3
Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276 Dilute Al–Mn alloys for superconductor device applications S.T. Ruggiero a, *, A. Williams a , W.H. Rippard b , A.M. Clark b , S.W. Deiker b , B.A. Young c , L.R. Vale b , J.N. Ullom b a Department of Physics, University of Notre Dame, Notre Dame, IN 46556, USA b National Institute of Standards and Technology, Boulder, CO 80305, USA c Department of Physics, Santa Clara University, Santa Clara, CA 95053, USA Abstract We discuss results on the superconducting and electron-transport properties of Mn-doped Al produced by sputter deposition. The critical temperature of Al has been systematically reduced to below 50 mK by doping with 1000– 3000 ppm Mn. Values of the a parameter are in the range of 450–500, indicating sharp normal-to-superconductor transitions. This material is thus of significant interest for both transition-edge sensors operating in the 100 mK regime and superconductor/insulator/superconductor and superconductor/insulator/normal devices, in the latter case where appropriately doped Al–Mn replaces the normal metal. r 2003 Elsevier B.V. All rights reserved. PACS: 74.62.Dh; 73.40.Gk; 85.25.j Keywords: Mn doped al; Transition-edge sensors; SIS devices Transition-edge sensors (TES) require films with superconducting transition temperatures below 1 K. One approach to meeting this need is to use elemental superconductors, including W (T c ¼ 80 mK) [1,2], Ti (T c ¼ 370 mK) [3], and Ir (T c ¼ 90–330 mK) [1,4–7]. Perhaps more widely used are bi-layer systems such as Ti/Au [8,9], Mo/ Cu [10], Mo/Au [11,12], and Ir/Au [13]. However, reproducibility has remained an issue with both elemental and bilayer systems. Ion implantation of W films with Co, Fe and Ni [14] has also been successfully employed, although the reproducible preparation of W films with low critical tempera- tures is required. Our work introduces a new approach to producing films with superconducting transition temperatures in the 100 mK regime—with Al films doped with Mn in the 1000—3000 ppm regime. The films were prepared by simple co-deposition from two sputter targets: one with a relatively high (3000 ppm) concentration of Mn and a second target of pure Al. The sputter guns were tilted to intersect at a point equidistant from each gun, where substrates were placed. Sputtering rates were B0.2 nm/s from each gun. Films were prepared on oxidized, 3 in. diameter Si wafers, which could be rotated to produce films with uniform Mn doping. Systematic studies of film uniformity have yet to be conducted. Shown in Fig. 1 is T c versus Mn concentration, the latter established with Rutherford backscatter- ing. Results for the low-temperature (4.0 K) ARTICLE IN PRESS *Corresponding author. Tel.: +1-303-497-4319; fax: +1- 303-497-3042. E-mail address: [email protected] (S.T. Ruggiero). 0168-9002/$ - see front matter r 2003 Elsevier B.V. All rights reserved. doi:10.1016/j.nima.2003.11.236

Dilute Al–Mn alloys for superconductor device applications

  • Upload
    jn

  • View
    213

  • Download
    1

Embed Size (px)

Citation preview

ARTICLE IN PRESS

Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276

*Corresp

303-497-304

E-mail a

0168-9002/$

doi:10.1016

Dilute Al–Mn alloys for superconductor device applications

S.T. Ruggieroa,*, A. Williamsa, W.H. Rippardb, A.M. Clarkb, S.W. Deikerb,B.A. Youngc, L.R. Valeb, J.N. Ullomb

aDepartment of Physics, University of Notre Dame, Notre Dame, IN 46556, USAbNational Institute of Standards and Technology, Boulder, CO 80305, USA

c Department of Physics, Santa Clara University, Santa Clara, CA 95053, USA

Abstract

We discuss results on the superconducting and electron-transport properties of Mn-doped Al produced by sputter

deposition. The critical temperature of Al has been systematically reduced to below 50 mK by doping with 1000–

3000 ppm Mn. Values of the a parameter are in the range of 450–500, indicating sharp normal-to-superconductor

transitions. This material is thus of significant interest for both transition-edge sensors operating in the 100mK regime

and superconductor/insulator/superconductor and superconductor/insulator/normal devices, in the latter case where

appropriately doped Al–Mn replaces the normal metal.

r 2003 Elsevier B.V. All rights reserved.

PACS: 74.62.Dh; 73.40.Gk; 85.25.j

Keywords: Mn doped al; Transition-edge sensors; SIS devices

Transition-edge sensors (TES) require films withsuperconducting transition temperatures below1K. One approach to meeting this need is to useelemental superconductors, including W(Tc ¼ 80 mK) [1,2], Ti (Tc ¼ 370 mK) [3], and Ir(Tc ¼ 90–330 mK) [1,4–7]. Perhaps more widelyused are bi-layer systems such as Ti/Au [8,9], Mo/Cu [10], Mo/Au [11,12], and Ir/Au [13]. However,reproducibility has remained an issue with bothelemental and bilayer systems. Ion implantation ofW films with Co, Fe and Ni [14] has also beensuccessfully employed, although the reproduciblepreparation of W films with low critical tempera-tures is required.

onding author. Tel.: +1-303-497-4319; fax: +1-

2.

ddress: [email protected] (S.T. Ruggiero).

- see front matter r 2003 Elsevier B.V. All rights reserve

/j.nima.2003.11.236

Our work introduces a new approach toproducing films with superconducting transitiontemperatures in the 100 mK regime—with Al filmsdoped with Mn in the 1000—3000 ppm regime.The films were prepared by simple co-depositionfrom two sputter targets: one with a relatively high(3000 ppm) concentration of Mn and a secondtarget of pure Al. The sputter guns were tilted tointersect at a point equidistant from each gun,where substrates were placed. Sputtering rateswere B0.2 nm/s from each gun. Films wereprepared on oxidized, 3 in. diameter Si wafers,which could be rotated to produce films withuniform Mn doping. Systematic studies of filmuniformity have yet to be conducted.

Shown in Fig. 1 is Tc versus Mn concentration,the latter established with Rutherford backscatter-ing. Results for the low-temperature (4.0 K)

d.

ARTICLE IN PRESS

S.T. Ruggiero et al. / Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276 275

resistivity, rð0Þ; of the films (inset) can becompared with room-temperature resistivities forAu, Cu, and Mo of 2.04, 1.56 [15], and 5.7 mO cm[16], respectively (room-temperature to low-tem-perature resistance ratios for these materials aretypically 3–5), and rð0ÞB12 mO cm for Ti [17]. Thisimplies that for a given Tc; the conductivity ofdoped Al–Mn films are generally competitive withother systems for TES applications.

In our own investigations, we have seen thatferromagnetic materials such as Fe and Ni do notproduce a rapid depression of Tc in Al, and thatthe rate of Tc suppression with Mn doping is lowerthan typically observed with Abrikosov–Gor’kov[18] pair breaking with magnetic dopants. Thissuggests that Tc suppression in Al–Mn alloys is

0

0.2

0.4

0.6

0.8

1

0 1000 2000

0

1

2

3

4

0 1000 2000Mn conc. (ppm)T

c/T

co ρ(0)

(µΩ

cm

)

Mn Concentration (ppm)

Fig. 1. Reduced critical temperature versus Mn concentration

for Al–Mn thin films. Inset shows low-temperature (4.0K)

resistivity, rð0Þ; versus Mn concentration. Tco ¼ 1:17K.

1.4

1.2

1.0

0.8

0.6

0.40.2

0

0.460.450.440.430.420.410.40

∆T/Tc = 0.041Tc = 0.437 K

Al-Mn(1000 ppm Mn)

T(K)

Res

ista

nce

(arb

. uni

ts)

Fig. 3. Resistive transitions for Al–Mn films with transition tempe

rather the result of pair scattering from resonantmagnetic impurity sites in the context of theFriedel–Anderson model [19], as quantified bythe Kaiser theory [20].

Fig. 2 further illustrates the correlation of Tc

with transport properties. Shown is Tc versusresistance ratio, the ratio of the room temperatureto 4.0 K resistivity. Present are results for filmsmade at specific Mn concentrations and thoseproduced by a phase spread, where a substrate washeld fixed between pure Al and Al–Mn sputtertargets. The majority of the data is for films200 nm or greater in thickness.

The sharpness of transitions is a key parameterfor TES applications, quantified by a ¼dðln RÞ=dðln TÞ; where larger values represent

0

0.1

0.2

0.3

0.4

0.5

1 1.5 2 2.5

Uniform Dilutions

Phase Spread

Tc

(K)

resistance ratio

Fig. 2. Tc versus resistance ratio, defined as R273K/R4.0 K, of

Al–Mn thin films.

0.6

0.4

0.2

0

0.0960.0920.0880.084

∆T/Tc = 0.052Tc = 0.0898 K

Al-Mn(1500 ppm Mn)

T(K)

Res

ista

nce

(arb

. uni

ts)

ratures of 437 and 89.8mK. Arrows define transition region.

ARTICLE IN PRESS

S.T. Ruggiero et al. / Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276276

sharper transitions. Resistive transitions for Al–Mn films with critical temperatures of 437 and89.8 mK are shown in Fig. 3. They have a values of500 and 450, respectively, compared with reportedvalues for single and bi-layer systems ranging fromB90 to1000 [7–9,12].

Acknowledgements

The authors acknowledge useful discussionswith S. Nam. Work supported by the NationalInstitute of Standards and Technology, Depart-ment of Energy Grant DE FG02-88ER45373, andDARPA SpinS.

References

[1] B.A. Young, S.W. Nam, P.L. Brink, B. Cabrera, B. Chugg,

R.M. Clark, A.K. Davies, K.D. Irwin, IEEE Trans. Appl.

Supercond. 7 (1997) 3367.

[2] D. Fukuda, Y. Noguchi, M. Ohno, H. Takahashi, M.

Ataka, H. Pressler, F. Hirayama, M. Ukibe, M. Ohkubo,

H.M. Shimizu, M. Nakazawa, Low temperature detectors,

Ninth International Workshop on Low Temperature

Detectors, Madison, WI, in: F.S. Porter, D. McCammon,

M. Galeazzi, C.K. Stahle (Eds.), AIP Conference Proceed-

ings, Vol. 605, AIP, Melville, New York, 2002,

pp. 263–266.

[3] A.T. Lee, Shih-Fu Lee, J.M. Gildemeister, P.L. Richards,

Proc. LTD7 (1997) 123.

[4] H. Pressler, M. Koike, M. Ohkubo, D. Fukuda, Y.

Noguchi, M. Ohno, H. Takahashi, M. Nakazawa, Appl.

Phys. Lett. 18 (2002) 331.

[5] M. Tinkham, Introduction to Superconductivity,

McGraw-Hill, New York, 1996.

[6] M. Ohno, Y. Noguchi, D. Fukuda, H. Takahashi, M.

Nakazawa, M. Ataka, M. Ukibe, F. Hirayama, M.

Ohkubo, H.M. Shimizu, Low temperature detectors, AIP

Conference Proceedings, Vol. 605, AIP, Melville, New

York, 2002, pp. 259–262.

[7] S. Trowell, A.D. Holland, G.W. Fraser, D. Goldie, E. Gu,

Low temperature detectors, AIP Conference Proceedings,

Vol. 605, AIP, Melville, New York, 2002, pp. 267–270, and

reference therein.

[8] G. Ventura, M. Barucci, E. Pasca, E. Monticone, M.

Rajteri, Proc. ICATPP7 World Scientific, Singapore, 2002,

p. 677.

[9] M. Ukibe, T. Kimura, T. Nagaoka, H. Pressler, M.

Ohkubo, Low temperature detectors, AIP Conference

Proceedings, Vol. 605, AIP, Melville, New York, 2002,

pp. 207–210.

[10] G.C. Hilton, J.M. Martinis, K.D. Irwin, N.F. Bergren,

D.A. Wollman, M.E. Huber, S. Deiker, S.W. Nam, IEEE

Trans. Appl. Supercond. 11 (2001) 739.

[11] N. Tralashawala, Nucl. Instr. and Meth. A 444 (1999)

1888.

[12] E.F. Feliciano, J. Chervenak, F.M. Fikbeiner, M. Li, M.A.

Lindeman, C.K. Stahle, C.M. Stahle, Low temperature

detectors, AIP Conference Proceedings, Vol. 605, AIP,

Melville, New York, 2002, pp. 239–242.

[13] J. Schnagl, G. Angloher, F.v. Feilitzsch, M. Huber, J.

Jochum, J. Lanfranchi, M.L. Sarsa, S. Wanninger, Nucl.

Instr. and Meth. Phys. Res. A 444 (2000) 245.

[14] B.A. Young, T. Saab, B. Cabrera, J.J. Cross, R.M. Clarke,

R.A. Abusaidi, J. Appl. Phys. 86 (1999) 6975.

[15] N.W. Ashcroft, N.D. Mermin, Solid State Physics, Holt,

Rinehart and Winston, Philadelphia, PA, 1976, p. 8.

[16] http://www.goodfellow.com/csp/active/static/A/MO00.

HTML.

[17] E. Monticone, M. Rajteri, M.L. Rastello, V. Lacquaniti,

C. Gandini, E. Pasca, G. Ventura, Low temperature

detectors, AIP Conference Proceedings, Vol. 605, AIP,

Melville, New York, 2002, pp. 181–184.

[18] A. Abrikosov, L.P. Gor’kov, Soviet Phys. –JETP 12 (1961)

1243.

[19] N.W. Ashcroft, N.D. Mermin, Solid State Physics,

Saunders, 1976, p. 687.

[20] M.B. Maple, in: D.H. Douglas (Ed.), Superconductivity

in d- and f- Band Metals, AIP Conference Proceedings,

Vol. 4, American Institute of Physics, New York, 1972,

pp. 175–203.