TE

ST

CA

PAB

ILIT

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Op cal Inspec on and external package analysis

Scanning Acous c Microscopy (CSAM)

Live‐Time X‐ray

Curve trace / Electrical characteriza on

Decapsula on: Jet‐etch and acid decapsula on

Wire bond pull tes ng

Ball shear tes ng

Die shear tes ng

Scanning Electron Microscopy (SEM)

Cross‐sec onal Analysis

Fourier Transform Interferometry (FTIR)

Materials Characteriza on:

Differen al Scanning Calorimetric (DSC)

Thermal Mechanical Analysis (TMA)

Dynamic Mechanical Analysis (DMA)

Thermal Gravimetric Analysis (TGA)

Thermal Conduc vity

Microtek Laboratories offers a wide range of Component Testing and inspection services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectan-cy and improve reliability, and increase perfor-mance on integrated circuits (ICs), printed cir-cuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.

Microtek Labs has an extensive array of equip-ment and technical experience to provide you with the tools and data necessary to overcome your shortfalls and failures. 

COMPONENT TESTING

Global Headquarters:

Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.

eMail: TechSupport@TheTestLab.com Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com

Global Leader in Test Technology and Expertise

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