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Development of ATLAS Liquid Argon Calorimeter Front-‐end Electronics
for the HL-‐LHC
Andy Tiankuan Liu on behalf of
the ATLAS Liquid Argon Group
Outline 1. IntroducGon 2. Analog front-‐end
– 65 nm – 130 nm – SiGe
3. ADCs 4. OpGcal links
– Laser driver array ASICs – OpGcal transmiNer array module
5. Summary
2 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
ATLAS LAr Detector and Phase-‐II Upgrade
Preamp + shaper Func;onally the Same as the current detector
New Approach Trigger-‐less readout DigiGze and ship all digital data
LAr Detector @ 87K not change except
potenGal upgrade of FCal
3 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
The back end will also be replaced to readout the new front-‐end
Upgrade ObjecGves
• Detector capacitance 0.2 to 1.5 nF • Signal dynamic range ~ 16 bits • Noise requirements ~ 100 nA • Selectable input impedance 25 or 50 Ω for cable terminaGon • Moderate radiaGon tolerance requirements ~300 krad, 1013 cm-‐2
1-‐MeV eq. neutrons • DigiGze all 128 channels/FEB @ 14 bits, 40 or 80MS/s with 2 gain
scales. • Ship data from all channels off detector (trigger-‐less readout). • Keep the power dissipaGon to the current one or lower.
4 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Op;ons Being Explored
1. Mul;ple-‐ASIC solu;on – Preamplifier + shaper – ADC – Encoder + serializer – Laser drivers and op;cal transmiLers
2. Front-‐End System-‐On-‐Chip (FESOC) solu;on – Preamplifier + shaper + ADC + serializer – Laser drivers and op;cal transmiLers
5 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Outline 1. IntroducGon 2. Analog front-‐end
– 65 nm – 130 nm – SiGe
3. ADCs 4. OpGcal links
– Laser driver array ASICs – OpGcal transmiNer array module
5. Summary
6 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Front-‐End System On Chip • FESOC (front-‐end system
on a chip): proposed • HLC1: 8-‐ch analog FE
ASIC – Dual range – Programmable gain – Programmable
terminaGon – Programmable filter
• To be integrated with ADCs and mux/encoder/serializers
• Power dissipaGon ~1.2 W • CMOS 65 nm
7 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Preamp in 65 nm -‐ Design • New concept • Fully differenGal amplifier • Very stable terminaGon (R and N independent of signal current)
Noiseless capaciGve feedback sehng the gain
8 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Preamp in 65 nm -‐ Performance • Equivalent noise at
the input ENI ~57nA rms at 260pF, 40ns
• Nonlinearity now within 0.1% at 9mA, within 0.5% at 10mA
• Power dissipaGon ~100 mW/channel from single 1.2V supply
• The layout design is being finalized, and the test chip submission is imminent.
9 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
40 ns
57 nA
Peaking Gme sehng
Analog FE in 130 nm -‐ Design
Noise
Line termina;on
10 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Analog FE in 130 nm -‐ Performance
10 kHz
1 MHz
100 MHz
Frequency (Hz)
Inpu
t impe
dance (Ω
)
25.5Ω @1MHz
High gain (0-‐1-‐mA)
High gain (1-‐10 mA)
Integral nonlinearity with CR-‐RC2 (40 ns peaking Gme)
Impedance flat from 10 kHz to 100 MHz < 1 Ω variaGon versus current due to Super Common base Zin variaGon
Noise dominated by R0 and NMOS: 150 nA with 1.5 nF
±0.2%
±0.2%
11 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
FE analog in 130 nm -‐ Prototype
LAUROC : 8 Channel prototype • Super Common Base type Preamp • Programmable Zin: 25 or 50Ω • 2 Gain Ranges: 2 or 10mA • Input Noise eq. < 10Ω • High current SaturaGon miGgaGon • Preamp Power 7mA @ 2.5V ~ 18mW • SubmiNed April 2016
12 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Compare 130 nm and 65 nm: • Test boards/benches similar • ComparaGve measurements of 65/130 nm chips Goal -‐ Converge
FE Analog in SiGe (180 nm) • Similar to the current design which is implemented with discrete components • Bonding opGon for 25/50 Ω. No impedance/dynamic range tuning • Might be marginal at High frequency (> 30 MHz) and large current • Good noise performance on simulaGon : 25 Ω preamp : 86 mW, 97 nA for 1.0 nF
with CR-‐RC2 shaping • Layout exists. Submission is under discussion
13 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Outline 1. IntroducGon 2. Analog front-‐end
– 65 nm – 130 nm – SiGe
3. ADCs 4. OpGcal links
– Laser driver array ASICs – OpGcal transmiNer array module
5. Summary
14 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
ADC in -‐ Specs
• High resoluGon: 14 bits • High speed: 40-‐80 MS/s • Low power, small area • RadiaGon-‐tolerant
Detector Output Signal
Phase-II Upgrade FEB (On detector)
MUX
& Serializer
Optical Links
To Back-end -1000 200400600800100012001400
0
0.5
1
Time [ns]
Nor
mal
ized
Am
plitu
de
Analog Shaper
ADC
Preamp
ADC
16-bit DR 10 Gbps ?
15 15 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Chip Architecture
16 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
• The work is sGll “in-‐progress” and the chip FEB2 context study started
• 65 nm CMOS • 8-‐channel 14-‐
bit ADCs at 40 MS/s
• QFN package preferred (100 pins, 0.5 mm pitch, 12 mm x 12 mm
Power cut
Possible Layout
17 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Power cuts
Digital side
Analog side
ADC channels. Silicon space 0.2 mm x 1 mm per channel
References • Chip produces
data volume of 5.12 Gbit/s
• Die size 1.98 x 1.95 mm
• 136 die I/O pads
Outline 1. IntroducGon 2. Analog front-‐end
– 65 nm – 130 nm – SiGe
3. ADCs 4. OpGcal links
– Laser driver array ASICs – OpGcal transmiNer array module
5. Summary
18 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
OpGcal Links: Overview • The opGcal link part will take advantage of lpGBT and VersaGle Link +, together
aiming at the development of rad-‐tol opGcal links. • The major parts (Mux, encoder and serializer) of lpGBT (65-‐nm CMOS technology)
will be integrated with the analog front-‐end and ADCs. • Laser array driver ASICs and opGcal transmiNer modules are designed for VersaGle
Link +.
19 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Related talks: • Paulo Moreira, RadiaGon hard High-‐Speed OpGcal Links for HEP, 9:00-‐9:45, Thursday. • Csaba Soos, VersaGle Link PLUS Transceiver Development, 11:10 AM, Thursday.
GBTLDD
TIA PD
Laser
TRx
Versatile Link FPGA
On-DetectorCustom Electronics & Packaging
Radiation HardOff-Detector
Commercial Off-The-Shelf (COTS)Custom Protocol
Timing and Trigger
DAQ
Slow Control
Timing and Trigger
DAQ
Slow Control
GigaBit Laser Driver (GBLD)
Mux+ENC +SER
Laser Driver Array: Design and Layout
20 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
Two-‐stage pre-‐driver
VLAD output driver
lpVLAD output driver
1.9 mm
1.7 mm Pitch 0.25 mm
1.9 mm
VLAD (VCSEL Array Driver) and lpVLAD (low-‐power VCSEL Array Driver) are 4-‐channel, 10-‐Gbps-‐per-‐channel VCSEL array driver ASICs designed in a 65-‐nm CMOS technology with different output structures.
Related Talk: Di Guo, Developments of two 4 × 10-‐Gbps radiaGon-‐tolerant VCSEL array drivers in 65 nm CMOS, 3:40 PM, Wednesday. Poster: Zhiyao Zeng, LDQ10P: A Compact Low-‐Power 4x10 Gb/s VCSEL Driver Array IC, today.
Laser Driver Array: OpGcal mulG-‐channel test Results • Total jiNer = 48 ps • Total power consumpGon 33.9 mW/ch
• 10 Gbps opGcal eye with adjacent channel working simultaneously
• Input: diff, swing 200 mV, PRBS 27-‐1 • Tested rad-‐tol above to 300 Mrad.
• Signal source: Agilent J-‐BERT N4903B (12.5 Gb/s)
• Oscilloscope: Agilent DSA91204A (12 GHz) with opGcal receiver Agilent 81495
• Total jiNer 35 ps • Total power consumpGon 21.6 mW/
ch. This is a world record now.
21 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
100 ps 845 µW 100 ps 975 µW
VLAD lpVLAD
Laser Driver Array: Module Development • ATx (Array opGcal TransmiNer) is a 12-‐channel,10 Gbps-‐per-‐channel opGcal transmiNer module
developed, based on the MOI and Prizm from US Connec and the AZ8 connector from Samtec with custom acGve-‐alignment method for the module assembly.
• ATx is used as a test vehicle for VLAD/lpVLAD. • MOI and prizm tested rad-‐tol up to 96 Mrad.
22 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016
ATxfootprint:10mmx15mm.MOIwithaPrizmconnecttoa12-wayfiberribbon.
2mm
1.51mm1.78mm
Thebasewillbereducedfrom2mmto1.2mm.ATxmoduleswillbe5.3mmtallfornow.Inthefinaldesignwehopetoreducetheheightto4.5mm.
1.2mm
Summary
• The ATLAS LAr front-‐end readout electronics without trigger is under development to meet the high luminosity requirements.
• An approach of System-‐On-‐Chip is being targeted: integraGng all front-‐end funcGonal blocks (preamplifiers/shapers/ADCs/mux/encoders/serializers).
• Three analog front-‐end ASICs in early development stages show promising performances within terminaGon, capacitance range, input signal dynamic range and power requirements.
• New ADC design has been started. • Two radiaGon-‐tolerant laser driver array ASICs and an opGcal transmiNer modules are prototyped and tested.
23 Tiankuan Liu, TWEPP, Karlsruhe, Germany, September 27, 2016