DATA SHEET SKY65160-11: 350-470 MHz, 4 W High Power PA …

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 1

DATA SHEET

SKY65160-11: 350-470 MHz, 4 W High Power PA Module Applications

• Terrestrial Trunked Radios (TETRAs)

• GSM450 and GSM480

• NMT450

• Wireless Local Loops

• UHF TV broadcasts

Features

• Wideband frequency operation: 350 to 470 MHz

• High efficiency: 45% PAE

• High gain: 37 dB

• P1dB = +33 dBm

• Saturated power = +36 dBm

• Single DC supply = 3.6 V

• Internal RF match and bias circuits

• PA on/off voltage control

• Unconditionally stable under any load impedance

• Small, MCM (16-pin, 8 x 10 mm) package (MSL3, 260 °C per JEDEC J-STD-020)

Skyworks Pb-free products are compliant with all applicable legislation. For additional information, refer to Skyworks Definition of Lead (Pb)-Free, document number SQ04-0073.

Description The SKY65160-11 is a fully-matched, 4 W Power Amplifier (PA). Its high efficiency is designed for use in the 350 to 470 MHz frequency range.

The PA contains all the active bias and RF matching circuits, which makes it easy to integrate into 50 Ω RF systems. The internal input and output match are optimized for efficiency and high power performance into a 50 Ω load.

Primary bias to the SKY65160-11 is supplied directly from a single cell Li-ion or other suitable battery with a nominal output of 3.6 V. No external supply-side switch is needed since typical “off” leakage is a few microamperes with full primary voltage supplied by the battery.

The SKY65160-11 is fabricated using Skyworks high reliability GaAs Heterojunction Bipolar Transistor (HBT) process, which allows for single supply operation while maintaining high efficiency and good linearity. The device is provided in an 8 x 10 mm, 16-pin Multi-Chip Module (MCM) package.

A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.

RF_IN

VBAT

VCC1 VCC2

VREG

RF_OUTInputMatch

OutputMatch

Stage 1PA

Stage 2PA

Active Bias Control

Inter-StageMatch

S1842

Figure 1. SKY65160-11 Block Diagram

DATA SHEET • SKY65160-11 HIGH POWER PA

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A

S1843

1

2N/C

VBAT

RF_I

N

VREG

GND

GND

N/C

N/C

VCC1

GND

GND

RF_O

UT

GND

GND

VCC2

GND

3

4

5 6 7 8 9

10

11

12

13141516

Figure 2. SKY65160-11 Pinout – 16-Pin MCM (Top View)

Table 1. SKY65160-11 Signal Descriptions

Pin # Name Description Pin # Name Description

1 RF_IN RF input to PA 9 RF_OUT RF output of PA

2 N/C No connection 10 GND Ground

3 VBAT Supply voltage for bias circuit, +3.6 V 11 VCC2 Supply voltage to 2nd amplifier, +3.6 V

4 GND Ground 12 GND Ground

5 N/C No connection 13 N/C No connection

6 VCC1 Supply voltage to 1st amplifier, +3.6 V 14 GND Ground

7 GND Ground 15 GND Ground

8 GND Ground 16 VREG PA enable control signal (on = +3.6 V, off = 0 V)

Electrical and Mechanical Specifications The absolute maximum ratings of the SKY65160-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4.

Performance characteristics for the SKY65160-11 are illustrated in Figures 3 through 9.



Table 2. SKY65160-11 Absolute Maximum Ratings

Parameter Symbol Minimum Typical Maximum Units

RF output power POUT +37 dBm

Supply voltage (VCC1, VCC2, VBAT, VREG) VCC 5.1 V

Supply current ICC 2500 mA

Operating temperature TOP –40 +85 °C

Storage temperature TSTG –65 +125 °C

Junction temperature TJ 150 °C

Thermal resistance ΘJC 18 °C/W

Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.

CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.

Table 3. SKY65160-11 Recommended Operating Conditions

Parameter Symbol Minimum Typical Maximum Units

Operating frequency f 350 470 MHz

Supply voltage (VCC1, VCC2) VCC 3.2 3.6 4.0 V

Bias voltage VBAT 3.2 3.6 4.0 V

Enable voltage: On state Off state

VREG 2.7 0

3.6

4.0 0.5

V V

Operating temperature TOP –40 +25 +85 °C

Table 4. SKY65160-11 Electrical Specifications (1 of 2) (Note 1) (VBAT = VCC1 = VCC2 = VREG = 3.6 V; f = 350 MHz, 410 MHz, and 470 MHz; TOP = +25 °C, Unless Otherwise Noted)

Parameter Symbol Test Condition Min Typical Max Units

1 dB Output Compression Point OP1dB CW +33.0 +34.0 dBm

Saturated output power PSAT CW, input power = +5 dBm

+35.8 +36.5 dBm

Small signal gain GSMALL_SIGNAL CW, input power = –5 dBm

34.3 35.5 dB

Large signal gain GLARGE_SIGNAL POUT = +32.8 dBm 33.9 37.2 40.0 dB

Noise Figure NF 6.5 7.0 dB

Quiescent current IQ No RF input 300 mA

Operating current @ P1dB I1DB POUT = +33 dBm 2000 mA

Operating current @ PSAT ISAT CW, input power = +5 dBm

2500 mA

PAE @ PSAT PAEPSAT TETRA-correlated CW measurements, input power = +5 dBm

45 48 %

PAE @ POUT = +32.8 dBm PAE+32.8DBM TETRA-correlated CW measurements

34 36 %



Table 4. SKY65160-11 Electrical Specifications (2 of 2) (Note 1) (VBAT = VCC1 = VCC2 = VREG = 3.6 V; f = 350 MHz, 410 MHz, and 470 MHz; TOP = +25 °C, Unless Otherwise Noted)

Parameter Symbol Test Condition Min Typical Max Units

Input return loss |S11| Input power = –15 dBm 11 14 dB

Output return loss |S22| Input power = –15 dBm 12 dB

VSWR for stable operation VSWR CW 8:1 –

Leakage current ILEAK No RF input, VREG = 0 V 0.5 1.0 μA

Note 1: Performance is guaranteed only under the conditions listed in this Table.

Typical Performance Characteristics (VBAT = VCC1 = VCC2 = VREG = 3.6 V, f = 410 MHz, TOP = +25 °C, Unless Otherwise Noted)

30

31

32

33

34

35

36

37

38

39

+28 +29 +30 +31 +32 +33 +34 +35 +36 +37

POUT (dBm)

Gain

(dB)

350 MHz410 MHz470 MHz

Figure 3. Gain vs. Output Power Over Frequency

37

38

39

40

41

34

35

36

350 370 390 410 430 450 470 490

Frequency (MHz)

Gain

(dB)

Figure 5. Gain vs Frequency

1.0

1.5

2.0

2.5

3.0

0

0.5

+24 +25 +26 +27 +28 +29 +30 +31 +32 +33 +34 +35 +36 +37

POUT (dBm)

Icc (A

)


Figure 7. Total Operating Current vs Output Power Over Frequency

+30

+32

+34

+36

+38

+20

+22

+24

+26

+28

–15 –13 –11 –9 –7 –5 –3 –1 +1 +3 +5 +7

PIN (dBm)

POUT

(dBm

)350 MHz410 MHz470 MHz

Figure 4. Input Power vs Output Power Over Frequency

–10

–8

–6

–20

–18

–16

–14

–12

Retu

rn L

oss

(dB)

350 370 390 410 430 450 470 490

Frequency (MHz)

S22S11

Figure 6. Input and Output Return Loss vs Frequency

35

40

45

50

55

25

30

10

15

20

0+25+24 +26 +27 +28 +29 +30 +31 +32 +33 +34 +35 +36 +37

POUT (dBm)

PAE

(%)


Figure 8. PAE vs Output Power Over Frequency



Evaluation Board Description The SKY65160-11 Evaluation Board is used to test the performance of the SKY65160-11 LNA. An assembly drawing for the Evaluation Board is shown in Figure 9 and the layer detail is provided in Figure 10. The layer detail physical characteristics are noted in Figure 11. A schematic diagram of the SKY65160-11 Evaluation Board is shown in Figure 12.

Input and output trace lengths have been minimized to reduce losses. All surface mount components are 0402-sized to reduce component parasitics. The use of 0603 or larger components is not recommended. Component spacing has also been minimized. The board is provisioned with two RF connectors and a DC launch.

It is very important to place multiple ground vias as close to shunt components as possible. This ensures proper grounding and circuit performance.

Board material is 10 mil thick VT47 FR4 with 1 oz. copper cladding. RF input and output traces are 50 Ω.

Evaluation Board Test Procedure

Step 1: Connect RF test equipment to amplifier input/output SMA connectors.

Step 2: Connect DC ground.

Step 3: Connect VBAT, VCC1, VCC2, and VREG to a +3.6 V supply with a current limit of 3 A. Verify that the board draws approximately 290 mA.

Step 4: Apply a low RF signal (e.g., –30 dBm) or noise source.

Package Dimensions The PCB layout footprint for the SKY65160-11 is provided in Figure 13. Package dimensions for the 16-pin MCM are shown in Figure 14, and tape and reel dimensions are provided in Figure 15.

Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.

THE SKY65160-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 °C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, PCB Design & SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752.

Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format.



RF_OUT

RF_IN

J3

S2541

Figure 9. SKY65160-11 Evaluation Board Assembly Diagram



Layer 1: Top – Metal

Layer 2: Ground

Layer 3: Power Plane

Layer 4: Solid Ground Plane

S1844

Figure 10. SKY65160-11 Evaluation Board Layer Detail



S2540

Cross Section Name Thickness (mm) Material εr

Pri 0.025 Cu –

Die1 0.400 Rogers 4003 –

L2 0.025 Cu –

Die2 0.600 FR4 4.0

L3 0.025 Cu –

Die3 0.400 FR4 4.0

Sec 0.025 Cu –

Figure 11. Layer Detail Physical Characteristics

1 16 15 14

6 7 8

2

3

4

5

13

12

11

10

9

N/C

VBATBias Circuit Supply

(+3.6 V)

GND

N/C

VCC1

GND

GND

RF_O

UT

RF_I

N

VREG

GND

GND

N/C

GND

VCC2

GND

J5

J4

C510 μF

C60.022 μF

S1845

×

×

×C10.022 μF

C210 μF

C310 μF

C40.022 μF

PA1 Supply(+3.6 V)

PA2 Supply(+3.6 V)

PA Enable

Figure 12. SKY65160-11 Evaluation Board Schematic



10.3

10.310.4

0.0625 Typ. 16X 0.76

0.875 Typ.

Pin 16

Pin 1

0.2 X 0.2

ComponentOutline

ComponentOutline

ComponentOutline

Stencil aperture size of 80% to 100%of the module/package solder mask openings.

Pin 16Pin 1

Pin 16

Pin 1

Stencil ApertureTop View

MetallizationTop View

Thermal Via Array, ∅0.3 mmon 0.6 mm pitch will improvethermal performance.NOTE: thermal vias should be tentedwith solder mask, 30-35 mmCu plating recommended.

Solder Mask OpeningTop View

S2565All dimensions are in millimeters

2X 2.93759X 0.76

8.3

8.3

16X 1.175

16X 1.275

2X 1.9375

16X 0.86

9X 1.175

1.91 Typ.

1.91 Typ.

0.6 Typ.8.4

1.91 Typ.

0.25 Typ.

0.2 X 0.2

Opening size of60 to 100% of exposedcenter opening shown;exposed center pad

Figure 13. SKY65160-11 PCB Layout Footprint



Metal Pad Edge

0.9 ± 0.1

0.76 ± 0.05

0.875SolderMask Edges

(0.125)

Side View Bottom ViewTop View

All measurements are in millimeters.

Dimensioning and tolerancing according to ASME Y14.5M-1994. S1623b

SolderMask Edges4X R0.05 Max.

SolderMask Edges5X R0.05 Max.

10 B

AA

10X 3.875

12X 1.5

12X 0.5

4X 1.91

4X 3

.82

6X 4

.875

8X 2

.5

8X 1

.5

8X 0

.5

4X 1

.91

C

0.15 A B C0.1

Pin 1Indicator

1.35 ± 0.1

Pin 16

Pin 1 IndicatorSee Detail C

24X Solder Mask OpeningSee Detail B

16X SMT Pad

0.2 A B C

A B CM0.1

8

Pin 1

Detail APad

Scale: 2X

5X This rotation5X Rotated 180°3X Rotated 90° CW3X Rotated 90° CCW

Detail BScale: 2X

23X This rotation

Detail CScale: 2X

1X This rotation

0

0

0.875

0.875

0.875

Figure 14. SKY65160-11 16-Pin MCM Package Dimensions



0.3 ±0.05 (T)Pin 1

10.35 (Bo)

A

A

B

12 (P1)Ø1.5 ±0.05

4 (Po)

0.3 Ref

A

2.0

Ref

2 ± 0.051.75 ± 0.1

7.5 ± 0.05

16 ± 0.3

Ø1.5 MinB

8.35 (Ao)

2 (Ko)

B

Notes: 1. Carrier tape: black conductive polystyrene. 2. Cover tape material: transparent conductive PSA. 3. Cover tape size: 13.3 mm width. 4. Po/P1, 10 pitches cumulative tolerance on tape ±0.20 mm. 5. Ao and Bo measurement point to be 0.3 mm from bottom pocket. 6. All measurements are in millimeters. S1625

Figure 15. SKY65160-11 Tape and Reel Dimensions



Ordering Information Model Name Manufacturing Part Number Evaluation Board Part Number

SKY65160-11 High Power PA SKY65160-11 TW18-D110-003

Copyright © 2011 Skyworks Solutions, Inc. All Rights Reserved.

Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.

No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.

THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.

Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.

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DATA SHEET SKY65160-11: 350-470 MHz, 4 W High Power PA …