consider the Silica (SiO2) - Alumina (Al2O3) system.

    Phase diagram shows:mullite, alumina, and cristobaliteas candidate refractories.

    From Fig. 12.8,

    Callisters Materials

    Science and Engineering,

    Adapted Version.(Fig. 12.8 is adapted from

    F.J. Klug and R.H.

    Doremus, "Alumina Silica

    Phase Diagram in the

    Mullite Region", J.

    American Ceramic

    Society70(10), p. 758,

    1987.)

    Application: Refractories

    Composition (wt% alumina)

    T(C)

    1400

    1600

    1800

    2000

    2200

    20 40 60 80 1000

    alumina+

    mullite

    mullite+ L

    mulliteLiquid

    (L)

    mullite+ cristobalite

    crystobalite+ L

    alumina + L

    3Al2O3-2SiO2

    3

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    tensileforce

    AoAddie

    die

    Die blanks:-- Need wear resistant properties!

    Die surface:-- 4 mm polycrystalline diamond

    particles that are sintered onto a

    cemented tungsten carbide

    substrate.

    -- polycrystalline diamond helps control

    fracture and gives uniform hardness

    in all directions.

    Courtesy Martin Deakins, GE

    Superabrasives, Worthington,

    OH. Used with permission.

    From Fig. 23.2 (d),

    Callisters Materials

    Science and Engineering,

    Adapted Version.

    Courtesy Martin Deakins, GE

    Superabrasives, Worthington,

    OH. Used with permission.

    Application: Die Blanks4

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    Tools:-- for grinding glass, tungsten,

    carbide, ceramics

    -- for cutting Si wafers

    -- for oil drilling

    bladesoil drill bits Solutions:

    coated single

    crystal diamonds

    polycrystalline

    diamonds in a resin

    matrix.

    Photos courtesy Martin Deakins,

    GE Superabrasives, Worthington,

    OH. Used with permission.

    Application: Cutting Tools

    -- manufactured single crystal

    or polycrystalline diamonds

    in a metal or resin matrix.

    -- optional coatings (e.g., Ti to helpdiamonds bond to a Co matrix

    via alloying)-- polycrystalline diamonds

    resharpen by microfracturing

    along crystalline planes.

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    Applications: Advanced

    Ceramics Ceramic Armor

    Al2O3, B4C, SiC & TiB2

    Extremely hard materials shatter the incoming projectile

    energy absorbent material underneath

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    Applications: Advanced

    Ceramics

    Heat Engines

    Advantages: Run at higher temperature

    Excellent wear &corrosion resistance

    Low frictional losses

    Ability to operate without

    a cooling system

    Low density

    Disadvantages:

    Brittle

    Too easy to have voids-

    weaken the engine

    Difficult to machine

    Possible partsengine block, piston coatings, jet engines

    Ex: Si3N4, SiC, & ZrO2

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    Alumina Ceramics

    Textile Industry Components

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    Industrial Ceramic Components

    Cutting Tool Inserts (Si3N4)

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    Silicon Nitride Components

    Bearing Rollers

    Turbocharger Rotors

    AFM Tip

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    Stabilised Zirconia Articles12

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    Metals

    Alloys

    Graphite

    Ceramics

    Semicond

    PolymersComposites

    /fibers

    E(GPa)

    Based on data in Table B2,Callisters Materials Science and Engineering,

    Adapted Version.

    Composite data based on

    reinforced epoxy with 60 vol%

    of aligned

    carbon (CFRE),aramid (AFRE), or

    glass (GFRE)

    fibers.

    Youngs Moduli: Comparison

    109Pa

    0.2

    8

    0.6

    1

    Magnesium,

    Aluminum

    Platinum

    Silver, Gold

    Tantalum

    Zinc, Ti

    Steel, Ni

    Molybdenum

    Graphite

    Si crystal

    Glass-soda

    Concrete

    Si nitrideAl oxide

    PC

    Wood( grain)

    AFRE( fibers) *

    CFRE*

    GFRE*

    Glass fibers only

    Carbon fibers only

    Aramid fibers only

    Epoxy only

    0.4

    0.8

    2

    4

    6

    10

    2 0

    4 0

    6 08 0

    10 0

    200

    600800

    10 001200

    400

    Tin

    Cu alloys

    Tungsten

    Si carbide

    Diamond

    PTFE

    HDPE

    LDPE

    PP

    Polyester

    PSPET

    CFRE( fibers)*

    GFRE( fibers)*

    GFRE(|| fibers)*

    AFRE(|| fibers)*

    CFRE(|| fibers)*

    14

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    Room Tvalues

    Based on data in Table B4,Callisters Materials Science and

    Engineering, Adapted Version.

    a = annealedhr = hot rolled

    ag = aged

    cd = cold drawn

    cw = cold worked

    qt = quenched & tempered

    Yield Strength : ComparisonGraphite/Ceramics/Semicond

    Metals/Alloys

    Composites/fibers

    Polymers

    Yieldstrength,sy(MPa)

    PVC

    H

    ardtomeasure

    ,

    sinceintension,fra

    ctureusuallyoccursbeforeyield.

    Nylon 6,6

    LDPE

    70

    20

    40

    6050

    100

    10

    30

    2 00

    3 00

    4 00

    5 006 007 00

    10 00

    2 0 00

    Tin (pure)

    Al(6061)a

    Al(6061)ag

    Cu(71500)hrTa (pure)Ti (pure)aSteel (1020)hr

    Steel (1020)cd

    Steel (4140)a

    Steel (4140)qt

    Ti (5Al-2.5Sn)aW(pure)

    Mo (pure)Cu(71500)cw

    Hardtomeasure,

    inceramicmatrixandepoxymatrixcompo

    sites,since

    intension,frac

    tureusuallyoccursbefo

    reyield.

    HDPEPP

    humid

    dry

    PC

    PET

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    Tensile Strength : Comparison

    Si crystal

    Graphite/Ceramics/Semicond

    Metals/Alloys

    Composites/fibers

    Polymers

    Tensile

    st

    rength,

    TS

    (MPa)

    PVC

    Nylon 6,6

    10

    100

    200300

    1000

    Al(6061)a

    Al(6061)ag

    Cu(71500)hr

    Ta (pure)Ti (pure)a

    Steel (1020)

    Steel (4140)a

    Steel (4140)qt

    Ti (5Al-2.5Sn)aW(pure)

    Cu(71500)cw

    LDPE

    PP

    PC PET

    20

    3040

    2000

    3000

    5000

    Graphite

    Al oxide

    Concrete

    Diamond

    Glass-soda

    Si nitride

    HDPE

    wood( fiber)

    wood(|| fiber)

    1

    GFRE(|| fiber)

    GFRE( fiber)

    CFRE(|| fiber)

    CFRE( fiber)

    AFRE(|| fiber)

    AFRE( fiber)

    E-glass fibCfibersAramid fib

    Room Temp. values

    Based on data in Table B4,Callisters Materials Science and

    Engineering, Adapted Version.

    a = annealed

    hr = hot rolled

    ag = aged

    cd = cold drawn

    cw = cold worked

    qt = quenched & tempered

    AFRE, GFRE, & CFRE =

    aramid, glass, & carbon

    fiber-reinforced epoxy

    composites, with 60 vol%

    fibers.

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    Honeycombs for Catalysts17

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    Example: Oxygen sensor ZrO2 Principle: Make diffusion of ionsfast for rapid response.

    Application: Sensors

    A Ca2+impurity

    removes a Zr4+and aO2- ion.

    Ca2+

    Approach:Add Ca impurity to ZrO2:

    -- increases O2-vacancies-- increases O2-diffusion rate

    referencegas at fixedoxygen contentO2-

    diffusion

    gas with anunknown, higher

    oxygen content

    -+voltage difference produced!

    sensor Operation:

    -- voltage differenceproduced when

    O2-ions diffusefrom the external

    surface of the sensor

    to the reference gas.

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    Applications: Advanced

    CeramicsElectronic Packaging

    Chosen to securely hold microelectronics & provideheat transfer

    Must match the thermal expansion coefficient of the

    microelectronic chip & the electronic packagingmaterial. Additional requirements include: good heat transfer coefficient

    poor electrical conductivity

    Materials currently used include: Boron nitride (BN)

    Silicon Carbide (SiC)

    Aluminum nitride (AlN)

    thermal conductivity 10x that for Alumina

    good expansion match with Si

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    High-kMaterials for Gate Dielectrics 20

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    High-kMaterials for Gate Dielectrics21

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    Dielectric Applications

    -Al2O3: Spark-plug insilators

    SiO2: Gate dielectrics

    (Ba, Sr)TiO3: Dynamic random access memory

    (DRAM)

    Lead magnesium niobate (PMN): Chip

    capacitors

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    Advances in Superconductivity

    This research area was stagnant for many

    years.

    Everyone assumed Tc,maxwas about 23 K

    Many theories said you couldnt go higher 1987- new results published for Tc> 30 K

    ceramics of form Ba1-xKxBiO3-y

    Started enormous race.

    Y Ba2Cu3O7-x Tc= 90 K

    Tl2Ba2Ca2Cu3Ox Tc= 122 K

    tricky to make since oxidation state is quite important

    Values now stabilized at ca. 120 K

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    Magnetic Ceramics

    -Fe2O3: Recording tapes Mn0.4Zn0.6Fe2O4: Transformer cores in touch

    tone telephones

    BaFe

    12O

    19: Permanent magnets in loudspeakers

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    Transmittance:--Aluminum oxide may be transparent, translucent, or

    opaque depending on the material structure.

    Adapted from Fig. 1.2,Callisters Materials

    Science and Engineering,

    Adapted Version.

    (Specimen preparation,

    P.A. Lessing; photo by S.

    Tanner.)

    single crystal

    polycrystal:

    low porosity

    polycrystal:

    high porosity

    OPTICAL PROPERTIES26

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    Optical Applications

    Doped SiO2: Optical fibres

    -Al2O3: Transparent envelopes in street lamps

    Doped ZrSiO4: Ceramic colours (pigments)

    Doped (Zn, Cd)S: Fluorescent screens Pb1-xLax(ZryTi1-y)1-x/4O3: Thin-film optical switches

    Nd doped Y3Al5O12(YAG): Solid-state lasers

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    Thermal Conductivity: Comparison

    increasingk

    PolymersPolypropylene 0.12Polyethylene 0.46-0.50Polystyrene 0.13Teflon 0.25

    By vibration/rotation of chainmolecules

    CeramicsMagnesia (MgO) 38Alumina (Al2O3) 39Soda-lime glass 1.7Silica (cryst. SiO2) 1.4

    By vibration ofatoms

    MetalsAluminum 247Steel 52Tungsten 178Gold 315

    By vibration ofatoms andmotion ofelectrons

    k (W/m-K) Energy TransferMaterial

    Selected values from Table 19.1Callisters Materials Science and Engineering,

    Ada ted Version.

    28

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    Application:

    Space Shuttle Orbiter

    Silica tiles(400-1260C):--large scale application --microstructure:

    Fig. 19.2W, Callister 6e. (Fig. 19.2W adapted from L.J.Korb, C.A. Morant, R.M. Calland, and C.S. Thatcher, "The

    Shuttle Orbiter Thermal Protection System", Ceramic

    Bulletin, No. 11, Nov. 1981, p. 1189.)

    Fig. 19.3W, Callister 5e. (Fig. 19.3W courtesy the

    National Aeronautics and Space Administration.)

    Fig. 19.4W, Callister 5e. (Fig. 219.4W courtesy

    Lockheed Aerospace CeramicsSystems, Sunnyvale, CA.)

    Thermal Protection System

    reinf C-C(1650C)

    Re-entry TDistribution

    silica tiles(400-1260C)

    nylon felt, silicon rubbercoating (400C)

    ~90% porosity!

    SiO2fibersbonded to one

    another during

    heat treatment.

    100mm

    Chapter-opening photograph, Chapter 23, Callister 5e

    (courtesy of the National Aeronautics and Space

    Administration.)

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    30

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    Heat Transfer

    Thermal Barrier CoatingsCritical Enabling Technology for

    Gas Turbine Engines(Aviation & Power Generation)

    Superal loy

    Bond Coat

    Thermal Barr ier

    TGO

    State of the Art TBC Systems

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    CT Scan

    Artificial JointsCeramics in Biomedical

    Applications

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    Useful Properties of Ceramics

    High melting points

    High hardness & compressivestrength

    Wear resistance

    Chemical inertness

    Catalysis

    Biocompatibility

    Good electrical insulation

    High dielectric constant

    Ferroelectricity

    Piezoelectricity

    Good electrical conduction

    Superconductivity

    Semiconductivity (SiC, ZnO)

    Ionic conduction (fuel cells,sensors)

    Good thermal insulation Refractories

    Good thermal conductivity

    SiC, AlN

    Magnetism

    Optical transmission Optical birefringence

    Electro-optical properties

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    Etymology of Ceramic

    The word ceramic is derived from the

    Greek word keramos, which means

    potters clay or pottery.

    Its origin (apparently) is in a Sanskrit term

    meaning to burn.

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    Definitions of Ceramics Barsoum, Ceramics can be defined as solid compounds that are formed

    by the application of heat, and sometimes pressure, comprising of

    at least one metal and a non-metallic elemental solid (e.g. TiC) or a non-metal (e.g. TiO2),

    a combination of at least two non-metallic elemental solids (e.g. GaN, TiB2),

    or a combination of at least one non-metallic elemental solids and a non-

    metal (e.g. SiO2).

    Diamond and graphite not included in this definition! Kingery: Ceramics can be defined as inorganic non-metallic solids.

    Si, Ge included in ceramic materials! (Along with GaN, GaAs)

    Glass is a supercooled liquid, with characteristics of a solid. Hence, the

    definition of the solid state must be taken in its broadest sense.

    Ice has properties similar to most ceramics, but its a molecular solid. Predominance of ionic or covalent bonding is essential for a material to

    be classified as a ceramic. So, ceramics can be defined as inorganic,

    non-metallic, non-molecular solids with predominantly ionic or covalent

    bonding.

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