37
1 CHAPTER 1: INTRODUCTION 1.1 THERMALLY STABLE POLYMERS Thermally stable / High performance polymers (HPPs) are resistant to oxidative degradation at elevated temperature, resistant to thermolytic process and stable to radiation and chemical reagents. These polymers are able to provide long-term service at elevated temperatures. The development of different thermally stable polymers is continued due to the large requirement of high temperature polymers. Thermally stable polymers are widely used in electrical, electronics, automotive and aerospace industries. The aerospace industry was a significant driving force behind the development of new materials. The research and development of HPPs was started in the year 1960. The most prolific decade for HPPs was 1960 -1970 when thermally stable heterocyclic rings were incorporated into polymers. A large number of thermally stable polymers have been synthesized. In these the thermal stability is imparted by the high regularity and rigidity of the backbone. These types of polymers exhibit poor processing characteristics due to insolubility in common organic solvents and high melting temperature. Many efforts have been taken to improve the processability without decreasing the thermal stability. Among the class of thermally stable polymers a few are technically important and they are polyoxadiazole, polyquinoxaline, polyquinolines, hexafluoroisopropylidene containing polymers, hexfluroisopropoxy group containing polymers and polyimides. Of these polyimides have been the most widely used.

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CHAPTER 1: INTRODUCTION

1.1 THERMALLY STABLE POLYMERS

Thermally stable / High performance polymers (HPPs) are resistant to oxidative

degradation at elevated temperature, resistant to thermolytic process and stable to

radiation and chemical reagents. These polymers are able to provide long-term service at

elevated temperatures. The development of different thermally stable polymers is

continued due to the large requirement of high temperature polymers.

Thermally stable polymers are widely used in electrical, electronics, automotive

and aerospace industries. The aerospace industry was a significant driving force behind

the development of new materials. The research and development of HPPs was started in

the year 1960. The most prolific decade for HPPs was 1960 -1970 when thermally stable

heterocyclic rings were incorporated into polymers.

A large number of thermally stable polymers have been synthesized. In these the

thermal stability is imparted by the high regularity and rigidity of the backbone. These

types of polymers exhibit poor processing characteristics due to insolubility in common

organic solvents and high melting temperature. Many efforts have been taken to improve

the processability without decreasing the thermal stability. Among the class of thermally

stable polymers a few are technically important and they are polyoxadiazole,

polyquinoxaline, polyquinolines, hexafluoroisopropylidene containing polymers,

hexfluroisopropoxy group containing polymers and polyimides. Of these polyimides have

been the most widely used.

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1.2 POLYIMIDES

Aromatic polyimides (Figure 1.1) are one of the most important classes of high

performance polymers due to their excellent thermal, mechanical and electrical

properties.1,2

Polyimides are polycondensation products prepared from derivatives of

tetracarboxylic acids and primary diamines3-7(Scheme 1.1). Polyimides are also formed

by the self-polycondensation of amiodicarboxylic acid derivatives8,9

(Scheme 1.2).

N Ar N Ar'

O O

OO

Figure 1.1: Structure of polyimides

OH

OCH3

HO

H3CO

O

O

O

O

+ H2N (CH2)2 NH2HO

H3CO OCH3

ONH3

O

O O

O

(CH2)2 NH2

NN (CH2)2

n

O

O O

O

derivatives of tetracarboxylic acids

primary diamines

polyimides

Scheme 1.1: Synthesis of polyimide

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3

H2N

O N

n

+ H2O

O

O

O

O

aminodicarboxylic acid polyimides

Scheme 1.2: Self-polycondensation of aminodicarboxylic acid derivatives

Polyimides backbone contains heterocyclic imides unit. Among imides containing

polymers, polyimides derived from aromatic tetracarboxylic acid and aromatic diamines

are of primary importance and represent typical high performance speciality polymers

that are commercially employed in various applications.

Historically the first report concerning the polyimides was made by Bogert and

Renshaw in 1908 which was synthesized starting from 4-aminophthalic anhydride.

Edwards and Robinson first prepared high molecular weight polyimides by the

polymerization of salts formed from diamines and pyromellitic acid or related diester.10

Endrey used a two step method to prepare the first commercial aromatic

polyimide (Scheme 1.3) from pyromellitic dianhydride and 4,4’-diaminodiphenyl ether

in the year 1960.11-15

This polymer was patented by Du Pont and is known by the trade

name Kapton. In the two-step method, a soluble polyamic acid was prepared first and

then converted into polyimide.

Vinogradova and coworkers developed a one-step method to prepare soluble

aromatic polyimides.16

This method involved the direct polymerization of diamines and

dianhydrides at an elevated temperature in the presence of tertiary amines.

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O O

O

O O

O

+ H2N O NH2

RT, DMAc

NN

O O

OO

On

HN

HO

NH

OH

O

O

O

O

O

n

-H2O

poly(amic acid)

PMDA ODA

Kapton

Scheme 1.3: Synthesis of kapton polyimide

1.2.1 Synthesis of polyimides

Various synthetic methods for the polyimides have been described. A successful result

for each method depends on the nature of the chemical components involved in the

system, including monomers, intermediates, solvents and the polyimides products, as

well as on the physical condition during the synthesis. Properties such as monomer

reactivity, solubility, glass - transition temperature (Tg), crystallinity (Tm) and melt

viscosity of the polyimides products ultimately determine the effectiveness of each

process. Accordingly proper selection of synthetic method is often critical for the

preparation of polyimides.

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1.2.1.1 Two-step method

In the two-step method, a soluble polyamic acid is prepared by the condensation of a

tetracarboxylic acid dianhydride and diamine in polar approtic solvent such as NMP,

DMAc, or DMF at or below room temperature17-19

(Scheme 1.4). The resulting polyamic

acid is then converted into the polyimides via imidization.

O Ar O NH2Ar'H2N

O O

OO

ArHO NH

OH

O O

OO

NH

Ar'

-2H2ON Ar N Ar'

O O

OO

+

dianhyride diamine polyamic acid

polyimide

Scheme 1.4: Synthesis of polyimides by two-step method

1.2.1.1.a Formation of polyamic acid

The mechanism of formation of polyamic acid involves the nucleophilic attack of the

amino group on the carbonyl carbon of the anhydride group, as shown in Scheme 1.5. In

this equilibrium reaction, the forward reaction is much faster than the reverse reaction.

The acylation reaction of amine is an exothermic reaction.20

The forward reaction in a

dipolar approtic solvent is a second order reaction and the reverse reaction is a first order

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reaction. Therefore, the forward reaction is favoured at low temperature and high

monomer concentration to form high molecular weight polyamic acid.21

O

O

O

+ NH2O

O

NH2O

O

NH2

O

O

OH

NH

O

O

Scheme 1.5: Mechanism of formation of polyamic acid

1.2.1.1.b Monomer reactivity

The reactivity of the monomer is an important factor in deciding the rate of polyamic acid

formation. The nucleophilicity of the amino nitrogen atom of the diamine and the

electrophilicity of the carbonyl group of the dianhydride are important factors in

determining the rate of the reaction. There is close relationship between the reaction rates

and the electron affinity Ea of dianhydrides. Dianhydrides with electron withdrawing

group enhance the Ea value and reactivity, where as electron donating substituents

rreduce reactivity. The nucleophilicity of the amino nitrogen atom of diamines enhances

their reactivity toward a given dianhydride. Electron-donating substituents increase the

reaction rate but electron withdrawing substituents, particularly located at para position to

the amino group reduce the reactivity. The diamines with basicity pKa of 4.5-6.0 are

more suited for the acylation reaction.22

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1.2.1.1.c Effect of solvents

The most commonly used solvents are dipolar approtic solvents such as DMAc, DMF,

DMSO and NMP. The use of polar approtic solvents that form strong hydrogen bond

with the carboxyl group and prevent the reverse reaction favours the amic acid

formation.23

Esterification or neutralization of carboxylic acid group with tertiary amine

can also prevent the reverse reaction. The resulting polyamic acid is then converted into

the polyimide by the extended heating at elevated temperature called thermal imidization

or by treatment with chemical dehydrating agents called chemical imidization.

1.2.1.1.d Thermal imidization

The polyamic acid is processed into desired shapes such as films or fibre and then heated

at 250 to 400 0C to remove the solvent and water. This process is called thermal

imidization. One of the popular heating cycles is 1 h at 100 0C, followed by 1 h at 200

0C

and 1 h at 300 0C.

24, 25 The imidization is accompanied through nucleophilic attack of the

amide nitrogen on the acid carbonyl carbon with elimination of water. Two possible

reaction pathways can occur during the thermal imidization26

(Scheme 1.6).

In the first pathway (a), the proton is lost after cyclization, while it is removed

prior to or during the ring closure in the second pathway (b). Ring closure occurs

considerably faster in second pathway since the nucleophilicity of the conjugate base of

the amide is much stronger than that of the amide. Therefore, fully ionized amine salts of

polyamic acids imidize up to ten times faster than the corresponding polyamic acid.

Thermal imidization is particularly effective for the preparation of thin materials such as

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films, coatings, fibres and powders because it allows the diffusion of the byproducts and

the solvent without forming bristles and voids.

NH

OH

O

O

N

O

OHO

NH

O

OHHO

N

O

O

(a)

(b)

NH

OH

O

O

NH

O

OO

N

OH

O

O

N

O

O OH

1.+ H

2 .- H2ON

O

O

-H

H

Scheme 1.6. Mechanism of thermal imidization of polyamic acid

1.2.1.1.e Chemical imidization

Imidization of polyamic acid can also be performed by means of chemical dehydration at

ambient temperatures. Commonly used reagents are dehydrating agent and a basic

catalyst.27

Among the basic catalysts used are tertiary amines, such as pyridine, methyl

pyridine, trimethylpyridine, triethylamine, and isoquinoline. Among the dehydrating

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agents used are acetic anhydride, propionic anhydride, butyric anhydride and benzoic

anhydride, etc.

O

NH

O O CH3

O

R3N + (CH3CO)2O H3C C NR3

O+ CH3COO

NH

OH

O

O

R3NNH

ONHR3

O

O

CH3 C NR3

O

NH

O CH3

O

O

O

NH

O CH3

O

O

O

route a

route b

NH

O O

O

CH3

O

CH3COOHN

O

O

CH3COOH

O

N

O

Scheme 1.7: Mechanism of chemical imidization of polyamic acid

The mechanism of chemical imidization28

is shown in Scheme 1.7. The tertiary

amine plays two important roles in the conversion of the acid hydroxyl group to a better

leaving acetate group. The tertiary amine converts the acetic anhydride to its salt form,

which is more susceptible to nucleophilic attack. Secondly, it converts the aromatic

carboxylic acid to its ionic conjugate base, which is a better nucleophile. Ring cyclisation

can proceed via a second nucleophilic substitution reaction by two different pathways. In

route “a” attack of the nitrogen atom generates an imide ring, while attack of the oxygen

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atom generates an isoimide ring in rout “b”. At first, both products can be formed.

However, since the isoimide is kinetically favoured product, it then rearranges to

thermodynamically stable product imide. This reaction is catalyzed by the acetate ion

present in the reaction mixture. The mechanism is shown in Scheme 1.8.29

The reverse

reaction cannot occur since the carboxylic acid proton is eliminated in the chemical

imidization. The degree of imidization of the final polymer depends on the solubility. In

general, polymer that is more soluble will remain in solution longer and reach high

degree of imidization. Even if the polymer is soluble throughout the polymerization

reaction, it will contain more amic acid than obtained by thermal imidization. Therefore,

the polyimide obtained by chemical imidization usually needs to be heated to elevated

temperature to increase the degree of imidization.

O

N

O

CH3COOO

N

O O CH3

O

O

O CH3

OO

N

N

O CH3

OO

O

-CH3COON

O

O

Scheme 1.8: Catalization of acetate ion in chemical imidization of polyamic acid

1.2.1.1.f High temperature solution imidization of polyamic acid

Polyimides resulting from thermal imidization often demonstrate insolubility, infusibility

and thus poor processability.30

To overcome these drawbacks, high temperature solution

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imidization has been successfully utilized.31,32

Cyclodehydration is conducted by heating

a polyamic acid solution in a high boiling solvent at temperature of 160-200 0C, in the

presence of an azeotropic agent. Compared with bulk thermal imidization, the lower

process temperature and greater mobility in the solution ensures the avoidance of

degradation and side reaction. Several studies were carried out investigating the kinetics

and reaction and mechanism of the imidization process.33

Second order kinetics were

demonstrated.

1.2.1.2 One - step high temperature solution polymerization

Soluble polyimide can also be prepared via a one-step high temperature solution

polycondensation of tetracarboxylic acid anhydride and diamines. In this process, the

dianhyride and diamine monomers are heated in a high boiling solvent or a mixture of

solvents at a temperature of 140-250 0C, which permits the imidization reaction to

proceed rapidly. Commonly used solvents are dipolar approtic amide solvents,

nitrobenzene, benzonitrile, α–chloronaphthalene, o-dichlorobenzene, trichlorobenzene,

phenolic solvents such as m-cresol and chlorophenols. In some cases toluene, xylene, o-

dichlorobenzene are used as co-solvent in order to facilitate the removal of water formed

by condensation via azeotropic distillation.34-36

When a mixture of diamine, dianhydride and solvent is heated, a viscous solution

is formed at an intermediate temperature of approximately 30-100 0C. At this point, the

composition of the products is mainly polyamic acid and phase separation is usually

observed in nonpolar solvents such as chlorinated aromatic hydrocarbons. However, on

raising the temperature to 120–160 0C, a vigorous evolution of water occurs and the

reaction mixture becomes homogeneous. At this stage the, product is essentially a low

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molecular weight polyimides having o-dicarboxy and amino end groups. Thereafter a

slow stepwise polycondensation reaction takes place according to the reaction between

the end groups. The rate is slower in basic approtic solvents, and faster in acidic solvents

such as m-cresol. In general, the imidization reaction has been shown to be catalyzed by

acid37

. Kreuz et al., however observed thermal imidization of polyamic acid could be

catalyzed by tertiary amines.26

High temperature solution polymerization in m-cresol is

often performed in the presence of high boiling tertiary amine such as quinoline as

catalyst.

1.2.1.3 Polyimides via derivatized polyamic acid precursors

Polyamic acids in solution are unstable and are susceptible to hydrolytic degradation.

This process breaks down the molecular weight of the amic acid and result in

polyimides.38

It is believed that hydrolysis occurs through the acid catalyzed formation

of an anhydride as shown in Scheme 1.9.

OH

O

N

HO

O

O

N

HOH

O

N

HHO

O + H2N

1

2

3

OO

O

Scheme 1.9: Mechanism for amic acid back reaction to anhydride and amine.

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To prevent this, efforts have been made to exclude the proton transfer from the

acid groups. The simplest way to eliminate the proton transfer step is to neutralize the

acid group with a base, such as a tertiary or a secondary amine, to form a polymeric

salt.28

But this method increases the viscosity of the solution due to the presence of ionic

polymer chain. Alternative method involves converting the acid group into either amide

or ester. The ortho-carboxylic group in polyamic acid can be chemically modified to

either an ester or an amide moiety. The ester or amide derivatives of polyamic acid are

unable to form carboxylate anion, which prevents the creation of degradation

intermediates. Polyamic ester can be stored for an indefinite period at ambient

temperatures. Conversion of esters of poly(amic acid) to polyimides proceeds thermally,

but at slower rate, and generally requires a temperature significantly higher than 200 0C.

1.2.1.4 Polyimides via polyisoimide precursors

In general, polyisoimides are more soluble and possess lower melt viscosities and lower

glass–transition temperatures than the corresponding polyimides.39

Polyisoimides are

formed from the corresponding polyamic acid using a dehydrating agent such as

trifluroacetic anhydride in conjunction with triethylamine, N,N’-dicyclohexylcarbo

diimide (DCC) and acetyl chloride.40

A polyisoimide can easily be converted to the

corresponding polyimide via thermal treatment at temperature >250 0C. Alternatively,

polyisoimides have been reacted with alcohol to produce polyamic ester, which could

then be thermally converted to polyimides.41

On treatment with amines, polyisoimides

likewise give polyamic amide quantitatively which can be converted to polyimides

thermally (Scheme 1.10).

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N

OH

O

O H

(C2H5)3N / (CF3CO)2O

or DCC

O

O

N

N

O

O

O

N

O

ROH

O

O

OR

N

H

N

O

O

O

N

O

R2NH

N

NR2

O

O H

N

O

O

heating

heating

heating

Scheme 1.10: Polyimides via polyisoimide precursors

1.2.1.5 Polyimides from diester-acids and diamines (ester-acid routes)

Synthesizing polyimides via the ester-acid route involves derivatizing the anhydrides to

ester-acid and subsequently allowing diamines to react which yields the desired polyamic

acid and polyimides.42

In the initial stage of esterification, the dianhydride is simply

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refluxed with excess of alcohol. Once the excess alcohol has been evaporated, the

resulting diester diacid is then reacted in solution with the suitable diamine to form a

polyamic acid. The polyimide is obtained by thermal or high temperature solution

imidization. Johnston et al. discovered that the anhydride functional group was formed at

elevated temperatures in situ from the ortho ester acid.43,44

The anhydride then reacts with

the diamine to yield a polyamic acid.

1.2.1.6 Polyimides from tetracarboxylic acids and diamines

The aromatic tetracarboxylic acids and aliphatic diamines combine to form salts, similar

to the synthesis of nylon via nylon salts. The salts are thermally imidized under high

pressure at temperature above 200 0C to form polyimides (Scheme 1.11). It should be

pointed out that the intermediate polyamic acids are not detected during the

polycondensation stage. Rather, it appears that the imidization and formation of polyamic

acid take place at the same time. This means that the imidization rate is very fast.45

HO2C CO2H

CO2RRO2C

+ H2N (CH2)x NH2

R= H, CH3

CO2

CO2RRO2C

O2C+ H3N (CH2)x NH3

NN (CH2)x

n

+ H2O + R OH

O

O

O

O

Scheme 1. 11: Polyimides from tetracarboxylic acids and diamines

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1.2.1.7 Polyimides from dianhydrides and diisocyanates

The reaction of aromatic diisocyanate with dianhydride has been utilized to synthesize

polyimides46 - 49

(Scheme 1.12).

O

O Ar

O

O

O

O

+ O C N Ar N C O-CO2

N Ar N Ar

O O

OO

Scheme 1.12: Polyimides from dianhydrides and diisocyanates

O O

O

O

O

O

+ COCN

H

H

NCO

heat

N

O N

O

C

O

O

O

O

O

O

H

H nheat

NN

O

O

O

O

C

H

H n

+ 2nCO2

PMDA methylenediphenyl diisocyanate

polyimide

Scheme 1.13:Proposed route to polyimides from dianhydride and

diisocyanate via seven-membered rings

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The reaction takes different pathways depending on the conditions. In the absence

of catalyst the reaction has been claimed to proceed through a seven membered

polycyclic intermediate that finally gives rise to polyimides with separation of carbon

dioxide (Scheme 1.13). Spectroscopic evidence of the seven-membered rings has been

found in the preparation of polyimides from pyromellitic dianhydride and

methylenediphenyldiisocyanate.48

On the other hand polyimides of very high molecular

weight have not been reported by this method. The mechanism is different when the

catalysts accelerate the reaction. Catalytic quantity of water or alcohol facilitate imide

formation and intermediate ureas and carbamates seem to form, which then react with

anhydrides to yield polyimides.48-50

It was also reported that high molecular weight polyimides were obtained using

mixtures of anhydride and their corresponding tetracarboxylic acids with diisocyanates in

the presence of tertiary amines.51

In Volksen’s review28

a mechanism has been proposed

to address the role of the hydrolyzed species (Scheme 1.14).

In the presence of water, the anhydride and isocyanate hydrolyse simultaneously

to dicarboxylic and carbamic acids, respectively (reaction 1 and 2). Some of the carbamic

acid reacts with isocyanate to form urea (reaction 3). It has been suggested that the urea is

capable of reacting slowly with anhydride to form imide, so the presence of urea would

not limit molecular weight. Additionally, either products of the hydrolysis, carbamic acid

or diacid, is capable of reacting to form a mixed carbamic carboxylic acid anhydride

(reaction 4 and 5 respectively). Subsequent heating causes the mixed anhydride to cyclize

into imide with the loss of carbon dioxide and water.

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OH2O OH

OH

(1)

N C OH2O

N C OH

H O (2)

N C OH

H O N C O

N C N

H O H(3)

N C OH

H O

+ O

OH

O C N

O

O O H

(4)

(5)

OH

OH

O

O

+ NCO

OH

O C N

O

O O H

O

O

O

OO

O

Scheme 1.14: Mechanism of formation of polyimides from dianhydride and

diisocyanate

1.2.1.8 Polymerization via nucleophilic aromatic substitution reactions

Aromatic nucleophilic substitution reaction of bishalo-and bisnitro– substituted aromatic

ketones and sulfones with bisphenolates can produce polyetherketones52

and

polyethersulfones53

respectively. Aromatic halo-and nitro-groups are also strongly

activated by imide groups toward nucleophilic aromatic substitution54

with anhydrous

bisphenol salt in polar approtic solvents. The polymer chain is generated by the formation

of successive aromatic ether bonds. The synthetic pathway is given in Scheme 1.15 a.

Halo- and nitro- substituted imides are more reactive than the corresponding sulfones and

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ketones. This is due to the fact that the imide ring is not only activated by the additional

carbonyl group, but the two carbonyl groups are locked in a coplanar conformation with

the phenyl ring, providing more effective resonance. Because of the favourable carbonyl

conformation, the Meisenheimer type of transition is stabilized by the effective

delocalization of the negative charge (Scheme 1.15 b).

N Ar N

X

+O Ar'

X

N Ar N

OO Ar'

+ X

(a)

Ar' O

X

N Ar

NX

OAr'

Ar NX

OAr'

Ar

(b)

O

X=NO2 or Cl

OO

O O

O

O O

O

O

O

O

O

O

O

Scheme 1.15: Mechanism of polymerization via nucleophilic aromatic substitution

reactions

Alternatively, ether-containing dianhydrides bis(etheranhydride)s are prepared by

a nitro substitution reaction, followed by hydrolysis of the product bis(etherimide)s

according to the Scheme 1.16.55

Unlike commercial dianhydride such as PMDA and

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BTDA, bis(etheranhydride)s possess moderate reactivity toward nucleophile because of

the electron-donating property of the ether groups. Bis(etheranhydride)s are hardly

affected by atmospheric moisture. The stability and solubility of bis(etheranhydride)s

provide significant advantages in the manufacturing operation.

R-NO Ar O

N R

OO Ar O

O

bis(etheranhydride)

bis(etherimide)

2 R-N

NO2

H2O

O

O

O

O

O

O

O

O

O

O

HO Ar OH

Scheme 1.16: Synthesis of bis(etheranhydride)s

1.2.1.9 Polymerization by transimidization reaction

High molecular weight poly(etherimide)s have been synthesized via one-step imide-

amine exchange reaction between bis(etherimide)s and diamines56

according to the

Scheme 1.17. The Scheme 1.17 eliminates the process of converting bis(etherimide)s to

bis(etheranhydride)s. When poly(etherimide)s are fusible the polymerization is

performed in the melt, allowing the monoamine to distill off. Bisimides derived from

heteroaromatic amines such as 2-aminopyridine are readily exchanged by common

aromatic diamines.57,58

High molecular weight poly(etherimide)s have been synthesized

from various N, N’-bis(heteroaryl)bisetherimides.

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RNO Ar O

NR + H2N Ar' NH2

NO Ar O

N Ar' + RNH2

O

O

O

O

O

OO

O

bis(etherimide)sdiamines

poly(etherimide)s

Scheme 1.17: Polymerization by transimidization

1.2.1.10 Other routes to polyimide formation

Many other polyimides preparation methods have been reported in addition to the above

mentioned routes. Due to the improved solubility and stability of derivatized PAAs, a

number of techniques have been developed to form alkyl esters,59

silyl esters60

and

ammonium salts61, 62

of PAAs, all of which can be thermally cyclized to form polyimides.

Polyimides can also be prepared by Diels-Alder and Michael cycloaddition reaction,

63

palladium64

and nickel65

catalyzed carbon-carbon coupling reactions.

1.3 COPOLYIMIDES

The most important copolyimides are poly(etherimide)s, poly(esterimide)s and

poly(amideimide)s. The most important methods for the preparation of copolyimides are

given here.

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1.3.1 Poly(etherimide)s

Poly(etherimide)s are a class of polymers containing ether and heterocyclic imide unit in

the polymer backbone. Such a structural modification leads to lower glass transition

temperature and crystalline melting temperature as well as significant improvement in

solubility and other characteristics without sacrificing thermal stability.

1.3.1.1 Synthesis of poly(etherimide)s

Poly(etherimide)s can be synthesized by i) Displacement polymerization method similar

to the method discussed in Section 1.2.1.8. ii) The cyclization polymerization method66

:

Ether containing diamine monomer is cyclized with dianhydride or ether containing

dianhydride is cyclized with diamines to form the imide ring. The cyclization process is

similar to the one described for polyimides. iii) Poly(etherimide)s can also be prepared by

transimidization reaction similar to the method discussed in Section 1.2.1.9.

1.3.2 Poly(esterimide)s

Poly(esterimide)s are the class of polymers containing ester and rigid heterocyclic imide

unit in the polymer backbone. The structural modification improves solubility

significantly and other characteristics without sacrificing thermal stability.

1.3.2.1 Synthesis of poly(esterimide)s

Poly(esterimide)s are usually synthesized by i) The imide forming reaction using ester

containing monomers 67

: Ester containing amine monomer is cyclized with anhydride to

form the imide ring. In another approach ester containing anhydride is cyclized with

diamine monomers to form the imide ring. The cyclization process is similar to the one

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described for polyimides. ii) Ester forming reaction using imide containing monomers68

:

Imide containing diacid monomers polymerized with diol monomers or the imide

containing diol monomers polymerized with diacid monomers or self condensation of

hydroxyl acid containing imide.

1.3.3 Poly(amideimide)s

Poly(amideimide)s are the class of polymers containing amide and heterocyclic imide

unit in the polymer backbone. Poly(amideimide)s combines the thermal stability property

of polyimides and the ease of processability of polyamides and are intermediate in

properties between polyimides and polyamides.

1.3.3.1 Synthesis of poly(amideimide)s

O

O

OXOC

+ H2N Ar NH2 N

O

O

Ar

HN-OC

-HX

-H2O

X= OH, Cl, etc

Scheme 1.18: Synthesis of poly(amideimide)s by amide-imide forming reaction

Poly(amideimide)s are usually synthesized by i) Amide-imide forming reaction69

:

An acid chloride such as trimellitic anhydride can be considered as an ideal monomer.

Both the carboxylic acid and anhydride groups can react with diamines to make up

poly(amideimide)s. The overall reaction is depicted in Scheme 1.18. ii) Imide forming

reaction using amide containing monomers70

: Amide containing diamine monomer is

cyclized with anhydride to form the imide ring. In another approach amide containing

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anhydride is cyclized with diamine monomers to form the imide ring. The cyclization

process is similar to the one described for polyimides. iii) Amide forming reaction using

imide containing monomers71

: Imide containing diacid is polymerized with diamine

monomers or the imide containing diamine is polymerized with diacid monomers

(Scheme 1.19). They have been also successfully synthesized by phosphorylation method

from diamines and diacids (Scheme 1.20).72

N

O

O

Ar N

O

OClOC COCl

+ H2N Ar' NH2

N

O

O

Ar N

CO-NHOC

O

OAr' NH

-HCl

Scheme 1.19: Synthesis of poly(amideimide)s by amide forming reaction

N

O

O

Ar N

O

OHOOC COOH

+ H2N Ar' NH2

TPP/NMP/PY/CaCl2

N

O

O

Ar N

CO-NHOC

O

OAr' NH

Scheme 1.20: Synthesis of poly(amideimide)s by phosphorylation method

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1.4 STRUCTURE PROPERTY RELATIONSHIP IN POLYIMIDES

1.4.1 Chain-chain interaction

It has been proposed that aromatic polyimide chains interact with each other via charge

transfer or electronic polarization mechanism.73

These electronic interactions affect the

neighbouring polymer molecule and influences the polyimides colour, glass transition

temperature, crystallinity, mechanical properties and chemical résistance. Research has

been directed towards elimination or lessening these interactions in order to improve the

thermoplastic flow and to increase solubility without sacrificing thermal stability.

1.4.2 Glass transition temperature (Tg)

The Tg of a polymer depends upon several factors. Increasing interchain interaction as

well as chain stiffness and crosslinking raises Tg values. The Tg values decrease as the

polymer goes from all para catenation to meta.74

This is due to the flexibility in the meta

catenation polymers. Higher dipolar bridging groups such as carbonyl, sulfonyl impart

higher Tg than do the groups such as oxy or methylene. By introducing kinks or bulky

substituent along the chain, the regularity of the chain is disrupted which results in

decreasing Tg value.75

1.4.3 Thermo-oxidative stability

Accordding to the rule of thermo-oxidative stabilities in the polyimides, if the

dianhydrides and diamines are in a higher oxidation state, polyimides should exhibit

better oxidation resistannce than the other polymers of similar molecular weight.

Common polyimides based on PMDA, BTDA, ODPA, and 6FDA have dianhydrides that

are in high oxidation states; then the thermo-oxidative instability in general must be

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related to the more oxidation susceptibility of the diamine derived units. In the process of

preparing polyimides one generally tries to maximize molecular weight by using exactly

the same number of moles of the dianhydride and diamine or else the stoichiometry will

be upset. High molecular weight species generally exhibit better thermo-oxidative

stability than their corresponding low molecular weight species.

1.4.4 Crystallinity

Crystallinity76

of polyimides depends on several factors such as regularity in the chain,

chain flexibility and rigidity of the chain. Presence of polar groups along the backbone

increases the inter chain interaction and the crystallinity.77

The presence of bulky pendant

groups prevents ordering of molecules and prevent the crystallinity.78

Crystallinity of

polyimides has direct bearing on their physical properties and applications as fibres or

plastics. Generally fibres possess high degree of crystallinity and tensile strength. Plastics

are amorphous and un-oriented.

1.4.5 Solubility

Systematic variations in the structure of polyimides have led to improved solubility.

Changlu Gao et al. reported79

soluble biphenyl-based polyimides from asymmetric

bis(chlorophthalimides). When compared with polyimides derived from symmetric 4,4’-

BCPIs and 3,3’-BCPIs, the polyimides derived from asymmetric 3,4-BCPIs showed

better solubility. Shuqing Wu et al.80

prepared polyimides with copolymerization of

bis(chlrophthalimide)s with 2,5 dichlorobenzophenone. The insertion of benzophenone

group into the polyimides increases the solubility. Any structural modification in the

polyimides which decreases the chain-chain interaction leads to increase in solubility.

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1.4.6 Dielectric constant

Linear aromatic polyimides which contain the hexafluoroisopropyl group have dielectric

constant lower than more conventional polyimides. More flexible meta-linked diamine

gives lower dielectric constant values than the corresponding para-linked system. This

may be related to free volume in the polymer, the meta-substituted systems have a higher

degree of entropy. The 6F based polyimides have the lowest overall dielectric constant

values which are lowered further when the 6F moiety is in both the dianhydride and the

diamine. Tomoko et al. 81

reported a dielectric constant of 2.40 at 10GHz for fluorinated

polyimides. The incorporation of fluorinated substituents into polymers reduces the

dielectric constant because of the mutual repulsion of the outermost shell electrons of

fluorine atoms and large free volume of trifluoromethyl groups resulting in low

intermolecular cohesive energy and low chain packing efficiency.

1.5 APPROACHES TO IMPROVE THE PROCESSABILITY OF POLYIMIDES

The fabrication process for a polymeric material requires that the polymers be either

soluble in organic solvents for a casting process or molten below their decomposition

temperature for a moulding extrusion process. However, aromatic polyimides are

insoluble and infusible and very difficult to fabricate into desired articles.82

Many

significant synthetic efforts have been made to improve the processability without

decreasing thermal stability. In order to increase the processability the main approach

used for structural modifications include:

(i) Incorporation of flexible linkages

(ii) Incorporation of Kinks in the polyimides chain

(iii) Incorporation of large non-polar and polar pendant groups

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(iv) Attachment of flexible side chain

(v) Soluble copolyimides derived from two dianhydrides or two diamines

1.5.1 Incorporation of flexible linkages

A common approach to increase the flexibility of the polymer chain is to introduce a

flexible unit into either a diamine or dianhydride monomers.83

Polyimides with aliphatic

linkages, such as those derived from MDA have lower thermal stability. To maintain

good thermal stability, it is common to use flexible units containing thermally stable

groups such as O, C=O, O=S=O, S and C(CF3)2.

N N O

O O

OO

n

N N

O

O

O

O

OO

n

ON

ON

O

O

O

O

H3C CH3

n

Kapton, Tg = 377' C

LaRC-TPI, Tg = 264' C

Ultem, Tg = 220' C

Figure 1.2: Example of some commercial polyimides

The incorporation of the 6F group into the polymer chain usually increases the

solubility, thermal stability, flame resistance and oxidation resistance, while decreasing

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the crystallinity.84

The high thermal stability of the 6F containing polyimides is due to

strong C-F bond. The Tg value decreases with increasing number of flexible groups in

the polyimide chain and the solubility also increases (Figure 1.2). Comparing with the

polyimide derived from PMDA and p-phenylenediamine, the commercially available

polyimides kapton, laRC-TPI and ultem have much lower Tg’s value.

1.5.2 Incorporation of kinks in the polyimides chain

The solubility of the polyimides can be increased by the incorporation of a kink in the

polyimides backbone through ortho or meta catenation. Para catenation results in the

least soluble polyimides because of linearity. The ortho catenation polyimide is more

soluble than the meta catenation polyimides.85 Polyimides derived from m-

phenylenediamine are generally more soluble than the polyimides derived from p-

phenylenediamine. Comparing the polyimdes derived from 3,3’,4.4’-bipheny

tetracarboxylivc anhydride with the polyimides derived from its isomer 2,2’,3,3’

biphenyltetracarboxylic dianhydride, the latter is more soluble due to non-planar

structure86

(Figure 1.3).

O O

O

O

O

O

biphenyl- 3,3', 4,4'- tetracarboxylic dianhydride

O

OO

O

O

O

biphenyl- 2,2', 3,3'- tetracarboxylic dianhydride

Figure 1.3: Rigid and kinked dianhydride (BPDA)

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1.5.3 Incorporation of large non-polar and polar pendant groups

Polyimides solubility can be increased by the introduction of large non-polar and polar

pendant groups along the backbone. The polar groups increase the affinity between the

polymer and the solvent and hence the solubility increases. Polyimides which contain

benzamide groups have been prepared. 87

The polyimides with benzamide groups showed

more solubility than the corresponding unsubstitted polyimides (Figure 1.4).

N N

O

O

O

O R

R= H

R=NHCOPh

Figure 1.4: Polyimides derived from PMDA and diphenylamine

The increase in solubility depends upon the nature of non-polar pendant groups.

The polyimides (Figure 1.5) derived from PMDA and m-phenylenediamine is an

insoluble material. However once the isopropyl group is introduced the resulting

polyimides is soluble in DMF, with the introduction of large anthracene as a pendant

group, the polyimides become more soluble in DMF, NMP, DMAc, DMSO etc.88

N N

O

O O

O

R

R= CH(CH3)2

R=

R= H

Figure 1.5: Polyimides derived from PMDA and m-phenylenediamine

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1.5.4 Incorporation of twisted biphenyl structure

A series of twisted diamines 2,2’-disubstituted -4,4’diaminophenyl (Figure 1.6) such as

2,2’-bis(trifluoromethyl)-4,4’diaminophenyl,89

and 2,2’-dimethyl-4,4’diaminophenyls90

have been synthesized to produce high strength polyimides.

H2N NH2

R

R

R = -CF3

R = -CH3

Figure 1.6: 2, 2’-disubstituted -4.4’-diaminobiphenyls

The substituted group at the 2,2’-position of biphenyl sterically forces the two

aromatic rings into a non-planar conformation. Such non-planarity causes a decrease in

the polymers crystallinity which leads to enhanced solubility, while the high temperature

properties associated with rigid-rod polyimides remain.

Several twisted dianhydrides, containing twisted biphenyltetracarboxylic

dianhydride structure have been developed91

(Figure 1.7). The polyimides obtained from

a twisted dianhydrides and some of the twisted diamines contain segmental rigid-rod

structure while being soluble in common organic solvents like acetone and THF.

R

RO

O

O

O

O

OR = Br

R = Ph

R = CF3

Figure 1.7:2, 2’-disubstituted-4, 4’, 5, 5’-biphenyltetracarboxylic dianhydrides

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1.5.5 Soluble copolyimides derived from two dianhydrides or two diamines

The copolymerization of two dianhydrides or diamines has been used to disrupt chain

symmetry and regularity and improve solubility. For example, polyimides derived from

PMDA and 4,4’-(dibenzeneamine)-9-fluorene completely insoluble and polyimides

derived from BPDA and 4,4’-(dibenzeneamine)-9-fluorene only soluble in 1,1,2,2-

tetrachloroethane. However, the copolyimides derived from PMDA, BPDA and 4,4’-

(dibenzeneamine)-9-fluorene prepared from a 50:50 ratio of each dianhydride is soluble

in amide solvents as well as 1,1,2,2-tetrachloroethane.92

1.5.6 Attachment of flexible side chain

Polyimides with flexible side chains are prepared and are exhibiting high solubility in

common organic solvents. Polyimides containing n-dodecyl side chains were prepared by

Schmidt and coworkers93,94

(Figure 1.8).

NN

R

R C12H25

C12H25C12H25

C12H25C12H25

C12H25

O

O O

O

Figure 1.8: Polyimides containing n-dodecyl side chains

The high molecular weight polymers had good solubility in common solvents.

However, the polymers exhibited a loss of weight at 380 0C due to the presence of

aliphatic moieties.

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1.6 APPLICATIONS OF POLYIMIDES

The list of applications of polyimides is unending and keeps growing with the increasing

demand of growing technologies. Polyimides are widely used in electrical, electronics,

automotive, semiconductor and aerospace industries. Polyimides are used in the form of

films, fibres, foams, plastics, adhesives and coatings.95

1.6.1 Films

Polyimides films are used as insulation in electrochemical items, cables, generators,

electric motors, for the parts operating at elevated temperatures. Polyimides film can

also be used as electrical insulation material for systems operating at lower temperatures.

Polyimides film considerably extends service life and ensures reliable protection in the

case of emergency overheating. Films based on fluorinated polyimides96

are promising

dielectrics; their dielectric constant is within 2.3-3.0 and moisture absorption within 0.50-

0.85 %. As the temperature is raised to 300 0C, the dielectric constant increases by not

more than 1.0-1.5 %. Fully fluorinated polyimides film exhibit high optical transparency

in the visible and UV ranges and used in optical telecommunication technology.

1.6.2 Fibres

Arimid T polypyromellitimide fibre is the most heat resistant synthetic fibre. Polyimides

fibres fully preserve the elasticity and strength at the liquid nitrogen temperature.

Polyimides fibres and fabrics completely restore elastic deformation at elevated

temperature. Combinations of unique properties allow the polyimides fibre to be used in

equipment operating for a long time at increased level of radiation and temperature.

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1.6.3 Foamed polyimide plastics

Foamed plastics have long been studied as materials for insulation of various apparatus,

devices, units etc.97,98

Polyimides attracted particular attention of researchers working on

development of protective structures for high-speed apparatus, primarily for air-and

spacecrafts. The main requirements to such protection are enhanced heat and fire

resistance, low density, and flexibility. Foamed materials are used for manufacturing

walls, floors, seats, ceilings, and other elements of not only air and space craft, but also

ships, submarine, high speed train and cars. In some cases, to enhance the rigidity and

impact strength foamed polyimides are formed in combination with reinforcing materials

such as fibre glass, fibrous carbon etc.

1.6.4 Polyimide membrane

Polyimide used as a membrane for separation of gases, vapors, and liquids99-104

.Their

high heat resistance allows separation of gases for long time at elevated temperature.

Polyimides membranes showed the best performance in separation of gas mixture

especially simple gases such as hydrogen, helium, carbon dioxide and some other gases

from petrochemical industry. Polyimide membrane used by Ube (Japan) for separation

and purification of hydrogen operate at 150 0C and a pressure of 15 MPa. Polyimides

membrane is used for production of ultra pure hydrogen widely used in semiconductor

industry, refining of some metals, and chemical reactions involving fine catalytic

processes. Another gas purified on polyimide membrane is helium. Helium is recovered

both from mixtures of natural gases and from artificial mixtures containing air and

industrial gases. Polyimide membrane is successful in recovery of CO2 from various gas

mixtures in gas and oil-refining industry.

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1.6.5 Plastic

Polyimides plastics105,106

are used in aerospace parts, such as tips of nose cones and front

edges of wings of space shutters, and part of gas pipes of rocket and aviation engines.

Thermoplastic polyimide Aurum was developed by Mitsui Tooatsu (Japan). It is stable

without weight loss up to approximately 500 0C, radiation resistant, and inert to acids,

oils, organic solvents, and other chemicals. It is used in the form of composite reinforced

with fibre glass or carbon fibres. Polyimide materials are suitable in engine construction

for carburetors, high-strength motor parts, reducers, and other parts. Carbon-reinforced

polyimides plastics materials are of particular interest for development of reliable

spacecraft and hypersonic aircraft.

1.6.6 Varnishes, adhesives and coatings

Polyimide adhesives are available as liquids or films. Polyimides are superior to most

other adhesive types with regard to long term strength retention at elevated

temperatures.107-111

Polyimide varnishes are successfully used both as solution and as

adhesives formulations, for preparing enameled copper, aluminium, and steel wires. This

is useful for multi-layered printed circuit boards due to the excellent adhesive properties,

good electrical properties and reliability under the hot / wet condition. Microelectronics

field requires readily soluble materials forming elastic, flexible, hydrophobic, low-

shrinking, and transparent coatings. These requirements are met by partially or fully

fluorinated polyimides. Along with fluorinated imides, siloxane–containing polyimides

are used as adhesives in electronics.

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1.7 OBJECTIVES OF THIS WORK

Polyimides are one of the most useful classes of high performance polymers.112-114

However, their applications are limited due to processing difficulties like insolubility in

common organic solvents and their extremely high softening or melting temperature,

because of the rigidity and strong inter chain interaction. So, polyimides can be

synthesized by structural modifications, that can be melt and / or solution processed. The

structural modifications that disturb the chain-chain interaction increase the solubility and

decrease the glass transition temperature and melting point. In recent years in the area of

polyimides synthesis efforts have been focused on the design and synthesis of

processable polymers with the purpose of increasing properties such as electrical

insulation, adhesion, gas permeability etc. These properties of the polymers depend to a

large extent on the monomers structure and hence the choice of monomers is of prime

importance in the design of novel polymers.

Research work has been directed to synthesize polymers with structural

modification, which disturb the regularity and chain packing thus providing better

processability. The prime objective of this research was to synthesize monomers

containing flexible groups (-O-, -SO2-, and -C=O), isopropylidene groups, pendant

groups and 1, 3-substituted phenyl ring. The structurally modified monomers were

polymerized into polyimides, poly(etherimide)s, poly(esterimide)s and

poly(amideimide)s and were characterized by IR, 1

H-NMR, X-ray diffraction,

thermogravimetry, differential scanning calorimetery, gel permeation chromatography,

solution viscosity and solubility behavior.

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With these above objectives the following problems were chosen for the present work.

1 To synthesize new aromatic diamine monomers containing flexible groups (-O-,

SO2-, and -C=O) and isopropylidene groups and to study the structure-property

relationship of polyimides derived from these diamine monomer.

2 To synthesize new bis(nitrophthalimide)s monomers containing ether, sulfonyl

and carbonyl groups and to study the effect of flexible groups (-O-, -SO2-, and -

C=O) on crystallinity, solubility and thermal properties of the poly(etherimide)s

derived from these bis(nitrophthalimide)s.

3 To synthesize AB type monomers and to develop poly(etherimide)s from these

AB monomers and to study the crystallinity, solubility and thermal properties of

the poly(etherimide)s.

4 To synthesize new imide containing aromatic diols monomers and to study the

effects of ether groups, isopropylidene groups and meta substituted phenyl rings

on the solubility, crystallinity and thermal properties of the poly(esterimide)s

derived from these diols monomer.

5 To synthesize novel diimide-diacids monomers containing ether and pendant

hexafluoroisopropylidine unit and to develop poly(amideimide)s. To study the

effect of flexible ether and pendant hexafluoroisopropylidine units on the

solubility, crystallinity and thermal properties of poly(amideimide)s.

6 To study the applications of selected polymers as insulation materials for high

temperature electrical insulation.