CS710-CF - Industrial CF Product Specifications

Apacer Technology Inc.

1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C

Tel: +886-2-2267-8000 Fax: +886-2-2267-2261

www.apacer.com

Halogen-free & RoHS Recast Compliant

CS710-CF Industrial CF Product Specifications

April 19, 2019

Version 1.4

1 © 2019 Apacer Technology Inc.

Specifications Overview:

CompactFlash Association Specification Revision 6.1 Standard Interface

– ATA command set compatible

– ATA transfer mode supports: PIO Mode 6, Multiword DMA Mode 4, Ultra DMA Mode 6 in True-IDE mode

Capacity

– 128, 256, 512 MB

– 1, 2, 4, 8, 16, 32, 64 GB

Performance*

– Sequential read: Up to 55 MB/sec

– Sequential write: Up to 55 MB/sec

– Random read (4K): Up to 2,000 IOPS

– Random write (4K): Up to 1,000 IOPS

Flash Management

– Global Wear Leveling

– Built-in BCH ECC capable of correcting up to 96 bits in 1KB data

– Supports S.M.A.R.T commands

– Flash Block Management

– Power Failure Management

Reliability

– Supply voltage power-down detection for full power-down robustness

NAND Flash Type: SLC

MTBF: >2,000,000 hours

Temperature Range

– Operating:

Standard: 0°C to 70°C

Wide: -40°C to 85°C

– Storage: -40°C to 100°C

Supply Voltage

– 3.3V ± 5%

– 5.0V ± 10%

Power Consumption*

Operating Voltage: 3.3V

– Active mode: 145 mA

– Standby mode: 10 mA

Operating Voltage: 5.0V

– Active mode: 145 mA

– Standby mode: 10 mA

Connector Type

– 50 pins female

Form Factor

– 36.4mm x 42.8mm x 3.3mm

– Net Weight: 9.79 g

Halogen Free

RoHS Recast Compliant

– Complies with 2011/65/EU Standard

*Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations or platform settings.


Table of Contents

1. General Descriptions ........................................................................3

1.1 Intelligent Endurance Design ..................................................................................................... 3

1.1.1 Error Correction Code (ECC) .................................................................................................. 3

1.1.2 Global Wear Leveling ............................................................................................................. 3

1.1.3 S.M.A.R.T. Technology ........................................................................................................... 3

1.1.4 Flash Block Management ....................................................................................................... 4

1.1.5 Power Failure Management .................................................................................................... 4

2. Functional Block ...............................................................................5

3. Pin Assignments ................................................................................6

4. Product Specifications......................................................................8

4.1 Capacity ........................................................................................................................................ 8

4.2 Performance ................................................................................................................................. 8

4.3 Environmental Specifications .................................................................................................... 9

4.4 Mean Time Between Failures (MTBF) ........................................................................................ 9

4.5 Certification and Compliance ..................................................................................................... 9

5. Software Interface ......................................................................... 10

5.1 CF-ATA Command Set .............................................................................................................. 10

6. Electrical Specifications ............................................................... 13

6.1 Operating Voltage ...................................................................................................................... 13

6.2 Power Consumption .................................................................................................................. 13

6.3 AC/DC Characteristics .............................................................................................................. 14

6.3.1 DC Characteristics ................................................................................................................ 14

6.3.2 AC Characteristics ................................................................................................................ 16

7. Physical Characteristics ................................................................ 20

7.1 Dimensions ................................................................................................................................ 20

7.2 Net Weight .................................................................................................................................. 20

8. Product Ordering Information ........................................................ 21

8.1 Product Code Designations ..................................................................................................... 21

8.2 Valid Combinations ................................................................................................................... 22


1. General Descriptions

Apacer’s value-added Industrial CompactFlash Card offers high performance, high reliability and power-efficient storage. Regarding standard compliance, this CompactFlash Card complies with CompactFlash specification revision 6.1, supporting transfer modes up to Programmed Input Output (PIO) Mode 6, Multi-word Direct Memory Access (DMA) Mode 4, Ultra DMA Mode 6 in True-IDE Mode.

Apacer’s value-added CFC provides complete PCMCIA – ATA functionality and compatibility. Apacer‘s CompactFlash technology is designed for applications in Point of Sale (POS) terminals, telecom, IP-STB, medical instruments, surveillance systems, industrial PCs and handheld applications such as the new generation of Digital Single Lens Reflex (DSLR) cameras.

1.1 Intelligent Endurance Design

1.1.1 Error Correction Code (ECC)

The CompactFlash card is programmed with BCH Error Detection Code (EDC) and Error Correction Code (ECC) algorithms capable of correcting up to 96 random bits in 1KB bytes data.

High performance is achieved through hardware-based error detection and correction.

1.1.2 Global Wear Leveling

Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs, when a change is made to stored data, like erase or update, the controller mechanism on HDDs will perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears down the lifespan of blocks gradually. Repeatedly program/erase cycles performed on the same memory cells will eventually cause some blocks to age faster than others. This would bring flash storages to their end of service term sooner. Global Wear leveling is an important mechanism that levels out the wearing of blocks so that the wearing-down of all blocks can be almost evenly distributed. This will increase the lifespan of SSDs.

1.1.3 S.M.A.R.T. Technology

S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard allowing disk drives to automatically monitor their own health and report potential problems. It protects the user from unscheduled downtime by monitoring and storing critical drive performance and calibration parameters. Ideally, this should allow taking proactive actions to prevent impending drive failure. Apacer SMART feature adopts the standard SMART command B0h to read data from the drive. When the Apacer SMART Utility running on the host, it analyzes and reports the disk status to the host before the device is in critical condition.

Code SMART Subcommand

D0h READ DATA

D1h READ ATTRIBUTE THRESHOLDS

D2h Enable/Disable Attribute Autosave

D4h Execute Off-line Immediate

D5h Read Log (optional)

D6h Write Log (optional)

D8h Enable Operations


Code SMART Subcommand

D9h Disable operations

DAh Return Status

General SMART attribute structure

Byte Description

0 ID (Hex)

1 – 2 Status flag

3 Value

4 Worst

5*-11 Raw Data

*Byte 5: LSB

SMART attribute ID list

ID (Hex) Attribute Name

12 (0x0C) Power cycle count

160 (0xA0) Initial bad block count

161 (0xA1) Bad block count

162 (0xA2) Spare block count

163 (0xA3) Max. erase count

164 (0xA4) Avg. erase count

241 (0xF1) Total LBAs written

242 (0xF2) Total LBAs read

1.1.4 Flash Block Management

Current production technology is unable to guarantee total reliability of NAND flash memory array. When a flash memory device leaves factory, it comes with a minimal number of initial bad blocks during production or out-of-factory as there is no currently known technology that produce flash chips free of bad blocks. In addition, bad blocks may develop during program/erase cycles. When host performs program/erase command on a block, bad block may appear in Status Register. Since bad blocks are inevitable, the solution is to keep them in control. Apacer flash devices are programmed with ECC, block mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected, data in those blocks will be transferred to free blocks and error will be corrected by designated algorithms.

1.1.5 Power Failure Management

Power Failure Management plays a crucial role when experiencing unstable power supply. Power disruption may occur when users are storing data into the SSD. In this urgent situation, the controller would run multiple write-to-flash cycles to store the metadata for later block rebuilding. This urgent operation requires about several milliseconds to get it done. At the next power up, the firmware will perform a status tracking to retrieve the mapping table and resume previously programmed NAND blocks to check if there is any incompleteness of transmission.


2. Functional Block

The CompactFlash Card (CFC) includes a controller and flash media, as well as the CompactFlash standard interface. Figure 2-1 shows the functional block diagram.

Figure 2-1 Functional Block Diagram


3. Pin Assignments

Table 3-1 lists the pin assignments with respective signal names for the 50-pin configuration. A “#” suffix indicates the active low signal. The pin type can be input, output or input/output.

Table 3-1 Pin Assignments

Pin No. Memory card mode I/O card mode True IDE mode

Signal name Pin I/O type Signal name Pin I/O type Signal name Pin I/O type

1 GND - GND - GND -

2 D3 I/O D3 I/O D3 I/O





7 #CE1 I #CE1 I #CS0 I

8 A10 I A10 I A101

I

9 #OE I #OE I #ATA SEL I

10 A9 I A9 I A91 I

11 A8 I A8 I A81 I

12 A7 I A7 I A71 I

13 VCC - VCC - VCC -

14 A6 I A6 I A61 I

15 A5 I A5 I A51 I

16 A4 I A4 I A41 I

17 A3 I A3 I A31 I

18 A2 I A2 I A2 I

19 A1 I A1 I A1 I

20 A0 I A0 I A0 I

21 D0 I/O D0 I/O D0 I/O

22 D1 I/O D1 I/O D1 I/O

23 D2 I/O D2 I/O D2 I/O

24 WP O #IOIS16 O #IOCS16 O

25 #CD2 O #CD2 O #CD2 O

26 #CD1 O #CD1 O #CD1 O

27 D11 I/O D11 I/O D11 I/O

28 D12 I/O D12 I/O D12 I/O

29 D13 I/O D13 I/O D13 I/O

30 D14 I/O D14 I/O D14 I/O

31 D15 I/O D15 I/O D15 I/O

32 #CE2 I #CE2 I #CS1 I

33 #VS1 O #VS1 O #VS1 O

34 #IORD I #IORD I #IORD I

35 #IOWR I #IOWR I #IOWR I

36 #WE I #WE I #WE I

37 RDY/-BSY O #IREQ O INTRQ O

38 VCC - VCC - VCC -

39 #CSEL I #CSEL I #CSEL I

40 #VS2 O #VS2 O #VS2 O

41 RESET I RESET I #RESET I

42 #WAIT O #WAIT O IORDY O

43 #INPACK O #INPACK O DMARQ2 O

44 #REG I #REG I DMACK2 I

45 BVD2 O #SPKR O #DASP I/O

46 BVD1 O #STSCHG O #PDIAG I/O


Pin No. Memory card mode I/O card mode True IDE mode

Signal name Pin I/O type Signal name Pin I/O type Signal name Pin I/O type

47 D8 I/O D8 I/O D8 I/O

48 D9 I/O D9 I/O D9 I/O

49 D10 I/O D10 I/O D10 I/O

50 GND - GND - GND - 1. The signal should be grounded by the host. 2. Connection required when UDMA is in use.


4. Product Specifications

4.1 Capacity

Capacity specifications of the Compact Flash Card series (CFC) are available as shown in Table 4-1. It lists the specific capacity and the default numbers of heads, sectors and cylinders for each product line.

Table 4-1 Capacity Specifications

Capacity Total bytes* Cylinders Heads Sectors Max LBA

128 MB 127,696,896 433 16 36 249,408

256 MB 250,961,920 557 16 55 490,160

512 MB 510,787,584 1,732 16 36 997,632

1 GB 1,011,032,064 1,959 16 63 1,974,672

2 GB 2,011,226,112 3,897 16 63 3,928,176

4 GB 4,011,614,208 7,773 16 63 7,835,184

8 GB 8,012,390,400 15,525 16 63 15,649,200

16 GB 16,013,942,784 16,383 16 63 31,277,232

32 GB 32,017,047,552 16,383 16 61 62,533,296

64 GB 64,023,257,088 65,535 16 63 125,045,424 Note: Display of total bytes varies from operating systems. Cylinders, heads or sectors are not applicable for these capacities. Only LBA addressing applies. Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion of the capacity is reserved for device maintenance usages.

4.2 Performance

Performance of the CF cards is listed in Table 4-2.

Table 4-2 Performance Specifications

Capacity

Performance

128 MB

256 MB

512 MB

1 GB 2 GB 4 GB 8 GB 16 GB

32 GB

64 GB

Sequential Read* (MB/s) 24 28 38 55 55 55 55 55 55 55

Sequential Write* (MB/s) 4 8 16 24 42 45 44 55 55 55

Random Read IOPS** (4K) 2,000 2,000 2,000 2,000 2,000 2,000 2,000 2,000 2,000 2,000

Random Write IOPS** (4K) 90 200 400 800 1,000 1,000 1,000 1,000 1,000 1,000 Note: Results may differ from various flash configurations or host system setting. *Sequential performance is based on CrystalDiskMark 5.2.1 with file size 1,000MB. **Random performance measured using IOMeter with Queue Depth 32.


4.3 Environmental Specifications

Environmental specifications of the Compact Flash Card series (CFC) are shown in Table 4-3.

Table 4-3 Environmental Specifications

Item Specifications

Operating temp. 0°C to 70°C (Standard); -40°C to 85°C (Wide)

Non-operating temp. -40°C to 100°C

Operating vibration 7.69 GRMS, 20~2000 Hz/random (compliant with MIL-STD-810G)

Non-operating vibration 4.02 GRMS, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G)

Operating shock 50G, 11ms, half-sine wave

Non-operating shock 1,500G, 0.5ms, half-sine wave

4.4 Mean Time Between Failures (MTBF)

MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value represents the average time between a repair and the next failure. The measure is typically in units of hours. The higher the MTBF value, the higher the reliability of the device. The predicted result of this CompactFlash Card is higher than 2,000,000 hours.

4.5 Certification and Compliance

The CompactFlash card complies with the following global standards:

CE FCC Halogen-free EMC RoHS Recast (2011/65/EU)


5. Software Interface

5.1 CF-ATA Command Set

Table 5-1 summarizes the CF-ATA command set with the paragraphs that follow describing the individual commands and the task file for each.

Table 5-1 CFC-ATA Command Set

Command Set Command Code Protocol

CFA Feature Set Request Sense 03h Non-data

Write Sectors Without Erase 38h PIO data-out

Erase Sectors C0h Non-data

Write Multiple Without Erase CDh PIO data-out

Translate Sector 87h PIO data-in

Write Multiple w/o erase CDh PIO

Write sector(s) w/o erase 38h PIO

General Feature Set Execute Drive Diagnostic 90h Device diagnostic

Flush Cache E7h Non-data

Identify Device ECh PIO data-in

Read DMA C8h DMA

Read Multiple C4h PIO data-in

Read Sector(s) 20h or 21h PIO data-in

Read Verify Sector(s) 40h or 41h Non-data

Set Feature EFh Non-data

Set Multiple Mode C6h Non-data

Write DMA CAh DMA

Write Multiple C5h PIO data-out

Write Sector(s) 30h or 31h PIO data-out

NOP 00h Non-data

Read Buffer E4h PIO data-in

Write Buffer E8h PIO data-out

Set Feature EFh Non-data

Power Management Feature Set

Check Power Mode E5h or 98h Non-data

Idle E3h or 97h Non-data

Idle Immediate E1h or 95h Non-data

Set sleep mode E6h or 99h Non-data

Sleep E6h or 99h Non-data

Standby E2h or 96h Non-data



Standby Immediate E0h or 94h Non-data

Security Mode Feature Set

Security Set Password F1h PIO data-out

Security Unlock F2h PIO data-out

Security Erase Prepare F3h Non-data

Security Erase Unit F4h PIO data-out

Security Freeze Lock F5h Non-data

Security Disable Password F6h PIO data-out

Media Lock DEh Non-data

Media Unlock DFh Non-data

SMART Feature Set SMART Disable Operations B0h Non-data

SMART Enable/Disable Autosave B0h Non-data

SMART Enable Operations B0h Non-data

SMART Return Status B0h Non-data

SMART Execute Off-line Immediate B0h Non-data

SMART Read Data B0h PIO data-in

Host Protected Area Feature Set

Data Set Management 06h DMA

Read Native Max Address F8h Non-data

Read native max addr Ext 27h Non-data

Set Max Address F9h Non-data

Others Format Track 50h PIO data-out

Initialize Drive Parameters 91h Non-data

Recalibrate 1Xh Non-data

Seek 7Xh Non-data

Write Verify 3Ch PIO data-out

Download Microcode 92h PIO data-in

Download Microcode DMA 93h DMA

48-bit Address Feature Set

Read Sector Ext 24h PIO data-in

Read DMA Ext 25h DMA

Read Multiple Ext 29h PIO data-in

Write Sector Ext 34h PIO data-out

Write DMA Ext 35h DMA

Read Verify Sector Ext 42h Non-data

Write Multiple FUA Ext CEh PIO data-out

Flush Cache Ext EAh Non-data

Read Log Ext 2Fh PIO

Read Log DMA Ext 57h DMA



Write DMA FUA Ext 3Dh DMA

Write Log Ext 3Fh PIO

Write Log DMA Ext 57h DMA

Write Multiple Ext 39h PIO

Set max address Ext 37h Non-data


6. Electrical Specifications

6.1 Operating Voltage

Table 6-1 lists the supply voltage for the CompactFlash card.

Table 6-1 Operating Range

Item Range

Supply voltage at 3.3V 3.135 to 3.465 V

Supply voltage at 5V 4.75 to 5.25 V

6.2 Power Consumption

Table 6-2 and 6-3 list the power consumption for the CompactFlash card.

Table 6-2 Power Consumption @3.3V

Capacity

Mode

128 MB

256 MB

512 MB

1 GB 2 GB 4 GB 8 GB 16 GB 32 GB 64 GB

Active (mA) 70 70 100 120 125 130 135 120 125 145

Standby (mA) 10 10 10 10 10 10 10 10 10 10

Table 6-3 Power Consumption @5V

Capacity

Mode

128 MB

256 MB

512 MB

1 GB 2 GB 4 GB 8 GB 16 GB 32 GB 64 GB

Active (mA) 70 75 105 115 120 130 135 125 125 145

Standby (mA) 10 10 10 10 10 10 10 10 10 10 Note: *All values are typical and may vary depending on flash configurations or host system settings. **Active power is an average power measurement performed using CrystalDiskMark with 128KB sequential read/write transfers.


6.3 AC/DC Characteristics

The following section provides general AC/DC characteristics of this CompactFlash card.

6.3.1 DC Characteristics

Absolute Maximum Ratings

Parameter Remark

Supply voltage on 3.3V supply pins -0.5V to 3.63V

Supply voltage on 1.2V supply pins -0.5V to 1.32V

Voltage on CF/PATA pins with respect to ground -0.5V to 6.7V

Voltage on flash pins with respect to ground -0.5V to VDDF + 0.5V

Voltage on GPIO8..15 pins with respect to ground -0.5V to VDDG + 0.5V

Voltage on other pins with respect to ground -0.5V to VCC + 0.5V

Storage temperature -40°C to 125°C

DC Parameters

Parameter Remark

Supply Voltage VCC, AVCC 3.30V ± 5%

Supply Voltage VDDF, VDDG 3.30V ± 5%, 1.80V ± 5%

Supply Voltage VDDC, AVDDC 1.2V ± 5%

Temperature (ambient) -40°C to 85°C (industrial)

General DC characteristics

Symbol Parameter Min Max Unit Remark

VIL, H Input LOW Voltage -0.3 0.8 V CF/PATA host interface

VIH, H Input HIGH Voltage 2.0 5.5 V

VIL Input LOW Voltage -0.3 0.3*VDD V VDD is VDDF (flash IF),

VDDG (GPIO8..15) or VCC (other pins)

VIH Input HIGH Voltage 0.7*VDD *VDD+0.3 V

VOL Output LOW Voltage 0.4 V at 4mA (12mA for DASP)

VOH, H Output HIGH Voltage VCC-0.51 V at 6mA, CF/PATA pins

VOH Output HIGH Voltage VDD-0.4 V at 4mA, other pins

ILI Input Leakage Current -5 5 μA if not pull-up/pull-down

ILO Output Leakage Current -5 5 μA if not pull-up/pull-down

IPURB33 Pull-Up Current 1.5 2.5 mA FnRB0..3 pins, at 3.3V

IPURB18 Pull-Up Current 0.6 1.4 mA FnRB0..3 pins, at 1.8V

IPU Pull-Up Current 15 110 μA other pins

IPD Pull-Down Current 20 160 μA

CIO Input/Output Capacitance 10 pF

ESD ESD Protection 2 kV HBM


Operating Currents

Symbol Parameter Typ Max Unit Remark

IVCC

VCC current

Sleep mode 3.0 4.5 mA

Operating 15 85 mA in UDMA6 mode

IVDDC

VDDC current at 25°C

Sleep mode 1 6 mA

Operating 50 80 mA at 160 MHz CPU clock

IVDDF

VDDF, VDDG current at 80 MHz flash clock,

typical CF card PCB

at 1.8V 8 25 mA

at 3.3V 15 60 mA

IAVCC AVCC current 0.4 0.6 mA

IAVDDC

AVDDC current

Sleep mode 20 200 μA

Operating 4.5 14.0 mA typ for 400 MHz PLL

Voltage Regulator Parameters

1.2V switching regulator (supply for VDDC)

Symbol Parameter Min Typ Max Unit Remark

VI Input voltage (CIN) 3.00 3.30 3.60 V

VO Output voltage 1.15 1.20 1.25 V

IO Average load current 600 mA

VR20 Output ripple 20 MHz BW 15 mV

Ton Startup time 50 μS

LO Output filtering inductor 2.2 μH

CO Output filtering capacitor 2x10 μF 2 capacitors

ESR Output capacitor ESR 2 200 mΩ

ESL Output capacitor ESL 4 nH

1.8V linear regulator (supply for VDDF/VDDG)


VI Input voltage (FIN) 3.00 3.30 3.60 V

VO Output voltage (FOUT) 1.72 1.80 1.88 V

IO Average load current 150 mA

Ton Startup time 10 μS

CO Output filtering capacitor 2.2 μF

ESR Output capacitor ESR 4 200 mΩ

ESL Output capacitor ESL 4 nH

SLEVCC Switchable ISO7816 Power Supply Output Parameters


VSLE SLEVCC Output Voltage VCC -0.2

VCC V When enabled

ISLE SLEVCC Output Current 30 mA

TSLE SLEVCC Ramp Up Time 10 μS

CSLE SLEVCC Output Capacitor 0.1 μF


Supply Voltage Monitor Parameters


Res1.2R 1.2V Reset rising threshold 95 % of 1.2V regulator output

Res3.3R 3.3V Reset rising threshold 2.23 2.35 2.47 V at VCC pin

Res3.3F 3.3V Reset falling threshold 2.15 2.20 2.25 V at VCC pin

S5VH 5V sense high threshold 4.31 4.40 4.49 V at SENSE5V pin

S5VL 5V sense low threshold 3.01 3.07 3.13 V at SENSE5V pin

S3V 3.3V sense threshold 2.84 2.90 2.96 V at SENSE3V pin

The Res1.2R and Res3.3R thresholds are used by the reset logic to release the internal reset signal on a system power-on. The Res3.3L threshold is used to assert the internal reset signal on a system power down.

The S3V and S5V threshold comparators generate interrupts to the firmware. The S3V comparator normally monitors the 3.3V VCC supply, the S5V comparator normally monitors the 5V or 3.3V module supply. The S3V interrupt can be used to stop accesses to the flash memory early on a system power down event. The S5V interrupt can be used to implement a supply hold-up functionality when a backup energy source is available.

In packages that do not have the SENSE3V pin, SENSE3V is internally connected to VCC.

6.3.2 AC Characteristics

The AC Characteristics reference the timing diagrams of the CompactFlash Specification Revision 4.1 and the symbols in these timing diagrams. The AC characteristics are valid for a supply voltage of 3.3V ± 5%.

Attribute Memory Read and Write Characteristics

See figures 25 and 26 in the CF Specification Revision 4.1.

Symbol Parameter Min Max Unit

tc(R) Read cycle time 250 ns

ta(A) Address access time 250 ns

ta(CE) Card Enable access time 250 ns

ta(OE) Output Enable access time 125 ns

tdis(CE) Output disable time from CE 100 ns

tdis(OE) Output disable time from OE 100 ns

ten(CE) Output enable time from CE 5 ns

ten(OE) Output enable time from OE 5 ns

tv(A) Data valid time from address change 0 ns

tsu(A) Address setup time 30 ns

tc(W) Write cycle time 250 ns

tw(WE) Write pulse time 150 ns

trec(WE) Address hold time from WE 30 ns

tsu(D-WEH) Data setup time for WE 80 ns

th(D) Data hold time 30 ns


Common Memory Read and Write Characteristics

See figures 27 and 28 in the CF Specification Revision 4.1. The wait functionality is not used.


tc Cycle time 80 ns

ta(OE) Output Enable access time 45 ns

tdis(OE) Output disable time from OE 45 ns

tsu(A) Address setup time 10 ns

th(A) Address hold time 10 ns

tsu(CE) Card Enable setup time 0 ns

th(CE) Card Enable hold time 10 ns

tw(WE) Write pulse time 55 ns

tsu(A) Address setup time for WE 10 ns

tsu(CE) Card Enable setup time for WE 0 ns

tsu(D-WEH) Data setup time for WE 30 ns

th(D) Data hold time 10 ns

trec(WE) Write recovery time 15 ns

I/O Access Read and Write Characteristics

See figures 29 and 30 in the CF Specification Revision 4.1. The wait functionality is not used.


td(IORD) Data delay after IORD 45 ns

th(IORD) Data hold following IORD 5 ns

tw(IORD) IORD pulse width 55 ns

tsuA(IORD) Address setup time for IORD 15 ns

thA(IORD) Address hold time from IORD 10 ns

tsuCE(IORD) Card Enable setup time for IORD 5 ns

thCE(IORD) Card Enable hold time from IORD 10 ns

tsuREG(IORD) REG setup time for IORD 5 ns

thREG(IORD) REG hold time from IORD 0 ns

tdfINPACK(IORD) INPACK delay falling from IORD 0 45 ns

tdrINPACK(IORD) INPACK delay rising from IORD 45 ns

tdfIOIS16(ADR) IOIS16 delay falling from address 35 ns

tdrIOIS16(ADR) IOIS16 delay rising from address 35 ns

tsu(IOWR) Data setup time for IOWR 15 ns

th(IOWR) Data hold time from IOWR 5 ns

tw(IOWR) IOWR pulse width 55 ns

tsuA(IOWR) Address setup time for IOWR 15 ns

thA(IOWR) Address hold time from IOWR 10 ns

tsuCE(IOWR) Card Enable setup time for IOWR 5 ns

thCE(IOWR) Card Enable hold time from IOWR 10 ns

tsuREG(IOWR) REG setup time for IOWR 5 ns

thREG(IOWR) REG hold time from IOWR 0 ns


True-IDE PIO Mode Read and Write Characteristics

See figure 31 in the CF Specification Revision 4.1. The IORDY functionality is not used.


t0 Cycle time 80 ns

t1 Address setup time for IORD/IOWR 10 ns

t9 Address hold time from IORD/IOWR 10 ns

t2 IORD/IOWR pulse width 55 ns

t2i IORD/IOWR recovery time 20 ns

t5 Data setup time for IORD 10 ns

t6 Data hold following IORD 5 ns

t6z Output disable time from IORD 20 ns

t3 Data setup time for IOWR 15 ns

t4 Data hold following IOWR 5 ns

True-IDE MDMA Mode Read and Write Characteristics

See figure 32 in the CF Specification Revision 4.1.


tO Cycle time 80 ns

tD IORD/IOWR pulse width 55 ns

tE IORD data access 45 ns

tF Data hold following IORD 5 ns

tG Data setup time for IORD/IOWR 10 ns

tH Data hold following IOWR 5 ns

tI DMACK setup time for IORD/IOWR 0 ns

tJ DMACK hold following IORD/IOWR 5 ns

tKR, tKW IORD/IOWR recovery time 20 ns

tLR, tLW IORD/IOWR to DMARQ delay 35 ns

tM CS0, CS1 setup for IORD/IOWR 5 ns

tN CS0, CS1 hold following IORD/IOWR 10 ns

tZ Output disable time from DMACK 25 ns

True-IDE UDMA Mode Read and Write Characteristics

The interface timing in the True-IDE UDMA modes is not only depending on the interface hardware, but also on the correct setup of the UDMA registers in the firmware, according to the UDMA transfer mode selected by the host. With a correct register setup, the interface timing complies to the UDMA Mode 0 to Mode 7 timing specifications of the CF Specification Revision 6.1, and to the UDMA Mode 0 to Mode 6 timing specifications of the ATA/ATAPI-7 Standard.

Toggle Mode Flash Memory Interface Characteristics

The AC Characteristics for the flash memory interface are based on the F9 flash interface clock cycle time. τ is ½ of the flash interface clock cycle time configured in the preformat. In Toggle mode, the valid range for τ is 5ns to 10ns. The table lists the flash memory interface timing based on τ, valid for a load of not more than 45pF on the flash interfacepins.


Symbol Parameter Min Typ Max Unit

tCALS CLE, ALE setup time 6 τ – 2 ns

tCALH CLE, ALE hold time 1.5 τ – 2 ns

tCS CE# setup time 6 τ – 2 ns

tCH CE# hold time 1.5 τ – 2 ns

tCAS Data (command/address) setup time 2.5 τ – 2 ns

tCAH Data (command/address) hold time 1.5 τ – 2 ns

tWC Write cycle time 7.5 τ ns

tWP WE# low pulse width 4 τ – 2 ns

tWH WE# high pulse width 4 τ – 2 ns

tDSC DQS cycle time 2 τ ns

tDQSH DQS high time 0.94 τ ns

tDQSL DQS low time 0.94 τ ns

tDS Data output setup time to DQS 0.5 τ – 1.5 ns

tDH Data output hold time from DQS 0.5 τ – 1.5 ns

tRC Read cycle time 2 τ ns

tRP RE# low pulse width 0.94 τ ns

tREH RE# high pulse width 0.94 τ ns

tDQSQ DQS to input data skew 0.5 τ – 1.6 ns

tQH Input data hold from DQS 0.5 τ + 0.8 ns

ONFI-2 Mode Flash Memory Interface Characteristics

The AC Characteristics for the flash memory interface are based on the F9 flash interface clock cycle time. τ is ½ of the flash interface clock cycle time configured in the preformat. In ONFI-2 mode, the valid range for τ is 5ns to 10ns. The table lists the flash memory binterface timing based on τ, valid for a load of not more than 45pF on the flash interface pins.

Symbol Parameter Min Typ Max Unit

tCK Average clock cycle time 2 τ ns

tCKH Clock high time 0.94 τ 1.06 τ ns

tCKL Clock low time 0.94 τ 1.06 τ ns

tCALS ALE, CLE, W/R# setup time to CLK τ – 3 ns

tCALH ALE, CLE, W/R# hold time from CLK τ – 3 ns

tCS CE# setup time to CLK 5 τ – 3 ns

tCH CE# hold time from CLK τ – 3 ns

tCAS Data output setup time to CLK τ – 3 ns

tCAH Data output hold time from CLK τ – 3 ns

tDQSS DQS phase 2 τ – 2 2 τ + 2 ns

tDQSH DQS high time 0.94 τ 1.06 τ ns

tDQSL DQS low time 0.94 τ 1.06 τ ns

tDS Data output setup time to DQS 0.5 τ – 1.5 ns

tDH Data output hold time from DQS 0.5 τ – 1.5 ns

tDQSQ DQS to input data skew 0.5 τ – 1.6 ns

tQH Input data hold from DQS 0.5 τ + 0.8 ns


7. Physical Characteristics

7.1 Dimensions

Figure 7-1 Physical Dimensions

7.2 Net Weight

Capacity Net Weight (g)

128 MB 8.32

256 MB 8.32

512 MB 8.32

1 GB 8.32

2 GB 9.61

4 GB 8.32

8 GB 8.32

16 GB 8.32

32 GB 9.79

64 GB 8.32

Unit: mm


8. Product Ordering Information

8.1 Product Code Designations

AP – CF xxxX R H N S – XX NR K

Capacity 128M = 128MB 256M = 256MB 512M = 512MB 001G = 1GB 002G = 2GB 004G = 4GB 008G = 8GB 016G= 16GB 032G= 32GB 064G = 64GB

Model Name

Apacer Product Code

Halogen Free Compliant

CFC Type R: Standard CF

CTL Type

Specification NR: Non-Removable

FW

Configuration

Operating Temperature Blank: Standard Temperature ET: Wide Temperature


8.2 Valid Combinations

Capacity Standard Temperature Wide Temperature

128MB AP-CF128MRHNS-NRK AP-CF128MRHNS-ETNRK



1GB AP-CF001GRHNS-NRK AP-CF001GRHNS-ETNRK







Note: Valid combinations are those products in mass production or will be in mass production. Consult your Apacer sales representative to confirm availability of valid combinations and to determine availability of new combinations.


Revision History

Revision Description Date

0.1 Preliminary release 8/10/2018

0.2

- Added Net Weight to Form Factor on Specifications Overview page

- Updated the functional block diagram at 2. Functional Block

- Added 7.2 Net Weight

- Updated Supply Voltage on Specifications Overview page

8/15/2018

1.0 Official release 9/3/2018

1.1 - Updated product photo on the cover page

- Added extended temperature support 10/9/2018

1.2

- Renamed extended temperature to wide temperature

- Revised SMART attribute ID list at 1.1.3 S.M.A.R.T. Technology

- Renamed Power Failure Management to DataDefender at Flash Management on Specifications Overview page and 1.1.5 section and updated the technology description

2/20/2019

1.3 Added ID 241 and 242 to SMART attribute ID list at 1.1.3 S.M.A.R.T. Technology

3/19/2019

1.4

- Replaced DataDefender with Power Failure Management at Flash Management on Specifications Overview

- Updated technology description for 1.1.5 Power Failure Management

4/19/2019


Global Presence

Taiwan (Headquarters) Apacer Technology Inc.

1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan R.O.C. Tel: 886-2-2267-8000 Fax: 886-2-2267-2261 [email protected]

U.S.A. Apacer Memory America, Inc.

46732 Lakeview Blvd., Fremont, CA 94538 Tel: 1-408-518-8699 Fax: 1-510-249-9551 [email protected]

Japan Apacer Technology Corp.

6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku, Tokyo, 108-0023, Japan Tel: 81-3-5419-2668 Fax: 81-3-5419-0018 [email protected]

Europe Apacer Technology B.V.

Science Park Eindhoven 5051 5692 EB Son, The Netherlands Tel: 31-40-267-0000 Fax: 31-40-290-0686 [email protected]

China Apacer Electronic (Shanghai) Co., Ltd

Room D, 22/FL, No.2, Lane 600, JieyunPlaza, Tianshan RD, Shanghai, 200051, China Tel: 86-21-6228-9939 Fax: 86-21-6228-9936 [email protected]

India Apacer Technologies Pvt Ltd,

1874, South End C Cross, 9th Block Jayanagar,

Bangalore-560069, India Tel: 91-80-4152-9061/62 Fax: 91-80-4170-0215 [email protected]

../../../../../Product%20specs/20150903/EH373/[email protected]



mailto:[email protected]


Mouser Electronics

Authorized Distributor

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AP-CF002GRHNS-ETNRK AP-CF001GRHNS-ETNRK AP-CF128MRHNS-NRK AP-CF256MRHNS-NRK AP-

CF004GRHNS-NRK AP-CF064GRHNS-ETNRK AP-CF256MRHNS-ETNRK AP-CF008GRHNS-ETNRK AP-

CF512MRHNS-ETNRK AP-CF004GRHNS-ETNRK AP-CF032GRHNS-NRK AP-CF064GRHNS-NRK AP-

CF008GRHNS-NRK AP-CF128MRHNS-ETNRK AP-CF512MRHNS-NRK AP-CF016GRHNS-ETNRK AP-

CF016GRHNS-NRK AP-CF002GRHNS-NRK AP-CF032GRHNS-ETNRK AP-CF001GRHNS-NRK

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Documents

CS710-CF - Industrial CF Product Specifications