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C-Prime Desktop Bonding System
Applications
Bonding Dispensing Welding SMT Systems Soldering
The DIMA Group Desktop Series is a product range for Heat-Seal Bonding, ACF Laminating process ap-plications and Reflow Soldering. All kind LCD, Flex foil and PCB connections can be made using these sys-tems. DIMA Group has the most intelligent systems designs, very rigid base constructions with exchange-able soldering/bonding heads which minimizes your production down time when switching over to another soldering/bonding head. But more revolutionary are the exchangeable product movement modules! They make it possible for you to upgrade your C-Prime to a C-Slide or C-Turn in minutes. You don’t need to buy a complete new desktop, only a product movement mo-dule which will be a considerable cost benefit for you.
Options: h Automatic force control h Soldering/Bonding Head Modules in different force ranges for optimal process adjustment h Interposer Module for soldering and bonding processes h Product Alignment for fine pitch applications h Quality control modules, e.g. automatic force control, joint penetration depth measurement, multiple thermocouples.
DIMA Bonding
CP-100/110/120/130
h Heat-Seal Bonding h Reflow soldering h ACF laminating h Heat-Staking
Main Features Customer Benefits
h Most rigid frame construction h Smartest Hot Bar exchange design h Exchangeable product handling and process modules h User friendly touchscreen, easy progammable. h Controller for time, temperature, force and joint pene-
tration
h High performance processing h Untighten the screws in seconds h Maximum flexibility for upgrades and new products h Set up is easy and takes seconds h Process qualtiy control is guaranteed as never before
Smart WatchFlex - PCB LCD modules
Processes:
C-Prime Desktop System with optional interposer.
For more detailed information, please contact our Sales Representatives. We are very willing to explain you the product application opportunities, all the available system configurations as well as our customized turn-key automation facilities. We are pleased to serve you with the best process technologies and going for the best system fit into your manufacturing processes. Your success is ours too!
Your Local Representative
DIMA Group BV T : +31 (0)493 352 752Beukelsdijk 2 F: +31 (0)493 352 7505753 PA Deurne E: [email protected] Netherlands I: www.dimagrp.comwww.dimagrp.com
Copyright © 2013 by DIMA Group BV, The Netherlands. All rights reserved. Design, features, and specifications are subject to change without notice.
Technical Specifications C-Prime Bonding System
Specifications C-Prime desktopSystem dimensions (HxWxD) 450 x 700 x 600 mmMax. Fixture dimensions (optional) 300 x 200 mmProduct handling Fixed positionPower Connection Power 110/240 VAC, 50 / 60Hz, 6 bar, 16 ATransformer Integrated ‘4 step’ 4.5 kVA TransformerHeating profiles Up to 200 heating profiles can be savedPer heating profile 20 Programmable points for process time / temparature / forceNoise level <70 dB (A)Weight 70 kgEasy exchangeable modules Bonding Heads, interposer, thermodes, motion and product handling.
User Interface C-Prime
Thermodes in mounting block
C-Prime modelsBase Frame, Prime Module, User Interface, Pulsed heat power supply, Manual force controle, Data logging via USB-stickCP-100, low force Bonding Head Force 5 - 100 NCP-110, middle force Bonding Head Force 20 - 250 NCP-120, high force Bonding Head Force 50 - 700 NCP-130, extra high force Bonding Head Force 100 - 1750 N
Bond Head with thermodeC
-Prim
e - C
P-10
0/11
0/12
0/13
0 - 0
314
Mounting blocks ThermodesMounting Block 3D 2D Pulsed Heat Metal ThermodesUp to 50 mm UO-3200 UO-3220 PT-xxxyy, up to 50 mm xxx = lenght, yy = 10*width in mmUp to 75 mm - UO-3221Up to 100 mm UO-3202 - PT-xxxyy, up to 100 mm xxx = lenght, yy = 10*width in mmUp to 130 mm UO-3203 UO-3222 PT-xxxyy, up to 130 mm xxx = lenght, yy = 10*width in mm
OptionsUO-5000 Z-Displacement sensorUO-5220 Programmable Automated Force ControlUO-4010 Interposer Manual for Silicone tapeUO-4060 Interposer Automated for Silicone tape