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8/15/2019 Developing Bluetooth Low Energy (BLE) Products
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ARGENOX
Developing Bluetooth Low
Energy Products
©2016 Argenox Technologies, LLC. All Rights Reserved.
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wwCopyright © Argenox Technologies. All Rights Reserved
• Gustavo Litovsky
• 10 years of wireless designs
• Formerly at TI’s Connectivity group – Wi-Fi/Bluetooth/Gsupporting companies (Nike FuelBand, Motorola, GE,
• Left to develop products at other companies• Consulting
• 2013 – Started Argenox for Wireless development
Who Am I?
@agusnox
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CONFIDENTIAL wwCopyright © Argenox Technologies. All Rights Reserved
Argenox
Complete IoT Solutions
• Hardware, RF, Antenna Design andOptimization, Plastics
• Extensive Embedded Firmware
• Mobile Apps – iOS, Android
• Manufacturing
Helping Customers add connectivity to products
Connected Product Development
• Complete Reference Designs
• Proven and Fully Customizable
Low Powe
Faster Time to Market Turnkey Designs Full ProductDevelopment
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• Control something remotely,from anywhere
• Get alerted when somethinghappens
• Get data to the cloud
• Place devices anywhere
• Location
• Reliability – no mechanical limit
• Add new features, bug fixes
• Smartphone as Interface
Wirelessly Connecting Devices
Benefits
• Increased Cost• Increased Comple
Design and Manu
• Regulatory Certifi
• Limited Range
Challenges
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What Happened to Bluetooth Clas
• Headsets / Speakers
• High Speed Data (2Mb/s, 3Mb/s)
• High Power consumption, High latency
• More complicated Development, Testing• MFI required for Data on iPhone
Still Here
Not ideal for low power devices
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• Low Energy (LE) added to Bluetooth v4.0 Spec• Mass adoption after Apple adds to iPhone (2011)
• Direct connection to Smartphones
• Easy to Use
• Low Power
• Cheap
• People Know Bluetooth Brand
Introducing BLE
Ideal Technology for Connecting Low Power Devices
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wwCopyright © Argenox Technologies. All Rights Reserved
Comparing BLE
Physical
Medium
Power Consumption Data Rate
Bluetooth Low
Energy
2.4GHz
AFH
40 Channels
10mA Running
1.5uA Sleep
1Mbps raw
~100kbps
Bluetooth Classic 2.4GHz
80 Channels
30mA Running 2-3Mbps raw
1-2Mbps
Wi-Fi 2.4GHz 100mA – 200mA Running
10uA-50uA Sleep
~10Mbps Embedded
Wi-Fi
Thread/Zigbee 2.4GHz 250kbps
Sub-1GHz 433MHz
915MHz
A few mA to 100mA+
depending on output power
9.6kbps to 3-4Mbps
~2000m~220mAh
400uA avg Current
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Device Example
BLE Enabled Accelerometer
BLESOC
Coin Cell Battery
Accelerometer I2C
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Is BLE Good for Me?
• Uses 2.4GHz Band – Worldwide• Range can be extended to 400m+
• Highly resilient to interference – Adaptive Frequency H(AFH)
• Simplifies building products on top
• Very low power – Coin cell
• Direct connection to Smartphones and gateways
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wwCopyright © Argenox Technologies. All Rights Reserved
BLE Evolution
Bluetooth v4.0 Bluetooth v4.1 Blue
• Original Spec • Adds ability to act multirole • Packet L
• Secure C
• Improved
2010 2013
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wwCopyright © Argenox Technologies. All Rights Reserved
Product Architecture
BLE as Core
BLE as Network Pr
BLESoC
Power
Sensors
• System Already Exists
• BLE SoCs CPU not enough
• Features in other devices
• More development
Buttons /
LEDs
• BLE SoC Handles Bluetooth and All Processing
• Lowest Cost
Main Processor Power
Sensors
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• Trend to provide complete SoCs
• Most use Cortex-M3, Cortex-M3 and Cortex-M4 processors
BLE Chipsets
BLE Radio
CPU
CortexM0/M3/M4
Flash Memory128kB / 256kB / 512kB
RAM16kB / 32kB / 48kB /
64kB
Timers GPIO ADC I2C / SPI / UART
Power
32kHz
High Speed
Oscillator
• Power optimized
• Minimal external comp
• Capabilities and design
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wwCopyright © Argenox Technologies. All Rights Reserved
• Manufacturers moving to Bluetooth v4.2• More advanced CPUs – Cortex-M4 and M3 replacing M
and 16-bit
• Larger RAM and Flash to run more advanced applicati
• RF fully integrated in the device
• Advanced peripherals requiring less CPU intervention
• Multiple protocols in the same device
Trends in Chipsets
Some companies use BLE SoCs instead of microcontro
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wwCopyright © Argenox Technologies. All Rights Reserved
• nRF8001, nRF51822, nRF52832• Very popular devices
Nordic Semiconductor
nRF52832
• 64MHz ARM Cortex™ M4F
• Bluetooth Smart v4.2 / ANT
• 5.5mA / 5.5mA TX/RX at 0dBm
• 1.7V to 3.6V• 512 kB flash memory + 64 kB RAM memory
• -96dBm, +4dBm Output Integrated Balun
• UART, SPI, I2C, PWM, GPIO 12-bit ADC
• PDM and I2S for Audio
• NFC for Out-of-Band pairing
Di l S i d
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• DA14580, DA14680• Found in Wearables, Low cost devices
Dialog Semiconductor
DA14580
• 16MHz ARM Cortex™ M0
• Bluetooth Smart v4.1
• 3.4mA / 3.7mA TX/RX at 0dBm
• 1.7V to 3.6V• 512 kB flash memory + 64 kB RAM memory
• -93dBm, +0dBm Output
• UART, SPI, I2C, PWM, GPIO 12-bit ADC
• PDM and I2S for Audio
• NFC for Out-of-Band pairing
NXP S i d t
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• KW40Z, KW41Z• Acquired Freescale in 2015
NXP Semiconductor
KW41Z
• 48MHz ARM Cortex™ M0
• Bluetooth Smart v4.2 / 802.15.4 Thread
• 1.7V to 3.6V, 0.9V to 1.795V
• 512 kB flash memory + 128 kB RAM memory
• -96dBm, +4dBm Output Integrated Balun
• UART, SPI, I2C, PWM, GPIO 16-bit ADC and 12-bit DAC
C S i
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• PSoC 4 BLE, PROC 4 BLE• Recently acquired Broadcom
• Modules
Cypress Semi
PSoC 4 BLE
• 48MHz ARM Cortex™ M0
• Bluetooth Smart v4.2
• 1.8V to 5.5V• 16.5mA / 18.7mA TX/RX at 0dBm
• 256 kB flash memory + 32 kB RAM memory
• -92dBm, +3dBm Output
• Unique PSoC Programmable Digital and Analog
• Capacitive Touch, Op Amps, LCD,
• UART, SPI, I2C, PWM, GPIO 12-bit ADC and DAC
Sili L b
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• Acquired Bluegiga
• Module vendor
Silicon Labs
Integrated Bluetooth Smart and
• ARM Cortex™ M4 with
• 256 kB flash memory /3
• Integrated high-efficienc
• UART, SPI, I2C, PWM,
• Crypto accelerator, 32-bBlue Gecko
• 40MHz ARM Cortex™ M4F
• Bluetooth Smart v4.2
• 1.8V to 5.5V
• 8.8mA / 18.7mA TX/RX at 0dBm
• 256 kB flash memory + 32 kB RAM memory
• -94dBm, +3dBm Output or 8dBm
• Fully Certiofie
• UART, SPI, I2C, PWM, GPIO 12-bit ADC and DAC
T I t t
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• CC2540, CC2541, CC2630/40/50
Texas Instruments
CC26xx
• 48MHz ARM Cortex™ M0
• Bluetooth Smart v4.2
• 1.8V to 3.8V
• 6.1mA / 5.9mA TX/RX at 0dBm
• 128 kB flash memory + 20 kB RAM memory
• -97dBm, +5dBm Output
• Unique PSoC Programmable Digital and Analog
• Sensor Control Engine
• UART, SPI, I2C, PWM, GPIO 12-bit ADC
BLE Chi t G ti
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CC2541
nRF51822
BLE Chipset Generations
CC2540
nRF8001
KW40Z
1st Generation
2011
PSoC 4 BLE
Picking a De ice
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Picking a Device
• Depends on your product requirements
• Hardware, Stack, Features, Support
• Some devices have unique features (PSoC, Periphera
Chip or Module?
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• Best performance – if done right• Customized – may fit better
• Lowest cost in high volume
• Engineering time and Cost – need RF expertise
• Design must be certified
Chip or Module?
Discrete Module
• Quickest Time to Market• Good performance
• Higher cost in high volume
• Engineering time and cost
• Modules certified and ready to go
BLE Product Design Lifecycle
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BLE Product Design Lifecycle
Development Certification ManufacturingMobile App
System Design AntennaTuning
FCC / IC
Certification
Manufacturing
BT SIG
Certification
Testing / QAHardware
Mechanical
Firmware
UX / Graphics
Bluetooth
iOS
AndroidOther
Certifications
Certifications FCC
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Certifications - FCC
• Required for any wireless transmitter
• Document preparation
• Lab measures radio and produces a report
• Results submitted to TCB to obtain FCC ID
• Modules already have FCC ID which is reused by integrator
• Products using modules need Unintentional Radiator certification
FCC Part 15 - Intentional Radiator
Certifications BTSIG
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Certifications - BTSIG
• Required to use Bluetooth trademarks and IP
• Small companies (< 1MM and first declaration ) $2500, others $8000• Lab testing needed for discrete designs
Bluetooth SIG
Firmware / Software
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Firmware / Software
• Required to use Bluetooth trademarks and IP
• Small companies (< 1MM and first declaration ) $2500, others $8000• Lab testing needed for discrete designs
Bluetooth SIG
Blu
User
Drivers
Peripherals
BLE System Architecture
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BLE System Architecture
Central Peripheral
Peripheral
GATT Server
GATT Server
GATT Client
Profile
Service
Characteristic
Properties
Value
Descriptor
Characteristic
Properties
Value
Descriptor
GAT
GATT Table
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• Product designer defines the table – Services, Charact
• Bluetooth SIG defined standard set of services
• When standard services don’t fit, define your own
GATT Table
Device Information Service
Manufacturer Name String
Model Number String
Hardware Revision String
“Argenox”
“K221”
“1.1”
UUIDs
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• Unique Identifiers used to identify any characteristic or
• Bluetooth SIG uses 16-bit for their own services, whichrest of 96-bits are fixed
• For custom services, you use 128-bit numbers
UUIDs
Device Information Service
Manufacturer Name StringModel Number String
0x180A
0x2A290x2A24
Custom Service
Manufacturer Name String
Model Number String
5b0aba62-354e-4743-8fd3-18f754f6f30d
0x2A29
0x2A24
Getting the GATT Data
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1. Central device discovers peripheral
2. Central device connects to Peripheral
3. Central Device enumerates services and characterist
4. Central devices reads/writes characteristics
Getting the GATT Data
Discovering Peripherals
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• Peripheral devices must be advertising to be found andconnected
• Advertisement packets aredefined by the productdeveloper and can containmany things:• Device Name• UUIDs of Services Available• Custom Data
• Packet is defined by using APIs from the BLE stackdeveloper
Discovering Peripherals
Advertisements
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• Packets go out on 3 special channels called advertisingchannels
• Channels were selected to avoid Wi-Fi interference
• Packets sent at Advertising Interval
Advertisements
Connecting and Enumerating
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• Central device connects to a peripheral it discovers froadvertising packets, finds all services and characteristi
• Connection allows bidirectional data transfer between d
Connecting and Enumerating
BLE Security
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Connections can be encrypted and secured againsteavesdropping and data manipulation
YES and NO
• Bluetooth v4.0 and v4.1 devices are insecure if initialconnection and pairing are sniffed
• Bluetooth v4.2 is much more secure - both devices musupport LE Secure Connections
BLE Security
Is BLE Secure?
BLE Mesh
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• BLE is typically point to point, point to multipoint
• Mesh allows data to get data across distance using dev
• Mesh expected to be ratified by Bluetooth Sig in Septe
BLE Mesh
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Low Energy
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• Processor and Radio consume significant power
• Low power requires system to sleep as much as possib
• Use smart peripherals as much as possible
• Measure, Measure and Measure
Low Energy
Low Energy -
t’s in the name
Mobile Apps
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• Main user interaction point with devices
• Bluetooth Development
ob e pps
Gateways
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• BLE can connect to most BLE devices
• Routers starting to support BLE out of the Box
• Build your own
y
Apple HomeKit / MFI
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• Homekit allows communication with accessories in the• Discovery
• Configuration
• Control
• Actions
• Siri
• Specifications and Info under NDA
• Join Apple MFI program
pp
References
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