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Defining Requirements and Specifications for 400G & all
Modulations – 200G, 300G, 500G+
NGON 2016
July 30, 2016
Karl Gass
OIF Physical and Link Layer
Committee Vice-Chair for Optics
About the OIF
The Optical Internetworking Forum:
• Represents an end-to-end ecosystem
membership base of 100+ members
• Accelerating market adoption and
ROI for new technologies • OIF 100G DWDM work united the industry
around a 100G framework and IAs for
photonics, FEC and module MSA
• Electrical work defines critical backplane,
chip and module interfaces for 100-400G
• Open and agile workplan • Find gaps obstructing deployment and fill
them internally or working with other SDOs
• Distributed Control, Centralized Control –
whatever best fits operator needs!
www.oiforum.com
Network Operators
System Suppliers
Transceiver Suppliers
Component Suppliers
PLL Electrical, Protocol and Optical working groups
Looking for opportunities to serve the industry by development of
interoperable solutions that are not being addressed by other
industry bodies
• Electrical interfaces (Common Electrical Interface)
• Protocol interfaces (MLG, Flex E)
• Optical interfaces
Publically available, freely shared, Implementation Agreements
Broadly defined so applicable to multiple market segments
Addressing current industry needs of speed (data rate), density,
power efficiency, flexibility (re-use)
Electrical Implementation Agreements
CEI IA is a clause-based format supporting publication of new clauses over time: • CEI-1.0: included CEI-6G-SR, CEI-6G-LR, and CEI-11G-SR clauses.
• CEI-2.0: added CEI-11G-LR clause
• CEI-3.0: added work from CEI-25G-LR, CEI-28G-SR
• CEI-3.1: added work from CEI-28G-MR and CEI-28G-VSR
CEI-11G and -28G specifications have been used as a basis for specifications developed in IEEE 802.3, ANSI/INCITS T11, and IBTA.
CEI 56G projects are in progress: • LR: backplane
• MR: chip to chip
• VSR: chip to module
• XSR: chip to optics engine (separate chips)
• USR: chip to optics engine (2.5D or 3D package)
CEI 112G – under discussion!
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 SxI-5 CEI-1.0 CEI-2.0 CEI-3.0 CEI-3.1
3G 6G
11G 25G & 28G 56G
112G
CEI 56G Applications
Host IC
Module
Connector
AC
Coupling
Cap Module
Retimer IC
USR
LR
MR
VSR
XSR
Different reaches, number of connectors,
channel materials mean we can optimize the
application specifications for best efficiency
Different modulations provide advantage in
certain cases
CEI-56G Application Space
6
USR: 2.5D/3D applications
1 cm, no connectors, no packages
XSR: Chip to nearby optics engine
5 cm, no connectors
5-10 dB loss @28 GHz
VSR: Chip-to-module
10 cm, 1 connector
10-20 dB loss @28 GHz
MR: Interfaces for chip to chip and midrange backplane
50 cm, 1 connector
15-25 dB loss @14 GHz
20-50 dB loss @28 GHz
LR: Interface for chip to chip over a backplane
100cm, 2 connectors
35dB at 14Ghz
Chip-to-Chip & Midplane Applications
Chip-to-Module
Chip Pluggable Optics
CEI-56G-USR
Chip Chip
Backplane or Passive Copper Cable
Chip Chip
3D Stack
CEI-56G-XSR
CEI-56G-VSR
2.5D Chip-to-OE
Optics Chip
Chip to Nearby OE
CEI-56G-MR
CEI-56G-LR
NRZ IA
NRZ & PAM4 IAs
NRZ & PAM4 IAs
NRZ & PAM4 IAs
PAM4 & ENRZ IAs
CEI-56G is leading the drive to higher bandwidths for both networking and data center applications.
Projects underway in five link reaches with multiple modulations
PLL – How OIF Accelerated 100G
Router Router OTN
Switch
100GbE OTH, OTU4 100GbE
IEEE 802.3ba
ITU-T
OIF 40G development highly fragmented
Collaboration much improved on 100G
• Clear business case
• Stronger ecosystem
• Consistent standards and IAs
Fra
me
r
Photonic TX
Photonic RX
100G ULH MSA
FEC
OTN
Switch
OIF work on 100G DWDM transport united the industry around
• An overall framework including a modulation format
• Detailed IAs including photonics Tx/Rx modules, FEC, MSA
400G ?
How do we build on our successful deployment of coherent
100G systems?
400G Technology Options White Paper
http://www.oiforum.com/documents/download-technology-
options-for-400g-implementation/
Carrier/User requirements
Survey of modulation formats/options from White Paper
400G Systems
Theoretical system parameters in terms of OSNR@BER=10-2 (SD-FEC) /OSNR@BER=10-3 (HD-FEC) for all reported modulation formats
9
Coherent Transport
Optical components still dominate coherent modem system costs and this cost is very volume sensitive.
Complexity and system level flexibility at the coherent DSP engine level actually enables a substantial cost savings for the industry since it enables the consolidation of the industry EO component volumes into only three functions.
• This is the strength of the coherent solution for transport.
• It has enabled coherent to move into markets not originally
expected [dominates Metro now]
10
Flexible transceiver
11
What can be flexible? • Baud rate
• Modulation format
• FEC algorithms and overhead
• Sampling rate
• Grid
Different combinations suitable for different scenarios
Interfaces to support SDN which brings end to end reconfiguration and performance optimization
Steven Gringeri, Nabil Bitar, and Tiejun J. Xia. "Extending Software Defined Network Principles to Include Optical Transport." IEEE Communications Magazine March 2013: 32-40.
Flexible Coherent DWDM Transmission Framework
Description:
• There are different technical approaches for beyond 100G, but
lack of consensus on implementation.
• Different from 100G, new features like flex data rate (single chip)
have been incorporated into beyond 100G technology.
• Business perspective to improve the investment on the beyond
100G technology elements for both system vendors and
component suppliers.
Goal/Scope: This project will develop a Framework:
• Technical solution(s) for Flex Coherent Transmission
implementation for different application scenarios: long haul,
metro, and data center inter-connection.
• To provide guidance on the hardware implementation, which is
given fundamentally by two parameters: the modulated
spectrum width and the number of optical carriers.
CFP8-ACO
Description:
• A new analog coherent optics (ACO) project that supports
higher baud rate and higher wavelength/carrier-count
applications at higher density per wavelength/carrier than the
existing CFP2-ACO.
• Up to 4 wavelengths/carriers.
• Up to 64 Gbaud per wavelength/carrier.
Utilizes existing CFP8 definition from the CFP-MSA group:
• 20W power profile.
• The 9.5 mm module height allows for a double stack line card
design or belly to belly.
• The 40 mm module width enables a 2 x 8 configuration for a 16
module line card.
Validation of PLL Work: Interop Demos!
Interoperability demos have taken place at OFC and ECOC over the past 4 years demonstrating CEI-25G, CEI-56G and CFP2-ACO These are interops of OIF member hardware
Summary
OIF has an established history of meeting industry needs for interoperable electrical channels, protocols and optical hardware.
Applications for Backplanes, chip to chip for various reaches, VSR for chip to module, are evolving to meet new requirements and data rates.
Optical solutions are being developed that enable flexibility of deployment in terms of reach and bandwidth
The complete industry benefits when we work together to build an ecosystem.
Thank You!