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Conference Schedule at a Glance
November l2 (Mon) November l3 (Tue) November l4 (Wed) November l5 (Thu)
Registration8:30-9:20 Keynote Lecture 3
Zeng-Yuan Guo8:50-9:40
Keynote Lecture 5
Takemi Chikahisa8:50-9:40
Opening
Keynote Lecture I
Gang Chen9:40- I 0:30
Keynote Lecture 4
Mamoru Tanahashi
9:40- l0:30
Keynote Lecture 6
Peng Zhang9:40-10:30
Break Break Break
Short Presentation I
l0:40-l l:30Short Presentation 4
l0:40-l l:30
Short Presentation 6
l0:40-ll:10
Poster Session 6
I l:10-12:00
Poster Session I
I I:30-l2:30Poster Session 4
I l :30-12:30
Lunch BreakI 2:00- I 3:00
Lunch Breakl 2:30- I 3:30
Lunch Breakl2:30-13:30
Short Presentation 7
l3:00-13:40
Keynote Lecture 2Sung Jin Kiml3:30- l4:20
Short Presentation 5
l3:30- 14:20 Poster Session 7
I 3:40- 14:40
Coffee BreakPoster Session 5
l4:20-15:.20Closing l4:40-14:50
Short Presentation 2
l4:50- l5:40
Technical Tour
Mitsubishi Historical Museum
l5:00-16: t 0
Departure time of shuttle bus:
l5:00
Break
Poster Sessiorr 2
l5:40-16:40
fukivama Award l5:50-16:0(
Award LecturePeter Stephan
| 6:00-16:50
Registrationl6:00-18:00
ReceptionI 7:30- l 9:00
Break
Short Presentation 3
l6:50-17:40PickuP to banquet
Departure time of shuttle bus:
l7:00 - 17:50
Poster Session 3
l7:40- l8:40
Banquet@lnasa-Yamal8:30-20:30
1-
Dear IFHTZD 12 P articipants,
On behalf of the Organizing Committee and Executive Committee, we would like to welcomeyou to the 3rd International Forum on Heat Transfer, IFHT2O12.
The IFHT is an international forum organized by Heat Transfer Society of Japan. It started inSeptember 2004 in Kyoto (Professor Maruyama was the forum Chair then), followed by the secondforum held in Tokyo in 2008 (Professor Sato was the Chair). This year, the third IFHT takes place
in the resort city, Nagasaki. The IFHT encompasses a broad range of heat and mass transfer,thermophysical propereties and combustion sciences from nanoscale to macroscale.
In accordance with the custom established through the last two conferences, a general session
consists of short oral presentations, followed by a poster session. All speakers are asked to give a
short oral presentation about their research within one and a half minutes, and then move onto.aposter presentation for more detailed information. In this style, speakers need to put together theirresearch into one or two slides, whereas audiences can take note of the research of their interest inthe short oral presentation and ask the speakers to explain their research more in detail later in the
poster presentation. We believe this is an ideal style for us participants, in that rve can understand
the whole picture of the session and also learn details of the research that we are interested in.
In the third IFHI besides nearly 140 presentations, six keynote speakers from China, Korea,
the United States, and Japan, and one Nukiyama Memorial Award recipient from Germany are
invited to deliver lectures. The keynote speakers are the world's top level scholars in the areas ofenergy conversion, fuel cell system, combustion science and electronic cooling.
The Nukiyama Memorial Award was an international award established by the Heat Transfer
Society of Japan on its 50th anniversary to commemorate outstanding contributions by Professor
Shiro Nukiyama at Tohoku University. Professor Nukiyama was an excellent heat transfer scientist
who found the boiling curve. The Nukiyama Memorial Award shall be bestowed biennially to ascientist around 50 years of age or younger. The first prestigious Award is bestowed to Dr. Peter
Stephan, a professor of Technical Termodynanics at the Technische Universitiit Darmstadt in
Germany. The Award ceremony and lecture are scheduled on the second day of the forum.
On the final day of the Forum, Technical Tour to visit Nagasaki Shipyard & Machinery Works
and Nagasaki Research & Development Center is planned. In addition, selected papers of the
IFHT2Ol2 will be published in a special issue of the Journal of Thermal Science and Technology.
With the holding of the lFHT20l2, we would like to express our sincere appreciation for all the
cooperation and support from our cooperating societies, including ASME International Japan
Section, Combustion Society of Japan, French Heat Transfer Society, International Centre for Heat
and Mass Transfer (ICHMT), Japan Institute of Energy, Japan Society of Fluid Mechanics, Japan
Society of Mechanical Engineers, Japan Society for Multiphase Flow Japan Society ofThermophysical Properties, Korean Society of Mechanical Engineers, Society of Chemical
Engineers, Japan, The Chemical Society of Japan, Turbomachinery Society of Japan, and
Visualization Society of Japan
Finally, we all hope you enjoy presentations and lively discussions in the Forum and have a
wonderful time in this attractive resort city, Nagasaki.
Yasuyuki Taknta, Kyushu University, Organizing Committee Chair
Koji Miyazafri, Kyushu Institute of Technology, Executive Committee Chair
2-
General Information
Meeting Area Floor PIan
Technical sessions consist of short oral presentations and poster presentations. All oral
presentations and Keynote Lectures will be held in the International Conference Hallon the third floor. Poster presentations will be held in the Lounge on the third floor ofthe Brick Hall.
Registration
The registration desk will open at 16:00 on Monday, November 12,2012, in the Lobby
on the third floor of the Brick Hall. Registration will be available from Tuesday to
Thursday at the same place. Only cash (Japanese Yen) is accepted for on-site
registration.
Welcome Reception
There will be a welcome reception on the evening of November 12,2012. All attendees
are invited. The reception will start at I 7:30 (and end at l9:00) at the Lounge on the
third floor of the Brick Hall.
Lunch and Banquet
There are many restaurants for lunch within walking distance of the Brick Hall. The
Conference Banquet will be held in Garden Terrace Nagasaki (http://www.st-
naeasaki jpA from l8:30 to 20:30 on Wednesday, November 14, 2012. A full course
dinner will be served. All registered attendees are invited to the Conference banquet.
Banquet tickets for accompanying persons are available at the registration desk.
Keynote Lectures and Audio-Visual Aids
Keynote Lectures will take place in the International Conference Hall. A full-color
projector equipped with a connection cable with D-sub mini l5-pin male connector for
RGB-video is available. Also, a Windows PC with MS PowerPoint and Adobe Acrobat
Reader installed is available for use if you bring your presentation data on your USB
flush memory or CD-ROM.
All Technical Presentations except Keynote Lectures
Alltechnical sessions consist of short oralpresentations and poster presentations.
3-
General Information
Meeting Area Floor Plan
Technical sessions consist of short oral presentations and poster presentations. All oral
presentations and Keynote Lectures will be held in the International Conference Hall
on the third floor. Poster presentations will be held in the Lounge on the third floor ofthe Brick Hall.
Registration
The registration desk will open at 16:00 on Monday, November 12,2012, in the Lobby
on the third floor of the Brick Hall. Registration will be available from Tuesday to
Thursday at the same place. Only cash (Japanese Yen) is accepted for on-site
registration.
Welcome Reception
There will be a welcome reception on the evening of November 12,2012. All attendees
are invited. The reception will start at l7:30 (and end at 19:00) at the Lounge on the
third floor of the Brick Hall.
Lunch and Banquet
There are many restaurants for lunch within walking distance of the Brick Hall. The
Conference Banquet will be held in Garden Terrace Nagasaki (http://www.et-
naeasaki.ipl) from 18:30 to 20:30 on Wednesday, November 14, 2012. A full course
dinner will be served. All registered attendees are invited to the Conference banquet.
Banquet tickets for accompanying persons are available at the registration desk.
Keynote Lectures and Audio-Visual Aids
Keynote Lectures will take place in the International Conference Hall. A full-color
projector equipped with a connection cable with D-sub mini l5-pin male connector for
RGB-video is available. Also. a Windows PC with MS PowerPoint and Adobe Acrobat
Reader installed is available for use if you bring your presentation data on your USB
flush memory or CD-ROM.
All Technical Presentations except Keynote Lectures
All technical sessions consist of short oral presentations and poster presentations.
3-
Short Oral Presentation
The presentation is limited to 90 seconds and the entire slideshow should be set up
in landscape orientation and not exceeded two slides. Animations (visual effects
and movie) cannot be used. The slideshow file should be submitted by e-mail at
ifht2O I [email protected] by October 3 l, 2Ol2 (Wed.). Files
created in PDF and Microsoft PowerPoint (.ppt) are accepted but PPT file will be
converted to PDF.
Poster Presentation
Each poster will have an assigned space in the Lounge. The size of the poster board
is 90cm in width x 200cm in height with thumb tacks. It is strongly recommended
that posters be printed on a single sheet (e.g., an A0-size sheet with the shorter side
at the top). Each poster station will have an identification number on your paper.
It is the author's responsibility to remove all the posters and clean the area at the
end of the session.
Banquet@Inasa-yama
The 5 pickup shuttle buses for the Conference Banquet venue (Inasa-yama) will be
readied at l7:00 behind the building of the Brick Hall.
The bus will start as soon as the number of the passenger reaches the capacity of the
bus. and the last bus will start at l7:50.
4-
Organizing
ChairYasuy:ki Takata, I(yuhu LiniaersiA, JaPan
Comrnittee MembersPradeep Bansal
Uniaersiry oJAackland, Neu Zealand
Chin-Hsiang Cheng
National Chezg Kttng U niaersi!, Taiwan
I{atsunori Hanamura
To@o Institate of Tecbnology' JEanMoohwan Kim
Po bang U niuersig of S cience and Techno logy,
Korea
Ivlasamichi KohnoI(ya s ha (J xiuers i q, J E an
Joon Sik Lee
Seoal National (jniaersiry, Korea
Josua P. Nleyer
Uniaeniry of Pretoia, Sotth AJnca
I{oji N'Iiyazaki
fu^ho lnstitate of Tecbnology' JapanI{azuhiro Nakabe
Iloto Uniursilt, JaPan
Taku Ohara
To ho ku U niue rsi !', J aPan
Fliroto Sakashita
Ho kkaido U niuersiry, J aPan
Naoki Shikazono
Uniuersiq of Tokyo, JaPan
Yutaka Tabe
Ho kkaido U niaersiy, J EanTostrio Tomimura
Ksmamoto Uniuersil, J @anSebastian Volz
Ecole Cextrale Pait, Frann
Tomohiko YamaguchiN agas a ki U niuersi 9, J Ean
Hideo YoshidaI(yo to U niaersi ry, J aP an
Tianshou ZhaoHongKongUdwrsiry of Scienn and
Technobgy, China
Gommittee
JuergenJ. BrandnerKarlsrube Institate of Technokg, Cermany
Masayuki Fukagawa
Mitvtbishi Hearl lndustiu, Lsd., JapanTassos G. Karayiannis
BnmelUriuersij, U.KSungJin Kim
Korea Adaanced lutinrtu of Science and
Techno/ogy, Kona
Yoshihiro KondoHitachi Ltd., Japan
Iiaoru Nlaruta
Tobokr Uniaeniry, JaPan
Sushanta Nlitraliniwrsil of Albena, Canada
Satoru ivlomokiN agn a ki U n iue rsi Y, J aPan
Iiim Choon NgNational Uniuersig of Singapon, Sing@ore
Alfonso Ortegal/illanoaa U niuersigt, U.S A
Khellil Sefiane
Uniaeniry of Edinburgh, U.KYuji Sr:zuki
Uriaersig of Toklo, JaPan
Hiroshi TakamatsuI(y s hr U niuersi ry, J aP an
Takaharu Tsuruta
I(1ushu Institite oJ Techno logt, J apat
Akira Yamada
Mitsubisbi Heary lndzutiu Ltd.' Japan
Atsumasa Yoshida
Osaka Prefeaun Uxiuersi4t, JaPan
Xing ZhaogTsinghu a U niae rs i E, C h i n a
5-
Executive Gommittee
ChairK<rii Miyazaki,I(ynsha Instituh of Technology, Japaz
Comrnittee MembersHirofumi Arima Masayuki Fukagawa
Saga Udwrsiry, JEan Mitsubirhi Heatjt Indrstries, I-td., JapatYoshinori Flamamoto N{asaru Ishizuka
b^h, Uiluersig, Japan Tolama Pnfearral Uniaersig, JEanKeishi Kariya Masamichi Kohno
I9^ho Udaersiry, Japan l(yasbu Uniaersij, JapatSatoru Momoki Fliroto Sakashita
Nagasaki Uniursiry, Japan Hokkaido Uniuersi!, JapaxNaoya Sakoda Soichi Sasaki
b^ho Uniuersij, Japax Nagasaki Ltniwrsig, JapanNaoki Shikazono Yutaka Tabe
Uilaersij of Tok1o, Japar Hokkaido Llniaersil' JapanYasuyrrki Takata Tomohiko Yamaguchi
I(1usha Uniaersig, Japan Nagasaki Uniwrsii' JapanAtsumasa Yoshida
Osaka Pn-fectan Ltnitwsig, Japnt
Gooperating Societies
ASNIE International Japan Section
Combustion Socieq' of JapanFrench Heat Transfel Socieq'
Intemational Centre for Heat and Mass Transfer (ICHMD
Japan Institute of Energy
Japan Society of Fluid Machanics
Japan Society of Mechanical Engineers
Japan Society for Multiphase Flow
Japan Society of Thermophysical Properties
Korean Society of Mechanical Engineers
Society of Chemical Engineers, JapanThe Chemical Society of JapanTurbomachinery Society of JapanVisualization Society of Japan
6-
t00
201
r6l
Experimental studS on the thermal performance ofa pulsating heat pipeJungseok Lee' Young Jik Youn, Sung Jin Kim (Korea Advanid Inttitut" of Science and Technologlt)
A flow modeling for a piezoelectric heat sinkHeeseung Park, sung Jin Kim (Korea Advanced Institute ofscience and rechnologlt)
Performance of heat pump c-r cle using zeotropic mirrures of R r 234ze(E) and R32shotaro Yamamoto, Sho Fukuda, Shigeru Koyama (K.vusyu University)
Prediction of flow boiling heat transfer coefficient of binary mi.rture (HFol2341f +R32) in a horizontal smooth rubeMinxia Li (Tianjin (Iniversityl, Chaobin Dang, Eiji Hihari (t/niversity of rokyctl
Effect of lubricating oil on flow boiling heat transt'er of low GWP refrigerant HFo- 12341 f in a horizontal small-diametertubeShizuo Saitoh, Chaobin Dang, Eiji Hihara (Universitl,of Totcyo.l
Speed of sound measurement in HFo- l 2341'f liquid phase using a sound velocitr sensorLei Gao, Takuro shibasaki, Tomohiro Honda, riiroyuki Asou (Fukuoka IJniverstry,l
t
084
November
8:50-9:40
9:40-10:30
l0:40-l l:30I l:30-12:30
020
In
204
144
14, Wednesday MorningKeynote Lecture 3"Entropy and Entransy"Ze n g- Yu an Guo (Ts in g h u a IJ niv ers i ry* )Chai: Shigenao Maruyama (Tohoku [jniversity)
Keynote Lecture 4"Multi-Dimensional/Multi-Variable Laser Diagnostics and DNS in Turbulent Combustion Research',M a m o r u Tana has hi (To ky o Ins t i tu t e oJ' T e c h n o I o pt )Chair: sangmin choi (Korea Advanced Institute of science and rechnologt)
Break
Short Presentation 4Poster Session 4Session Chair Katsunori Hanamura (Totgto Institute of Technologt)
lErperimental studl'of fuel-lean rebuming/sNcR s)stem for No. reduction in LpG flameJung Min Yu, seung wook Baek (Korea Advanced Institure o.f Science and rechnologtl
Buovancl effect on microflameYusuke Kakizaki, Yuto onodera, Kazunori Kuwana (yamagata university)
Studl on the N2O formation under low temperature condition in pulverized biomass combustionYukihika okumura (Maizuru National Coilige of Technologt), Hirotatsu l4/atanabe, Ken okazaki Ookyo Instinte ofTechnolog,)
Stabili6 linrits and behaviors of micro flames for methane, hrdrogen and diluted fuel with nitrogenKentaro Talcatera, Ryuii Takashima, Kentaro Sakamoto. Takamitiu Yoshimoto (Kobe City Coile'ge of Technotogt), ToshimiTakagi (Former Osaka IJniversity)
Large- and fine-scale vortical structures in turbulent premixed V_flameTaltayuki Kadowaki, Naoya Fukushima, Masayasu S-himura, Mamoru Tanahashi, Tashio Miyauchi ffokyo Institute ofTechnology)
Behaviors and characteristics of combuslion on radial horizontaljet diffirsion flame for methane, h1'drogen and fuel gasdiluted with nitrogenRyuii Talashima, Hiroki Hara, Talamitu Yoshimoto (Kobe City Cotlege of Technologtl, Toshimi Talcagi (Former OsapnUniversitlt)
Flame behavior and stabilitl. on radial horizontal jet premixed flameHiroki Hara. Shin-nosuke Watanabe, Takamitsu yoihimoto (Kobe City College of Technologt), Toshimi Takagi (FormerOsala Universityl
030
046
t39
140
SESSION 4Combustion / Visualization and Measurement T
t45
-14-
I 53 Using 3D modeling technologies in research of heal l arm transfer processes in combustion chamber of acting energlobjectsAliya Askarova, Sj'mbat Bolegenova, Valery Marimov, Ai$tn gtlr^ufUamet (Al-Farabi Kazakh Nationat L'niversitl'.t
165 Effect of fuel-N concentration on NO. emission during air and O2/CO2 coal combustionDejudom Kiatpanachart, Fumiya Arai, Hirotatsu Watanabe, Ken Okazaki (To$,o Jrtr,,ur, of Technologt')
016 Measurement of void fraction of ammonia boiling florv in plaie evaporatorHirofumi Arima, Fumiy'a Mishima, Kohei Koyama, Toru Fukunami, Yasuyuki lkegami (Saga Universitl')
028 Development of simultaneous imaging method of temperature and water concentration of aqueous solutions based on thenear-infrared absorption characteristics of waterNaoto Kalwta (Tokyo Metopotitan University), Katsut'a Kondo (Tottori University), Hidenobu Arimolo (National Instituteqf Advanced Industrial Science and Technologt), Yukio Yamada (University of Electro-Communications)
029 Simultaneous measurement of bubble behavior and emissions of Balmer series in radio-frequencl plasma in water br a
high-speed carneraShinobu Mukasa, Atsushi Kamada. Shinfuku Nonrura, Hiromichi Tqtota (Ehime University)
058 Effect ofnanoscale wall roughness on zeta potential in microchannel flowTasuku Tabei, Shun Yoshikawa, Yuta Mizumoto, Jakob Born, Hiromi Jitsukawa, Taka:yuki lkebe, Kota Ozawa, YasuhiroKakinuma, Yohei Sato (Keio University)
063 Quantitative visualization of temperature distribution rvith micron resolution bl spontaneous Raman imagingReiko Kuriyama, Yohei Sato (Keio University)
073 Visualization and measurement of laminar natural convection in square enclosureEita Shoji, Shion Kon, Atsuki Komiya, Junnosuke Okajima, Shigenao Maruylama Cohoku universiO')
081 Esperimental studl on natural convection heat transfer in water with microbubble injectionTakuya Ozato, Atsuhide Kitagawa, Yoshimichi Hugiwara (K.,-oto Institute of Technology), Yuichi Murai (HokkaidoUniversity)
082 Studl'of flow rate measurement on bent pipe flou'using ultrasonic velocit) profile method and computational fluiddlnamicsWeerachon Treenuson, Nobuyoshi Tsuzuki, Hiroshige Kikura. Masanori Aritomi (Tokyo Instilute ofTechnology), SanehiroWada, Kenichi Tezuka (Tokyo Electric Power Company)
089 A stsmp senor for mcasurement of thermal conductiviq'and therrnal diffirsivitl'of solid nuterialsSyansul H4, Mamoru Nishitani, Takanobu Fukunaga, Kosaku Kurata, Hiroshi Takamatsu (Kyushu University)
lO7 Development of sensitive detection method using tunable diode laser absorption specroscop) with optical hollow fiberAkira Adachi, Yoshihiro Deguchi /University of Tokushimal
109 Development of realtime 2D temperature measurement method using CT tunable diode laser absorption spectroscop)Yoshihiro Deguchi, Daisuke Yasui. Akira Adachi lUniversitl, of Tokushina)
I I 8 In-plane thermal and electrical conductiviq' of Si thin film with periodic microporousYosuke Kawahara (Kyushu Institute of Technologyl, Harutoshi Hagino (BEANS Laboratory), Hisashi lwata lKltushuInstitute of Technologltl, Koji Miyazaki (BEANS Laboratory)
130 Measurement of radiative transmission through a diffuse surface using fluorescent materialKae Nakamura, Hirokazu Kawai (Shibaura Institute ofTechnologt), Masaya Koshino, Sadaki Takata (Shiseido Co., Ltd.),Jun Yamada (Shibaura Insfinrc of Technologtl
| 47 Stud) the thermoelectric properties of the ultralong double-walled carbon nanotube bundles b1 using a novel T-qpe methodTingting Miao, Weigang Ma, Xing Zhang, Jialin Sun (Tsinghua University)
157 Studl' on SThM with multifunctional thermal cantilever probeMasayuki Shinya, Osamu Nakabeppu lMeiji Universityl
166 Thermal diffusivitl and thermal conductir itl of r r'rticalll -aligned multi-walled carbon nanotube arrall{eigang Ma, Xing Zhang (Tsinghua Unirersin ,. I.iping Yang. An Cai (Shanghai Institute of Ceramics, Chinese Academy ofSciences), Zhenzhong Yong, Qingw,en Li rSu:ltou lnsrilute qf ,Yano-Tech and Nano-Bionicsl
187 Measurementsof h1'drogen viscositr uith capillarr tuhe method up to 7?3K and l00MPaTemujin Uehara, Kousuke Yoshimura lK.r'ushu Iirlersil,,. Elin Yusibani r$'iah Kuala Liniversitl't. Kan'ei Shinzato(National Instilute of Advanced IndustrialSclerrr't' dnti Tethnolofltr. Masanit'hi Kohno. l'asuyuki Takara (KtashuUniversity)
188 PVT prope4 measuremen$ of hldrogen in the range tierm -i:-i K tr ".1 K rnd up 1ir ]{d-i \{p6 br rhe iiochoric method
I
I
-15-
Proceedings of the
3rd International Forum on Heat Transfer
November 13-15, 2012, Nagasaki, Japan
Paper No.
A STAMP SENSOR FOR MEASUREMENT OF THERMAL CONDUCTIVITY
AND THERMAL DIFFUSIVITY OF SOLID MATERIALS
Syamsul HADI*, Mamoru NISHITANI*, Takanobu FUKUNAGA*, Kosaku KURATA*
and Hiroshi TAKAMATSU*
* Department of Mechanical Engineering, Kyushu University
744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan
E-mail : [email protected]
Keywords : measurement technique, thermal conductivity, thermal diffusivity, in-situ measurement, contact measurement
ABSTRACT
We have proposed a convenient method that uses a stamp-type
sensor for measuring thermal transport properties of solids including
soft materials. A unique feature of this method is to press a small film
sensor/heater against the surface of a sample with spreading a gel of
known thermal properties on the sensor to avoid thermal contact
resistance. The sensor is fabricated on the bottom of a shallow cavity
to make a uniform gel layer of roughly fixed thickness independent of
contact pressures. The objective of the present study was to
demonstrate feasibility of the method using a prototype sensor. A
thin platinum sensor with a circular pattern of 3-mm diameter that
was deposited on the surface of 0.16-mm thick glass substrate was
used with a 50-m thick silicon rubber sheet as a spacer. The
transient temperature rise of the sensor was obtained from measured
electrical resistance after heating the sensor at a constant current.
Experiments were conducted with four different materials. The
thermal conductivity and the thermal diffusivity of a sample as well
as the thickness of the gel were determined simultaneously by a
Gauss-Newton algorithm within five to eight iterations. The
calculated temperature agreed well with the measured temperature
rise of the sensor.
1. INTRODUCTION
The thermal conductivity and the thermal diffusivity of solid
materials are measured with several methods. One of the most
reliable and popular methods is the laser flash method, which heats
the front side of a precisely prepared disk sample by laser irradiation
and measures the temperature rise at its back side (Akoshima et al,
2009, Baba et al, 2001). The other methods include the transient
plane method which heats the sensor that was put between two
samples (He, 2005), and the point contact-probe method that presses
a small heated spherical sensor to the surface of a sample (Takahashi
et al, 1999a, 1999b, Komiya et al, 2010). Application of these
methods depends on the sample material, required accuracy, and
restriction for measurement. The laser flash method has an
advantage in terms of the accuracy, but it requires preparation of a
sample with precise thickness. The other two methods have an
advantage in easier measurement including sample preparation.
However, none of these methods is appropriate for soft materials
including biological materials. Preparation of soft samples with
precise dimension is difficult in the laser flash method. Clamping a
thin heater/sensor between two identical samples is difficult for soft
materials in the transient plane method, although clamping is crucial
for reducing the thermal contact resistance between the sensor and
the sample. Pressing a bead sensor on a soft sample would alter the
contact area in the point contact-probe method, although the method
assumes point contact between the sensor and the sample. Hence to
develop a convenient measurement method for solid particularly soft
materials, we have proposed a new method using a 'stamp sensor'
(Hadi et al, 2012). It is a sort of contact method that works for
non-destructive in-situ measurement. The uniqueness of this method
is to put a gel between a film heater/sensor and a sample to
eliminate the thermal contact resistance. In addition, a shallow
cavity with given dimensions is prepared around the sensor for the
gel. As the first step to develop the method, we have carried out a
numerical study (Hadi et al, 2012). The protocol to determining the
thermal conductivity and the thermal diffusivity was checked using
virtual experimental data that have been generated by adding an
artificial scattering to a theoretical temperature change of the sensor.
The results indicated that the measurement error was less than ~2 %
for the thermal conductivity and ~5 % for the thermal diffusivity.
Since the feasibility of the method has been examined by the
numerical analysis, the next step is to demonstrate the measurement
by experiments. In this paper, we present preliminary results
obtained with a prototype sensor and find the problems for further
development of the proposed method.
2. SENSOR AND METHODS
2.1 Stamp Sensor
A conceptual design and the detail of the prototype stamp
sensor, which is named by ourselves, is shown in Fig. 1. A thin
metallic film heater/sensor that also works as a resistance
thermometer is deposited on the top of a glass substrate. A circular
sensor is used so that the system could be described by an
axisymmetric 2-D model. The sensor is pressed against the surface
of a sample with a gel spread on the sensor to eliminate the contact
thermal resistance between the sensor and the sample. The important
feature of the sensor is that the sensor is placed at the bottom of a
shallow cavity made by a spacer between the substrate and the
sample, which ensures the approximately constant thickness of the
gel layer independent of the contact pressure and gives us an
estimate of its thickness.
Fig. 1 Schematic and a detail of stamp sensor
The final design of the sensor would be a stamp-type device
where a sensor is fabricated on the bottom of a cylindrical holder
(Fig. 1, right). However, as a preliminary study, a sensor pattern
with electrodes was fabricated on a 0.16-mm thick 22 mm x 40 mm
glass substrate by the physical vapor deposition (PVD) of platinum
(Fig. 2). A circular pattern of 3 mm in diameter was drawn with a
single stroke of a 125 m wide line. An annular silicone rubber
sheet, 50-m thick and 15 mm in the inner diameter, was used as the
spacer. The glass substrate was held with a hollow cylinder. A
sample was heated not directly from the heater/sensor but through
the substrate to avoid the sensor from being peeled off during
cleaning after experiments, even though the sensor was coated by a
glass layer.
Fig. 2 Pattern of the sensor deposited on the glass substrate
2.2 Equipment and Measurement
The electrical resistance of the sensor was measured by the
four-terminal method; the voltage drops in the sensor and a standard
resistor connected to the power line were measured at every 0.18 s
(Fig. 3). Prior to the experiments, the electrical resistance of the
sensor was calibrated as a function of temperature by applying small
currents to the sensor that was held in a temperature-controlled
dielectric liquid, FC-84.
The gel for the ultrasonic echo was used in the experiment. The
sensor was pressed against a sample after spreading a small amount
of gel in a shallow cavity. After waiting for the system to become
thermal equilibrium, the sensor was heated stepwise by applying a
constant current. The measured voltage was recorded by a data
acquisition system controlled by a computer.
Four kinds of materials, acrylic resin (Kaviani, 2002), agar gel,
machinable ceramic, and stainless steel, were used as samples (see
Table 1 for thermal transport properties from the literature). For
each sample, the heating power was determined so as to obtain ~5 K
in the increase of the average temperature of the sensor within 5 s.
Table 1 Thermal transport properties of samples from literature
Material
(W/mK)
(10-7
m2/s)
Acrylic Resin 0.21 1.20
Agar Gel 0.58 1.32
Machinable Ceramic 1.61 7.84
SUS304 16.3 36.2
Fig. 3 Schematic of measurements system
2.3 Theoretical analysis
The physical model for the theoretical analysis is shown in Fig.
4. The system was defined by the cylindrical coordinate system with
the origin at the center of the heater on the substrate surface.
Fig. 4 Physical model and boundary conditions
The heat conduction equation is generally described by
vqz
T
rr
T
r
T
t
T
2
2
2
2
(1)
Gel
Substrate
Sample
T = T0
T/r = 0 T = T0
T/z = 0
r z0
z
-z
with the thermal diffusivity of each region. The heat generation
rate per unit volume vq was incorporated only in the equation for
the heater, and was assumed to be uniform and constant. The initial
condition was
0T T= at 0t = (2)
and the boundary conditions were described as follows:
0T T= at r→∞ or z→∞ (3)
T/r = 0 at 0r = (4)
T/z = 0 at 0z z (5)
The sensor side of the glass substrate, z = z0, that was exposed to
the air inside the hollow cylinder was assumed to be adiabatic. The
continuity of heat flux was also taken into account at the interfaces
between different regions.
Numerical solution to Eq. (1) was obtained by a finite volume
method with central difference for conduction terms and fully
implicit formulation for unsteady terms. The solution domain was
divided into 330 1000 meshes with variable sizes after
examination of the effect of mesh size on the calculated result.
Physical properties of water was used for the gel layer.
2.4 Protocol to Determine Thermal Transport Properties
Measurement of Thermal transport properties includes a
process to find the theoretical temperature rise that fits the
experimental data, i.e. a process to determine the thermal
conductivity , the thermal diffusivity and the thickness of the
gel layer which minimize the cumulative squared difference in the
average temperature of the sensor between the theory and
experiment:
N
ii,theoiexp, ,,TTS
1
2 (6)
where N is the total number of experimental measurements, ,exp iT is
the i-th measured temperature, and ,theo iT is the temperature
obtained from the numerical solution at the time of measurement.
The Gauss-Newton algorithm with a numerical approximation to the
Jacobian was used for this nonlinear least-squares problems. The
method that used by Woodfields et al.(2008) for determination of
and in a short-hot-wire method was extended to a
three-parameters problem. The algorithm is as follows:
(1) Guess , and .
(2) Solve Eq. (1) numerically to obtain transient average
temperature , ( , , )theo iT (i=1~N).
(3) Solve Eq. (1) numerically to obtain three sets of temperatures for
different combinations of , and , i.e. , ( , , )theo iT ,
, ( , , )theo iT and , ( , , )theo iT (i=1~N).
(4) Find x, x and x that satisfy the following equation :
min2
1
i,theoi,theoi,theoi,theo
N
ii,theoi,theoi,theoiexp,linear
TTxTTx
TTxTTS
(7)
(5) Set new values for , and such that
new x , new x , new x (8)
(6) Repeat steps (2)-(5).
The values of , and were taken to be 1 % of the
current estimates , and The step (4) was carried out with the
linear least-square method using Gram-Schmidt ortho-normalization
and Q-R factorization.
The first guess was taken by comparing the experimental data
with a prepared data set of calculated temperature rise. The average
temperature rise of the sensor has been calculated as a function of
time assuming a gel layer of the cavity depth, 50m, for various
combinations of andwhich are given in increments of 20 %.
The values of and that yield minimum difference from the
experimental data were chosen from the prepared set as the first
guess.
The standard deviation of the difference between the
experimental data and calculated temperatures, i.e.
N
ii,theoiexp,T ,,TT
NN
SSD
1
21 (9)
was evaluated after step (4) of each iteration, and used as an index to
convergence.
3. RESULTS AND DISCUSSIONS
The process for determining the thermal conductivity and the
thermal diffusivity for acrylic resin was demonstrated in Fig. 5, Fig.
6 and Table 2.
Fig. 5 Measured and calculated temperature rise for acrylic resin
In this case, ~5-K increase in the temperature of the sensor
within 5 s was obtained by heating at ~20 mW (Fig. 5). The
temperature change calculated with the first assumption, 1= 0.244
W/mK, 1= 1.50x10-7 m2/s and 1 = 50 m, was lower than the
measured temperature. The thickness of the gel, , was fixed at 50
m for the following iteration steps as long as the difference
between the calculated and measured temperature, SDT, was larger
than 0.03 K. In the case shown in Figs. 5 and 6, was incorporated
as a variable at the third step, since SDT reduced to 0.015 at the
second iteration (Table 2). While the difference between the
measured and calculated temperature increased once by
incorporation of , it decreased again with further iteration (Fig. 6
and Table 2). The iteration was continued six times and the final so-
Fig. 6 Difference between measured and calculated temperature
rise for acrylic resin
lution was obtained by the values of , and that was used at the
6th iteration because there was no change in SDT from the 5th trial.
Figure 6 indicates that the temperature calculated with the final ,
and agreed well with the measured temperature. The difference
from the literature values were5.2% for 21.9% for and
33.4% for .
Table 2 Values of , , and of iteration steps
i
(W/mK)
(10-7
m2/s)
(m)
error
(%)
error
(%)
error
(%)
SDT
(K)
1st 0.244 1.50 50.0 16.2 25.0 0.0 0.131
2nd 0.242 1.74 50.0 15.0 45.0 0.0 0.015
3rd 0.200 0.69 33.0 -4.73 -42.5 -33.9 0.262
4th 0.201 0.92 34.0 -4.23 -23.0 -31.9 0.038
5th 0.199 0.94 33.3 -5.26 -21.9 -33.4 0.003
6th 0.199 0.94 33.3 -5.24 -21.9 -33.4 0.003
Table 3 shows the summary of finally obtained results with four
different materials: acrylic resin, agar gel, machinable ceramic and
SUS304. Figures 7-9 also show the measured temperature rise and
some of temperature rises obtained during iteration process. Because
of the wide range of thermal transport properties, the heating power
that gave appropriate temperature rise was considerably different
each other depending on the samples. In addition, the increasing
manner was also different particularly for SUS304; the temperature
increased quickly and slowed down immediately (Fig. 9). Even
though the experimental data showed variations in the transient tem-
Table 3 Measured values of thermal conductivity and thermal
diffusivity
Material
Q
(mW)
Number
of
iteration
(W/mK)
(10-7
m2/s)
(m)
error
(%)
error
(%)
SDT
(K)
Acrylic
Resin 19.9 6 0.20 0.94 33.3 -5.2 -21.9 0.003
Agar gel 36.2 5 0.60 1.19 98.7 4.3 -9.9 0.003
Machinable
Ceramic 50.8 6 1.81 7.71 85.1 13.3 -1.6 0.002
SUS304 117.5 8 14.8 40.8 69.1 -9.3 12.7 0.005
perature rise, the calculated temperature rises at the final iteration
agreed well with the experimental data in all cases. However, this
does not imply that the finally determined transport properties also
agreed well with literature values. The differences in the thermal
conductivity from literature values of four tested materials were
5.2%, 4.3%, 13.3% and 9.3%. Those in the thermal diffusivity
were 21.9%, 9.9%, 1.6% and 12.7%. In general the error was
larger for the thermal diffusivity than the thermal conductivity as
has been demonstrated in our previous study (Hadi et al, 2012)
based on the numerical simulation.
This was probably because the temperature rise was more sensitive
to the thermal conductivity than the thermal diffusivity. It is
interesting that only the result for machinable ceramic showed
smaller error in the thermal diffusivity, of which reason is not clear
to date. The estimated thickness of the gel layer was between ~33
m and ~99 m. The gel layers of ~33 m that is ~34% smaller than
the thickness of the silicone spacer and ~99 m, almost double of
the spacer, are both unfeasible. This indicates the difficulty in
determining the thickness of the gel layer correctly. However, it
conversely implies the lower sensitivity of the temperature rise to
the thickness of the gel layer. This is desirable for our method
because the targets to be determined are not the gel thickness but the
thermal transport properties of samples.
Fig. 7 Measured and calculated temperature rise for agar gel
Fig. 8 Measured and calculated temperature rise for machinable
ceramics
Fig. 9 Measured and calculated temperature rise for SUS304
The number of iteration that was required to obtain final solution
was 5 to 8 depending on the experiments. It depends in part on the
initial guess; the smaller difference between the calculated and the
measured temperature rise at the first trial would result in smaller
number of iteration. Hence preparation of larger numbers of pairs of
thermal conductivity and thermal diffusivity for the initial guess
could reduce the iteration. Acceleration of the solution process
would be one of the next subjects.
The results shown in this paper include only one measurement
for each material. The measured thermal transport properties are
likely dependent on the experimental runs. The errors could be
therefore different for different measurement. Hence the accuracy of
the present method will be discussed after checking the
reproducibility of the experimental data and evaluating the error for
each of a number of measurements. However, the results obtained in
the present paper demonstrated the feasibility of our convenient
method for measuring thermal conductivity and thermal diffusivity
of solid materials.
CONCLUSIONS
The final goal of our research is to develop a method for
measuring thermal transport properties using a novel stamp sensor.
We have demonstrated the feasibility of the proposed method by
preliminary measurement of different kinds of samples with a wide
range of thermal transport properties using a prototype sensor. The
conclusions are as follows:
1. The thermal conductivity, the thermal diffusivity and the
thickness of gel layer were determined successfully by the
Gauss-Newton algorithm within five to eight iterations. The
calculated temperature agreed well with the measured temperature
rise of the sensor.
2. Finally obtained thermal conductivity for four different materials
was different from literature value by ~4 to ~13% depending on the
material. The difference in the thermal diffusivity ranged from ~2 to
~22%.
More experiments are needed for evaluation of the accuracy of
the present method. In addition, there are several points to be
improved: preparation of the lists for the initial assumption, more
effective iteration procedure, and estimation of the starting time of
heating, which was not discussed in the present paper.
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NOMENCLATURE
Thermal conductivity (W/m K)
Thermal diffusivity (m2/s)
Thickness of gel layer (m)
T : Temperature (K)
Ttheo : Calculated temperature (K)
Texp : Measured temperature (K)
t : Time (s)
Q : Heating power (W)
SDT : Standard deviation of difference between the calculated and
the measured temperature (K)
H. Takamatsu received the B.E. (1980),
M.E. (1982), and D.E. (1985) in Kyushu
University.
Professor of Department of Mechanical
Engineering, Kyushu University.
His current interests include heat and mass
transfer associated with medicine and
biology.
Syamsul Hadi received the B.E. (1996) in
Sepuluh Nopember Institut of Technology
(ITS), Master (2005) in Gadjah Mada
University (UGM).
Lecturer and researcher of Department
of Mechanical Engineering, Sebelas Maret
University (UNS), Indonesia and a doctor
course student in Kyushu University.
M. Nishitani received the (2010) and M.E.
(2012) in Kyushu University.
Engineer in Production Engineering and
Development Center, Research and
Development Management Headquarters of
FUJIFILM Corporation.
T. Fukunaga received the B.E. (2004),
M.E. (2006), and D.E. (2009) in Kyushu
Sangyo University.
Technical staff of Department of Mechanical
Engineering, Kyushu University.
His current interests include developing
technique and strategies for lithography
technique and thin film fabrication.
.
K. Kurata received the B.E. (1996), M.E.
(1998), and D.E. (2001) in Kyushu
University.
Associate Professor of Department
of Mechanical Engineering, Kyushu
University.
His current interests include biomechanical
engineering associated with hard and soft
tissues.