CX3 Model 80 System -- Hardware and Operational Overview · Overview July 7, 2008 This document describes the hardware, ... SP A I/O module 1, SP A SPS B SPS A EMC3432 Figure 2 SPE2

CX3 Model 80 SystemHardware and Operational

OverviewJuly 7, 2008

This document describes the hardware, powerup and powerdownsequences, and status indicators for CX3 model 80 systems, which aremembers of the CX3 UltraScale™ series of storage systems.

Major topics are:

Storage-system major components.................................................. 2Storage processor enclosure (SPE2) ................................................. 4Disk-array enclosures (DAE3Ps) ..................................................... 9Standby power supplies (SPSs)....................................................... 16Powerup and powerdown sequence ............................................... 17Status lights (LEDs) and indicators ................................................. 22

1

Storage-system major components

The storage system consists of:

A storage processor enclosure (SPE2) and two standby powersupplies (SPSs)

One Fibre Channel disk-array enclosure (DAE) with a minimumof five disk drives

Optional DAEs

EMC3465

DAE3P

SPE2

SPS

Figure 1 Storage system

The high-availability features for the storage system include:

Redundant storage processors (SPs)

Standby power supplies (SPS)

Redundant power supplies

Redundant blowers

The SPE2 is a highly available storage enclosure with redundant powerand cooling. It is 4U high (a U is a NEMA unit; each unit is 1.75 inches)

2 Hardware and Operational Overview

and includes two storage processors (SPs). Each SP has four FibreChannel front-end I/O ports and four back-end disk ports.

The storage system supports 4 Gb/s Fibre Channel operation from itsfront-end host I/O ports through its back-end disk ports. The host I/Ofront-end ports can operate at up to 4 Gb/s and the back-end portscan operate at 2 or 4 Gb/s. The storage system senses the speed ofthe incoming host I/O and sets the speed of the front-end ports to thelowest speed it senses. The speed of each back-end port is determinedby the speed of the DAEs connected to it.

The storage system requires at least five disks and works in conjunctionwith one or more disk-array enclosures (DAEs) to provide terabytes ofhighly available disk storage. A DAE is a basic disk enclosure withoutan SP. SPE2 systems include a 4 Gb/s point-to-point DAE3P, whichsupports up to 15 Fibre Channel disks. Each DAE3P connects to theSPE2 or another DAE with simple FC-AL serial cabling.

The storage system supports a total of 480 disks on its back-endbuses. A four-bus configuration (with maximum performance andavailability) supports as many as 120 disks per back-end bus; a two-busconfiguration supports as many as 240 disks per back-end bus. You canplace the disk enclosures in the same cabinet as the SPE, or in one ormore separate cabinets. High-availability features are standard.

CX3 Model 80 storage systems require 200–240 V AC input power.

Hardware and Operational Overview 3

Storage processor enclosure (SPE2)

The SPE2 components include:

A sheet-metal enclosure with a midplane and front bezel

Two storage processors (SPs), each consisting of one CPU moduleand two I/O modules

Two management modules, each with SPS, management, andservice connectors

Four blowers

Two power supplies

Figure 2 shows the SPE2 components. Details on each componentfollow the figure. If the enclosure provides slots for two identicalcomponents, the component in slot A is called component-name A. Thesecond component is called component-name B. For increased clarity, thefollowing figures depict the SPE2 outside of the rack cabinet. YourSPE2 may be installed in a rackmount cabinet.


A B C D

! !

! !

! !

+-

+-

Blower modulesPower supply A Power supply B

Rear

I/O module 0, SP B I/O module 1, SP B

Managementmodule B

Managementmodule A

Fillerpanel

FrontI/O module 0, SP A I/O module 1, SP A

EMC3432SPS ASPS B

Figure 2 SPE2 outside the cabinet — front and rear views

Midplane

The midplane distributes power and signals to all the enclosurecomponents. The power supplies, blowers, and storage processors(SPs) plug directly into midplane connectors.

Front bezel

The front bezel has a key lock and two latch release buttons. Pressingthe latch release buttons releases the bezel from the enclosure. Thefront bezel inhibits electromagnetic interference (EMI). You can takeoff the bezel to replace parts, but EMI compliance requires a properlyinstalled front bezel.

Storage processors (SPs)

The SP is the SPE2’s intelligent component and acts as the controlcenter. Each SP includes:

One CPU module with:

Dual processors

8 GB of DDR DIMM (double data rate, dual in-line memorymodule) memory

Two I/O modules, each with:

Two SFP (small-form factor pluggable) shielded Fibre Channelconnectors (optical) for server I/O (connect to a switch or serverHBA)


Two SFP shielded Fibre Channel connectors (copper SFP) fordisk connections (BE 0 and BE 1 on I/O module 0; BE 2 andBE 3 on I/O module 1).

Figure 3 show the locations of the connectors on the rear of the SPs.

! !

! !

! !

+-

+-

EMC3397

Rear

BE 0BE 1

0 Fibre1 Fibre

BE 2BE 3

2 Fibre3 Fibre

BE 0BE 1

0 Fibre1 Fibre

BE 2BE 3

2 Fibre3 Fibre

Figure 3 Connectors on the rear of the CX3-80 SPs

Management modules

Each SPE2 storage processor has a corresponding management modulethat includes:

One serial port for connection to a standby power supply (SPS) –micro DB9 connector

One 10/100 Ethernet LAN port for management and backup – RJ45connector

One 10/100 Ethernet LAN port for peer service – RJ45 connector

One serial port for RS-232 connection to a service console – microDB9 connector


! !

! !

! !

+-

+-

EMC3368

!

+-

Power

Fault

ServiceSPS

Service

ManagementLAN

Figure 4 CX3–80 management module

Power supplies

A power supply is located on each side of the SPE2. Each powersupply is an auto-ranging, power-factor-corrected, multi-output,offline converter with its own line cord and power switch. Each supplysupports the SPE2 and shares load currents with the other supply.

An SP or power supply with power-related faults does not adverselyaffect the operation of any other component. If one power supply fails,the write caching is disabled. You can replace a failed power supplywhile the SPE2 is powered up.

Blowers

All four blowers cool both storage processors. If one blower fails,the other blowers speed up to compensate. If two blowers fail, theSPE2 powers down. You can replace a failed blower while the SPE2is powered up.

SPE2 field-replaceable units (FRUs)

The following are field-replaceable units (FRUs) that you can replacewhile the SPE2 is powered up:

CPU modules

Memory modules (DIMMs)

I/O modules


Management modules

Small form-factor pluggable (SFP) modules, which plug into theFibre Channel front-end port slots

Power supplies

Blowers

You or your service provider can replace a failed power supply, blower,or SFP module. A service provider must replace the other FRUs if theyfail.


Disk-array enclosures (DAE3Ps)

DAE3P UltraPoint™ (sometimes called "point-to-point") disk-arrayenclosures are highly available, high-performance, high-capacitystorage-system components that use a Fibre Channel Arbitrated Loop(FC-AL) as the interconnect interface. A disk enclosure connects toanother DAE3P or an SPE2 and is managed by storage-system softwarein RAID (redundant array of independent disks) configurations.The enclosure is only 3U (5.25 inches) high, but can include 15 harddisk drive/carrier modules. Its modular, scalable design allows foradditional disk storage as your needs increase.

A DAE3P includes either high-performance Fibre Channel diskmodules or economical SATA (Serial Advanced TechnologyAttachment, “SATA II”) disk modules. You can integrate and connectFC and SATA enclosures within a storage system, but you cannot mixSATA and Fibre Channel components within a DAE3P. The enclosureoperates at either 2 or 4 Gb/s bus speed (2 Gb/s components, includingdisks, cannot operate on a 4 Gb/s bus)..

Simple serial cabling provides easy scalability. You can interconnectdisk enclosures to form a large disk storage system; the number andsize of buses depends on the capabilities of your storage processor. Youcan place the disk enclosures in the same cabinet, or in one or moreseparate cabinets. High-availability features are standard in the DAE.

The DAE3P includes the following components:

A sheet-metal enclosure with a midplane and front bezel

Two FC-AL link control cards (LCCs) to manage disk modules

As many as 15 disk modules

Two power supply/system cooling modules (referred to aspower/cooling modules)

Any unoccupied disk module slot has a filler module to maintain airflow.

The power supply and system cooling components of thepower/cooling modules function independently of each other, but theassemblies are packaged together into a single field-replaceable unit(FRU).


The LCCs, disk modules, power supply/system cooling modules,and filler modules are field-replaceable units (FRUs), which can beadded or replaced without hardware tools while the storage systemis powered up.

Figure 5 shows the disk enclosure components. Where the enclosureprovides slots for two identical components, the components are calledcomponent-name A or component-name B, as shown in the illustrations.

For increased clarity, the following figures depict the DAE3P outside of therack or cabinet. Your DAE3Ps may arrive installed in a rackmount cabinetalong with the SPE.

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!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

Power LED(green or blue)

Fault LED(amber)Power/cooling module B Link control card B

Fault LED(amber)

Disk activityLED (green)

Power/cooling module A Link control card AEMC3437

Figure 5 DAE3P outside the cabinet — front and rear views

As shown in Figure 6, an enclosure address (EA) indicator is located oneach LCC. (The EA is sometimes referred to as an enclosure ID.) Eachlink control card (LCC) includes a bus (loop) identification indicator.The storage processor initializes bus ID when the operating systemloads.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureaddress

#

EA selection(press here tochange EA)

EMC3210

Figure 6 Disk enclosure bus (loop) and address indicators

The enclosure address is set at installation. Disk module IDs arenumbered left to right (looking at the front of the unit) and arecontiguous throughout a storage system: enclosure 0 contains modules0-14; enclosure 1 contains modules 15-29; enclosure 2 includes 30-44,and so on.

Midplane

A midplane between the disk modules and the LCC and power/coolingmodules distributes power and signals to all components in theenclosure. LCCs, power/cooling modules, and disk drives – theenclosure’s field-replaceable units (FRUs) – plug directly into themidplane.

Front bezel

The front bezel has a locking latch and an electromagnetic interference(EMI) shield. You must remove the bezel to remove and install drivemodules. EMI compliance requires a properly installed front bezel.

Link control cards (LCCs)

An LCC supports and controls one Fibre Channel bus and monitorsthe DAE3P.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

EMC3226

Expansion linkactive LED

Primary linkactive LED

Fault LED (amber)

Power LED (green)

!

EXP PRI

EXP PRI

Figure 7 LCC connectors and status LEDs

A blue link active LED indicates a DAE3P enclosure operating at 4 Gb/s. Thelink active LED(s) is green in a DAE3P operating at 2 Gb/s.

The LCCs in a DAE3P connect to other Fibre Channel devices(processor enclosures, other DAE3Ps) with twin-axial copper cables.The cables connect LCCs in a storage system together in a daisy-chain(loop) topology.

Internally, each DAE3P LCC uses FC-AL protocols to emulate a loop;it connects to the drives in its enclosure in a point-to-point fashionthrough a switch. The LCC independently receives and electricallyterminates incoming FC-AL signals. For traffic from the system’s storageprocessors, the LCC switch passes the input signal from the primaryport (PRI) to the drive being accessed; the switch then forwards thedrive’s output signal to the expansion port (EXP), where cables connectit to the next DAE3P in the loop. (If the target drive is not in the LCC’senclosure, the switch passes the input signal directly to the EXP port.)At the unconnected expansion port (EXP) of the last LCC, the outputsignal (from the storage processor) is looped back to the input signalsource (to the storage processor). For traffic directed to the system’sstorage processors, the switch passes input signals from the expansionport directly to the output signal destination of the primary port.

Each LCC independently monitors the environmental statusof the entire enclosure, using a microcomputer-controlled FRU(field-replaceable unit) monitor program. The monitor communicates


status to the server, which polls disk enclosure status. LCC firmwarealso controls the LCC port-bypass circuits and the disk-module statusLEDs.

LCCs do not communicate with or control each other.

Captive screws on the LCC lock it into place to ensure properconnection to the midplane. You can add or replace an LCC while thedisk enclosure is powered up.

Disk modules

Each disk module consists of one disk drive in a carrier. You canvisually distinguish between module types by their different latchand handle mechanisms and by type, capacity, and speed labels oneach module. An enclosure can include Fibre Channel or SATA diskmodules, but not both types. You can add or remove a disk modulewhile the DAE3P is powered up, but you should exercise special carewhen removing modules while they are in use. Drive modules areextremely sensitive electronic components.

Disk drivesThe DAE3P supports Fibre Channel and SATA disks. The FibreChannel (FC) disks conform to FC-AL specifications and 2 or 4 Gb/sFibre Channel interface standards, and supports dual-port FC–ALinterconnects through the two LCCs. A DAE3P supports 2 Gb/s drivesonly if the entire back-end bus that contains the drives is operating at 2 Gb/s.SATA disks conform to Serial ATA II Electrical Specification 1.0 andinclude dual-port SATA interconnects; a paddle card on each driveconverts the assembly to Fibre Channel operation. The disk moduleslots in the enclosure accommodate 2.54 cm (1 in) by 8.75 cm (3.5 in)disk drives.

Table 1 lists the disks that are available for the storage system.


Table 1 Available disks

Available GB

Listed Capacity Disk 0-4 (vault disk) Other disks

73 GB 33.6387 GB 66.6055 GB

146 GB 100.6806 GB 133.6473 GB

300 GB 235.4042 GB 26809 GB

400 GB 333.80 GB 366.76 GB

500 GB N/A 458.5629 GB

750 GB N/A 687.8560 GB

1000 GB 884.1824 GB 917.1492 GB

Notes: 500 GB, 750 GB, and 1000 GB disk are SATA disks and they cannot be used as vault disks (disks 0-4). Usable disk space differsfrom the disk drive size reported by the manufacturer. A drive manufacturer’s definition of a gigabyte is 1,000,000,000 bytes and thestorage system’s "true" definition is 1024 x 1024 x 1024, or 1,073,741,824 bytes.

Drive carrierThe disk drive carriers are metal and plastic assemblies that providesmooth, reliable contact with the enclosure slot guides and midplaneconnectors. Each carrier has a handle with a latch and spring clips.The latch holds the disk module in place to ensure proper connectionwith the midplane. Disk drive activity/fault LEDs are integrated intothe carrier.

Power/cooling modules

The power/cooling modules are located above and below the LCCs.The units integrate independent power supply and dual-blowercooling assemblies into a single module.

Each power supply is an auto-ranging, power-factor-corrected,multi-output, offline converter with its own line cord. Each supplysupports a fully configured DAE3P and shares load currents with theother supply. The drives and LCCs have individual soft-start switchesthat protect the disk drives and LCCs if they are installed while thedisk enclosure is powered up. A FRU (disk, LCC, or power/coolingmodule) with power-related faults does not adversely affect theoperation of any other FRU.

The enclosure cooling system includes two dual-blower modules.If one blower fails, the others will speed up to compensate. If two


blowers in a system (both in one power/cooling module, or one in eachmodule) fail, the DAE3P goes offline within two minutes.


Standby power supplies (SPSs)

Two 2U 2200-watt DC SPSs provide backup power for one SPE2 andthe first (enclosure 0, bus 0) DAE3P adjacent to it. The two SPSsprovide high availability and allow write caching — which preventsdata loss during a power failure — to continue. A faulted or not fullycharged SPS disables write caching. Each SPS rear panel has one ACinlet power connector with power switch, AC outlets for the SPE2 andthe first DAE3P (EA 0, bus 0) respectively, and one phone-jack typeconnector for connection to a management module. Figure 8 showsthe location of the SPS connectors.

Online Battery onReplace batterySPS fault

LEDs:

AC infromPDU

Powerswitch

RJ12 to RS-232interface on SPE

AC out to SPE and DAEEA0, bus 0

SPS B SPS A

EMC3365

Figure 8 2200 W SPS connectors

A service provider can replace an SPS while the storage system ispowered up.


Powerup and powerdown sequence

The SPE2 and DAE3P do not have power switches.

Powering up the storage system

1. Verify the following:

❑ Master switch/circuit breakers for each cabinet/rack powerstrip are off.

❑ The two power cords for the SPE2 power supplies are pluggedinto the SPSs and the power cord retention bails are in place.

❑ Serial connections between the SPE2 management modules andthe SPSs are in place.

❑ Power cords for the first DAE3P (EA 0, bus 0; often calledthe DAE-OS) are plugged into the SPSs and the power cordretention bails are in place.

❑ The power cords for the SPSs and any other DAE3Ps areplugged into the cabinet’s power strips.

❑ The power switches on the SPSs are in the on position.

❑ Any other devices in the cabinet are correctly installed andready for powerup.

2. Turn on the master switch/circuit breakers for each cabinet/rackpower strip.

In the 40U-C cabinet, master switches are on the power distributionpanels (PDPs), as shown in Figure 9.


Each AC circuit in the 40U-C cabinet requires a source connection that cansupport a minimum of 4800 VA of single phase, 200-240 V AC input power.For high availability, the left and right sides of the cabinet must receivepower from separate branch feed circuits. Each pair of power distributionpanels (PDP) in the 40U-C cabinet can support a maximum of 24 A ACcurrent draw from devices connected to its power distribution units (PDU).Most cabinet configurations draw less than 24 A AC power, and requireonly two discrete 240 V AC power sources. If the total AC current drawof all the devices in a single cabinet exceeds 24 A, the cabinet requires twoadditional 240 V power sources to support a second pair of PDPs. Use thepublished technical specifications and device rating labels to determine thecurrent draw of each device in your cabinet and calculate the total.


ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

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!!

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EXP PRI

EXP PRI

#

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EXPPRI

EXPPRI

#A

B

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EXP PRI

#

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EXPPRI

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B

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EXP PRI

#

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B

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EXP PRI

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EXPPRI

#A

B

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EXP PRI

EXP PRI

#

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EXPPRI

#A

B

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EXP PRI

#

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EXPPRI

EXPPRI

#A

B

!!

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EXP PRI

EXP PRI

#

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EXPPRI

EXPPRI

#A

B

! !

!

!

!

!

Power source A

Power source CPower source D

Power source B

EMC3433

Master switch

Master switch

Master switch

Master switch

Figure 9 PDP master switches and power sources in the 40U cabinet

The storage system can take 10 to 15 minutes to complete a typicalpowerup. If the storage system was installed in a cabinet at your site(field-installed system), the first powerup will require several rebootsand can take 30 to 45 minutes. Amber warning LEDs flash during thepower on self-test (POST) and then go off. The front fault LED and theSPS recharge LEDs commonly stay on for several minutes while the


SPSs are charging. The powerup is complete when the CPU powerlight on each SP is steady green.

If amber LEDs on the front or back of the storage system remainon for more than 15 minutes (45 minutes for the first powerup of afield-installed system), make sure the storage system is correctly cabled,and then refer to the troubleshooting flowcharts for your storagesystem on the CLARiiON Tools page on the EMC Powerlink website(http://Powerlink.EMC.com). If you cannot determine any reasons forthe fault, contact your authorized service provider.

Powering down the storage system

1. Stop all I/O activity to the SPE. If the server connected to the SPE isrunning the Linux or UNIX operating system, back up critical dataand then unmount the file systems.

Stopping I/O allows the SP to destage cache data, and may takesome time. The length of time depends on criteria such as the sizeof the cache, the amount of data in the cache, the type of data inthe cache, and the target location on the disks, but it is typicallyless than one minute. We recommend that you wait five minutesbefore proceeding.

2. After five minutes, use the power switch on each SPS to turn offpower. The SPE and primary DAE3P power down within twominutes.

! CAUTION

Never unplug the power supplies to shut down an SPE.Bypassing the SPS in that manner prevents the storage systemfrom saving write cache data to the vault drives, and resultsin data loss. You will lose access to data, and the storageprocessor log displays an error message similar to the following:

Enclosure 0 Disk 5 0x90a (Can’t Assign - Cache Dirty)0 0xafb40 0x14362c

Contact your service provider if this situation occurs.


http://powerlink.emc.com

http://Powerlink.EMC.com

This turns off power to the SPE2 and the first DAE3P (EA 0, bus 0). Youdo not need to turn off power to the other connected DAE3Ps.


Status lights (LEDs) and indicators

Status lights made up of light emitting diodes (LEDs) on the SPE2,its FRUs, the SPSs, and the DAE3Ps3P and their FRUs indicate thecomponents’ current status.

Storage processor enclosure (SPE2) LEDs

This section describes status LEDs visible from the front and the rearof the SPE2.

SPE2 front status LEDs

Figure 10 and Figure 11 show the location of the SPE2 status LEDs thatare visible from the front of the enclosure. Table 2 describes these LEDs.

EMC3409

DAE3P

SPE2

SPS

Power LEDFault LED

Power LEDFault LED

Figure 10 SPE2 front status LEDs (bezel in place)


EMC3373

Blowers

Blowerfault LEDs

A B C D

Enclosurefault LED

Poweron LED

Power supply A Power supply B

Power supplyfault LED

Power supplyfault LED

Front

Figure 11 Front SPE2 status LEDs (bezel removed)

Table 2 Meaning of the SPE2 front status LEDs

LED Quantity State Meaning

Off SPE2 is powered down.Power 1

Solid green SPE2 is powered up.

Off SPE2 is operating normally.Enclosure fault 1

Solid amber A fault condition exists in the SPE2. If the fault is not obvious from anotherfault LED on the front, look at the rear of the enclosure.

Off Power supply is not powered.

Solid green Power supply is powered and operating normally.

Solid amber Power supply is faulted.

Power supply fault(see note)

1 per supply

Blinking amber Fault condition exists external to power supply, such as SP removed, noAC power input, ambient over-temperature condition.

Off Blower is not powered.

Solid green Blower is powered and operating normally.

Blower fault (seenote)

1 per blower

Solid amber Blower is faulted.

Note: Light is visible only with the bezel removed.

SPE2 rear status LEDs

Figure 12 shows the status LEDs that are visible from the rear of theSPE2. Table 3 describes these LEDs.


! !

! !

! !

+-

+-

I/O module fault LEDsSP fault LEDs

Rear

Power LEDPower LED

SP B

SP A

Fibre channel link LEDs EMC3403

Figure 12 SPE2 rear status LEDs

Table 3 Meaning of the SPE2 rear status LEDs


Solid green Power is being supplied to SP.Power 1 per SP

Off Power is not being supplied to SP.

Off SP is powered up and operating normally.

Solid amber SP is faulted.

SP fault 1 per SP

Blinking amber SP is in process of powering up.

Off I/O module is powered up and operating normally.I/O module fault 1 per I/O module

Solid amber I/O module is faulted.

Off No link because of one of the following conditions: thecable is disconnected, the cable is faulted or it is not asupported type.

Solid green 1 Gb/s or 2 Gb/s link speed.

Solid blue 4 Gb/s link speed.

BE port link 1 per back-end FibreChannel port

Blinking green then blue Cable fault.



Off No link because of one of the following conditions: thehost is down, the cable is disconnected, an SFP is not inthe port slot, the SFP is faulted or it is not a supportedtype.

Solid green 1 Gb/s or 2 Gb/s link speed.

Solid blue 4 Gb/s link speed.

FE port link 1 per front-end FibreChannel port

Blinking green then blue SFP or cable fault.

DAE3P status LEDs

This section describes the following status LEDs and indicators:

Front DAE3P and disk modules status LEDs

Enclosure address and bus ID indicators

LCC and power/cooling module status LEDs

Front DAE3P and disk modules status LEDs

Figure 13 and Figure 14 show the location of the DAE3P and diskmodule status LEDs that are visible from the front of the enclosure.Table 4 describes these LEDs.


EMC3409

DAE3P

SPE2

SPS

Power LEDFault LED

Power LEDFault LED

Figure 13 Front DAE3P and disk modules status LEDs (bezel in place)

EMC3422

Power LED(Green or Blue)

Fault LED(Amber)

Fault LED(Amber)

Disk Activity LED(Green)

Figure 14 Front DAE3P and disk modules status LEDs (bezel removed)


Table 4 Meaning of the front DAE3P and disk module status LEDs


Off DAE3P is not powered up.

Solid green DAE3P is powered up and back-end bus is running at 2Gb/s.

DAE power 1

Solid blue DAE3P is powered up and back-end bus is running at 4Gb/s.

DAE fault 1 Solid amber On when any fault condition exists; if the fault is notobvious from a disk module LED, look at the back of theenclosure.

Off Slot is empty or contains a filler module or the disk ispowered down by command, for example, as the result ofa temperature fault.

Solid green Drive has power but is not handling any I/O activity (theready state).

Blinking green, mostly on Drive is spinning and handling I/O activity.

Blink green at a constantrate

Drive is spinning up or spinning down normally.

Disk activity 1 per disk module

Blinking green, mostly off Drive is powered up but not spinning; this is a normal partof the spin-up sequence, occurring during the spin-updelay of a slot.

Disk fault 1 per disk module Solid amber On when the disk module is faulty, or as an indicationto remove the drive.

Enclosure address and bus ID indicators

Figure 15 shows the location of the enclosure address and bus IDindicators that are visible from the rear of the enclosure. In this example,the DAE3P is enclosure 2 on bus (loop) 1; note that the indicators forLCC A and LCC B always match. Table 5 describes these indicators.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureaddress

#

EAselection

0123

4567

0123

4567Bus IDEnclosure

address

#

EAselection

EMC3178

Figure 15 Location of enclosure address and bus ID indicators

Table 5 Meaning of enclosure address and bus ID indicators


Enclosure address 8 Green Displayed number indicates enclosure address.

Bus ID 8 Blue Displayed number indicates bus ID. Blinking bus IDindicates invalid cabling – LCC A and LCC B are notconnected to the same bus or the maximum number ofDAE3Ps allowed on the bus is exceeded.

DAE3P power/cooling module status LEDs

Figure 16 shows the location of the status LEDs for the powersupply/system cooling modules (referred to as power/cooling modules).Table 6 describes these LEDs.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

!!

Power LED (green)Power fault LED (amber)Blower fault LED (amber)

EMC3179

!!

Power LED (green)Power fault LED (amber)Blower fault LED (amber)

Figure 16 DAE3P power/cooling module status LEDs

Table 6 Meaning of DAE3P power/cooling module status LEDs

LEDs Quantity State Meaning

Power supply active 1 per supply Green On when the power supply is operating.

Power supply fault(see note)

1 per supply Amber On when the power supply is faulty or is not receiving ACline voltage. Flashing when either a multiple blower orambient over-temperature condition has shut off power tothe system.

Blower fault (seenote)

1 per cooling module Amber On when a single blower in the power supply is faulty.

Note: The DAE3P continues running with a single power supply and three of its four blowers. Removing a power/cooling moduleconstitutes a multiple blower fault condition, and will power down the enclosure unless you replace a blower within two minutes.

DAE3P LCC status LEDs

Figure 17 shows the location of the status LEDs for a link control card(LCC). Table 7 describes these LEDs.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

EMC3184

Expansion linkactive LED (2 Gb/s - green4 Gb/s - blue)

Primary linkactive LED (green or blue)

Fault LED (amber)

Power LED (green)

!

EXP PRI

EXP PRI

Expansion linkactive LED

Primary linkactive LED

Fault LED (amber)

Power LED (green)

!

EXPPRI

EXPPRI

Figure 17 DAE3P LCC status LEDs

Table 7 Meaning of DAE3P LCC status LEDs

Light Quantity State Meaning

LCC power 1 per LCC Green On when the LCC is powered up.

LCC fault 1 per LCC Amber On when either the LCC or a Fibre Channel connectionis faulty. Also on during power on self test (POST).

Green On when 2 Gb/s primary connection is active.Primary link active 1 per LCC

Blue On when 4 Gb/s primary connection is active.

Green On when 2 Gb/s expansion connection is active.Expansion linkactive

1 per LCC

Blue On when 4 Gb/s expansion connection is active.

SPS status LEDs

Figure 18 shows the location of SPS status LEDs that are visible fromrear. Table 8 describes these LEDs.


Online Battery onReplace batterySPS fault

LEDs:

AC infromPDU

Powerswitch

RJ12 to RS-232interface on SPE

AC out to SPE and DAEEA0, bus 0

SPS B SPS A

EMC3365

Figure 18 2200 W SPS status LEDs

Table 8 Meaning of 2200 W SPS status LED


Online 1 per SPS Green When this LED is steady, the SPS is ready and operating normally. Whenthis LED flashes, the batteries are being recharged. In either case, theoutput from the SPS is supplied by AC line input.

Battery on 1 per SPS Amber The AC line power is no longer available and the SPS is supplying outputpower from its battery. When battery power comes on, and no other onlineSPS is connected to the SPE, the storage system writes all cached data todisk, and the event log records the event.

Replace battery 1 per SPS Amber The SPS battery is not fully charged and may not be able to serve its cacheflushing function. With the battery in this state, and no other online SPSconnected to the SPE, the storage system disables write caching, writingany modified pages to disk first.

SPS fault 1 per SPS Amber The SPS has an internal fault. The SPS may still be able to run online, butwrite caching cannot occur.


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