ASE Confidential / Security-C ASE Confidential / Security-C
Co-Design for High Density SiP Module
Miniaturized Products Corp. R&D ASE Nov 11th, 2015
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ASE Confidential / Security-C
Outline
Market Opportunities and Trend
High Density Heterogeneous Integration Examples
Co-Design Capabilities
Conclusion
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5G
SiP Module Growing Opportunities
2
Wearable SiP/Module Smartphone SiP/Module
WWAN/WLAN SiP/Module IOT SiP/Module
Processor:
AP, MCP,
BB,
Data Center
http://www.google.com.tw/url?url=http://www.kpcb.com/blog/how-kleiner-perkins-invests-in-the-internet-of-things-picking-the-winners&rct=j&frm=1&q=&esrc=s&sa=U&ei=MCPkVJ6dKI3Z8gX0tYDoDA&ved=0CBsQ9QEwAw&sig2=RY5aDo-zAWpfG-hvjBH_XA&usg=AFQjCNH0J3gk-oU5qhY0utPjeqsoiUKvMwhttp://www.google.com.tw/url?url=http://www.fandroides.com/devuelve-el-lte-a-tu-nexus-4-con-android-5-0-lollipop/&rct=j&frm=1&q=&esrc=s&sa=U&ei=bCPkVPeSNoKi8AWj7YDgDA&ved=0CCEQ9QEwBg&sig2=O7LYWnqyWeR0XSJMsfL15A&usg=AFQjCNEaPbHWlsx4VjW_YAVIW1Om7XeFuQhttp://www.google.com.tw/url?url=http://www.padgadget.com/2014/07/08/ipads-could-face-downturn-as-attention-shifts-to-wearable-devices/&rct=j&frm=1&q=&esrc=s&sa=U&ei=5CPkVKi_N4nz8gWRgIHgDA&ved=0CCEQ9QEwBjgo&sig2=pvCdYCwUhDlhzz0Ig5peXg&usg=AFQjCNHGDce0o0WAQ1JzHa2rUpSTCzEhUQ
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Complexity of Heterogeneous SiP Module
Package
System/
Sub-system
Component
Optical
Sensor
RF/FEM
Connectivity
WWAN
Storage
Power
Component Count: 10 100 200 500
3
http://www.google.com.tw/url?url=http://en.wikipedia.org/wiki/Apple_S1&rct=j&frm=1&q=&esrc=s&sa=U&ei=ZhbjVJLbOs738QWXr4DwDw&ved=0CBUQ9QEwAA&sig2=p-d_wrzFXscPOToGDB2MHA&usg=AFQjCNESk3UG6md75JrM8etlFHrVTR1oyw
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Wireless AP
Module
WWAN/WiFi/BT
Modem Module
WWAN/WiFi/BT
RF and FE
4G/Connectivity/5G SiP Module Trend
http://www.google.com.tw/url?url=http://en.wikipedia.org/wiki/Apple_S1&rct=j&frm=1&q=&esrc=s&sa=U&ei=ZhbjVJLbOs738QWXr4DwDw&ved=0CBUQ9QEwAA&sig2=p-d_wrzFXscPOToGDB2MHA&usg=AFQjCNESk3UG6md75JrM8etlFHrVTR1oyw
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Trend and Examples
5
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RF/FEM Cu Pillar FC (irregular) Conformal/Compartment Shielding Embedded substrate
Sensor Non-standard form factor Extended BOM HD SMT, molding, shielding
Storage Die & package stacking Double-side Molding Low Frq. Conformal Shielding
MPU/MCU 2.5D Organic/Si/Glass Interposer 3D TSV Die Stack HB PoP
Wireless Connectivity EMI Shielding Embedded substrate Double-side Molding Antenna on Package
MEMS Embedded Substrate Wafer Level MEMS
Power Management Embedded substrate Low Frq. Conformal Shielding Thermal mgmt.
DC/DC PMIC
Open cavity mold Combo sensor
Combo WiFi, BT, GPS, FM Low Power Wireless
Integration / Miniaturization Optimization / Simplification
FEM PAM Tx/Rx
Camera Module Biometric Sensor
Component Flash Micro SSD High BW PoP 2.5D/3D TSV
SiP Opportunities for Smartphone
ASE Confidential
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SiP Opportunities for Wearable
ASE Confidential
RF Shielding Conformal Shielding
Compartment Shielding
Antenna on Package Stamping Antenna (5GHz) Simulation, Design and Validation
Embedded SBS Embedded Passive SBS Embedded Active SBS
-aEASi -SESUB
Double-Side Structure Solder Frame Board
Double-Side & Exposed Molding HDSMT
Multi-Sensor Integration
MCU+ RF+ Sensors ARM(M0~M4), Firmware/Algorithm
Motion (Accelerator, Gyro.) Physiological Sign (HRM, ECG, SpO2..) Environment (O2, CO, CO2, Security)
Multi-Sensor Embedded SiP
(Chips on Board)
Advanced SiP solutions technology by integrating ASE group capability
7
Reduce X Y dimension
Reduce dimension and lower thickness
WiFi
Flash
MEMS
Optical Power
Antenna
MCU
GPS
BLE
Saving space
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Miniaturization Trend
Million units shipment proven record to global leading accounts with
state-of-the-art miniaturization technology into LTE module
1st gen. LTE 2nd gen. LTE 3rd gen LTE
Mass Production 2014 Jun 2015 Aug 2016
Dim: X-Y (mm) 23x26 20x21.1 15x15
Dim: Z (mm) 1.95 1.5 2.1
Component Count 372 273 218
Miniaturize
Technology
5mil HD SMT, molding with compartment
shielding
WLCSP chipset,
5mil HD SMT,
BT Substrate, metal Lid
Solder Bumping chipset ,
Memory die stacking,
wire bond,
double side 4mil HD SMT
0402
DDR Die
SF Die
Inductor
Xtal TCXO
0201
0201
ALT6401 Bumped Die
ALT1160 Bumped Die
RF
Front End
component
SUS
52% Area Reduction
30 % Area Reduction
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ASE Confidential / Security-C
LTE Dual-Band Module Dimension
PMIC
Baseband
RF
25.9 mm
22
.4 m
m
Dual-Band LTE Data Modem.
25.9x22.4x1.85(mm).
High-Density SMT.
CPS Molding.
ALT-3100 inductor
t mm
1.2mm
0.05mm
0.07mm
FR4,6L
2-2-2(W)
0.63
Component (mm) 1.2
Solder Past (mm) 0.07
Molding (mm) 0.05
H (mm) 1.9
t (mm)
6LItem
Molding
H mm
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RF
BB BB
Compartmental Shielding & Molding
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WLCSP in LTE Modem SiP Module 20.7mm
21.8
mm
18.80.1mm
27.6
0.1
mm
Top View
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WLCSP for Dimension Reduction
SQN3221 1.0 mm
0.15 mm
PA
Shielding case
LPDDR
Cap PA
0.3 mm
0.1 mm
Total Height = 1.55 mm (Max.)
20.7mm
21
.8m
m
Shielding Can = 0.1mm
Clearance = 0.15mm
Component + Soldering = 1.0 mm
PCB = 0.3 mm
----------------------------------------------------------------
Total Height = 1.55 mm (Max.)
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Comparison of Two SiP Module Structure: Single Side vs. Double Side
Lower Cost Lower Cost
Side View
Placement
Baseband
PA
LPDDR Cap
PA
0402
DDR Die SF Die
Inductor Xtal TCXO
0201
0201 RF Bumped Die
BB Bumped Die
RF
Front End
component SUS
Single Side HD SMT Double Side HD SMT
Low Z-height Smallest X-Y Lower Cost Lower Cost
Structure
Advantage
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A Proposed IoT Module Architecture w/ Double Side
Item Height (mm)
Die Bond + Wire Bond Stacking Die 0.2
Clearance 0.1
T1 (Bottom Side Height) Ball 0.43
T2 (SUS_M) BT, 8L,
anylayer 0.435(MAX)
TOP Side Component 0.9
space between component
& shielding 0.1
Shielding can thickness 0.15
H 2.015 mm
Extreme small in X-Y
Consistent Baseband
Flexible on RF variants
14 14
T2 mm
T1 mm
1.15mm H mm
0402
DDR Die
SF Die
Inductor Xtal TCXO
0201
0201 RF Bumped Die
BB Bumped Die
RF
Front End
component
SUS
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Heterogeneous SiP Module Co-design Capability
15
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EE/RF Design Services
Schematics Design
Platform Evaluation
Circuit design
Component selection
Power consumption
Substrate Layout
Dimension evaluation
Placement
PCB stack-up
Trace Routing
DFM
Simulation
PI
SI
Thermal
Warpage
Circuit & SiP Level Simulation, behavior prediction
System Validation
EVB design
Fixture design
Signal quality
Power rail
RF calibration & Test, compensate component/substrate variety
Pre-Certification
Program manag
