D. Attié, P. Colas, E. Delagnes, M. RiallotM. Dixit, J.-P. Martin,

S. Bhattacharya , S. Mukhopadhyay

Linear Collider Power Distribution & Pulsing Workshop

May 10th, 2011

i r f u

yalcas

i r f u

yalcas

Power pulsing of AFTER Power pulsing of AFTER in magnetic fieldin magnetic field

IntroductionIntroductionIntroductionIntroduction

2David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

•Proposal:

– Use existing electronics and adapt it for power pulsing to read out the detector pads:

• Integrated T2K electronics• Having a two power states: low and nominal • Switching between state as fast as possible

– In parallel, use constant current charging circuits to readout the detector mesh (see J.-P. Martin’s talk)

– Using an 55Fe source to monitor the signal and gain

– Operating in 5T magnet in DESY

AFTER-based electronicsAFTER-based electronicsAFTER-based electronicsAFTER-based electronics

3David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

• AFTER chip (72 channels/chip) from T2K experiment:

– low-noise (700 e-) pre-amplifier-shaper– full wave sampling by SCA (511 time bins)– 120 fC to 600 fC tunable gain– 100 ns to 2 μs tunable peaking time– pulser for calibration– 25 W, 5V at 5 A (0,5 W/chip)

• 1 FEM, 6 FECs, 24 chips :1728 ch

– 12-bit ADC, 6 channels multiplexed

– Zero Suppression capability (FPGA)

– ~14-25 mW/channel

FEC

AFTER chip wire bonded

Front-End Mezzanine (FEM)Front-End Mezzanine (FEM)Front-End Mezzanine (FEM)Front-End Mezzanine (FEM)

4David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

30 pinsconnector

FPGAXilinx V5

ADC

SRAM

Test Pulser

XilinxProm

Opticalconnector

AFTER

Design of the integrated electronicsDesign of the integrated electronicsDesign of the integrated electronicsDesign of the integrated electronics

5David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

•Picture and events taken last week in DESY with electron beam

•1726 pads read out by the AFTER-based electronics

•Power consumption of 25W was measured and confirmed

Electronics in DESY 1T magnetElectronics in DESY 1T magnetElectronics in DESY 1T magnetElectronics in DESY 1T magnet

6David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

Large prototype TPC

3 GeV electron Beam

Project designProject designProject designProject design

7David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

•DESY 5T magnet has to be reinstalled

•Endplate ø 32 cm

•Field cage length not yet defined

•1 FEM and 4 FEC to readout 1136 pads of 3,7×3,7mm²

E

B

Readout PadsReadout PadsReadout PadsReadout Pads

8David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

16 independent HV connections read out by

constant current charging system

•Specific firmware of the for the FPGA Xilink 5 will be done

•Switch on and off the regulator TPS70402 for powering 3.3 V: t<1 ms

Low power state conditionsLow power state conditionsLow power state conditionsLow power state conditions

9David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop

•Try power switching on both the (segmented) mesh readout as studied by Jean-Pierre Martin (see the next talk) and the T2K electronics

•For T2K electronics, power switching might be done on the mezzanine card (FEM) developed for the 7-module configuration of the Large Prototype Micromegas TPC

•The test will consist in checking the properties of known X-ray lines with and without pulsing

•The mechanical effects will be studied by having a large enough number of channels (1200) and a large magnetic field (5T) close to realistic conditions

Summary of the planSummary of the planSummary of the planSummary of the plan

10David.Attie@cea.fr May 10, 2011 - LC Power Distribution and Pulsing Workshop