1
Device Depth (µm) 40 µm heat sink Cathode Anode 8.015 µm Gunn Diode 10µm heat sink Device Width (µm) Figure 4 Figure 3 Cathode Heat Sink Gunn Diode Anode Heat Sink 0 1 2 3 4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Reverse IV Curves Current (A) Voltage (V) Measured 1928A 300K Model 1928A 300K Forward IV Curves Figure 5 Development of High Power THz sources for Imaging Applications Microelectronics and Nanostructures (M&N) Group, School of Electrical and Electronic Engineering Faisal Amir and Mohamed Missous Introduction An advanced step-graded Gunn diode is presented, which has been developed through joint modelling-experimental work. The novel higher frequency devices have been realized to test GaAs based Gunn oscillators at sub- millimetre wave for use as a high power (multi mW) Terahertz source in conjunction with a mm-wave multiplier, with novel Schottky diodes. Conclusion A novel 2D physical model for an advanced step-graded AlGaAs hot electron injector Gunn diode was successfully extended to higher frequency ( > 100GHz). Future work includes the development of a full functional multiplier as a high power terahertz source. The doping spike carrier concentration optimized value was used during higher frequency model development and instead the transit region length was reduced. The measured and simulated forward and reverse-bias IV characteristics of the ~100 GHz fundamental model are shown in Figure 8 and match extremely well with measured data. The manufactured device yielded a maximum fundamental power of ~22 mW at 94 GHz, the highest ever reported for a GaAs Gunn device. Physical Model Development The Epitaxial growth of the advanced step-graded GaAs- AlGaAs Gunn diode with hot electron injector wafers is performed at the university using a RIBER V100+ MBE reactor. To complement experimentally obtained data and perform a sensitivity analysis on the effects of variation in epitaxial composition, especially carrier concentration in the doping spike and transit region, predictive physical models, using SILVACO, have been developed . Harmonic generation The THz frequencies considered (up to 600 GHz) are to be generated in a two-stage module. The initial frequency source is to be provided by Contact: [email protected] Supervisor: Professor Mo Missous the novel high frequency Gunn diodes. The output from these diodes is then to be coupled into a multiplier module shown in figure 7. DC IV Characteristics The simulated forward and reverse bias IV characteristics of the 77 GHz model are shown in figure 5 and match extremely well with measured data thus validating the choice of the physical models and material parameters used. The doping spike analysis provided 1×10 18 cm -3 as optimized value. The model was then used to predict and develop higher frequency devices. A. Results from a SILVACO simulation showing the effects of the doping spike (1×10 18 cm -3 ) on electron concentration in the transit region (——; spike present, -----; spike absent). B. Effects of variation in doping spike carrier concentration on simulated IV characteristics (numbers next to forward bias curves represent calculated asymmetry values). Figure 6 0 1 2 3 4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Forward IV Curves 1.27 1.48 1.17 1.17 Current (A) Voltage (V) Spike 1×10 18 cm -3 Spike 2×10 18 cm -3 Spike 5×10 17 cm -3 Spike 2.5×10 17 cm -3 Reverse IV Curves 1.5 2.0 2.5 3.0 3.5 1e13 1e14 1e15 1e16 1e17 1e18 1e19 Contact layer Transit Region AlGaAs Launcher Electron Concentration (cm -3 ) Device Distance (μm) Contact layer (A) (B) SILVACO simulation results showing the measured and simulated IV characteristics at 300K A 2D modelled structure with Gold plated heat sinks. 3D cylindrical model developed in SILVACO SEM of a fabricated Gunn diode Epitaxial structure and conduction band diagram Higher Frequency Gunn (A). Measured and modelled forward / reverse IV curves for a 100GHz fundamental device at 300K (B). Measured and modelled forward IV curves at increasing temperatures. Figure 8 0 1 2 3 4 0.0 0.2 0.4 0.6 0.8 358K 300K 323K Current (A) Voltage (V) Modelled 300K Modelled 323K Modelled 358K Measured 300K Measured 323K Measured 358K Forward IV Curves 0 1 2 3 4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Current (A) Voltage (V) Measured 300K Modelled 300K Forward IV Curves Reverse IV Curves (A) (B) Figure 1 0 0.38 Conduction Band Typical Advanced Step-graded Injector Gunn Diode Structure barrier Transit Figure 2 Figure 7 Harmonic Generation Multiplier (x n) Block Gunn Block Resonant Disk Gunn Diode Output (w n ) Resonant Cavity (w o ) Varactor Micropstrip Back short Bias Post Choke WG28 - Waveguide Schottky

Development of High Power THz sources for Imaging Applications

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Page 1: Development of High Power THz sources for Imaging Applications

Devic

e D

epth

(µm

)

40 µm heat sink

Cathode

Anode

8.015 µmGunn Diode

10µmheat sink

Device Width (µm)

Figure 4

Figure 3

CathodeHeat Sink

Gunn DiodeAnode Heat Sink

0 1 2 3 40.0

0.2

0.4

0.6

0.8

1.0

1.2 Reverse IV Curves

Current (A)

Voltage (V)

Measured 1928A 300K

Model 1928A 300K

Forward

IV Curves

Figure 5

Development of High Power THz sources for Imaging Applications

Microelectronics and Nanostructures (M&N) Group,

School of Electrical and Electronic Engineering

Faisal Amir and Mohamed Missous

Introduction

An advanced step-graded Gunn diode is presented, which has been developed through joint modelling-experimental work. The novel higher frequency devices have been realized to test GaAs based Gunn oscillators at sub-millimetre wave for use as a high power (multi mW) Terahertz source in conjunction with a mm-wave multiplier, with novel Schottky diodes.

Conclusion

A novel 2D physical model for an advanced step-graded AlGaAs hot electron injector Gunn diode was successfully extended to higher frequency ( > 100GHz). Future work includes the development of a full functional multiplier as a high power terahertz source.

The doping spike carrier concentration optimized value was used during higher frequency model development and instead the transit region length was reduced. The measured and simulated forward and reverse-bias IV characteristics of the ~100 GHz fundamental model are shown in Figure 8 and match extremely well with measured data. The manufactured device yielded a maximum fundamental power of ~22 mW at 94 GHz, the highest ever reported for a GaAs Gunn device.

Physical Model Development

The Epitaxial growth of the advanced step-graded GaAs-AlGaAs Gunn diode with hot electron injector wafers is performed at the university using a RIBER V100+ MBE reactor.

To complement experimentally obtained data and perform a sensitivity analysis on the effects of variation in epitaxial composition, especially carrier concentration in the doping spike and transit region, predictive physical models, using SILVACO, have been developed .

Harmonic generation

The THz frequencies considered (up to

600 GHz) are to be generated in a

two-stage module. The initial

frequency source is to be provided by

Contact: [email protected]

Supervisor: Professor Mo Missous

the novel high frequency Gunn diodes. The output from these diodes is then to be coupled into a multiplier module shown in figure 7.

DC IV Characteristics

The simulated forward and reverse bias IV characteristics of the 77 GHz model are shown in figure 5 and match extremely well with measured data thus validating the choice of the physical models and material parameters used. The doping spike analysis provided 1×1018 cm-3 as optimized value. The model was then used to predict and develop higher frequency devices.

A. Results from a SILVACO simulation showing the effects of the doping spike (1×1018 cm-3) on electron concentration in the transit region (——; spike present, -----; spike absent).

B. Effects of variation in doping spike carrier concentration on simulated IV characteristics (numbers next to forward bias curves represent calculated asymmetry values).

Figure 6

0 1 2 3 40.0

0.2

0.4

0.6

0.8

1.0

1.2

Forward

IV Curves

1.27

1.48

1.17

1.17

Current (A)

Voltage (V)

Spike 1×1018 cm

-3

Spike 2×1018 cm

-3

Spike 5×1017 cm

-3

Spike 2.5×1017 cm

-3

Reverse IV Curves

1.5 2.0 2.5 3.0 3.51e13

1e14

1e15

1e16

1e17

1e18

1e19

Contact

layer

Transit Region

AlGaAs Launcher

Electron Concentration (cm

-3)

Device Distance (µm)

Contact

layer

(A) (B)

SILVACO simulation results showing the measured and simulated IV characteristics at 300K

A 2D modelled structure with Gold plated heat sinks.

3D cylindrical model developed in SILVACO

SEM of a fabricated Gunn diode

Epitaxial structure and conduction band diagram

Higher Frequency Gunn

(A). Measured and modelled forward / reverse IV curves for a 100GHz fundamental device at 300K (B). Measured and modelled forward IV curves at increasing temperatures.

Figure 8

0 1 2 3 4

0.0

0.2

0.4

0.6

0.8

358K

300K323K

Current (A)

Voltage (V)

Modelled 300K

Modelled 323K

Modelled 358K

Measured 300K

Measured 323K

Measured 358K

Forward IV Curves

0 1 2 3 4

0.0

0.2

0.4

0.6

0.8

1.0

1.2

Current (A)

Voltage (V)

Measured 300K

Modelled 300K

Forward

IV Curves

Reverse IV Curves

(A) (B)

Figure 1

00.38

Conduction

Band

Typical Advanced Step-graded Injector Gunn Diode Structure

barrier

Transit

Figure 2

Figure 7

Harmonic Generation

Multiplier (x n) BlockGunn Block

Resonant

Disk

Gunn Diode

Output

(wn)Resonant

Cavity (wo)Varactor

Micropstrip

Back short

Bias Post

Choke

WG28 - Waveguide

Schottky