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Company Profile of 2016Company Profile of 2016p y公司簡介
p y公司簡介
UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.U SO C C O OG S CO ,U SO C C O OG S CO ,
友順科技股份有限公司友順科技股份有限公司
U SO C C O OG S CO ,U SO C C O OG S CO ,
友順科技股份有限公司友順科技股份有限公司
http://www.unisonic.com.tw
Company Snapshotp y p
Founded: Jan 1990
T i i T i (HQ)
Global Operations:
Taipei, Taiwan (HQ)ChinaJapanJapanKorea
C it l US$ 10 illi (TWN)Capital : US$ 10 millions(TWN)
Employees: Headquarters: 230 persons,50 R&DEmployees: q pWorldwide: 2,200 persons, 200 R&D
2013 Revenue: US$ 256 Million2013 Revenue: US$ 256 Million
Milestone
1990 U i i T h l i C Ltd t bli h d1990 - Unisonic Technologies Co., Ltd was established.
1993 - Hong Kong Office : Union Win Enterprise Co., Ltd. was established.- Affiliated Company : YouWang Electronic Co., Ltd was established.Affiliated Company : YouWang Electronic Co., Ltd was established.
1995 - FuZhou Factory : FuShun Microelectronics Co., Ltd was established.
1996 D D F t A Sh Mi l t i C Ltd t bli h d1996 - DanDong Factory : AnShun Microelectronics Co., Ltd was established.
1999 - ShenZhen Branch : Unisonic Technologies Co., Ltd was established.- DaLian Branch : LianShun Electronics Co., Ltd was established.,
2000 - Korea Branch : Unisonic Technologies Co., Ltd was established
2001 - WuXi Branch : YouLi Electronics Co., Ltd was established.- FuZhou Factory : HeShun Microelectronics Co., Ltd was established.
2002 - XiaMen Branch : YuanShun Technologies Co., Ltd. Was established.2002 XiaMen Branch : YuanShun Technologies Co., Ltd. Was established.- UTC ISO9001:2000 Certification- Beijing Branch : LianShun Electronics Co., Ltd was established.
Milestone
2003 G Zh B h t bli h d2003 - GuangZhou Branch was established.
2004 - TienJing Branch : LianShun Electronics Co., Ltd was established.
2005 - SuZhou Branch, QingDao Branch was established.
2006 - FuShun Semiconductor Manufacturing, assembly line was established.
2007 - UTC ISO14001:2004 Certification.
2011 - XiaMen wafer fab put into pilot run.
2012 Xi M f f b t M P d ti2012 - XiaMen wafer fab put Mass Production.
2013 – WuXi & Shenzhen design center was established.
2014 – XIAn & ChengDu design center was established.
Corporate Structurep
DA LIAN BRANCH / R&D CENTER
DAN DONG FACTORY
BEIJINGBEIJING
QINGDAU
KOREA
WUXI
SUZHOU
.
CHENGDU
FU ZHOU FACTORYHE SHUN FACTORYFU SHUN SEMI MFG
JAY SHUN FACTORY
GUANGZHOU
JAY SHUN FACTORYYUAN SHUN BRANCHR&D CENTER
SHENZHEN
Organization Structure of UTC
Unisonic Technologies Co Ltd (TPE HQ)
O ga at o St uctu e o U C
Design
Unisonic Technologies Co., Ltd. (TPE HQ)
LianShun Electronics Co., Ltd. (DaLian)Design
YuanShun Technologies Co., Ltd. (XiaMen)
WuXi/Shenzhen/ChengDu/XiAn Design center.
UTC GWafer Fab
FuShun Microelectronics Co., Ltd. (FuZhou)
UTC Group JaySun Microelectronics Co., Ltd (XiaMen)
Packaging & Testing FuShun Semiconductor MFG Co., Ltd. (FuZhou)Testing
Marketing &
Unisonic Technologies Co., Ltd. (TPE HQ)
i i h l i C td (Sh h )Marketing &Sales Unisonic Technologies Co., Ltd. (ShenZhen)
Unisonic Technologies Co., Ltd. (QuanZhou)
OrganizationO ga at o
President Office CEO Business Operation Center
Wafer Business Wafer Business DivisionDivision
International International Business DivisionBusiness Division
Greater China Greater China DivisionDivision
General General ManagerManager
Marketing Korea Business
Sales Dept.1 R&D Finance
Engineering Oversea Dept.1
Sales Dept.2 TMD MIS
Oversea Dept. 2
Sales Dept.3 PC/MC QRA
DistyBusiness
Human Resource Marketing
RevenueRevenue
O ( O S S )##
##
## 256 682 261 816
301,088300,000
AM OU N T ( T H OU SAN D U SD )
##
225,225243,243
255,405 256,682 261,816
240,198
200,000
250,000
143,400 150,000
165,000150,150
180,180
150,000
200,000
50 000
100,000
0
50,000
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016(F)2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016(F)
Core CompetenciesCo e Co pete c es
IDM Provider
Competitive Hi h Q lit
Customer’sSatisfaction
pCost High Quality
Satisfaction
Short Lead-Time Strong R&D
Turn-Key SolutionSolution
R&D Center
Location: Location: Taipei Headquarters (UNISONIC TECHNOLOGIES CO., LTD.) Da-Lien Lien-Shun Electronics CO., LTD) W Xi Y Li Mi l t i CO LTD Wu-Xi Yu-Li Microelectronic CO., LTD Xia-Men Yuan-Shun Technologies CO., LTD
- Xia-Men Yuan-Shun Technologies CO., LTD- Xi-An Branch, Xia-Men Yuan-Shun Technologies CO., LTD- Cheng-Du Branch, Xia-Men Yuan-Shun Technologies CO., LTD
Staff: Staff: above 250 persons
Capability: Circuits Design(BCD/BiCMOS/CMOS/DMOS) Circuits Design(BCD/BiCMOS/CMOS/DMOS) Pattern Layout Process Development(CMOS 0.35um/Bipolar 0.8um…)
Wafer Fabs
Fu Zhou Factory- Fu Shun Microelectronics Co.,Ltd.- 4”/6” with CMOS/Bipolar/BiCMOS- 50,000 for 4”, 50,000 for 6”/max, , , /
Xia Men Factory- Jaysun Semiconductor Manufacturing CO., Ltd.6” CMOS/BiCMOS/DMOS- 6” CMOS/BiCMOS/DMOS
- 0.35um process0 000 f /- 50,000 wafers/max
Wafer Process RoadmapWafer Process Roadmap
Discrete TR
SS
SS Bipolar IC
OC
ESO
CES BiCMOS
BCD
PRO
PRO
CMOS
2um 1.2um 1.0um 0.8um 0.5um 0.35um 0.25um
IC Packagingg g
FuZhou Factory:- Fushun Semiconductor Manufacturing Co LtdFushun Semiconductor Manufacturing Co., Ltd.- 300M units produced per month
CP/Assembly/Final Test- CP/Assembly/Final Test- THD/Leaded SMD/Leadless packages
Process:- Process:* Die attach: Epoxy/Eutectic/Solder
* Wire Bonding: Au/Cu/Al/Ag wire* Wire Bonding: Au/Cu/Al/Ag wire* Halogen free* ISO9000/ISO14000 C tifi ti* ISO9000/ISO14000 Certification.
Package Portfoliog
Through Through Hole Hole
DIP SDIP H/SIP
TO-3PxHole Hole Device Device ZIP
TO-220-x
O 26/S
TO-230
TO-202
TO-220FxTO-262
TO-247
TO-126C
SIP-3/SIP-4
SOP
TO-251
H/SSOP
TO-92 family
H/TSSOP
TO-126/S
age
Size
TO 202
MSOP
TO 126C
QFN
Surface Surface Mount Mount
TO-263
TO-252x
SOT-223 SON
Pack
aMSOP
SO 23SMB
SMC
TO-277A
ou ou DeviceDevice
Tiny DFNSOT-23/5/6
SOT-89
SOT-7x3SOT-5x3
VSOT
VSONSOT-3x3
WLCSP
SOD-523
SOD-323
SOD-123SMA
SMB
SOT-113/s
Thin/Shrink/Leadless
QRA SystemQ y
Quality Reliability & Assurance
Quality Control Quality Assurance
IQC OQCIPQC QS VQMQEIQC
▪ ISO system▪ RoHS▪ DCC
OQCIPQC QS VQMQE
▪ Reliability▪ FA▪ Calibration
▪ RMA▪ Supplier
management
▪ OQC- Visual
Mech
▪ In Process Control1st Shot
▪ Wafer▪ ICs
Visual ▪ DCC▪ Customer
Audit Support
▪ Self Audit
▪ Calibration▪ Correlation▪ Customer
Sample▪ SPC
management-Qualification-Audit
- Mech.- Electrical▪ SPC
- 1st Shot- Visual- Mech.- Electrical▪ Final QC
SPC & C k
- Visual- Mech.- Electrical▪ Taping▪ SPC
▪ SPC & Cpk
Quality Assurance FlowQ y
Customer Sales Dept. Planning Dept. R&D Dept. EngineeringDept.
Manufacturing Dept. QA Dept.
Needs Market Product Planning
Planning Stage
Design Stage
Product Planning Review
Determination of target specifications
Development Plan
Development Design
Prototype Manufacture
Stage
Design Review
Prototype Manufacture
Characteristics EvaluationReliability
Evaluation
Stage
Mass
Quality Certification
Design Verification
Order Reception
Sales Plan
Materials Purchasing
Production Plan
Shi i Pl
Material Incoming
Wafer ProcessMass Production
Stage
Shipping Plan Wafer Process
Assembly Process IPOC
Final InspectionQAT
OQC
Inventory
ShippingAcceptance by
customer
18Usage Stage
customer
Trouble
Response
Complaint Reception
Reception
Investigation, Analysis and Corrective Action
Reliability Capability
Test Item Test Condition Reference S S Criteria
y p y
Test Item Test Condition Reference S.S Criteria
Pre-ConditionBake 125oC / 24 hrsSoak 60oC/ 60% RH/ 40 hrsIR Reflow 3 cycles
J-STD-020 180 0-Acc1 Rejy
High Temp Storage Life Test (HSLT) 150oC , 168(500/1000) hrs JESD22-A103 45 0-Acc1 Rej
121oC RH: 100% 2 ATM 96 (168) 0 AccPressure Cooker Test (PCT) 121oC, RH: 100%, 2 ATM, 96 (168) hrs JESD22-A102 45 0-Acc
1 Rej
Temperature Cycle Test (TCT) -65oC ~150oC / 30min, 100(500/1000) cycles JESD22-A104 45 0-Acc
1 Rej
High Temp High Hum. Storage Test (HTHH)
85oC, 85% RH,168(500 /1000) hrs JESD22-A101 45 0-Acc
1 Rej
0 AccSoldering Heat Test (SHT) 260±5oC, 10 sec JESD22-B10 45 0-Acc1 Rej
Solderability Test (SOT) 245±5oC, 5±0.5 sec JESD22-B102 10 0-Acc1 Rej
Electrostatic Discharge Test (ESD) HBM Mode≧ 2000 VMM Mode≧ 200 V
JESD22-A115JESD22-A114 3 0-Acc
1 Rej
Reliability Capability y p y
Test Item Test Condition Reference S.S Criteria
For IC -High Temp Operation Life Test (HTOL)
VCC(Max) x 1.1Temperature:85 or 125oC 168 (500/1000) h
JESD22-A108 22 0-Acc1 RejHigh Temp Operation Life Test (HTOL) (500/1000) hrs 1 Rej
For MOSFET / HV BJT -High Temperature Reverse Bias
BV(Max) x 80%Temperature:125oC JESD22-A108 45 0-Acc
1 Rejg p(HTRB)
p168 (500/1000) hrs 1 Rej
For TR or MOSFET -i i i
85oC, 85% RH,( ) % ( ) 0-AccHigh Temp High Hum. Reverse Bias
Test (H3TRB)BV(Max) x 80% (Max 100V)168 (500 /1000) hrs
JESD22-A101 45 0 Acc1 Rej
Product Tree
i IC
IGBT MOSFETPWM
C t llLow-Dropout
R l t
Discrete IC
IGBT
BJT
MOSFET
JFET
Controller
DC/DC Converter
Regulator
Li-Battery ProtectionBJT
SCR
JFET
Diode
Converter
Power Factor Corrector
Protection
Reset / Supervisory IC
TRIAC TVS
Corrector
LED Driver
Supervisory IC
Voltage / CurrentControl
Hall Sensor Logic Family
Op Amp / Audio Amp Other (ASIC…)
Product - IC
Linear Regulator Low Dropout Linear Regulator
Power Management
High-Speed MOSFET Driver AC-DC/DC-DC LED Lighting Driver Low Dropout Linear Regulator
DDR Termination Regulator Shunt Reference Regulator Step Down DC-DC Converter and Controller
AC DC/DC DC LED Lighting Driver Supervisory Circuit Voltage Detection and System Reset IC Power Switch
Step-Up DC-DC Converter and Controller Voltage mode PWM Controller Current Mode PWM Controller Green Mode PWM Controller (SSR/PSR)
Power Factor Control Li-Battery Protection or Charger IC FET Bias Controller Combo IC (CC+CV) Green Mode PWM Controller (SSR/PSR)
Green Mode PWM Power Switcher (SSR/PSR) FET Bias Controller
Combo IC (CC+CV) Inverting DC-DC Converter
Amplifier / Comparator
Audio Amplifier Audio Related Controller
Analog Switch
Video Signal Switch Analog Multiplexers, Demultiplexer IC
Operational Amplifier Voltage Comparator
g p p
Product - ICProduct IC
Motor Controller IC U74 HC/HCT Family
LogicSpecial Special Application ICIC
Interface and Driver Circuit Telecommunication Circuit Darlington Driver Melody IC
/ y U74 AC/ACT/AHC/AHCT Family U74 LV/LVC Family U74 AUP/AUC Familyy
Alarm /Sound Generator IC Timer IC Remote Controller IC Mouse & Keyboard Controller
U74 CBT/CBTLV Family High Voltage UCD40xx series
Mouse & Keyboard Controller Christmas Lamp Controller Television Circuit Leakage Current Detector
Hall IC
Unipolar Automotive IC A-D or D-A Converter Miscellaneous Radio and Cassette Recorder Circuit
Bipolar Omnipolar Linear Single/Two Phase Radio and Cassette Recorder Circuit Single/Two Phase
Product - DiscretesProduct Discretes
POWER MOSFET Combo Power MOSFET Planar Punch Through IGBT
IGBT
Trench: 12-100V Planar: 60-600V
Power MOSFET
Planar Punch Through IGBT Non-Punch Through IGBT(600V/1200V) Strobe Flash IGBT Trench PT IGBT
Trench: 10-200V Planar: 30-1000V
Super Junction Power MOSFET 500-1000V
Trench FS IGBT(600V/1200V)
Bipolar Transistor
TRANSISTOR
500 1000V
JFET JFET for Condenser MICp
Darlington Transistor Dual Chip Bipolar/Digital Transistor Built-in Bias Resistor Transistor Di it l T i t D i ti S t
JFET for General Purpose Application
Digital Transistors Designation System Complex Bipolar Transistor
Product - Discretes
MOS Gated Barrier Rectifier (MGBR)
DIODEDIODE TVSTVS
Transient Voltage Suppressors MOS Gated Barrier Rectifier (MGBR) Trench MOS Schottky (TGBR) Schottky Diode Bridge Diode
Transient Voltage Suppressors TVS-ESD Protection
Rectifier (SuperFast/UltraFast/HyperFast/Fast/ General/Glass-passivated)
Zener Diode/ Dual Zener Diode
TRIAC/SCRTRIAC/SCR
TRIAC: 400V-900V SCR:40V-1000V
Small Signal Schottky Diode Small Signal Switching Diode Current Regulator Diode Varactor Diode
PhotocouplerPhotocoupler
SCR:40V 1000V
Varactor Diode Low-Input-Current Transistor-
Output Photocoupler
Certification Award - Customer
Sony PlayStation Sony PlayStation 2 100Million Units2 100Million Units
ADDA ADDA Supplier AwardSupplier Award
ADDAADDASupplier AwardSupplier Award
ASUS GreenASUS GreenManagementManagement
MTI BestMTI Best LG Green LG Green LINPOLINPOSupplier AwardSupplier Award ProgramProgramLongLong--term Supportterm Support
Philosophy and Visionp y
By the Philosophy,“Q lit Fi t d C t O i t ti “ “Quality First and Customer Orientation“ ,
our challenge is to become a leading semiconductor company recognized by peers, trusted by customers. We will devote ourselves to create popular products and services, accordingly contributing to a better global society.
K. H. KaoPresident & CEO