69
DECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050) SAMTEC CORPORATION APPROVED BY: MAX PEEL' PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research

DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

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Page 1: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

DECEMBER 19, 1991

TEST REPORT #91481

QUALIFICATION TESTING

TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

SAMTEC CORPORATION

APPROVED BY: MAX PEEL'PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH

CONTECH RESEARCH, INC.

Contech Research

Page 2: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

i

This is to certify that the evaluation described herein wasdesigned and executed by personnel of Contech Research, Inc. Itwas performed with the concurrence of Samtec Corporation of NewAlbany, IN, who was the test sponsor.

All equipment and measuring instruments used during testing werecalibrated and traceable to NIST according to MIL-STD-45662, asapplicable.

All data, raw and summarized, analysis and conclusions presentedherein are the property of the test sponsor. No copy of thisreport, in part or in full, shall be forwarded to any agency,customer, etc., by Contech Research without the written approvalof the sponsor.

President

Ml?/10

2Contech Resewch

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f .i

rSAMPLE PREPARATION

I I I I ILLCR

IGAS

TIGHTI

LLCR

MATINGFORCE

1ST CYCLEI

LLCRI

UNMATINGFORCE

1ST CYCLE

IF LLCRI

DURABILITY

MATINGFORCE c

ILLCR

II THERMAL

UNMATING SHOCKFORCE I

I LLCRDURABILITY I

1 CYCLICMATING HUMIDITYFORCE I

I LLCRUNMATINGFORCE-1VIBRATION

DURABILITYI

MATINGFORCE

IUNMATINGFORCE

ILLCR

41 1.0 MICROSEC.VIBRATION I

LSHOCK

LL R 1.0 MICROSEC.I

SHOCKI

LLCR

DWVI

I

THERMAL LLCRSHOCK I

I THERMALDWV AGE

I IIR LLCR

I ICYCLIC GASHUMIDITY TIGHT

I IIR LLCR

ICAPACITANCE

INORMALFORCE

Gr. Gr. Gr. 3 Gr. 4 Gr.5Gr.

5Contech Research

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Page 5: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

PROJECT NO.: 91481 SPECIFICATION: N/A______-----------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050--____-----------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# l-1, 1-2---___-----------------------------------------------------------START DATE: 12/06/91 COMPLETE DATE: 12/06/91--____-----------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 32%_____----_------------------- ------------------------------------EQUIPMENT ID#: 54, 207, 251, Applicable Glassware----__-----------------------------------------------------------GAS TIW

PURPOSE:

To evaluate the integrity of the contact interface by assessmentof the gas tight characteristics of the contacting surfaces. Thegas tight characteristic is the ability of contacting surfaces toprevent harsh environment from penetrating between them andforming oxides and/or films which will degrade electricalperformance.

-----------------------------------------------------------------PROCEDURE:

1.

2.

3.

4.

5.

6.

7.

The test was performed in accordance with EIA RS-364, TP-36,Method II.

All test samples were cleaned prior to the gas exposure usingvapor degreasing with trichloroethane l-l-l and isopropylalcohol.

Nitric acid was placed in the test chamber of a sufficientvolume to result in saturation of the test chamber. Theconditions were room ambient.

The solution was allowed to saturate the test chamber for aminimum of 15 minutes.

The test samples were placed in the test chamber and exposedfor one hour k 5.0 minutes.

The test samples were placed in such a manner as not to becloser than 1" (25mm) from the wall of the test chamber andnot closer than 3" (76mm) from the solution surfaces.

After exposure, the samples were removed from the testchamber and oven dried at 50°C for a minimum of one hour.

10Contech Research

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1.

PROCEDURE -- Continued:

8. Within 60 minutes of drying, the final low level circuitresistance was measured and recorded. Measurements wereperformed with the test sample at room ambient.

9. Low level circuit resistance was measured in accordance withMIL-STD-1344, method 3002 with a 100 milliamp test currentand 20 millivolt open circuit voltage.

-----------------------------------------------------------------

REQUIREMENTS:

1. The initial low level circuit resistance shall not exceed15.0 milliohms.

2. The final low level circuit resistance shall not exceed 20.0milliohms.

1. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE

Connector ID4Avg. Max

m- Is% IAiJl- Chanae Chanae

ID# l-l, Initial 8.3 10.6 6.8 --- ---Final 8.6 10.0 7.3 + 0.3 + 1.4

ID# l-2, Initial 7.8 8.7 7.0 --- ---Final 7.6 8.6 6.8 - 0.2 + 1.1

2. See pages lla thru llb for individual data points.

I 11Contech Research

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Units: milliohmsDelta values

tf23 an open circ:ui

lla

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(I:..zi

a0>..Y

Page 9: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

TEST RESULTS

Vibration/Shock Series (13T,CR)

12Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A-----~~----~~---------~---~~~--~~-----~~~-~~~~~-----~--~~~~~~~~~~PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-----------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-3, 3-4-----------------------------------------------------------------START DATE: 12/04/91 COMPLETE DATE: 12/04/91-----------------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 40%-----------------------------------------------------------------EQUIPMENT ID#: 12, 150, 315-----------------------------------------------------------------

ING m UNMATING FOR!C&

PURPOSE:

To determine the mechanical forces required to mate and unmatethe connectors with all guiding and applicable hardware assembledto the test‘ samples.

-----------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with MIL-STD-1344,Method 2013.

2. The test samples were fixtured to the base plate of the teststand and applicable force gauge.

3. The fixturing was accomplished to assure axial alignment andallowed self centering movement to exist.

4. The test rate was 1.0 inch per minute.

The force required to mate and unmate the connectors shall bemeasured and recorded.

-----------------------------------------------------------------

RESULTS:

The following is a summary of the observed forces measured andrecorded.

Connector IDfMATING FORCE UNMATING FORCE

(Pounm (Pounds)

3-33-4 32.0 28.0

13Contech Research

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.

PROJECT NO.: 91481 SPECIFICATION: N/A-_---------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050___--------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-3, 3-4____--_-----------------------------~------~~------~~-~----------START DATE: 12/04/91 COMPLETE DATE: 12/04/91___----_-------- __-----------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 40%-----------------------------------------------------------------EQUIPMENT ID#: 236, 251--------------------------- ____----------------------------------JIOW J~F,VFT~ CIRCUIT RESISTANCF, (T,T,CR)

PURPOSE:

To evaluate contact resistance characteristics of the contactsystems under conditions where applied voltages and currents donot alter the physical contact interface and will detect oxidesand films which degrade electrical stability. It is alsosensitive to and may detect the presence of fretting corrosioninduced by mechanical or thermal environments as well as anysignificant loss of pressure.

-------------_---------------------------------------------------PROCEDURE:

1. This test was performed in accordance with MIL-STD-1344,Method 3002 with a 100 milliamp maximum test current and anopen circuit voltage of 20 millivolts (four wire technique).

2. The measurement was performed by placing the voltage probeson the contact terminations on the solder side of the testboard.

------_--------_--_----------------------------------------------REQUIREMENTS:

The low level circuit resistance as measured shall not exceed15.0 milliohms.

See the next page for test results.

Contech Research

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RESULTS:RESULTS:

1.1. The following is a summary of the data observed:The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCELOW LEVEL CIRCUIT RESISTANCE

Std.Std.C o n n e c t o r AYg. Max M i n . l&Y.C o n n e c t o r AYg. Max M i n . l&Y.

3-33-3 8.18.1 8.68.6 7.37.3 0.30.33-43-4 7.67.6 8.58.5 7.07.0 0.50.5

2.2. See pagesSee pages 21a thru 21b for individual data points.21a thru 21b for individual data points.

1515Contech ResearchContech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A____-------------------------------------------------------------

PART NO.: TFM/SFM PART DESCRIPTION: Connectors0.050 x 0.050

____-------------------------------------------------------------SAMPLE SIZE: 1 Conn. TECHNICIAN: DAM

ID# 3-3--_--------------------------------------------------------------START DATE: 12/04/91 COMPLETE DATE: 12/04/91-__--------------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 40%------ ___--------------------------------------------------------EQUIPMENT ID#: 12, 150, 236, 251, 315, Manual--_--------------------------------------------------------------DURABILITY

PURPOSE:

1. To determine the effects of subjecting the connector to apredetermined number of mating and unrnating cycles simulatingthe expected mechanical life of the connector system.

2. This is a preconditioning sequence which is used to inducethe type of wear on the contacting surfaces which may occurunder normal service conditions. The connectors are matedand unmated a predetermined number of cycles. Uponcompletion, the units being evaluated are exposed to theenvironments as specified to asses any impact on electricalstability resulting from wear or other wear dependentphenomenon.

3. This type of preconditioning sequence is also used tomechanically stress the connector system as would normallyoccur in actual service.other

This sequence in conjunction withtests is used to determine if a significant loss of

contact pressure occurs from said stresses which in turn, mayresult in an unstable electrical condition to exist.

____-__-__----_-------------------~~~~~~~------------------------

PROCEDURE:

1. The test was performed in accordance with MIL-STD-1344,Method 2016.

2. Test Conditions:

a) No. of Cycles : 50b) Rate .. 500 cycles per hour

3. The test samples were axially aligned to accomplish themating and unmating function allowing for self-centeringmovement.

Contech Research

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PROCEDURE -- Continued:

4. Low level circuit resistance was performed in accordance withMIL-STD-1344, Method 3002 using a 100 milliamp maximum testvoltage and a 20.0 millivolt open circuit voltage.

--___------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples so tested.

2. The force required to mate and unmate the connectors shall bemeasured and recorded.

3. The low level circuit resistance shall not exceed 20.0milliohms nor shall there be any change in excess of 5.0milliohms.

-------_---------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test samplesas tested.

2. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCEI *1111m

Avg. Max Std.Connecter ID# Ava. l&u pilin. Chanae Chancre QeY-

3-3 8.2 8.8 7.4 + 0.1 + 0.9 0.4

3. See pages 21a thru 21 b for individual data points.

4. The following is a summary of the data observed:

Connector IDtMATING FORCE UNMATING FORCE(Pounds) fPounds)

3-3 31.0 24.0

Contech Research

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.

PROJECT NO.: 91481 SPECIFICATION: N/A-_---------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-_---------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-3, 3-4----_------------------------------------------------------------START DATE: 12/05/91 COMPLETE DATE: 12/06/91-----------------------------------------------------------------ROOM AMBIENT: 2o"c RELATIVE HUMIDITY: 32%-----------------------------------------------------------------EQUIPMENT ID#: 33, 86, 223, 236, 251, 283, 296----_--_---~---~---~~-------~-------~~-----~-~~---------~~~~~~~--VIBRATION. SINUSOIDAJ,

I PURPOSE:

1. To evaluate the test samples to determine if frettingcorrosion occurs due to mechanical motion. To evaluate theintegrity of the test samples relative to a severe mechanicalenvironment.

2. To determine the effects of vibration within the predominantvibration frequency range and magnitudes that may beencountered during the life of the product being evaluated.

1. Low level circuit resistance was measured and recorded inaccordance with MIL-STD-1344, Method 3002, with a 100milliamp maximum test current and a 20.0 millivolt opencircuit voltage.

~ 2 . Vibration was performed in accordance with MIL-STD-1344,Method 2005, Test Condition III.

3. Test Conditions:

a) Frequency : 10 to 2000 to 10 Hzb) Amplitude : 0.06" da or 15 G'scl Duration . 4.0 hrs/axis, 3 axis total.d) Test Current : 100 mae) Sweep Time : 20 minutes

---_-------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples as tested.

I18

Contech Research

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REQUIREMENTS -- Continued:

2. The low level circuit resistance shall not exceed 20.0milliohms.

---___-----------------------------------------------------------RESULTS:

1. There was no evidence of physical damage to the test samplesas tested.

2. The following is a summary of the observed data:

LOW LEVEL CIRCUIT RESISTANCE

Avg. Max Std.ector ID# Aver. mx al. L2hange Chanae r&Y.

3-3 7.4 8.4 6.6 - 0.73-4 6.9 8.4 6.1 - 0.5

3. See pages 21a thru 21b for individual

+ 1.1 0.6+ 1.4 0.8

data points.

19Contech Research

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4

PROJECT NO.: 91481 SPECIFICATION: N/A______-----------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050______-------_---------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-3, 3-4-----------------------------------------------------------------START DATE: 12/10/91 COMPLETE DATE: 12/11/91___--_-----------------------------------------------------------ROOM AMBIENT: 21°C RELATIVE HUMIDITY: 40%______-------__--------------------------------------------------EQUIPMENT ID#: 34, 45, 84, 117, 200, 236, 251-__-__-----------------------------------------------------------MFCHANICAL SHOCK (SPECIFIED PUJ,SE)

PURPOSE:

To determine the mechanical and electrical integrity of theconnector for use with electronic equipment subjected to shockssuch as those expected from handling, transportation, etc.

-----------------------------------------------------------------PROCEDURE:

1. The shock test was performed in accordance with MIL-STD-1344,Method 2004, Test Condition A.

2. Test Conditions:

a) Peak value : 50 Gb) Duration .. 11.0 millisecondscl Wave form .. Half sined) Velocity .. 11.3 feet per seconde) No, of shocks : 3 shocks/direction, 3 axis (18 total)

3. Final low level circuit resistance was measured in accordancewith MIL-STD-1344, method 3002 with a 100 milliamp maximumtest current and a 20.0 millivolt open circuit voltage.

-----------------------------------------------------------------REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples as tested.

2. The low level circuit resistance shall not exceed 20.0milliohrns.

20Contech Research

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RESULTS:

1. There was no evidence of physical damage to the test samplesas tested.

2. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE

ple ID%Avg. Max Std.

Au. Max Nin. Chanae Chanae QeY.

3-3 7.4 8.1 6.9 - 0.7 + 0.8 0.53-4 6.8 8.3 6.1 - 0.6 + 1.2 0.7

3. See pages 21a thru 21b for individual data points.

4. The following are the shock characteristics as shown inFigures #2 (calibration pulse), and #3 (test pulse):

Calibration TestX-Axis (Duration)

Delay 1 to 1: Duration t ime 11.03 ms 11.03 msMilliseconds per division 5.00 ms 5.00 ms

Y-Axis (G Level)

MV/div x 0.1 G: G's/division 17.5 G's 17.5 G'sVamp 1 x 0.1 : G level 51.9 G's 51.9 G's

21Contech Research

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L’EiI0‘-I,;-;a’3-41>m2al0

4--rE. .VJ-w*.-I5

40>

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II -!

IIII1 XIV T8P’I6

L1c 2=w 1 :‘E

-.--.----_-I--- --__ -- -_-.__sw 00’S2-*rPPw 00 ‘SAW 00sQP/AU ix’sr ‘I 1 vkl

Page 22: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

rI

-- ---- -..__.

sw 00'S2-

I

f'-IV3 18PI6

ArP/sw 00'S

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L

Page 24: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

PROJECT NO.: 91481 SPECIFICATION: N/A-----_-___-_-__--___---------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050___---------__---------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-1, 3-2-----__---_____-________________________~~------~~-----~~~~-~~~--START DATE: 12/02/91 COMPLETE DATE: 12/03/91__-__---_-----__---_____________________-~---~------~---~~~-~~~--ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 44%-_------------___--_____________________-~~---~~---~~---~~~~-~~~~EQUIPMENT ID#: 52, 114, 315__-__-___--____---__---------------------------------------------ENGAGEMENT AND SEPARATION FORCE

PURPOSE:

To determine the magnitude of mechanical forces required to mate

and unmate the specified test pin to and from an individual asocket contact.

1. The test was performed in accordance with MIL-STD-1344,Method 2014, Procedure I.

2. Test Conditions:

a) Test Pin Diameter : 0.020 +O.OOOO/-0.0001 inches(engagement force)

b) Test Pin Diameter : 0.019 +O.OOOl/-0.0000 inches(separation force)

c) No. of Observations :d)

25 contacts per connectorRate - 1.0 inch per minute.

3. The test pin was cleaned with isopropyl alcohol after everyten measurements.

The force required to mate and unmate the test pin shall bemeasured and recorded.

See the next page for test results.

23Contech Research

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RESULTS:

1. The following is a summary of the data observed:

ENGAGEMENT FORCE SEPARATION FORCE(Ounc& (Ounces)

Connector ID& w. I&x Min. BJrg. Max uin.

3-1 5.1 5.8 4.2 1.0 1.3 0.83-2 5.8 6.6 5.1 1.1 1.4 0.8

2. See pages 24a thru 24b for individual data points.

c24

Contech Research

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1 PROJECT: 91 ‘+ Yi

1 EQUIPMENT I.D. #: //I-+ - ?

TEST: L/V ‘- ‘F REQ: /i -I?<*,.) /JF 2 o.~oz.SPEC: m/c -LTD.-,JYY PARAGRAPH: 3 o u J- T.P. - TECH: S - ,cSTARTED: o;! J7i;‘c cj ( SAMPLE I.D. #: conrm~~-/ c’C,Un/#~ 3- 3COMPLETED:&3 9&c 4\ TEMP: %Z “C R.H. Y 5/ % UNITS: c 2

, ‘5 - .y 73 &i=- -# 3;%I,’ ca.vr/, l+ 3-- I PC,. b,r//l/, d 3 - 2

1 I L’ i I I*/ I2 (‘, y ‘2 1 i ., cl

DATA SHEET

I 3 11 L-Y 1 ! i I/4 1

6 11 1. i I

2 4 b Contech Research, Inc.

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PROJECT NO.: 91481 SPECIFICATION: N/A-----------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050____-------------------------------------------------------------SAMPLE SIZE: 1 Conn. TECHNICIAN: DAM

ID# 3-1, 3-2--__---~_------~~~~_--~-----~-------~----~~----~-~~-------~-~----START DATE: 12/03/91 COMPLETE DATE: 12/03/91--__-------------------------------------------------------------ROOM AMBIENT: 2o"c RELATIVE HUMIDITY: 38%-----------------------------------------------------------------EQUIPMENT ID#: 12, 150, 315-----------------------------------------------------------------

G AND UNMATING FORCE

PURPOSE:

To determine the mechanical forces required to mate and unmatethe connectors with all guiding and applicable hardware assembledto the test samples.

-----------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with MIL-STD-1344,Method 2013.

2. The test samples were fixtured to the base plate of the teststand and applicable force gauge.

3. The fixturing was accomplished to assure axial alignment andallowed self centering movement to exist.

4. The test rate was 1.0 inch per minute.

The force required to mate and unmate the connectors shall bemeasured and recorded.

-----------__----------------------------------------------------

RESULTS:

The following is a summary of the observed forces measured andrecorded.

Connector ID#MATING FORCE UNMATING FORCE

cPoun&J- (PO-

3-1 29.0 21.03-2 30.0 22.0

25Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A___--------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050______-----------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-1, 3-2-----------------------------------------------------------------START DATE: 12/04/91 COMPLETE DATE: 12/04/91-----------------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 40%___-__-----------------------------------------------------------EQUIPMENT ID#: 236, 251-----------------------------------------------------------------PURARIJ,ITY

PURPOSE:

To determine the effects of subjecting the test samples to apredetermined number of mating and unmating cycles simulating theexpected mechanical life of the product being evaluated.

1. The test was performed in accordance with MIL-STD-1344,Method 2016.

2. Test Conditions:

a) No. of Cycles : 50b) Rate .. 500 cycles per hour

3. The test samples were assembled to special holding devicesand attached to the automatic cycling equipment.

4. The test samples were axially aligned to accomplish themating and unmating function allowing for self-centeringmovement.

REQUIREMENTS:

1. There shal 1 be no evidence of physical damage to the testsamples so tested.

2. The force required to mate and unmate the test samples shallbe measured and recorded.

26Contech Research

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RESULTS:RESULTS:

1.1. There was no evidence of physical damage to the test sThere was no evidence of physical damage to the test samplesamplesas tested.as tested.

2.2. The following is a summary of the data observed:The following is a summary of the data observed:

MATING FORCEMATING FORCE UNMATING FORCEUNMATING FORCEDie IDbDie IDb (Poun&Q(Poun&Q (Pour-&J-(Pour-&J-

3-l3-l 26.026.0 18.018.0

27274

Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A___--------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050_-_--------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-1, 3-2-----------------------------------------------------------------START DATE: 12/05/91 COMPLETE DATE: 12/06/91___---_----------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 40%___-_-_----------------------------------------------------------EQUIPMENT ID#: 30, 33, 86, 223, 283, 296--_--------------------------------------------------------------VIBRATION. SINUSOIDAJ,

PURPOSE:

To determine the effects of vibration within the predominantvibration frequency range and magnitudes that may be encounteredduring the life of the product being evaluated.

----------------_------------------------------------------------

PROCEDURE:

1. Vibration was performed in accordance with MIL-STD-1344,Method 2005, Test Condition III.

2. Test Conditions:

a) Frequency : 10 to 2000 to 10 Hzb) Amplitude : 0.06" da or 15 G'scl Duration : 4.0 hrs/axis, 3 axis totald) Test Current : 100 mae) Sweep Time : 20 minutes

-----------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples as tested.

2. There shall be no contact interruption greater than 1.0microsecond.

-------------__--------------------------------------------------

RESULTS:

See the next page for test results.

28Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A-___----_--------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-_-__------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 3-1, 3-2_____--_-----------~--------~~~-----------~~~~----------~~~~~~-~-START DATE: 12/10/91 COMPLETE DATE: 12/11/91-----------------------------------------------------------------ROOM AMBIENT: 21°C RELATIVE HUMIDITY: 40%_____-__---------------------------------------------------------EQUIPMENT ID#: 30, 34, 45, 84, 117, 200---__------------------------------------------------------------

PURPOSE:

To determine the mechanical and electrical integrity of theconnector for use with electronic equipment subjected to shockssuch as those expected from handling, transportation, etc.

_------_---------------------------------------------------------

PROCEDURE:

1. The shock test was performed in accordance with MIL-STD-1344,Method 2004, Test Condition A.

2. Test Conditions:

a) Peak value : 50 Gb) Duration . 11.0 milliseconds.cl Wave form . Half sine.d) Velocity : 11.3 feet per seconde) No. of shocks : 3 shocks/direction, 3 axis (18 total)

1. There shall be no evidence of physical damage to the testsamples as tested.

2. There shall be no contact interruption greater than 1.0microsecond.

---------------_-------------------------------------------------

RESULTS:

See the next page for test results.

ccmd30Contech Research

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RESULTS:

1. There was no evidence of physical damage to the test samplesas tested.

2. There was no contact interruption greater than 1.0microsecond.

3. The following are the shock characteristics as shown inFigures #2 (calibration pulse), and #3 (test pulse):

X-Axis (Duratiti

Delay 1 to 1: Duration time 11.03 msMilliseconds per division 5.00 ms

1s (G Level)

11.03 ms5.00 ms

MV/div x 0.1 G: G's/divisionVamp 1 x 0.1 : G level

17.5 G's51.9 G's

17.5 G's51.9 G's

-31

Contech Research

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-~

PROJECT NO.: 91481 SPECIFICATION: N/A___--------_-----------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-__--------------------------------------------------------------SAMPLE SIZE: 4 Conn. TECHNICIAN: DAM

ID# 5 thru 8--_--__-------~-----~~~---------~~~----~~-----------~-----~~~~~~-START DATE: 12/04/91 COMPLETE DATE: 12/05/91--_--------------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 40%-__--_---___-----------------------------------------------------EQUIPMENT ID#: 1, 18, 22, 207, 251-----------------------------------------------------------------THERMAT SHOCK

PURPOSE:

To determine the resistance of a given connector to exposure atextremes of high and low temperatures and the shock of alternateexposures to these extremes, simulating the worst probableconditions of storage, transportation, and application.

1. Initial and all subsequent readings of low level circuitresistance was measured and recorded in accordance withMIL-STD-1344, Method 3002, with a 100 milliamp maximum testcurrent and a 20.0 millivolt open circuit voltage.

2.

3.

Sample ID# 5 and 6 was cycled 50 times.

The test was performed in accordance with MIL-STD-1344,Method 1003, Test Condition A except as noted.

4. Test Conditions:

a) Number of Cycles : 5 cyclesb) Hot Extreme - +125OC +3°C/-OoC.cl Cold Extreme .. - 55Oc +0Oc/-3Ocd) Time at Temperature : 30 minutese) Mated Condition : Matedf) Mounting Condition : Mounted

5. Two separate test chambers were utilized. One chamber wasused for the high temperature extreme. The second chamberwas used for the low temperature extreme using liquidnitrogen assist.

6. The total number of cycles were performed continuously.

33Contech Research

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REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples as tested.

2. The low level circuit resistance shall not exceed 20.0milliohms.

1. There was no evidence of physical damage to the test samplesas tested.

2. The following is a summary of the observed data:

LOW LEVEL CIRCUIT RESISTANCEs)

3. See pages 36a thru 36d for individual data points.

Sample ID# -2.

ID# 5, Initial 8.5 9.6 7.6After Dur. 8.7 10.3 7.9Final 8.9 9.8 8.2

ID# 6, Initial 10.1 13.4 8.4After Dur. 9.2 11.3 7.1Final 9.1 11.1 6.7

ID# 7, Initial 8.7Final 8.7

ID# 8, Initial 8.7Final 8.6

10.79.3

10.810.3

I2i.D.

8.07.9

6.87.5

Avg. Max

---+ 0.2+ 0.4

---- 0.9- 1.0

---0.0

---- 0.1

---+ 1.4+ 1.1

---+ 1.1+ 1.4

---+ 0.5

---+ 2.1

34Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A________---------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050--------~~~~~~~~-~~~~~~~~--------~~~~~~----------~~~~~~~~~~~~~~~~SAMPLE SIZE: 4 Conn. TECHNICIAN: DAM

ID# 5 thru 8---------------~-~-~~~~~---------~~~~~~----------~~~~~~~~~~~~~~~~START DATE: 12/06/91 COMPLETE DATE: 12/16/91--______--------~~~-~--------~~~~----------------~~----~~-~~~~-~~ROOM AMBIENT: 2o"c RELATIVE HUMIDITY: 32%---_____---------------------------------------------------------EQUIPMENT ID#: 29, 121, 207, 251, 718-----------------------------------------------------------------

PURPOSE:

To evaluate the impact on electrical stability of the contactsystem when exposed to any environment which may generatethermal/moisture type failure mechanisms such as:

a)

b)

C

d)

e)

Fretting corrosion due to wear resulting from micromotion,thermal cycling induces micromotion between contactingsurfaces and humidity accelerates the oxidation process.

Oxidation of wear debris resulting from induced micromotionwhich may have become entrapped between the contactingsurfaces

ichOxidation of particulates which may have been deposited onthe contacting surfaces from the surrounding atmosphere whmay have been entrapped between them due to inducemicromotion.

Failure mechanisms resulting from a wet oxidation process.

This test obtains added effectiveness in employment oftemperature cycling that provides a breathing action,inducing corrosion processes, and the introduction ofmoisture into partially sealed test samples. This conditionimposes a vapor pressure on the samples which constitutes themajor force behind the moisture migration and penetration.

------------_----------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with MIL-STD-1344,Method 1002, Procedure II with the following conditions.

35Contech Research

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PROCEDURE -- Continued:

2. Test Conditions:

a) Preconditioning (24 hours) : 5o"c zk 2Ocb) Relative Humidity - 90% to 95%.c) Temperature Conditions : 25'C to 65OCd) Mating Conditions . Mated.e) Mounting Conditions : Mountedf) Duration .. 240 hours

-----------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical deterioration of thetest samples as tested.

2. The low level circuit resistance shall not exceed 20.0milliohms.

--_-----------_--------------------------------------------------

RESULTS:

1. The test samples as tested showed no evidence of physicaldeterioration.

2. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE(Milliohms)

Sample ID#

ID# 5 (UncycledID# 6 (UncycledID# 7 (Cycled)ID# 8 (Cycled)

Avg. MaxAva- Ll.ia an. Chanae Chanae

9.7 12.6 7.7 + 1.2 + 3.78.7 11.1 7.4 - 1.4 + 1.48.1 8.8 7.0 - 0.6 + 0.37.1 8.6 6.6 - 1.0 + 0.5

3. See pages 36a thru 368 for individual data points.

36Contech Research

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.c -.

E

r,

t.

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-1.9-1 .:I-2.3-2.1-2.3-2.7-2.4‘- % . 0tn.3: :’_. 2 _ g.,-2.T-. 1 . I.-. 7 _ '341 .A-1 :I

I! . 0-3.t:-1.2t r:) 13+s. I.-2.53-0.2+o. 9+0.2

t1.4-3.6-1.41.4

n

PPII

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.&c,‘,-e

!‘,cErrI?...

.iEcc

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36d

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TEST RESULTS

I .Thermal Shock/CyyWV

GrouP

Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A____-__---_-_--~~-----~----------~~~--~~~~~~~~~~~~-----~--~~~~~-~PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-----------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 5-1, 5-2-----------------------------------------------------------------START DATE: 11/25/91 COMPLETE DATE: 11/25/91_-----_-_--------------------------------------------------------ROOM AMBIENT: 23Oc RELATIVE HUMIDITY: 50%-----------------------------------------------------------------EQUIPMENT ID#: 2-----------------------------------------------------------------DJSUJATION RES 1 STANCE ( IR)

PURPOSE:

To determine the resistance of insulation materials to leakage ofcurrent through or on the surface of these materials when a DCpotential is applied.

1. The test was performed in accordance with MIL-STD-1344,Method 3003.

2. Test Conditions:

a) Between adjacent contactsb) Mated conditioncl Mounting conditiond) Electrification time

: Yes.. Unmated.. Unmounted.. 2.0 minutes

-----------------------------------------------------------------

REQUIREMENTS:

When the specified test voltage is applied (500 VDC), theinsulation resistance shall not be less than 5000 megohms.

--------------_----_---------------------------------------------

RESULTS:

The insulation resistance exceeded 50,000 megohms.

Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A_____------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050___--------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 5-1, 5-2___------_-------------------------------------------------------START DATE: 11/25/91 COMPLETE DATE: 11/25/91-__--------------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 42%-----------------------------------------------------------------EQUIPMENT ID#: 95_____----------~~-----------------~----------~-~--~~---~~~~~~~~~~DIF'JIECTRIC WITHSTANDING VOLTAGE (SEA J,EmT,)

PURPOSE:

To determine if the sockets can operate at its rated voltage andwithstand momentary overpotentials due to switching, surges andother similar phenomenon.

-----------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with MIL-STD-1344,Method 3001.

2. Test Conditions:

a) Between adjacent contacts : Yesb) Mated condition .. Unmatedcl Mounting condition .. Unmountedd) Hold time .. 60 secondse) Rate of application .. 500 volts/set.

-------_------------____________________-------------------------

REQUIREMENTS:

When a 1000 VAC test voltage is applied, there shall be noevidence of breakdown, arcing, etc.

All test samples as tested met the requirements as specified.

39Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A_______----------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050--__-------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 5-1, 5-2-----------------------------------------------------------------START DATE: 11/25/91 COMPLETE DATE: 11/25/91-----__----------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 42%-----------------------------------------------------------------EQUIPMENT ID#: 1, 18, 22, 95-----------------------------------------------------------------

T, SHOCK

PURPOSE:

To determine the resistance of a given connector to exposure atextremes of high and low temperatures and the shock of alternateexposures to these extremes, simulating the worst probableconditions of storage, transportation, and application.

1.

2.

3.

4.

The test was performed in accordance with MIL-STD-1344,Method 1003, Test Condition A except as indicated.

Test Conditions:

a) Number of Cycles : 5 cyclesb) Hot Extreme .. +125OC +3°C/-OoCc) Cold Extreme .. - 55Oc +0Oc/-3Ocd) Time at Temperature : 30 minutese) Mating Conditions : Unmatedf) Mounting Conditions : Unmounted

Two separate test chambers were utilized. One chamber wasused for the high temperature extreme. The second chamberwas used for the low temperature extreme using liquidnitrogen assist.

The total number of cycles were performed continuously.

----------------_------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples as tested.

40Contech Research

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REQUIREMENTS -- Continued:

2. When a 1000 VAC test voltage is applied, there shall be noevidence of arcing, breakdown, etc.

-----__----------------------------------------------------------

RESULTS:

All test samples so tested met the requirements as specified.

41Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A--_--------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050--_--------------------------------------------------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 5-1, 5-2-----------------------------------------------------------------START DATE: 12/03/91 COMPLETE DATE: 12/13/91-----------------------------------------------------------------ROOM AMBIENT: 22Oc RELATIVE HUMIDITY: 38%-----------------------------------------------------------------EQUIPMENT ID#: 2, 27, 29, 121-----------------------------------------------------------------

CYCTfING)

PURPOSE:

To evaluate the impact on the connector stability when exposed toany environment which may generate thermal/moisture type failuremechanisms such as:

a ) This test imposes a vapor on the material under test thatconstitutes the force behind the moisture migration andpenetration. Hygroscopic materials are sensitive to moistureand deteriorate rapidly under humidity conditions. Absorptionof moisture may result in swelling that would destroyfunctioning utility, and cause loss of physical strength andchanges in other important mechanical properties.Degradation of electrical properties may also occur.

1. The test was performed in accordance with MIL-STD-1344,Method 1002, Procedure II with the following conditions.

2. Test Conditions:

a) Preconditioning (24 hours) : 5o"c f 2Ocb) Relative Humidity .. 90% to 95%cl Temperature Conditions : 25OC to 65OCd) Mating Conditions : Unmatede) Mounting Conditions .. Unmountedf) Duration .. 240 hours

1. There shall be no evidence of physical deterioration of thetest samples as tested.

Contech Research

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I

REQUIREMENTS -- Continued:REQUIREMENTS -- Continued:

2.2. When the specified test voltage is applied (500 VDC), theWhen the specified test voltage is applied (500 VDC), theinsulation resistance shall exceed 1000 megohms.insulation resistance shall exceed 1000 megohms.

--_-------------_------------------------------------------------RESULTS:

1. There was no evidence of physical damage to the connectors astested.

2. The insulation resistance exceeded 50,000 megohms.

Contech Research

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.

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Page 51: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

1.’/

. . .: . .. ..:.

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Page 52: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

:

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. .

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_. -_

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Page 55: DECEMBER 19, 1991 TEST REPORT #91481 ...suddendocs.samtec.com/testreports/91481.pdfDECEMBER 19, 1991 TEST REPORT #91481 QUALIFICATION TESTING TFM/SFM CONNECTOR SERIES (0.050 X'O.050)

._ .

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.._. -

_..

.._

_.---I__

.-I

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PROJECT NO.: 91481 SPECIFICATION: N/A____--------_---------------------------------- __----------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-_--_---______-__-___-______________________---------------------SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 5-1, 5-2--_-______-_______-_____________________-------------------------START DATE: 12/13/91 COMPLETE DATE: 12/13/91__-_---~---~_-~~---------~~-~-------~--~--- __--------------------ROOM AMBIENT: 23Oc RELATIVE HUMIDITY: 45%------------------------------- __-----_----------_---------------EQUIPMENT ID#: 157----- __-----__--__-_---______________________~-~---~~-~~~-~~~~~~-

PURPOSE:

To determine the capacitance characteristic between contactsand/or other metallic components assembled to their housings.

1. The test was performed in accordance with MIL-STD-202, Method305.

2. Test Conditions:

a) Frequency .. 1KHzb) Polarization : N/Acl Mounting Conditions : Unmountedd) Adjacent Contacts : Yese) Mating Conditions : Unmatedf) No. of Observations : Eight adjacent positions/corm.

------------------------------------- __--------------------------REQUIREMENTS:

The capacitance shall not exceed 2.0 pF at the specifiedfrequency.

The capacitance was less than 0.7 pF.

44 cIxRContech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A____-------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050-___---_~-------~~~~----~~~~----~-------~------~~--------~------~SAMPLE SIZE: 2 Conn. TECHNICIAN: DAM

ID# 9 and 10-----------------------------------------------------------------START DATE: 11/15/91 COMPLETE DATE: 12/06/91-----------------------------------------------------------------ROOM AMBIENT: 2o"c RELATIVE HUMIDITY: 44%-----------------------------------------------------------------EQUIPMENT ID#: 107, 121, 207, 251-----------------------------------------------------------------

PURPOSE:

Contacts in their operating mode are normally subjected tomechanical stresses and exposure to operational temperatures.The operational temperatures are generated from adjacent powersources and/or components as well as current flowing through theconnector system. Contact materials under such conditions willtend to relax which results in a permanent loss of normal force.Contingent on the magnitude of this relaxation with its resultantloss of normal force, potentially unstable electrical conditionmay be created. All contact materials exhibit some degree ofrelaxation.

1. The mated system was exposed to 105'C for 300 hours.

2. Initial and subsequent low level circuit resistance wasmeasured and recorded in accordance with MIL-STD-1344, Method3002 with a 100 milliamp test current and a 20 millivolt opencircuit voltage.

3. Upon completion of the exposure, the samples were exposed toa gas tight environment as described in Group 1 and low levelcircuit resistance recorded.

Note: The final step (item #3) was performed to determine ifthermal relaxation resulted in the loss of the gastight interface.

--_------------_-------------------------------------------------

REQUIREMENTS:

The low level circuit resistance shall not exceed 20.0 milliohms.

Contech Research

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Connector ID# m. JY.ax

ID# 9, Initial 8.6 10.3After Thermal 9.0 11.1After Gas Tight 9.2 10.8

ID# 10, Initial 8.4 10.6After Thermal 9.0 13.2After Gas Tight 9.0 12.9

Avg. Maxan- Chanae Chanae

7.0 --- ---7.8 + 0.4 + 3.08.4 + 0.6 + 3.3

7.0 --- ---7.1 + 0.6 + 4.27.2 + 0.6 + 4.1

2. See pages 47a thru 47b for individual data points.

RESULTS:

1. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE

47Contech Research

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I:‘rrj.j:?i;t R: 9141:) Spec : IIIL-5T13-1.344C us1 onrpr-: CAPiTf i SubGroup: I,Product : TFIl/SFtl CONN#9 Fil.e #: 148109Df?scripiion: 100 PO%. CONN. Print Date: 06DecYl

I)l~c'n circuit vol!age: 20 rrti llivolts Test current: 100 milliamps

Units: milliohmsDelta values

F’o:. ID INTTXAL T.AGING G. T I G H Tto.1-I..1to.6-0.1to. 5-. 0 4.4 0 1.-0.2-0.4t 0 2.il.7.-ii . 4-I-1.00.00 . 0

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47b

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c 48Contech Research

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PROJECT NO.: 91481 SPECIFICATION: N/A-____------------------------------------------------------------PART NO.: TFM/SFM PART DESCRIPTION: Connectors

0.050 x 0.050----_------------------------------------------------------------SAMPLE SIZE: 5 Contacts TECHNICIAN: DAM-____------------------------------------------------------------START DATE: 12/12/91 COMPLETE DATE: 12/17/91----_------------------------------------------------------------ROOM AMBIENT: 2o"c RELATIVE HUMIDITY: 40%--___------------------------------------------------------------EQUIPMENT ID#: 107, 121, 207, 251-----------------------------------------------------------------NORMAT, FORCE

PURPOSE:

Normal force is one of the basic attributes of a contact system.It is a direct indication of contact pressure as well as contactintegrity. The magnitude of said force can establish the gastight condition between contacting surfaces. A gas tightinterface prevents harsh environments and oxide or film growthfrom penetrating between surfaces which may cause degradation ofelectrical stability. It will also influence fretting motion andwear.

1. The prepared sample was placed in a special holding fixtureon a X-Y moveable table.

2. The sample was positioned in such a manner so as to allow aspecial probe attached to a force transducer to deflect thecontact element to a given distance as specified.

3. The probe/force transducer is interconnected with a lineartransducer, amplifier, data acquisition/computer system andrecorder.

4. As the contact element is deflected to the level desired, thenormal force characteristic is plotted directly andsimultaneously.

5. The test was performed with the contacts assembled in theirhousing.

49

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REQUIREMENTS:

The force/deflection characteristic shall be plotted.

-___-------------------------------------------------------------RESULTS:

1. The force/deflection characteristic is shown in Figure #4.

2. The spring rate of the contact system tested was 22.5 to 24.5grams/O.001 deflection.

3. The initial contact gaps as measured ranged between 0.010 to0.011 inches. The projected normal force is 101 to 123grams.

Conteoh Research

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