ChaoJi/CHAdeMO 3.0 Development Update

1. Coupler Design2. Control Pilot Circuit Specification3. Heat Dissipation Analysis4. Schedule for IEC Proposal5. Communication Protocol for Next Generation

Oct. 17th , 2019Hidetoshi KUSUMI

Toyota Motor Corporation

1. Coupler Design

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1. Coupler Design - Mechanical Strength -

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Drive over/Crush/Drop tests are under going in both China and Japan. Results and final spec to be discussed by the end of 2019.

1. Coupler Design - Adapter -

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In addition to type-B, the availability of type-A is also under discussion. Plan to bring the topics in IEC61851/IEC62196 for better conversation.

2. Control Pilot CircuitChaoJi EVSE ChaoJi Vehicle

EVSE Vehicle

[ Start sequence ]1. Vehicle wakes up by DP2 becomes 12V. And Sv -> ON (if Sv is normaly open)2. Vehicle knows Coupler mated by CC2 circuit closed(DP3=6V). And S2’ -> ON3. EVSE knows Coupler mated by DP1 becomes low.4. EVSE close S1 to make entire system ready for charging.5. CAN communication start.

6V

- ChaoJi System -

Ver. 2019 Sep.

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- Backward Compatibility -

CHAdeMO 2.0

GB/T 2015

CCS Type2

ChaoJi VehicleAdapterEVSE

2V

8V

4V

100Ω

200Ω

400Ω

1.43 1.0kΩ kΩ

1.5kΩ

300Ω

250Ω

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Step1：BMC for current connectors→Take a data of each contact resistance and temp. rise during charging @400A, 30min.

EVSE Connector Terminal: A, B, C Vehicle Inlet Terminal

95sq w/h

Inlet resistance(heat source)

A

B C

Background: To prevent vehicle inlet temp. rise becomes over 50K during high current charging, the heat dissipation performance value for connector needs to be defined as a boundary condition between EVSEs and Vehicles.

Contact resistance, mΩ

Tem

p. ri

se, Δ

K 50

0.10 0.20

Good in EVSE cooling performance

Fig.2 Test piece for BMCFig.1 Temp. rise by contact resistance (assumed)

0.15

Step2：Study and optimize the contact resistance→e.g. If the contact resistance is 0.2mΩ, 32W of heat dissipation is required for liquid cooling connector. If 32W is not realistic then the contact resistance needs to be improved.

Determine a reasonable value for both contact resistance and heat dissipation target.

3. Heat Dissipation Analysis

- Reference terminal (sleeve terminal) for data acquisition

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connector Ref. terminals

w/h（95sq）

＜Cross section of Reference terminal＞

＜Reference terminals mating with connector＞

Fasten by screw⇒with torque management

Climping /welding w/h

Support pin(connector terminal)at 3 points

3. Heat Dissipation Analysis

Remove part of the connector to allow reference terminal mating.

2018年

12月 1月 2月 3月 4月 5月 6月 7月 8月 9月 10月 11月 12月

2019年

◆ Apply Schedule for CHAdeMO/ChaoJi standard

①Discuss needs and deal②Decide direction ⇒make a deal about the position of the heat dissipation③BMC for market available connectors（CCS（Jun）、ChaoJi（Nov～））: (Fig.1)④Study and optimise the inlet resistance （~Dec）⑤Making of the reference terminal⑥Tuning of the referenct terminal⑦Proposal for CHAdeMO/ChaoJi standard (Dec)

・HPC_SWG（12/19）

②Decide approach

⑤Making of ref. terminal

Proposal⑦

①Deal・K/O

③BMC for connectorsCCS

⑥TuningDesign of ref. terminal

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③ChaoJi

Optimise④

3. Heat Dissipation Analysis

4. Schedule for IEC Proposal

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4. Schedule for IEC Proposal- Five Years Schedule -

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5. Communication Protocol for Next Gen.

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Thank you!