Dr. Anthony J. TetherDARPA Director

Defense Advanced Research Projects Agency

Defense Advanced Research Projects Agency

Director, Tony TetherDeputy Director, Bob Leheny

DARPA Organization

Tactical TechnologySteve WelbySteve Walker

Air/Space/Land/Sea PlatformsUnmanned SystemsSpace Operations

Laser SystemsPrecision Strike

Information ExploitationBob TenneyMark Davis

Sensors

Exploitation Systems

Command & Control

Strategic TechnologyDave Honey

Larry Stotts/Brian PierceSpace Sensors/Structures

Strategic & Tactical NetworksInformation Assurance

Underground Facility Detection& CharacterizationChem/Bio Defense

Maritime Operations

Information Processing TechnologyCharlie Holland

Barbara Yoon/Chuck MorefieldCognitive Systems

High Productivity Computing Systems

Language Translation

Microsystems TechnologyJohn ZolperDean Collins

ElectronicsPhotonics

MEMSAlgorithms

Integrated Microsystems

Defense SciencesBrett Giroir

Barbara McQuistonPhysical Sciences

MaterialsBiology

MathematicsHuman EffectivenessBio Warfare Defense

NEAR MID FAR

Scie

nce

& T

echn

olog

y $

(FY0

7)DARPA Role in Science and Technology

10B -

5B -

0 -

Fundamental Research, Leading Edge Discovery, System Concept Invention

Science and Technology

Programs for the Armed Services

NEAR MID FAR

Scie

nce

& T

echn

olog

y $

(FY0

7)

DARPA

DARPA Role in Science and Technology

10B -

5B -

0 -

Fundamental Research, Leading Edge Discovery, System Concept Invention

Science and Technology

Programs for the Armed Services

0

0.1

0.2

0.3

FY94

FY95

FY96

FY97

FY98

FY99

FY00

FY01

FY02

FY03

FY04

FY05

FY06

FY07

FY08

DARPA Basic Research Funding ($B)Budget Activity 6.1 (“University” funding)

Bill

ions

($)

PB 08 Request

$152.6m

Basic Research Examples

• Defense Science Studies Group• Computer Science Studies Group• Computer Sciences Futures Group• Young Squirrels Awards• Finding the Fundamental Laws of Biology

Autonomous Ground Vehicles

GroundSurveillance

Radar

DARPA Accomplishments

LSTAT

Speech Recognition

SATURN

Assault Breaker

ARPANET

JSTARS

MIMIC

TALON GOLD

Mobile Robots

JSF Engine

X-45

Command Post of the Future

MEMS

Pegasus LaunchVehicle

Global Hawk

DARPASAT

VELA Hotel

ALTAIR

Mouse

GPS

ATACMS

Sea Shadow

Stealth

Fighter

Center forMonitoring Research

M-16

Uncooled IR

Exoskeleton

Phraselator

1970

Predator

SUO SASSUO SAS

Advanced Cruise Missile

BAT

Taurus Launch Vehicle

Transit

1960

1970

1980

1990

2000

• Low-cost titanium to enable routine use ($3.5/lb military grade alloy)

• Accelerate Development & Production of Therapeutics & Vaccines from 12+ years to 16 weeks or less

• Alternative Energy Sources for military operations, such as jet fuel from plants

• Prosthetics to enable a Soldier’s return to the unit without loss of capability

• Quantum Information Science for new computational capabilities

• Networks - Self-forming, Robust, Self-defending to enable true network centric operations

• Chip Scale Atomic Clock to replace communication devices’ reliance on GPS time signal

• Networked Sensors – Determine, track, and neutralize elusive threats, such as IED factories

• High-productivity computing system – peta scale computer for important DoD applications

• Air Vehicles - Fast Access, long loiter

• High Energy Liquid Laser Area Defense System as a penetration aid to replace stealth

• Submarines – reduce size and cost while maintaining existing capabilites

• Space capabilities to enable global military operations

• Real time language translation to replace linguists (Defense Language Institute, III IV)

• Solid State for the next generation of systems

Future Icons

FOR OFFICIAL USE ONLY – Not Cleared for Open Release

Ultraperformance NanophotonicIntrachip Communication (UNIC)Ultraperformance NanophotonicIntrachip Communication (UNIC)

Vision:• Create enhanced pathway to high-bandwidth, high-

performance and low power intra-chip communication for ultra-dense 2D and 3D systems on a chip

Goal:• Demonstrate nano-photonic technology using CMOS

compatible fabrication processes that would significantly exceed electrical global interconnect performance (and hence total performance) for IC microprocessor chips

• Develop nano-photonic architecture/system design that would enable such performance superiority

• Demonstrate a functional chip with all necessary components working together

Technical Challenges:• High integration density • Low power dissipation devices• High speed devices (Low latency)• Low loss waveguides and devices• Small physical size• Fabrication fully compatible and integrable with

mainstream electronicsImpact:

• >10X increase in processing performance as a function of power dissipation

The Ultimate OnThe Ultimate On--Chip Data Link: Eliminating the Interconnect BottleneckChip Data Link: Eliminating the Interconnect Bottleneck

Nanophotonic LayerNanophotonic Layer

Electronic LayerElectronic Layer

IntrachipIntrachipCommunicationCommunication

Proc

esso

r Per

form

ance

Time

PEAK PerformanceOps/s

ACTUAL Performance(Application Runtime)

GROWINGGROWINGPERFORMANCEPERFORMANCE

GAPGAP

On and off-chip communications

becoming performance bottleneck

UN

IC

FOR OFFICIAL USE ONLY – Not Cleared for Open Release

3-Dimensional Electronic Circuits (3-D IC)3-Dimensional Electronic Circuits (3-D IC)

Goal: • Develop the Design and Process Technology for

True 3D Integrated Circuits (multiple active layers)

Challenges: • Achieve dense 3D Interconnections of Multi-layer

Circuits• Design Tools that Optimize Place & Route of

Circuit Blocks, Synthesis of 3D circuits with Electro-Thermal Analysis

• Thermal mitigationKey Accomplishments:

• 3D-IC technology development based on thin layer wafer transfer methods.

• High density 3D vias demonstrated. • Through wafer vias in development for mm-wave

applications. • 3D Supercomputer chip designed.

Impact:• Higher speed/lower power system-scale circuits• Larger chip effective area, more transistors/unit

volume. Improved computational density.

DD

AA AA RR

D D RR AA DD A A

DDDDRR AA RR

Interconnectlevels

BondingPads

DDR R

Isolationlevels

DeviceLevels

D=DigitalA=Analog

R=Reconfigurable

Inter-layervia

Thermalvias

Layer 1Layer 2

Layer 3

DD

AA AA RR

D D RR AA DD A A

DDDDRR AA RR

Interconnectlevels

Interconnectlevels

BondingPads

DDR R

Isolationlevels

DeviceLevels

D=DigitalA=Analog

R=Reconfigurable

Inter-layervia

Thermalvias

Layer 1Layer 2

Layer 3

InterconnectsArchitecture

2D

3D

The Next Revolution in Digital ElectronicsThe Next Revolution in Digital Electronics

Slow LightSlow Light

ωω

ddnn

cvgroup

+=

Group velocity – velocity at which a pulse of light propagates through a material

Transmission

Refractive IndexUltra-slow

group velocity

High transmission with large effective nonlinearity

Exploring the limits and applications of slowing, storing, and manipulating light in various media (Slow light n group << C)

Exploring the limits and applications of slowing, storing, and manipulating light in various media (Slow light n group << C)

Demonstrated fiber-based technique to produce delays > 1200 pulse widths.

Demonstrated 10 bit buffering at 20 Gbps using 10μm ring resonators

All optical delay of images using slow light(left) 3ns delay of 2-d image, 0.8 photons per pulse and (right) 2d image propagating through air, 0.8 photons per pulse.

Delays shown at many different bandwidths and material systems open range of applications

www.darpa.mil/dso

Current Sensor Heads

Precision Inertial Navigation Systems:Ultra-cold Atom-based Inertial Measurements

▪ Ultracold atom navigation relies on precise measurements of forces acting on atom cloud∙ Platform motion decoupled from

acceleration, rotation measurements∙ System measures gravity to compensate

for local variations in gravity vector▪ Available regardless of geography,

jamming, etc.▪ Will drive atom-based navigation

system across country to demonstrate system performance

The Future

• DARPA Always Interested in Innovative Ideas• Solicitations: www.darpa.mil• Talk to DARPA Program Managers• Become a DARPA Program Manager

• Upcoming Events• 25th DARPA Systems & Technology

Symposium (DARPATech 2007) August 7 - 9 2007, Anaheim, California

• Urban Challenge, November 3, 2007

• 50th Anniversary Conference / Dinner

• April 10, 2008 – Washington, D.C.

DARPA Strategic Plan

www.darpa.mil/body/mission.html