COMPREHENSIVE MATERIALS TESTING FOR MECHANICAL AND ... image/UMT UNMT-Micro Nano Scratch Nan… · COMPREHENSIVE MATERIALS TESTING FOR MECHANICAL AND TRIBOLOGICAL PROPERTIES On One

COMPREHENSIVE MATERIALS TESTING FOR MECHANICAL AND TRIBOLOGICAL PROPERTIES


On One Precision Platform with Easily-Interchangeable Modules

UNMT-1 UNIVERSAL NANO & MICRO TESTER

UMT-2 UNIVERSAL MICRO MATERIALS TESTER

UMT-3 UNIVERSAL MACRO MATERIALS TESTER



UMT Series TestersUMT Series TestersUMT Series TestersUMT Series Testers

Center for Tribology, Inc.CETRCETRCETRCETRWWW.CETR.COM

Lubrication Environmental

Wear

Micro/Nano Indentation Micro/Nano Scratch

Strain/Deformation

Friction

Multi-Axis Fatigue

WORLD LEADERS IN MATERIALS & TRIBOLOGY TEST INSTRUMENTATION

The Universal Nano+Micro+Macro Tester platform comes in three main configurations:

for comprehensive mechanical tests of thin

films and nano-structured materials, with a load range of 1 mN to 10 N,

for comprehensive mechanical tests of coatings and materials, with a load range of 1 mN to 200 N,

for comprehensive mechanical tests of lubricants, metal and ceramic materials, with a load range of 0.1 N to 1 kN.

UNMT-1

UMT-2

UMT-3

nano and micro

micro-

macro-

APPLICATIONSAPPLICATIONS

Automotive, Aerospace

Microelectronics

Electric Contacts

Metals, Ceramics

Bio Materials, Medical

MEMS, Optics

Flexible & Hard Media

Composite Materials

Lubricants, Additives

Thin Films, Coatings

Polymers, Elastomers

Paper, Fabric

UNIVERSAL NANO+MICRO+MACRO MATERIALS TESTER (UMT)

Parameters Monitored

Parameters Monitored

X,Y, Z Forces

X, Y, Z Torques

X, Y, Z, Q Positions

Wear Depth & Rate,Deformations

Acoustic Emission

Electrical Resistance

Electrical Capacitance

Temperature

Humidity

Optical Images, Digital Video

Data Acquisition

Data Acquisition

100 kHz Data Rate

16 Sensor Inputs

Horizontal & Vertical Rotation

X Y Translation

Thermal Control

Vacuum Chamber

Humidity Control

LowerSpecimen

LowerSpecimen

Fast Oscillations

Rotation

X Y Z Translation

UpperSpecimen

UpperSpecimen

16 Bit Resolution

HARDWAREHARDWARE

FRICTION

STRAIN

ENVIRONMENTAL

SCRATCH

INDENTATION

ADHESION

FATIGUE

LUBRICITY

FUNCTIONAL TESTINGFUNCTIONAL TESTING

SOFTWARESOFTWAREData Monitor

RecordingData Monitor

Recording

Real-Time Scope Mode

Programmable Filtering

Motion ControlMotion Control

SynchronizedMotions

Programmable Velocities & Positions

DataPresentation

Data Presentation

Data Analysis

Format Conversions

Data Statistics

Charts

Forces & Torques

adhesion rotary

delamination linear

hardness reciprocating

abrasive

young’s modulus fretting

storage modulus galling

hardness seizure

pull-up static

stiction dynamic

scratch stick-slip

multi-axis elasticity

tension plasticity

compression creep

torsion

hydrodynamics temperature

mixed humidity

boundary vacuum

gases

WEAR

Y

SCRATCH-RESISTANCESCRATCH-

HARDNESSADHESION

SCRATCH-SCRATCH-TOUGHNESS

ET

ST

S

Applications

Optical coatings

Semiconductor layers

Flat panel LCD and plazma displays

Wear-resistant coatings

Corrosion-resistant coatings

Decorative coatings and paints

Data storage media overcoats

Cutting tools coatings

Automotive varnishes and finishes

Pharma tablets and pills

Technical Highlights

Loading system:

Scratch tools:

Maximum normal load:

Normal load minimum resolution:

Multiple sensors:

Sample shapes:

Sample sizes:

Sample stages:

Multi-scratch:

uniquely precise active-feedback servo-control for normal force, maintained either constant or increasing (in steps or gradually)

Rockwell and Vickers indenters

Diamond stylus, 2-200 mm

Tungsten carbide, sapphire, steel balls,1.5-25 mm

Steel needles, 0.1-1 mm

Patented micro-blades, 0.4-1.0 mm

200N

1 mN

Acoustic emission:

Friction coefficient

Electrical contact or surface resistance:

Capacitance for depth monitoring

Digital optical microscope for micro-imaging:

CCD Camera:

Atomic force microscope for nano-imaging:

high-frequency up to 5.5 MHz

mOhms-MOhms

550X

video and still images

contact and semi/non-contact modes

any, including irregular

from microns up to 150 mm

linear or rotary,

Position resolution < 1 mm

automatic mode

UNMT-1 with optical microscope and AFM Patented micro-blade (left) and holder (right)

CENTER FOR TRIBOLOGY, INC. WWW.CETR.COM

CETRCETRCETRCETRUNIVERSAL MATERIALS TESTERS UNMT-1AND UMT-2

MICRO-SCRATCH MODULEQUANTITATIVE COATING ADHESION,

SCRATCH-RESISTANCE AND SCRATCH-HARDNESS

MICRO-SCRATCH APPLICATIONS

Z-carriage

Coating sample

Micro-blade holder

Strain-gauge sensor

Moving stage

Normal load

ECR

Diamond tip

Fx

Fz Linearly increasing load

Coating

Substrate

CoF = Fx/Fz

Scratch-Hardness Test

Scratch-hardness test is performed with diamond stylus per ASTM G171-03 , under precisely controlled constant load. The scratch hardness:

2HSp = k Fz / W*

Where k- constant; Fz - applied load; W - scratch width.

When k is unknown, the scratch hardness can be determined by comparison of the scratch width on the sample and on a reference material. AE sensor is used to monitor the high-frequency signal generated during scratching and indicating the intensity of material fracture. A polished fused quartz (with the hardness of 9.5 GPa) was used as the reference material for the scratch-hardness calculations. Examples of COF and AE data as a function of time for comparison of two materials are plotted below.

CETR, INC. 1715 DELL AVE, CAMPBELL, CA 95008 PHONE 408.376.4040 FAX 408.376.4050 [email protected]

Scratch-Adhesion Test

The technique involves generating a controlled scratch with a scratching tip under a precisely controlled progressive load. At a certain critical load the coating starts to fail. The critical loads are detected precisely with multiple sensors and then are used to quantify the adhesive properties of film-substrate combinations.

Below is an example for a thin DLC coating on a magnetic disk. The critical load of scratching was detected at 4 sec, when ER dropped and AE increased (though friction did not react due to its averaging nature). For about 30 sec ER continued to drop and AE continued to increase. Then at 34 sec the final critical load of coating breakthrough was detected when ER dropped to zero, AE peaked, COF stepped up.

COFER, kOhm

AE, voltFx, g

Fz, g

A digital micro-image of a thick polymer coating tested similarly (load increased from right to left) shows three areas of the test track divided by two critical loads: from deformation (on the r i g h t ) t o m i c r o -scratching (center) to delamination (on the left)

An example of scratch 3-D nano-imaging and width measurement with integrated AFM is shown below.

Reference

3-D nano-image of the scratch

CCC EEE TTT RRR

1715 Dell Avenue, Campbell, CA 95008

408/376-4040 408/376-4050, USA

Phone: Fax: Email: [email protected]

NANO ANALYSER

Center for Tribology, Inc. Center for Tribology, Inc.

LEADERS IN TRIBOLOGY TEST INSTRUMENTATION AND SERVICES

NANO-HARDNESS NANO-SCRATCHING


Non-destructive measurement of Young’s modulus for thin and ultra-thin films.

Nano-scratching at ultra-shallow depths.

Nano imaging of specimen for precise nano-positioning on its target area and nano-imaging of shallow nano-scratches.

After sample insertion, it takes order of magnitude less time for measurements than conventional nano-indenters.

Simultaneous nano-mapping of surfaces for nano- topography and nano-mechanical properties.

A NON DESTRUCTIVE TECHNIQUE TO EVALUATE YOUNG’S MODULUS OF THIN FILM

NANO- IMAGING

Nano Image comparing Young’s Modulus measurement results with different techniques

Indent afterplastic deformation

Destructive indents

Indent within Elastic Limit of material

Nano Analyser is a Fast and Robust Metrology Tool

METROLOGY FOR COMPREHENSIVE NANO-MECHANICAL EVALUATION OF THIN FILMS

Applications

Thin film coatings

MEMS, NEMS

Semiconductor wafers and devices

Data storage media

Metals, Ceramics, Polymers

Super Hard materials

Nanoanalyser Specifications

X-Y stage Micro-positioning

Max Travel: 75mm

Resolution: 0.5µm

X-Y stage Nano-positioning

Max Travel: 50/100microns

Resolution: 10 nm

Hardness Measurement

Maximum indentor load: 10 g.

Range of measured values: 1-100 GPa

Young’s Modulus Measurement

Range of measured values : 10-1000 GPa

Nano Imaging

Resolution in XY plane:10 nm Resolution in Z plane: 1 nm

http://

CETRCETRCETRCETR

Nanohead Specifications

UNIVERSAL NANO+MICRO MATERIALS TESTER UNMT-1

NANO-INDENTATION MODULE NH-1

Applications

Thin films, coatings

MEMS, NEMS, Bio-MEMS

Semiconductor wafers and devices

Data storage media

Biomaterials

Polymers, Elastomers

Metals, Ceramics

YOUNG’S MODULUS

TENSIONCOMPRESSION

ADHESIONFATIGUE

CREEP

HARDNESSSTIFFNESS

NANO & MICRO TESTS

Script example for multiple loading-unloading cycles

Side optical microscope view of Berkovich tip approaching the surface (includes tip reflection)

Nano-indentation module includes nano-head NH-1, programable controller NC-1 and vision system with computerized optical microscope NM-1

Nano-indentation module can be easily attached to tester UNMT-1 via fast-exchange fixture or used as a stand-alone instrument

Metrology fully corresponds to the ISO14577 standard on instrumented nano-indentation

Load and penetration depth are continuously monitored and independently controlled

Proprietary contact surface approach, drift and machine compliance compensation algorithms

Hands-free electronics and intuitive control software, easily programable indentation cycles

Integrated computerized optical microscope with in-situ side and top-down views.

Optional AFM for in-line pre/post-test nano-imaging of the indent and indentation area

Optional acoustic and thermal enclosure, anti-vibrational table.


Nanohead NH-1 and Sample on Rotary Stage


Load

Displacement

X and Y stages Z stage

Rotary stage

Maximum Force: 400mN

Digital Resolution: 0.1 mN

Load ranges: ±4mN, ±40mN, ±400mN

Maximum Displacement: 200 µm

Digital Resolution: 0.02 nm

Displacement ranges: 1µm, 10µm, 100µm, 200µm

Travel: 75 mm x 75 mm 150 mm

Digital Resolution: 1 µm 2 µm

O Travel: 360

Position Resolution: 0.03 arcsec

METROLOGY APPLICATIONS

Nano-head NH-1 and nano-indenter tip are factory-calibrated, the information is conveniently stored.

Thin metal and ceramic films

TiN film on Si wafer: Er= 128GPa and H=16GPa

Flexible data storage media

DLC coating on flexible media: sinking-in behavior, Er = 0.42GPa and H = 0.65GPa.

Semiconductor porous films

Quality control of porous low-k films: sub-surface crack induced excursion

Sub-surface air bubble induced

inelastic behavior

MEMS Devices

0 0.05 0.1 0.15 0.2 0.250

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

2

Displacement, um

Fo

rce

,m

N

50µN load resulted

in 270nm displacement


Stiffness of micro-membrane:

(first segment reflects

stiffness of the nanohead)

Database of tip area functions

AFM image and cross-sections of Berkovich tip

The load versus displacement plots are generated automatically. The reduced elastic modulus Er and sample hardness H are calculated according to standard.

Multiple loading-unloading curves on fused quartz

Commercial advanced atomic force microscope (AFM)Functions:

- atomic-force microscopy- phase imaging- magnetic force microscopy- lateral force mapping- adhesion force mapping- contact and semi/non-contact

Scanning ranges:50X50X3 mm 85X85X7 mm 100X100X9 mm

Resolution: 0.1 nm

Digital high-resolution, wide field-of-view optical microscope (OM) and a color CCD camera

- continuous video- still micro-images- micro-positioning of AFM tip

Full mechanical and electrical integration into UNMT

NANO-MEASUREMENTS

Applications

Nano-imaging in mechanical and tribological testing without sample removal:

- comparison of surface topography before/after and periodically during tests - periodic nano-imaging (AFM) and continuous micro-imaging (OM) of wear, scratch, crack, indent development, growth and propagation- lateral and adhesion mapping of test surface before/after and periodically during tests

Force measurements in mechanical and tribological testing without sample removal:

- comparison of AFM nano-friction and UMT micro/macro-friction on surfaces - comparison of AFM nano-adhesion and UMT micro/macro-adhesion on surfaces

Nano Defectoscopy- auto-positioning on surface defects with known coordinates (X&Y or R&Q), easily downloadable from optical or stylus macro-characterization instruments,- rotary or linear sample table with sub-micron positioning resolution- failure analysis and quality control on samples up to 6”, optional 8”:

- optical displays (LCD, LED, Plazma)- optical disks (DVD, CD, PD)- magnetic disks and head wafers- semicon and MEMS wafers

NANO-IMAGING

TOPOGRAPHYMAGNETIC PROPERTIES

NANO-ROUGHNESSWEAR/SCRATCH/INDENT

NANO-MAPPING

LATERAL NANO-FRICTIONPULL-UP NANO-ADHESION


Process artifacts of a laser textured hard magnetic disk with

5-mm texture bumps and 2-mm wide

scratches.

CETRCETRCETRCETRUNIVERSAL NANO+MICRO MATERIALS TESTER UNMT-1

ATOMIC FORCE MICROSCOPE (AFM) MODULE

Dishing profile in a 50 micron line polished at 20 ml/min slurry flow

Dishing profile in a 50 micron line

polished at 55 ml/min slurry flow

Post-CMP of semiconductor wafers: two 3-D nano-images of dishing profiles on the copper lines

CETR, INC. 1715 DELL AVE, CAMPBELL, CA 95008 PHONE 408.376.4040 FAX 408.376.4050 WWWW.CETR.COM

AFM Module Integrated in the UNMT-1 with Linear Stages


MULTIPLE TESTS

friction

stick-slip

wear

stiction

delamination

indentation

fatigue

strain

torsion

bending

MULTIPLE SENSORS

force

6-Dforces torques

acoustic emission

wear deformation

electrical resistance

temperature humidity

vision system

AFM

SERVO-CONTROL

MULTIPLE SYNCHRONIZED

MULTIPLE CHAMBERS

INTERCHANGEABLE

on nano, micro and macro scales:

- static and dynamic

- ultra-low-speed (0.1 micron/s)

- adhesive, abrasive and scratching

- pull-off adhesion/

- scratch-adhesion and

- , hardness and elastic modulus

- multi-cycle, multi-axis

- , elasticity, plasticity and creep

- compression, tension and

- three-point

for IN-SITU test monitoring:

- ultra-precision sensors of the proprietary technology and patented design (1 mN to 1 kN)

- sensors for simultaneous measurements of 3 and 3 in all X, Y and Z axes

- high-frequency sensors of the proprietary design, ultra-sensitive to tiniest cracks and wear

- and sensors of micro (0.5 micron) and nano (20 nm) resolution

- contact and surface (mOhms to MOhms) for detection of film failure or buildup

- and sensors

- integrated for micro-positioning and digital video of the failure dynamics

- integrated for periodic nano-imaging of test surfaces, wear tracks, indents and scratches

Precision of loads, speeds, and positions for uniquely reproducible data and highly productive tests, e.g., repeatable different loads on different specimen areas for multi-test results from single tests

linear and rotary motions of upper and lower specimens in all X, Y and Z axes, including oscillations (up to 60 Hz), for sophisticated multi-axis tests, e.g., with spiral, zigzag or butterfly scratch/wear tracks

with computer controlled otemperature (-25 to 1000 C), humidity (10 to 95% RH),

-6vacuum (up to 10 Torr), gases

All motion and sensor modules are easily within a few minutes

Bearings

Valves

Connectors

Commutators

Contact/Wires

Screw-in-Nut

Pin-in-Chain

Shaft-in-Seal

Razor-on-Hair

Brush-on-Teeth

Orthopedic Joints

Semicon Wafers

Head-on-Disk

Cutting Tools

Contact Lenses

Optical Media/Lenses

ID

US

TI

NR

AL

Pin/Ball-on-Disk

Block/Pin-on-Ring

Crossed-Cylinders

Disc/Plate-on-Disc/Plate

Indenter-on-Plate

4-Balls

AS

TN

DA

RD

disc-on-disc module

reciprocation module owith 300 C chamber

block-on-ring module

pin-on-disk module with o

1000 C chamber

AFM module

nano-indenter

ISO/ASTM/DIN Standards


UNMT-1, UMT-2 AND UMT-3

TEST SCHEMATICS (EXAMPLES)

Lower High-Precision Linear with Upper Linear Motion

Lower Rotation (vertical axis) with Upper Linear or Rotary Motion

UNIVERSAL NANO+MICRO+MACRO MATERIALS TESTER (UMT)

Lower Disc: up to 150 mm (optional 200 mm)

Rotation: cw/ccw at two speed ranges:

0.1 to 5000 rpm or 0.001 to 50 rpm

Upper Ball: 1.5 to 25 mm

Upper Pin: cylinder 1 to 25 mm,

flat, spherical or conical end

Options: fluid bath, environmental chamber

Lower Rotation (horizontal axis) with Upper Linear or Rotary Motion

Lower Linear Fast Reciprocation with Upper Linear Motion

Lower Plate: up to 150 mm

Reciprocation Stroke: 75 mm

Positioning Resolution: 1 µm

Linear Speed: 0.001 to 10 mm/s

Options: fluid bath, environm. chamber


Four Types of Drive Modules

Lower Ring/Bearing: 10 to 80 mm

Rotation: cw/ccw, 0.1 to 5,000 rpm

Options: fluid bath, environmental chamber

Single-Radius Pin/Ball-on-Disc TestsSingle-Radius Pin/Ball-on-Disc Tests

Spiral-Wear Pin/Ball-on Disc TestsSpiral-Wear Pin/Ball-on Disc Tests

Four-Ball TestsFour-Ball Tests

Single/Multi-Crater TestsSingle/Multi-Crater Tests

Block-on-Ring TestsBlock-on-Ring Tests

Ball/Pin-on-Ring TestsBall/Pin-on-Ring Tests

Single/Multi-Crater TestsSingle/Multi-Crater Tests

Single/Multiple Indentation TestsSingle/Multiple Indentation Tests

Butterfly Wear-Track TestsButterfly Wear-Track Tests

Disc/Ring-on-Disc TestsUpper Disc or Ring: up to 150 mm

Stationary or rotating: cw/ccw, speeds 0.1 to 1,000 rpm

Disc/Ring-on-Disc Tests

Upper Indenter:

Rockwell, Vickers, Berkovich

Positioning on new indents:

automatic, resolution 1 µm

Upper Pin: 1 to 25 mm


Upper Sliding:

synchronous with lower sliding

Wear & Fretting TestsWear & Fretting Tests

Cross-Cylinder TestsCross-Cylinder Tests

Engine TestsEngine Tests

Upper Block or Plate: 1 to 150 mm

Narrow Wear Track:

stationary block/plate

Wide Wear Track:

sliding block/plate,

0.001 to 10 mm/s


Upper Pin: 1 to 25 mm,

flat, spherical or conical end

Upper Ball or Pin: rotating cw/ccw,

speeds 0.1 to 1,000 rpm

Positioning on new craters:

radial - range 360°,

resolution 0.5 µm

axial - range 75 mm,

resolution 1 µm

Lower Plate: up to 150 mm

Lower Cylinder/Wire: 1 µm to 25 mm

Reciprocation Frequency: 0.1 to 60 Hz

Reciprocation stroke: 50 µm to 25 µm

Options: fluid bath, environm. chamber

Upper Pin/Ball/Block: stationary

Multiple Wear Tracks:

auto-positioning, distance

0 to 75 mm, resolution 1 µm

Upper Cylinder: 0.1 to 25 mm

Upper Tensioned Wire/Suture/Fiber:

1µm to 1 mm

Narrow Wear Track:

stationary upper sample

Wide Wear Track:

sliding upper sample,

0.001 to 10 mm/s

Multiple Wear Tracks:

auto-positioning 0 to 75 mm,

resolution 1 µm

Upper Piston Ring: stationary

Lower Cylinder Liner: reciprocating

Upper Pin or Ball:

stationary during test,

automatic positioning on disc radii

0 to 75 mm, resolution 1 µm

Upper Pin or Ball:

sliding radially on Lower Disc,

speeds 0.001 to 10 mm/s

Lower Disc’ angular speed auto-

adjusted for constant linear speed

Upper Ball: stationary in the center

Three Lower Balls:

immersed in fluid bath

Upper Pin or Ball:

rotating cw/ccw, speeds

0.1 to 1,000 rpm

Positioning on new craters:

automatic radial positioning,

range 75 mm, resolution 1 µm

circumferential positioning,

range 360°, resolution 0.5 µm

Page 1Page 2Page 3Page 4Micro Scratch-Module.pdfPage 1Page 2

Nano Analyzer-Nano Scratch,Youngs Modulus and Image Analyser.pdfPage 1

Nano Indenting Hardnes-Module.pdfPage 1Page 2

AFM-Module.pdfPage 1

Documents

COMPREHENSIVE MATERIALS TESTING FOR MECHANICAL AND ... image/UMT UNMT-Micro Nano Scratch Nan… · COMPREHENSIVE MATERIALS TESTING FOR MECHANICAL AND TRIBOLOGICAL PROPERTIES On One