Characterisa*on setup for a novel CMOS TDI image sensor Centre for Electronic Imaging The Open University, Walton Hall, MK7 6AA hAp://www.open.ac.uk/cei [email protected] TesKng with LabVIEW Jade CMOS APS on demoboard The Design PCB layout design This PCB design has been inspired from a previous board that drives a CMOS sensor from Teledyne e2v (CIS 115). Summary A prototype CMOS image sensor (CIS) based on the Time Delay and IntegraKon (TDI) technique has been designed and manufactured by Teledyne e2v. Within the collaboraKon between Teledyne e2v and the Centre for Electronic Imaging (CEI), it has been necessary to create a setup in order to characterise the sensor. The project concentrates on the design and test of a Printed Circuit Board (PCB) that will accomplish the task of driving the image sensor. During the project period, it has been possible to manufacture the PCB. This gave the opportunity to ascertain the proper design of the board by driving it with a custom made LabVIEW soZware. The same PCB and soZware will be used in the future to conduct a full characterisaKon on the image sensor in order to verify its suitability for space applicaKons. SPIN Showcase The Imperial College London, United Kingdom 6 September 2017 Adriano Ferrucci under the supervision of KonstanKn D. Stefanov Centre for Electronic Imaging, The Open University, Walton Hall, Milton Keynes, MK7 6AA, UK The circuits employed to carry the input signals and supply voltages are: • Howland current pump, a simple current source generaKng bias current. • InstrumentaKon amplifier, amplifying the differenKal analogue outputs and filtering high frequency noise. • OperaKonal amplifiers driving several bias lines with capaciKve loads. This has been the task during which, sKll under DesignSpark PCB, the posiKon and organisaKon of all the components were established. It had to be done using the following rules: • Placing the components in a way that makes assembly and test easier (for example placing the test points and labels on the edges of the board). • Use as few as possible layers for the tracks, eventually using 4 layers. • Group as much as possible the components drawn together on the schemaKcs. • Miniaturise as much as possible the size of the board. • The board was assembled by hand in the CEI labs. In order to verify the correct operaKon of the PCB it has been necessary to test all voltages, clocks and biases. To do so, an improvement of an exisKng tesKng soZware under LabVIEW has been developed. All the biases, voltages and clocks have been tested. Time Delay and IntegraKon (TDI) TDI is a readout technique that allows image acquisiKon that is suitable for specific condiKons such as imaging of fast moving objects or in very low light condiKons. • This technique is based on the concept of accumulaKng different exposures of the same object, which is moving relaKve to the camera. It is made by shiZing the charge synchronously with the movement. • It allows large Signal to Noise RaKo (SNR) compared to a “single shot” capture. • It is the perfect technique for imaging of fast moving objects. • This procedure can naturally be done in CCDs as the modus operandi is by moving charges from row to row. • The sensor is basically a “CCD in a CMOS”, but the manufacturing technique is that of a CMOS image sensor. • TDI in CMOS has the advantage of beAer radiaKon hardness and lower power dissipaKon than CCDs. The whole SchemaKcs design has been carried out with DesignSpark PCB. The SchemaKcs is the design part that requires to be as clear and as coherent as possible. • New schemaKc components for were created, with all the corresponding pins and labels. • The circuits delivering the analogue input signals had to be displayed on the same sheet as the main component. These were the last tasks before handing the PCB and the soZware for a subsequent test of the image sensor. Picture of Pluto and Charon obtained by TDI imaging (from New Horizons mission, NASA)

Characterisa*on setup for a novel CMOS TDI image sensor · A prototype CMOS image sensor (CIS) based on the Time Delay and IntegraKon (TDI) technique has been designed and manufactured

Download PDF Report

Upload
others
View
5
Download
0

Embed Size (px)

Citation preview

Characterisa*onsetupforanovelCMOSTDIimagesensor

CentreforElectronicImagingTheOpenUniversity,WaltonHall,MK76AAhAp://www.open.ac.uk/[email protected]

TesKngwithLabVIEW

JadeCMOSAPSondemoboard

TheDesign

PCBlayoutdesign

ThisPCBdesignhasbeeninspiredfromapreviousboardthatdrivesaCMOSsensorfromTeledynee2v(CIS115).

SummaryAprototypeCMOSimagesensor(CIS)basedontheTimeDelayandIntegraKon(TDI)techniquehasbeendesignedandmanufacturedbyTeledynee2v.WithinthecollaboraKonbetweenTeledynee2vandtheCentreforElectronicImaging(CEI),ithasbeennecessarytocreateasetupinordertocharacterisethesensor.TheprojectconcentratesonthedesignandtestofaPrintedCircuitBoard(PCB)thatwillaccomplishthetaskofdrivingtheimagesensor.Duringtheprojectperiod,ithasbeenpossible tomanufacture thePCB. This gave theopportunity to ascertain theproperdesignof theboardbydriving itwith a custommade LabVIEWsoZware.ThesamePCBandsoZwarewillbeusedinthefuturetoconductafullcharacterisaKonontheimagesensorinordertoverifyitssuitabilityforspaceapplicaKons.

SPINShowcaseTheImperialCollegeLondon,UnitedKingdom6September2017

AdrianoFerrucciunderthesupervisionofKonstanKnD.Stefanov

CentreforElectronicImaging,TheOpenUniversity,WaltonHall,MiltonKeynes,MK76AA,UK

Thecircuitsemployedtocarrytheinputsignalsandsupplyvoltagesare:

•  Howlandcurrentpump,asimplecurrentsourcegeneraKngbiascurrent.

•  InstrumentaKonamplifier,amplifyingthedifferenKalanalogueoutputsandfilteringhighfrequencynoise.

•  OperaKonalamplifiersdrivingseveralbiaslineswithcapaciKveloads.

This has been the task during which, sKll under DesignSpark PCB, the posiKon andorganisaKonofallthecomponentswereestablished.

It had to be done using thefollowingrules:

•  Placing the components in awaythatmakesassemblyandtest easier (for exampleplacing the test points andlabels on the edges of theboard).

•  Use as fewas possible layersfor the tracks, eventuallyusing4layers.

•  Group as much as possiblethe components drawntogetherontheschemaKcs.

•  Miniaturise as much aspossiblethesizeoftheboard.

•  The boardwas assembled byhandintheCEIlabs.

In order to verify the correctoperaKon of the PCB it hasbeen necessary to test allvoltages,clocksandbiases.

To do so, an improvement ofan exisKng tesKng soZwareunder LabVIEW has beendeveloped.

All the biases, voltages andclockshavebeentested.

TimeDelayandIntegraKon(TDI)TDI is a readout technique that allows image acquisiKon that is suitable for specificcondiKonssuchasimagingoffastmovingobjectsorinverylowlightcondiKons.•  This technique is based on the concept of accumulaKng different exposures of the

sameobject,whichismovingrelaKvetothecamera.ItismadebyshiZingthechargesynchronouslywiththemovement.

•  ItallowslargeSignaltoNoiseRaKo (SNR) compared to a“singleshot”capture.

•  It istheperfecttechniqueforimaging of fast movingobjects.

•  This procedure can naturallybedoneinCCDsasthemodusoperandiisbymovingchargesfromrowtorow.

•  Thesensorisbasicallya“CCDi n a CMOS ” , b u t t h emanufacturing technique isthatofaCMOSimagesensor.

•  TD I i n CMOS h a s t h eadvantageofbeAer radiaKonhardness and lower powerdissipaKonthanCCDs.

The whole SchemaKcs design hasbeen carried out with DesignSparkPCB.

The SchemaKcs is the design partthat requires to be as clear and ascoherentaspossible.

•  New schemaKc components forwere created, with all thecorrespondingpinsandlabels.

•  The circuits delivering theanalogueinputsignalshadtobedisplayed on the same sheet asthemaincomponent.

ThesewerethelasttasksbeforehandingthePCBandthesoZwareforasubsequenttestoftheimagesensor.

Picture of Pluto and Charon obtained by TDI imaging (from New Horizons mission, NASA)