container means to an electrical power source: a hanger for supporting the container means in the plating solution; and an electri- cal connection fixedly attaching the cable to the container, said electrical connection being within the plating solution when the con- tainer is supported within the plating solution by the hanger. Plating Portions of a Printed

Wiring Board U.S. Patent 5,766,492. June 16, 1998

Method for Treating Tin Plating T Sadahisa et al., assignors to N@pon famf Co. Bath Sludge Ltd., Osaka& Japan and IBM. Armonk, N. Y

U.S. fafent .5,766,440. June 16. 1998 7: In0 et al., assignors to Kawasaki Steel Corp. and Mhon Parkerizing Co. Lfd, bofh of Japan

In a method for treating sludge compris- ing sodium stannic hexafluoride, sodium ferric hexafluoride, and ferric ferrocyanide, said sludge being a by-.product of a process of tin electroplating of steel plate by means of a plating bath containing cyanides and haloid ions. the steps which comprise im- mersing and mixing the sludge into an aqueous bath having a pH of 7 or less to form a slurry; physically separating the remaining solids that comprise sodium fer- ric hexatluoride and ferric ferrocyanide from the slurry to form a separated solution and residual solids; and subjecting the re-

coating; forming an etching resist -coating on the electric circuit, including the elec-

A method of metal plating electrode por- tions of a printed wiring board comprising

trode portions: and removing by etching

forming an electric circuit on the printed wiring board; copper plating an overall sur- face of the printed wiring board including the electric circuit so as to form a copper layer; forming a metal plating resist coating over a surface of the printed wiring board including the electric circuit, except for electrode portions: subjecting, at least one time. said electrode portions to an electro- lytic metal plating process to form a metal plated layer only over the electrode por- tions; removing the metal plating resist

sidual solids to alkali hvdrolvsis within a temperature range of 100 to 400°C to con- vert halide ions and cyanides to compounds comprising insoluble halides and at least one formate.

the copper layer from the overall surface of the printed wiring board, except from on the electric circuit; and removing the etch- ing resist coating.

Continuous Processing for Powder Coating Production U.S. Patent 5,766,522. June IS, 1998 A.T: Da/y et a/., assignors to Morfon lnfernafional inc., Chicago

Stainless Steel Passivation

In a method for producing a powder coating, the step of contacting a powder

Treatment

coating precursor stream comprising pow- der coating ingredients including at least one resin and at least one additional pow- der coating ingredient in a continuous ex- truder with a process media fluid effective to t-educe the viscosity of the powder coat- ing precursor stream to allow continuous extrusion of the powder coating precursor stream at a lower temperature, said process media fluid comprising a process media material in the form of a fluid selected from the group consisting of supercritical fluids and liquified gases.

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