Cree High-Brightness LED Soldering & Handling · 2015-12-29 · 1 SLDeRING ANDLING Copyright 2011‑2015 Cree Inc. all rights reserved. The information in this document is subect

11

Soldering & handling

Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.

Cree, Inc.4600 Silicon Drive

Durham, NC 27703USA Tel: +1.919.313.5300

CLD

-CTA

P001 R

ev 22Cree® High‑Brightness LED

Soldering & Handling

FeaturesThe purpose of this document is to provide customers and users with a clear understanding about the ways to use our LeD lamps

appropriately.

DescriptionGenerally, LeDs can be used the same way as other general-purpose semiconductors. When using Cree’s Lamps, the following

precautions must be taken to protect the LeD.

P2 anD P4 LEDS

1. Cleaning

• Don’tuseunspecifiedchemicalliquidstocleantheLED;thechemicalcouldharmtheLED.Whenwashingisnecessary,please

wipetheLEDwithalcoholatnormalroomtemperatureanddryatnormalroomtemperaturefor15 minutesbeforeuse.

• TheinfluenceofultrasoniccleaningontheLEDsdependsonfactorssuchasultrasonicpowerandthewaytheLEDsaremounted.

Ultrasoniccleaningshouldbepre‑qualifiedtoensurethiswillnotcausedamagetotheLEDs.

2. Forming

• Duringleadsforming,theleadsshouldbebentatapointatleast3 mmfromthebaseofthepackage.

• Don’tformtheleadsduringoraftersoldering.Ifformingisrequired,thismustbedonebeforesoldering.

• Avoid stressing the LeD package during leads forming.

• When mounting the LeDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LeDs.

3. Storage

• 25 °Cand<40% RHinproperpackage

4. Soldering

• Aminimalcathodepadareaof0.18×0.18inchessquaredisrecommendedforP2LEDsand0.18×0.18inchessquared×2for

P4LEDs.

• SolderingLEDsatnotlessthan3 mmfromthebaseofthepackageandbelowthetie‑barisrecommended.

• TheLEDsolderingspecificationisshownbelow(suitableforbothleadedsolder&lead‑freesolder).

22


2

HigH-BrigHtness LeD soLDering & HanDLing

Manual Soldering Solder Dipping

Soldering iron 35 Wmax Preheat 110 ºCmax

Temperature 300 ºCmaxPreheat time 60 secondsmax

Solder-bath temperature 260 ºCMax

Soldering time 3 secondsmax Dipping time 5 secondsmax

Position Notlessthan3 mmfromthebaseofthepackage. Position Notlessthan3 mmfromthebaseofthepackage.

• ManualsolderingontothePCBisnotrecommendedbecausesolderingtimeisuncontrollable.

• The recommended wave soldering is as below:

Differentlead‑freesolderrequiresdifferentsolderconditions.Pleasecontactusfordetails.

• Do not apply any stress to the LeD package, particularly when heated.

• TheLEDsmustnotbere usedoncetheyhavebeenextractedfromPCB.

• AfterLEDsoldering,thepackageshouldbeprotectedagainstmechanicalshockorvibrationuntiltheLEDshavereached40 ºCor

below.

• Precautions must be taken as mechanical stress on the LeDs may be caused by PCB warpage or from the clinching and cutting of

the LeD leads.

• WhenclampingofLEDsduringsolderingisrequired,itisimportanttoensurenomechanicalstressisexertedontheLEDs.

• Lead cutting must be performed at normal room temperature. Lead cutting at an elevated temperature may lead to LeD failures.

10 20 30 40 50 60 70 80 90 100 110 1200

30

150

100

300

250

200

50

Tem

pera

ture

ºC

Times (sec)

laminar wave

Fluxing

Preheat

33


3


5. Electrostatic Discharge and Surge Current

• Electrostaticdischarge(ESD)orelectricaloverstress(EOS)maydamageLEDs.

• Precautions such as eSD wrist straps, eSD shoe straps or antistatic gloves must be worn whenever handling the LeDs.

• Alldevices,equipmentandmachinerymustbeproperlygrounded.

• ItisrecommendedtoperformelectricalteststoscreenoutESDfailuresatfinalinspection.

• It is important to eliminate the possibility of electrical overstress during circuitry design.

6. Heat Management

• HeatmanagementofLEDsmustbetakenintoconsiderationduringthedesignstageofanLEDapplication.Thecurrentshouldbe

de‑ratedappropriatelybyreferringtothede‑ratingcurveincludedineachproductspecification.

• The temperature surrounding the LeD shouldn’t be so high that it will make the LeD fail when used in an application, and the

temperaturesurroundingtheLEDintheapplicationshouldconformtothede‑ratingcurveinourLEDspecificationdocuments.

7. Other notes

• Care must be taken so that reverse voltage will not exceed the absolute maximum rating.

• Theleadsareplatedwithsolder.Leadswillbecometarnishedifincontacthydrogensulfideandothergaseouschemicals.Precautions

must be taken to maintain a clean storage atmosphere.

• The power of high-brightness LeDs is very strong and may injure human eyes. Precautions must be taken such as avoiding looking

directly into lit LeDs.

• 3-mm conventional LeDs are not auto-insertable.

SMD LEDS

1. Cleaning

• Don’tuseunspecifiedchemicalliquidstocleananSMDLED;thechemicalcouldharmtheSMDLED.Whenwashingisnecessary,

please wipe the LeD with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.

• TheinfluenceofultrasoniccleaningontheSMDLEDdependsonfactorssuchasultrasonicpowerandthewaytheSMDLEDsare

mounted.Ultrasoniccleaningshouldbepre‑qualifiedtoensurethiswillnotdamagetheSMDLED.

2. Moisture‑Proof Packing

• In order to prevent moisture absorption into the SMD LEDs during the transportation and storage, the LEDs are packed in a

moisturebarrierbag.Desiccantsandahumidity indicatorarepackedtogetherwiththeSMDLEDsassecondaryprotection.The

humidity‑indicatorcardindicatesthehumiditywithintheSMDpacking.

3. Storage

• Do not open the sealed bag before you are ready to use the products.

44


4


• Shelflifeintheoriginalsealedbagatthestorageconditionof≤40 ºCand≤90%RHis12months.Bakingisrequiredwhenevershelf

life is expired.

• Before opening the sealed bag, please check whether or not the bag leaked air.

• Afteropeningthesealedbag,theSMDLEDmustbestoredunderthecondition<30 ºCand<60%RH.Undertheseconditions,the

SMDLEDsmustbeused(subjecttoreflow)within24hoursafterbagopening,andbakingisrequiredwhenexceeding24hours.

• Forbaking,placetheSMDLEDsinanovenat80 ºC±5 ºCandrelativehumidity<=10%RHfor24hours.

• Takethematerialoutofthepackagingbagforre‑bake.Donotopentheovendoorfrequentlyduringthebakingprocess.

• Pleaserefertotheproductspecificationsformoredetailedinformation.

4. SolderingManual soldering by soldering iron

• Since the temperature of manual soldering is not stable, manual soldering by soldering iron is not recommended.

• Ifmanualsolderingisnecessary,theuseofasolderingironoflessthan25 Wisrecommended,andthetemperatureoftheironmust

bekeptatbelow315 ºC,withsolderingtimewithin2seconds.

• TheepoxyresinoftheSMDLEDshouldnotcontactthetipofthesolderingiron.

• NomechanicalstressshouldbeexertedontheresinportionoftheSMDLEDduringsoldering.

• HandlingoftheSMDLEDshouldbedonewhenthepackagehasbeencooleddowntobelow40 ºCorless.ThisistopreventLED

failures due to thermal-mechanical stress during handling.

Reflow Soldering

• The temperature profile (1) is as below (for SMD LED CLV1A‑FKB/CLV1L‑FKB/CLV6B‑FKB/CLV6D‑FKB/CLX6B‑FKC/CLX6C‑FKB/

CLX6D‑FKB/CLX6E‑FKC/CLX6F‑FKC/CLY6C‑FKC/CLY6D‑FKC/CLYBA‑FKA):

Document No.: CREE-05-0057 Rev. NO. : 17

6/11

Use all SMD besides LP6-NPP1-01-N1 Solder = Sn63-Pb37 Solder = Lead-free

Average ramp-up rate = 4ºC/s max. Average ramp-up rate = 4ºC/s max

Preheat temperature = 100ºC ~150ºC Preheat temperature = 150ºC ~200ºC

Preheat time = 120s max. Preheat time = 120s max.

Ramp-down rate = 6ºC/s max. Ramp-down rate = 6ºC/s max.

Peak temperature = 230ºC max. Peak temperature = 250ºC max.

Time within 5ºC of actual Peak Temperature = 10s max. Time within 5ºC of actual Peak Temperature = 10s max.

Duration above 183ºC is 60s max. Duration above 217ºC is 60s max. Only use LP6-NPP1-01-N1 Solder = Low Lead-free

Average ramp-up rate = 3ºC/s max.

Preheat temperature = 130ºC ~170ºC

Preheat time = 120s max.

Ramp-down rate = 6ºC/s max.

Peak temperature = 213ºC max.

Time within 3ºC of actual Peak Temperature = 25s max.

Duration above 200ºC is 40s max.

Recommended solder pad design for heat dissipation (LM1 series):

0.5

7.5

7.0

4.5

2.6

1.5

Meltingpoint

Pre-heat Reflow Cooling

Time

Tem

pera

ture

55


5


Solder

Average ramp-up rate 4 ºC/secondmax.

Preheat temperature 150 ºC~200 ºC

Preheat time 120 seconds max.

Ramp-down rate 6 ºC/secondmax.

Peak temperature 250 ºCmax.

Timewithin5 ºCofpeaktemperature 10 seconds max.

Durationabove217 ºC 60 seconds max.

• Thetemperatureprofile(2)isasbelow(forSMDLEDCLMVB‑DKA/CLMVB‑FKA/CLMVC‑FKA/CLMUC‑FKA/CLP6CFKB/CLV1S‑FKB/

CLV6A‑FKB/CLX6A‑FKB/CLVBA‑FKAandotherproductsnotlistedherein):

Solder

Average ramp-up rate 4 ºC/smax.

Preheat temperature 150 ºC~200 ºC

Preheat time 120 seconds max.

Ramp-down rate 6 ºC/smax.

Peak temperature 235 ºCmax.

Timewithin5 ºCofpeaktemperature 10 seconds max.

Durationabove217 ºC 45secondsmax.

Meltingpoint

Tem

pera

ture

Time

Pre-heat CoolingReflowSoak

66


6


Theunitsinthegraphsbelowareinmillimeters(mm).

LM1 series recommended solder-pad design for heat dissipation:

LM4 & LM2 series recommended solder-pad design for heat dissipation:

LV1 & La1 & LVB series recommended solder-pad design for heat dissipation:

5/13

� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:

7.5

0.5

7.0

2.6

4.5

1.5

1.5

� LM4 & LM2 series recommended solder pad design for heat dissipation:

7.50.5

7.0

0.4

4.51.5 1.5

2.6

1.1

� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:

9.5

1.52.52.50.5

7.0

0.4

0.5

3.3

1.65

2.6

1.1

4.51.5 1.5

� LP6 series recommended solder pad design for heat dissipation:

5/13


7.5

0.5

7.0

2.6

4.5

1.5

1.5


7.50.5

7.0

0.4

4.51.5 1.5

2.6

1.1


9.5

1.52.52.50.5

7.0

0.4

0.5

3.3

1.65

2.6

1.1

4.51.5 1.5


5/13


7.5

0.5

7.0

2.6

4.5

1.5

1.5


7.50.5

7.0

0.4

4.51.5 1.5

2.6

1.1


9.5

1.52.52.50.5

7.0

0.4

0.5

3.3

1.65

2.6

1.1

4.51.5 1.5


5/13


7.5

0.5

7.0

2.6

4.5

1.5

1.5


7.50.5

7.0

0.4

4.51.5 1.5

2.6

1.1


9.5

1.52.52.50.5

7.0

0.4

0.5

3.3

1.65

2.6

1.1

4.51.5 1.5


5/13


7.5

0.5

7.0

2.6

4.5

1.5

1.5


7.50.5

7.0

0.4

4.51.5 1.5

2.6

1.1


9.5

1.52.52.50.5

7.0

0.4

0.5

3.3

1.65

2.6

1.1

4.51.5 1.5


5/13


7.5

0.5

7.0

2.6

4.5

1.5

1.5


7.50.5

7.0

0.4

4.51.5 1.5

2.6

1.1


9.5

1.52.52.50.5

7.0

0.4

0.5

3.3

1.65

2.6

1.1

4.51.5 1.5


77


7


LP6 series recommended solder-pad design for heat dissipation:

LU6 series recommended solder-pad design for heat dissipation:

Small‑top SMD LM3 series recommended solder-pad design for heat dissipation:

Note

Metalareaat1,2,3shouldnot

be less than 40 mm2 each for

sufficientheatdissipation.

6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0

� LU6 series recommended solder pad design for heat dissipation:

4.71.65 1.4

0.8

0.3

5

9.4

9.5

4.01

.8

4

5

3

2

61

� Small Top SMD LM3 series recommended solder pad design for heat dissipation:

� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:

� LA6 series recommended solder pad design for heat dissipation:

Note:

Metal area at 1, 2, 3 should not

be less than 40mm2 each for

sufficient heat dissipation.

1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




Note


be less than 16 mm2 each for

sufficientheatdissipation.

6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0


4.71.65 1.4

0.8

0.3

59.4

9.5

4.01

.8

4

5

3

2

61




Note:




1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0


4.71.65 1.4

0.8

0.3

5

9.4

9.5

4.01

.8

4

5

3

2

61




Note:




1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0


4.71.65 1.4

0.8

0.3

5

9.4

9.5

4.01

.8

4

5

3

2

61




Note:




1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0


4.71.65 1.4

0.8

0.3

59.4

9.5

4.01

.8

4

5

3

2

61




Note:




1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




88


8


Mini side 0.8‑mm SMD LS8 series recommended solder-pad design for heat dissipation:

La6 series recommended solder-pad design for heat dissipation:

LB6 series recommended solder-pad design for heat dissipation:

6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0


4.71.65 1.4

0.8

0.3

5

9.4

9.5

4.01

.8

4

5

3

2

61




Note:




1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




6/13

1.60.

5

2.0

4

5

3

2

8.4

6

A

1

6.6

2.0

2.43.0


4.71.65 1.4

0.8

0.3

5

9.4

9.5

4.01

.8

4

5

3

2

61




Note:




1.3

4.0

9.3

1.3

2.2

1.55

4.4

1.0

0.9

1.4

3.81.0

Note:




7/13

0.8

0.7

0.8

2.9

0.3

4.51.5 1.5

� LB6 series recommended solder pad design for heat dissipation:

1.5

1.4

1.5

5.2

0.4

7.4

1.8 3.8

� LT6 series recommended solder pad design for heat dissipation:

2.7

0.65

2.6

0.7

0.851.0

0.3

� LMV series recommended solder pad design for heat dissipation:

7/13

0.8

0.7

0.8

2.9

0.3

4.51.5 1.5

� LB6 series recommended solder pad design for heat dissipation:

1.5

1.4

1.5

5.2

0.4

7.4

1.8 3.8

� LT6 series recommended solder pad design for heat dissipation:

2.7

0.65

2.6

0.7

0.851.0

0.3

� LMV series recommended solder pad design for heat dissipation:

99


9


LT6 series recommended solder-pad design for heat dissipation:

LMV series recommended solder-pad design for heat dissipation:

7/13

0.8

0.7

0.8

2.9

0.3

4.51.5 1.5

� LB6 series recommended solder pad design for heat dissipation :

1.5

1.4

1.5

5.2

0.4

7.4

1.8 3.8

� LT6 series recommended solder pad design for heat dissipation :

� LMV series recommended solder pad design for heat dissipation :

2.7

0.65

2.6

0.7

0.851.0

0.3

8/13

0.8

0.8

1.9

2.51 1

� LMU series recommended solder pad design for heat dissipation:

0.8

0.8

1.9

2.5

1 1

� LV6 series recommended solder pad design for heat dissipation:

1.7

5.65

1.3

1.7 0.

475

8.2

2.7 2.8

� LX6 series recommended solder pad design for heat dissipation:

1010


10


LMU series recommended solder-pad design for heat dissipation:

LV6 series recommended solder-pad design for heat dissipation:

8/13

0.8

0.8

1.9

2.51 1


0.8

0.8

1.9

2.5

1 1


1.7

5.65

1.3

1.7 0.

475

8.2

2.7 2.8


8/13

0.8

0.8

1.9

2.51 1


0.8

0.8

1.9

2.5

1 1


1.7

5.65

1.3

1.7 0.

475

8.2

2.7 2.8


1111


11


LX6 series recommended solder-pad design for heat dissipation:

LY6 series recommended solder-pad design for heat dissipation:

9/13

� LY6 series recommended solder pad design for heat dissipation:

� Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications

must be pre-qualified to avoid damaging SMD LED.

� Reflow soldering should not be done more than one time.

� No stress should be exerted on the package during soldering.

� The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.

1.6

1.8

5.0

2.8

0.350.

70.

70.

7

9/13

� LY6 series recommended solder pad design for heat dissipation:

� Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications

must be pre-qualified to avoid damaging SMD LED.

� Reflow soldering should not be done more than one time.

� No stress should be exerted on the package during soldering.

� The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.

4.0

1.6

1.6

1.8

5.0

2.8

0.350.

70.

70.

7

0.5

0.5

0.5

0.40

1.2

2.3

1212


12


• ModificationofanSMDLED isnot recommendedaftersoldering. Ifmodificationcannotbeavoided, themodificationsmustbe

pre‑qualifiedtoavoiddamagingtheSMDLED.

• Reflowsolderingshouldnotbedonemorethanonetime.

• No stress should be exerted on the package during soldering.

• ThePCBshouldnotbewrappedaftersolderingtoallownaturalcoolingdownto40°.

5. Important notes (Small‑top and Mini‑side 0.8‑mm SMD Products)

• ThepackagingsizesoftheseSMDproductsareverysmallandtheresinisstillsoftaftersolidification.Usersarerequiredtohandle

withcare.NevertouchtheresinsurfaceofSMDproducts.

• Toavoiddamaging theproduct’ssurfaceand interiordevice, it is recommendedtochooseaspecialnozzle topickup theSMD

productsduringtheprocessofSMTproduction. Ifhandlingisnecessary,takespecialcarewhenpickinguptheseproducts.The

following two methods are necessary:

Fig.1a:ForSmallTopSMD Fig.1b:ForMini‑slde0.8 mmSMD

• SMDnozzle

For example: CLA1B

Forsilicone‑coveredSMDLEDs, it is recommended tousenon‑metallicnozzles.CreeandseveralofCree’scustomershavehad

successusingnozzlesfabricatedfromTeflonorfrom90durethane.

Document No.: CREE-05-0057 Rev. NO. : 16

9/9

pick up SMD products during the process of SMT production . If handling is necessary, it should take more

careful to pick up these products. The following two methods are necessary :

Fig. 1a: For Small Top SMD Fig. 1b: For Mini side 0.8mm SMD

For Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two

figure size for reference : a.) Circular Nozzle: inner diameter: Ø1.8mm+/-0.05mm, outer diameter: Ø2.3mm+/-0.05mm.

b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.

6. Electrostatic Discharge and Surge current Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED.

Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED.

All devices, equipment and machinery must be properly grounded.

It is recommended to perform electrical test to screen out ESD failures at final inspection.

It is important to eliminate the possibility of surge current during circuitry design

7. Heat Management

Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The

current should be de-rated appropriately by referring to the de-rating curve attached on each product specification. Data is subject to change without prior notice.

1313


13


• Items to notice before opening the bag:

1. Checktheshelflife(countingfromtheFQCstampingdateontheproductlabel).Iftheshelflifeisover12months,re‑bakingis

required.

2. RecordthelotnumberoftheSMDproducttoaidinvestigation.

3. Avoidexternaldamagetothepackagingbagafterproductistakenoutofthebox.Forexample,manySMDproductsarestacked

withoutbox;re‑packingwithbubbleplasticbagforprotectionisrecommended.

4. Before opening the vacuum-sealed bag, check for air leakage.

5. Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to re-pack

convenientlyforproductnottobeusedwithin24hours.

1414


14


• Items to notice after opening the bag:

1. Checkthecolorofthehumidity‑indicationcard(30%RH)atthetimeofopeningthevacuum‑sealedbag.Ifthecolorisslight

greenorblue,bakingisrequiredbeforeusage.

2. Record the date and time on the reel.

3. Theproductshouldbeusedwithin24hours.

4. IfSMDproductscan’tbeusedwithin24hours,theyshouldbere‑packedinavacuum‑sealedbag.Beforeattemptingtouseagain,

bakingisrequired.

• Bakingisrequiredwhenthefollowingconditionsoccur:

1. Shelflifehasexpired(over12months).

2. The vacuum-sealed bag has an air leak.

3. Thehumidity‑indicationcardhaschangecolorat30%RHatthetimeofopeningthevacuum‑sealedbag.

4. Thevacuum‑sealedbaghasbeenopened,butthestepslistedunder“Noticeitemsafteropeningthebag”(above)havenotbeen

followed.

• Baking method:

1. TheSMDLEDshouldnotbebakedwithinthepackagingbag.Thebakingconditionis80 ºCfor24hours.Theovendoorshould

notbeopenedfrequentlyduringthebakingprocess.

2. Refer to the photo below for a baking model that can help avoid reel deformation.

Color changeNormal

1515


15


For small reels For large reels

3. Bakedproductsshouldcooldownto40 ºCintheovenbeforebeingremovedforuse.

6. Electrostatic Discharge and Electrical Overstress

• Electrostaticdischarge(ESD)orelectricaloverstress(EOS)maydamageanSMDLED.

• PrecautionssuchasESDwriststraps,ESDshoestrapsorantistaticglovesmustbewornwheneverhandlingSMDLEDs.

• Alldevices,equipmentandmachinerymustbeproperlygrounded.

• ItisrecommendedtoperformelectricaltesttoscreenoutESDfailuresatfinalinspection.

• It is important to eliminate the possibility of electrical overstress during circuitry design.

7. Heat ManagementHeatmanagementofSMDLEDsmustbetakenintoconsiderationduringthedesignstageofSMDLEDapplications.Thecurrentshould

bede‑ratedappropriatelybyreferringtothede‑ratingcurveincludedineachproductspecification.

1616


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8. SMD Screen Product Moisture Sensitivity Level

Product Family P/n Moisture Sensitivity Level

SMDLEDs

CLMVB‑DKA

5a

CLMVB‑FKA

CLMVC‑FKA

CLMUC‑FKA

CLP6C‑FKB

CLV1A‑FKB

CLV1L‑FKB

CLV1S‑FKB

CLV6A‑FKB

CLV6B‑FKB

CLV6D‑FKB

CLVBA‑FKA

CLX6A‑FKB

CLX6B‑FKC

CLX6C‑FKB

CLX6D‑FKB

CLX6E‑FKC

CLX6F‑FKC

CLY6C‑FKC

CLY6D‑FKC

CLYBA‑FKA

The information in this document is subject to change without notice.

Documents

Cree High-Brightness LED Soldering & Handling · 2015-12-29 · 1 SLDeRING ANDLING Copyright 2011‑2015 Cree Inc. all rights reserved. The information in this document is subect