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Discussion Section 1 Sean Huang January 22, 2021

Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

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Page 1: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Discussion Section 1Sean HuangJanuary 22, 2021

Page 2: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

About Me• 4th-year graduate student

– Advised by Prof. Bora Nikolic• Working in the Berkeley Wireless

Research Center (BWRC)• Researching a framework for

designing and generating PLLs for all purposes

Page 3: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

About This Discussion Section• Quick review of relevant points from each week• Some example problems about those topics from lecture and homework

Page 4: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

About This Discussion Section• Quick review of relevant points from each week• Some example problems about those topics from lecture and homework

–We’ll be doing these together!

Page 5: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Last-Minute Logistics• Email me at [email protected]• Office Hours Fridays 2PM-3PM (14:00-15:00), Zoom link to be posted on the

website– If this time doesn’t work, let me know through email and we can try to set up

another time

Page 6: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling• Transistors getting smaller, faster, cheaper

Page 7: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling

IBM 1401 (1959)

Page 8: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling

Page 9: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling

Page 10: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling

8 transistors per card!

Page 11: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling

8 transistors per card!

Each card ≈ a 7400 chip

Page 12: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling

8 transistors per card!

Each card ≈ a 7400 chip

(1964)

Page 13: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling• Dennard Scaling

– Reducing dimensions and supply voltage yields performance improvements • Decreases gate capacitance (increased speed, lower power)• Constant power density (more devices, less power per device)

Page 14: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling• Dennard Scaling

– Reducing dimensions and supply voltage yields performance improvements • Decreases gate capacitance (increased speed, lower power)• Constant power density (more devices, less power per device)

• Frequency Scaling– Keep supply voltage constant, decrease size

• Speed increases quadratically! "#$• Power increases cubically! %&'

• “Power wall” at 3-4GHz– Same old tradeoff not worth it anymore

Page 15: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling• Moore’s Law

– Still trying to cram more transistors on the same package (chiplets)

– More transistors = more functionality?

Page 16: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Process and Frequency Scaling• Moore’s Law

– Still trying to cram more transistors on the same package (chiplets)

– More transistors = more functionality?• Frequency Scaling

– Actually dead– Worked up to the power wall, no clear way to

get past this– Most modern processor clock speeds pretty

much constant across generations

Page 17: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

The Pareto Optimal Frontier• Tradeoffs

– Power vs. Performance– Cost vs. (Pretty much everything)– Time-to-market vs. Performance

• Every engineering project is balancing compromises– How much should we sacrifice to meet

specifications?• Pareto optimal frontier

– Best possible outcome of tradeoff space

Page 18: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Digital Logic Design

Page 19: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Combinational Logic• Output only depends on current

input– “Memoryless”

• Truth Table– List all possible inputs– Define output behavior for each

A B Out

0 0 0

0 1 0

1 0 0

1 1 1

ANDA

BOut

Page 20: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Proof By Truth Table

C B A A|B (A|B)&C Out

0 0 0 0 0 1

0 0 1 1 0 1

0 1 0 1 0 1

0 1 1 1 0 1

1 0 0 0 0 1

1 0 1 1 1 0

1 1 0 1 1 0

1 1 1 1 1 0

C B A A|B !(A|B) !C Out

0 0 0 0 1 1 1

0 0 1 1 0 1 1

0 1 0 1 0 1 1

0 1 1 1 0 1 1

1 0 0 0 1 0 1

1 0 1 1 0 0 0

1 1 0 1 0 0 0

1 1 1 1 0 0 0

Page 21: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Sequential Logic• What if we need memory?• Registers (flip-flops) store

information– Output updates to equal input

depending on load signal• This is not instant

– Output is held steady until next load edge

• Clock (clk) signal is typically used for synchronizing registers

clk

Q

D 0 1

X 0

2

1

Time

Page 22: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Register Transfer Level (RTL)• There are limitations for synchronous

designs– No combinational loops

• All digital designs can be abstracted as RTL– Mix of combinational and

sequential logic blocks

Not to be confused with Resistor-Transistor Logic

• HDL Languages (Verilog, VHDL)– Use this abstraction to describe

systems– Follow similar division of designs

• Combinational section• Sequential section

Page 23: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

ASIC vs. FPGA

Page 24: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

ASIC vs. FPGAField-Programmable Gate Array (FPGA)Application-Specific Integrated Circuit (ASIC)

• Customizable layout• Control over entire chip layout (at design)• Optimized for few applications

• Array of pre-placed general logic blocks– Look-up tables, Registers, Multiplexer,

Memory, DSP accelerators, Combinational Logic, Interconnect

• Can be reprogrammed on the fly to implement hardware even after manufacture

Page 25: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

ASIC vs. FPGAFPGAASIC

• Area-efficient– Only place what you need

• Inflexibility– Can only configure as far as designed to– Usually only a few applications

• Design turnaround time in months/years• High Fixed Cost (NRE)

– Design and Verification• Only have 1 shot to get the chip right• Many hours of engineering work to create each

iteration• Low Manufacturing Cost

– Once design verified, can mass produce ASICs at very low cost• Area optimized for application, so higher yield

• Need to sell a lot of chips to offset NRE cost!

• Generality– Some logic blocks won’t be used for every application

• Flexibility– Can change hardware connections on the fly– Many potential applications

• Design turnaround time in minutes/hours• Low Fixed Cost (NRE)

– Just need to program some existing FPGAs– Low risk as redesign is quick

• Moderate Manufacturing Cost– Need to source FPGAs from a third party

• Need more area for generality, more cost per die• Less tolerance for manufacturing defects because of

larger die• Good for low volume production or need for

flexible implementation

Page 26: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

Simulation• RTL Simulation

– Quick verification of logical function• Used more in early stages of design to verify idea works

– Ideal behavioral models• Gate-level Simulation

– More “real” effects taken into account (e.g. timing)• Used in later design stages to verify actual chip still works

– Models each gate with library of parameters• Circuit Level Simulation (SPICE, Spectre)

– Lowest level simulation, taking everything possible into account

Page 27: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

SimulationSimulation is your friend! (But also your worst enemy)

• SPICE is a tool, not an oracle• Sometimes (rarely) the simulation is

wrong!– Incorrect setup– Bad model

• Have an idea for what to expect– Do hand calcs before simulating– Know what the system should do

Page 28: Discussion Section 1 - University of California, Berkeleyeecs151/sp21/files/...•Gate-level Simulation –More “real” effects taken into account(e.g.timing) •Used in later design

LTSpice Installation and Tutorial