CfD ace Demo

CFD-ACE+

Copyright ESI Group, 2010. All rights reserved.Copyright ESI Group, 2010. All rights reserved.Copyright ESI Group, 2006. All rights reserved.

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ESI

REFERENCES

5

REFERENCES

Electronics, Defense and AerospaceAM, Thales, Whirlpool, Boeing, DGA, EADS, ESA, I t l I fi GE S NASA US N

Engineering Simulation for Industry

5

Intel, Infineon, GE, Samsung, NASA, US Navy, Heavy Industry / EnergyAir Liquide, Alcan, Arcelor, Bridgestone, Caterpillar, Corus, EDF, Framatome, John Deere, Kobelco, LG, NKK O k G P S l T bi

2009

NKK, Osaka Gas, Posco, Solar Turbines, TransportationAlstom, Audi, Autoliv, Ballard Power, BMW, Bombardier, Breed, Daewoo, Daihatsu, Daimler-

Chrysler, Delphi, Faurecia, Ford, GM, Honda, Hyundai, Isuzu, Mazda, Mitsubishi, Nissan, Porsche, PSA, Renault, Rolls-Royce, Samsung, Seat, Skoda, Subaru, Toyota, TRW, Valeo, Viston, VW, y

Copyright ESI Group, 2010. All rights reserved.

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ESI

:800800

16

16

33


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ESI ChinaESI

ESI CHINA China

ESI CHINAOffice

ESI CHINA Office OfficeOffice

ESI CHINAESI CHINAAgent

Copyright ESI Group, 2010. All rights reserved. 4

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Airbus, AM, Boeing, CAC, DGA,

DLR, EADS, ESA, Intel, Infineon, GE, Motorola, Samsung, NASA, Thales US Navy WhirlpoolThales, US Navy, Whirlpool,

/Air Liquide, Alcan, Arcelor, Areva, Ballard Power,

Bridgestone, Caterpillar, Comex, Corus, EDF, John Deere, Kobelco, LG, MHI, NKK, Osaka Gas,

Posco, Solar Turbines,

Alstom, Audi, Autoliv, BMW, Bombardier, Breed, Daewoo, Daihatsu,

Daimler-Chrysler, Delphi, Faurecia, Ford, GM, Honda, Hyundai, Isuzu, Mazda, Mitsubishi, Nissan, Porsche, PSA, Renault, Rolls-Royce, Samsung, Seat,

Skoda, Subaru, Toyota, TRW, Valeo, Viston, VW,


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CFD ACE+CFD-ACE+

Copyright ESI Group, 2010. All rights reserved.Copyright ESI Group, 2006. All rights reserved.

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T-T MT-M


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DNADNA


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CFD-ACE+

CFD-ACE+ESI

NASABoeingAirbus

ESI-CFD HQ. Detroit, Michigan, USA

Copyright ESI Group, 2010. All rights reserved. 9

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( )

() /

() () /

() ECAD, MCAD


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CFD-ACE+

Motorola CTRL Samsung Advanced Institute of Technology Fuji Photo Film Konica Corporation

Technology NASA Johnson Space Center Photon Dynamics, Inc.

Advanced Energy Industries, Inc.

NASA Glenn Research Center NASA Marshall Space Flight Center LG Electronics Sandia National Laboratory

General Electric Company

LG Electronics Eastman Kodak Alcatel Cable France

Tokyo Electron America Lockheed Martin

cate Cab e a ce Sequenom Aixtron Semiconductor Technologies

GMBH Xeotron Corporation Korea Advanced Institute of

GMBH Institute of Electron Technology Oxford Instruments Plasma Technology


Science and Technology Oxford Instruments Plasma Technology DSO National Laboratories

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CFD-ACE+


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CFDACE+


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CFD-ACE+MEMSMicromesh


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1. /

BGA //

2.

PCB

3. CADEDA



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CFD-ACE+1 1.

CFD-Micromesh

4. (CMOS, IGBTs,)

2.

PCB PWA

(CMOS, IGBTs,) 5 PCB, PWA,

3. /

5.

, BGAs, 3DICs


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Generic Power MCM


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() (,) / VOF;

Bottom Gated Transfer Molding Cavity For Encapsulating IC Chip

Curing Chemistry; 10-5<

//


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(BGA)(BGA)


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//

IGBT(


IGBT( )

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//


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Micromesh


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CFD-Micromesh

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MEMS

Ulrich Zengerle1700 m 1000 m 15 m Flap1700 m 1000 m 15 m Flap400 x400 Seat

1828kFlap Modeled Using Shell Elements

//


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FDTDS-Y-

CFD-ACE+


(a)(b)

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MEMSMEMS

(a)(b)


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MEMS

CFD-ACE+AC/DCPZT, MHDMHDBEAD mesopump (Honeywell)Tesla/Tesla


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MEMSMEMS

BEAD MesopumpBEAD Mesopump


(IMM)

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MEMSMEMS

CFDRC


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MEMS

MEMS

CFD ACE+


CFD-ACE+

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SMEMS

CFD ACE+ Copyright ESI Group, 2010. All rights reserved.Copyright ESI Group, 2006. All rights reserved.

CFD-ACE+

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CFD-ACE+MEMS


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SMEMS

(GIF) 3D


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ALDALECVDMOCVDMOVPE

RTP

CFD-ACE+NCSU


CFD-ACE+NCSUAlN MOCVD

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MOVPE1 55 1.55mmLED MOVPE


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/

ACE+ICP/

L FCMOCVDCFDRC


LaFCMOCVDCFDRC

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() ()


()


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DamascenceDual D Damascence


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feature scale


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AIXTRON MOCVD

/


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RTCVD Quartz Window Quartz Window MC-Radiation Flow Flow Conjugate Heat Trnsfr. Surface/gas Chemistry Surface/gas Chemistry


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APCVD


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MOCVD


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CFD-ACE+Discrete OrdinateMonte CarloMonte Carlo

CFD-ACE+ :Monte CarloRTP

CFD-ACE+SEMATECH Benchmark

RTP


CFD ACE SEMATECH Benchmark

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latchup(SEL)SEU

TID STI

() (), CFD-Micromesh EDAIC


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CFD-ACE+ CFD ACE+ CFDRC//

CFDRCNit id Nitrides III-Vs Fluorocarbons

CFD-ACESandiaCHEMKIN II Fluorocarbons

SiC SiO2

CHEMKIN IICHEMKIN CFD-ACE+ SiO2 CFD-ACE+


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(Direct Write (DW) )(Direct-Write (DW) )


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/(Kinetic Theory & Stephen Maxwell) / ()


()

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(TEC) (VCSELs, ) (MSM p-i-n)(MSM, p-i-n)


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QWVCSELs, EELs, MSM, p-i-n

Simulation Manager I VL II-VL-ICFD-VIEW


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CFD-ACE+ VCSELCFD ACE VCSEL

CFD ACE VCSELCFD-ACE+ VCSEL (, ) ()()(DD) (EB)( )


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VCSEL


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VCSEL(L-I)(I-V)VCSEL

VCSEL

6VCSEL VCSEL


6VCSEL

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MSM

1ps


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Boltzmann())BoltzmannBoltzmanno t a


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(FDTD)(FDTD)

SY


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CFD Mi h CFD-Micromesh 30


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/ /

EMY


Y

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a) b)


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10GH 10GHz

d = 17 , r = 2.54L = 671 mm


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CFD-ACE+ CFD-ACE+

()

(PEMFC)(SOFC)

()

(SOFC)(DMFC)

!


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CFD ACE CFD-ACE+

, (UDF)(GUI)(GUI)


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PEM

(/)

CFD-ACE+PEM

()Nafion 117

()


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PEMPEM

PEM PEMPEM


PEM

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(DMFC)(DMFC)CFD-ACE+DMFCCFD-ACE+DMFC


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(DMFC)(DMFC)


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CFD-ACE+


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SOFC SOFC

SOFC


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ICPCCPSiO2 (ICP)

400


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(ICP) (CCP) CVD

SiO2()

(ICP) (CCP)

CVD (+ve, -ve

SiO2() (300mm)

)

(300mm) ICS(

)


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TCP


TCP

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ICP,CCPDCICPFilament modelSPICECCPDC


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CFD-ACE+10KHz

ICP10KHz


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CFD-MicromeshCFD Micromesh

1 CIFGDSII1. CIFGDSIIGDSII )

2 ( )2. ()3. (CFD-Micromesh) 4. (CFD-VIEW)


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CFD-MicromeshCFD-Micromesh


CFD-ACE+

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MicromeshMicromesh


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/

Lab-On-A-Chip Lab On A Chip DNA


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DNA

DNASolution-Phase Binding of target DNA

i h C l S dwith Complementary Strands Rate of Hybridization affected by

Mode of transport of Target DNA to p gbinding siteGeometry of Solid Supports

Different Hybridization Region Geometry Different Hybridization Region Geometry with same surface area Uniform PillarsFlat Patch Configuration


Flat Patch Configuration

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Spatial Variation in Extent of Hybridization at Different Time Instants

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Hybridization Channel Geometry Hybridization Channel GeometryChannel Geometry


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CfD ace Demo