Co-Design for High Density SiP Module - - Chang.pdf · Co-Design for High Density SiP Module Miniaturized

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  • ASE Confidential / Security-C ASE Confidential / Security-C

    Co-Design for High Density SiP Module

    Miniaturized Products Corp. R&D ASE Nov 11th, 2015

  • ASE Group. All rights reserved.

    ASE Confidential / Security-C

    Outline

    Market Opportunities and Trend

    High Density Heterogeneous Integration Examples

    Co-Design Capabilities

    Conclusion

  • ASE Group. All rights reserved.

    ASE Confidential / Security-C

    5G

    SiP Module Growing Opportunities

    2

    Wearable SiP/Module Smartphone SiP/Module

    WWAN/WLAN SiP/Module IOT SiP/Module

    Processor:

    AP, MCP,

    BB,

    Data Center

    http://www.google.com.tw/url?url=http://www.kpcb.com/blog/how-kleiner-perkins-invests-in-the-internet-of-things-picking-the-winners&rct=j&frm=1&q=&esrc=s&sa=U&ei=MCPkVJ6dKI3Z8gX0tYDoDA&ved=0CBsQ9QEwAw&sig2=RY5aDo-zAWpfG-hvjBH_XA&usg=AFQjCNH0J3gk-oU5qhY0utPjeqsoiUKvMwhttp://www.google.com.tw/url?url=http://www.fandroides.com/devuelve-el-lte-a-tu-nexus-4-con-android-5-0-lollipop/&rct=j&frm=1&q=&esrc=s&sa=U&ei=bCPkVPeSNoKi8AWj7YDgDA&ved=0CCEQ9QEwBg&sig2=O7LYWnqyWeR0XSJMsfL15A&usg=AFQjCNEaPbHWlsx4VjW_YAVIW1Om7XeFuQhttp://www.google.com.tw/url?url=http://www.padgadget.com/2014/07/08/ipads-could-face-downturn-as-attention-shifts-to-wearable-devices/&rct=j&frm=1&q=&esrc=s&sa=U&ei=5CPkVKi_N4nz8gWRgIHgDA&ved=0CCEQ9QEwBjgo&sig2=pvCdYCwUhDlhzz0Ig5peXg&usg=AFQjCNHGDce0o0WAQ1JzHa2rUpSTCzEhUQ

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    ASE Confidential / Security-C

    Complexity of Heterogeneous SiP Module

    Package

    System/

    Sub-system

    Component

    Optical

    Sensor

    RF/FEM

    Connectivity

    WWAN

    Storage

    Power

    Component Count: 10 100 200 500

    3

    http://www.google.com.tw/url?url=http://en.wikipedia.org/wiki/Apple_S1&rct=j&frm=1&q=&esrc=s&sa=U&ei=ZhbjVJLbOs738QWXr4DwDw&ved=0CBUQ9QEwAA&sig2=p-d_wrzFXscPOToGDB2MHA&usg=AFQjCNESk3UG6md75JrM8etlFHrVTR1oyw

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    ASE Confidential / Security-C

    Wireless AP

    Module

    WWAN/WiFi/BT

    Modem Module

    WWAN/WiFi/BT

    RF and FE

    4G/Connectivity/5G SiP Module Trend

    http://www.google.com.tw/url?url=http://en.wikipedia.org/wiki/Apple_S1&rct=j&frm=1&q=&esrc=s&sa=U&ei=ZhbjVJLbOs738QWXr4DwDw&ved=0CBUQ9QEwAA&sig2=p-d_wrzFXscPOToGDB2MHA&usg=AFQjCNESk3UG6md75JrM8etlFHrVTR1oyw

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    ASE Confidential / Security-C

    Trend and Examples

    5

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    ASE Confidential / Security-C 6

    RF/FEM Cu Pillar FC (irregular) Conformal/Compartment Shielding Embedded substrate

    Sensor Non-standard form factor Extended BOM HD SMT, molding, shielding

    Storage Die & package stacking Double-side Molding Low Frq. Conformal Shielding

    MPU/MCU 2.5D Organic/Si/Glass Interposer 3D TSV Die Stack HB PoP

    Wireless Connectivity EMI Shielding Embedded substrate Double-side Molding Antenna on Package

    MEMS Embedded Substrate Wafer Level MEMS

    Power Management Embedded substrate Low Frq. Conformal Shielding Thermal mgmt.

    DC/DC PMIC

    Open cavity mold Combo sensor

    Combo WiFi, BT, GPS, FM Low Power Wireless

    Integration / Miniaturization Optimization / Simplification

    FEM PAM Tx/Rx

    Camera Module Biometric Sensor

    Component Flash Micro SSD High BW PoP 2.5D/3D TSV

    SiP Opportunities for Smartphone

    ASE Confidential

  • ASE Group. All rights reserved.

    ASE Confidential / Security-C

    SiP Opportunities for Wearable

    ASE Confidential

    RF Shielding Conformal Shielding

    Compartment Shielding

    Antenna on Package Stamping Antenna (5GHz) Simulation, Design and Validation

    Embedded SBS Embedded Passive SBS Embedded Active SBS

    -aEASi -SESUB

    Double-Side Structure Solder Frame Board

    Double-Side & Exposed Molding HDSMT

    Multi-Sensor Integration

    MCU+ RF+ Sensors ARM(M0~M4), Firmware/Algorithm

    Motion (Accelerator, Gyro.) Physiological Sign (HRM, ECG, SpO2..) Environment (O2, CO, CO2, Security)

    Multi-Sensor Embedded SiP

    (Chips on Board)

    Advanced SiP solutions technology by integrating ASE group capability

    7

    Reduce X Y dimension

    Reduce dimension and lower thickness

    WiFi

    Flash

    MEMS

    Optical Power

    Antenna

    MCU

    GPS

    BLE

    Saving space

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    ASE Confidential / Security-C

    Miniaturization Trend

    Million units shipment proven record to global leading accounts with

    state-of-the-art miniaturization technology into LTE module

    1st gen. LTE 2nd gen. LTE 3rd gen LTE

    Mass Production 2014 Jun 2015 Aug 2016

    Dim: X-Y (mm) 23x26 20x21.1 15x15

    Dim: Z (mm) 1.95 1.5 2.1

    Component Count 372 273 218

    Miniaturize

    Technology

    5mil HD SMT, molding with compartment

    shielding

    WLCSP chipset,

    5mil HD SMT,

    BT Substrate, metal Lid

    Solder Bumping chipset ,

    Memory die stacking,

    wire bond,

    double side 4mil HD SMT

    0402

    DDR Die

    SF Die

    Inductor

    Xtal TCXO

    0201

    0201

    ALT6401 Bumped Die

    ALT1160 Bumped Die

    RF

    Front End

    component

    SUS

    52% Area Reduction

    30 % Area Reduction

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    ASE Confidential / Security-C

    LTE Dual-Band Module Dimension

    PMIC

    Baseband

    RF

    25.9 mm

    22

    .4 m

    m

    Dual-Band LTE Data Modem.

    25.9x22.4x1.85(mm).

    High-Density SMT.

    CPS Molding.

    ALT-3100 inductor

    t mm

    1.2mm

    0.05mm

    0.07mm

    FR4,6L

    2-2-2(W)

    0.63

    Component (mm) 1.2

    Solder Past (mm) 0.07

    Molding (mm) 0.05

    H (mm) 1.9

    t (mm)

    6LItem

    Molding

    H mm

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    ASE Confidential / Security-C 10

    RF

    BB BB

    Compartmental Shielding & Molding

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    ASE Confidential / Security-C

    WLCSP in LTE Modem SiP Module 20.7mm

    21.8

    mm

    18.80.1mm

    27.6

    0.1

    mm

    Top View

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    ASE Confidential / Security-C

    WLCSP for Dimension Reduction

    SQN3221 1.0 mm

    0.15 mm

    PA

    Shielding case

    LPDDR

    Cap PA

    0.3 mm

    0.1 mm

    Total Height = 1.55 mm (Max.)

    20.7mm

    21

    .8m

    m

    Shielding Can = 0.1mm

    Clearance = 0.15mm

    Component + Soldering = 1.0 mm

    PCB = 0.3 mm

    ----------------------------------------------------------------

    Total Height = 1.55 mm (Max.)

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    ASE Confidential / Security-C

    Comparison of Two SiP Module Structure: Single Side vs. Double Side

    Lower Cost Lower Cost

    Side View

    Placement

    Baseband

    PA

    LPDDR Cap

    PA

    0402

    DDR Die SF Die

    Inductor Xtal TCXO

    0201

    0201 RF Bumped Die

    BB Bumped Die

    RF

    Front End

    component SUS

    Single Side HD SMT Double Side HD SMT

    Low Z-height Smallest X-Y Lower Cost Lower Cost

    Structure

    Advantage

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    ASE Confidential / Security-C

    A Proposed IoT Module Architecture w/ Double Side

    Item Height (mm)

    Die Bond + Wire Bond Stacking Die 0.2

    Clearance 0.1

    T1 (Bottom Side Height) Ball 0.43

    T2 (SUS_M) BT, 8L,

    anylayer 0.435(MAX)

    TOP Side Component 0.9

    space between component

    & shielding 0.1

    Shielding can thickness 0.15

    H 2.015 mm

    Extreme small in X-Y

    Consistent Baseband

    Flexible on RF variants

    14 14

    T2 mm

    T1 mm

    1.15mm H mm

    0402

    DDR Die

    SF Die

    Inductor Xtal TCXO

    0201

    0201 RF Bumped Die

    BB Bumped Die

    RF

    Front End

    component

    SUS

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    Heterogeneous SiP Module Co-design Capability

    15

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    EE/RF Design Services

    Schematics Design

    Platform Evaluation

    Circuit design

    Component selection

    Power consumption

    Substrate Layout

    Dimension evaluation

    Placement

    PCB stack-up

    Trace Routing

    DFM

    Simulation

    PI

    SI

    Thermal

    Warpage

    Circuit & SiP Level Simulation, behavior prediction

    System Validation

    EVB design

    Fixture design

    Signal quality

    Power rail

    RF calibration & Test, compensate component/substrate variety

    Pre-Certification

    Program manag