ITRS Factory Integration TWG 1DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

ITRS Factory Integration Presentation

Mani Janakiram & Junji Iwasaki

July 2005

Global Co-Chairs:Europe: Arieh GreenbergJapan: Shige Kobayashi, Michio HonmaKorea: TBDTaiwan: Thomas ChenUS: Mani Janakiram

ITRS Factory Integration TWG 2DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Agenda1. Scope and Difficult Challenges

2. FI Current Status

3. Technology Requirements

4. Manufacturing Strategy Evolution

5. Top Factory Integration Focus Areas

6. Summary

Factory Integration Scope and Drivers

WaferMfg

ChipMfg

ProductMfg

Dis

trib

uti

on

• FEOL• BEOL

• Probe/Test• Singulation

• Packaging• Test

Si SubstrateMfg

ReticleMfg

Increasing cost &Cycle time implications

Factory is driven by Cost, Quality, Productivity, and Speed:Reduce factory capital and operating costs per functionFaster delivery of new and volume products to the end customerEfficient/Effective high volume production, high reliability, & high equipment reuseEnable rapid process technology shrinks and wafer size changes

FactoryOperations

ProductionEquipment AMHS Factory Information

& Control Systems Facilities

UI

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ITRS Factory Integration TWG 4DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Key Technologies that will Impact Factory Design 2005 and future years are targeted to meet productivity and capture

technology requirements Key process and device technology intercepts that will impact the factory

design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials and the next wafer size conversion

Year 2005 2006 2007 2008 2009

Technology trend (nm)

80 70 65 55 50

Wafer Size (mm) 300 300 300 300 300

Near Term Years

Long Term Years

Year 2010 2011 2012 2013 2014 2015 2016 2017 2018

Technology trend (nm) 45 40 35 32 28 25 22 20 18

Wafer Size (mm) 300 300 450 450 450 450 450 450 450

Next Wafer Size in Production?

New Device Structures?

Start Planning for 450mmStarted discussions

EUVL in Production?

Difficult Challenges Summary

Near Term: 2005 to 2009 >45nm1. Responding to rapidly changing and complex business requirements [E]2. Meeting growth targets while margins are declining [E]3. Managing ever increasing factory complexity [M]4. Meeting factory and equipment reliability, capability or productivity

requirements per the roadmap [M]5. Meeting the Flexibility, Extendibility, and Scalability needs of a cost

effective, leading edge factory [M]6. Meeting process requirements at 65nm and 45nm nodes running

production volumes [P]7. Increasing global restrictions on environmental issues [E]

Long Term: 2012 to 2018 <45nm1. Post conventional CMOS manufacturing uncertainty [P]2. Next Wafer Size and Emerging factory paradigm changes [M] [E]

Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth for both efficiency and effectiveness

E=Economic/BusinessP=Process TechnologyM=Manufacturing

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6DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Some Projected Attributes of a 300mm < 45nm Fab

SECS Control Line

Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data

Manufacturing Execution Systems

Factory SchedulerAnd Material Control

Full Wafer Level Tracking &Recipe/Parameter Changes

100% Direct Tool Delivery AMHS

Ubiquitous APC; Rapid Process Matching & New Product Qualification

Standard, Detailed EquipmentPerformance Tracking (EPT) Data

Systems Scaled for > 50k wspm

Data standards and Systems for RapidMask Set Creation

Aggressive NPW Reduction & Efficient Spares Mgmt

Very Fast Cycle time Fabs for Hot & Normal lots

Wafer Data Standard For Packaging

Offline tools to test schedule rules and rapidly put in MfgPervasive

E-Diagnostics

SPCAPC FDC

Yield PCS EPT

Equipment Engineering Capabilities

Recipes

E-Diag

EquipmentControl Systems

Partner, Customer

Or Supplier

Equipment & Systems designed for High Mix operation

Equipment &Process Data

FI Sub team – July 2005 StatusSubteam July 2005

1 Factory Operations (FO)

Focus: 1) Reduce mfg cycle time, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix

Completed Technology Requirements table and potential solutions tables. No major changes to the technology table anticipated. Working on the summary.

2 Production Equipment (PE)

Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement

Completed Technology Requirements table and potential solutions tables. Few changes to the technology table is made. Completed rev0 write-up and impact of focus area on PE

3 Automated Matl Handling Systems (AMHS) Focus: 1) Increase throughput, 2) Reduce Average Delivery times, 3) Improve Reliability

Completed Technology Requirements table and potential solutions tables. Updating the values for peak MPH specific to high thr’put bay. Working on the summary.

4 Factory Information & Control Systems (FICS)

Focus: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Handle data explosion,

4) Reduce or Maintain Mask Shop Cycle Time

Completed Technology Requirements table and potential solutions tables. Small changes to the technology table are made. Working on the summary.

5 Facilities

Focus: 1) Reduce Costs 2) Utility 3) Footprint 4) Reduce equipment installation time

Completed Technology Requirements table and potential solutions tables. Few changes to the technology requirements table are made. Working on the summary.

6 Other – Focus area & Cross-cut items 2005 FI chapter will include sections on 1) Focus areas 2) Text on AMC, EMI, ESD and cross-TWG issues.

Completed technology requirements, potential solutions, focus area and cross-cut challenges

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8DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Factory Operations Technical Requirements

Key Objectives: 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix

Solution exists Solution being developed Solution required

9DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Production Equipment Technical Requirements

Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement

Solution exists Solution being developed Solution required

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Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability

Material Handling Technical Requirements

Solution exists Solution being developed Solution required

11DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

FICS Technical Requirements

Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput,3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs

Solution exists Solution being developed Solution required

12DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Facilities Technical Requirements

Key Objectives: 1) Factory Extendibility, 2) AMC,3) Rapid Install/Qualification, 4) Reduce Costs

Solution exists Solution being developed Solution required

13DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

2005 FI Focus Area

Focus Areas July 2005 Status

1 Airborne Molecular Contamination (AMC) Implications at < 45nm process technologies (Now -> 2006)

AMC tables will be in YE and the reference text will be in PE and Facilities.

2 Rapid Equipment Install and Qualification (Now ->)

Rapid equipment install and adaptor plate ideas being formed by Facilities. Adaptor plate per tool type. Need a standard among the suppliers.

3 “Proactive Visual” manufacturing (Now ->) Need more clarity; Minifab versus Megafab; STRJ needs help to promote visualization; This can be treated as a solution.

4 Next Wafer Size (NWS) Transition (2005 -> 2012)

FI will work with International Sematech and will continue to define technology requirements for NWS FI

Factory Integration focus areas: AMC, NWS, and Proactive Visualization

14DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

AMC Requirements - Current status

AMC limits are currently addressed in the Yield Enhancement YE TWG, and the Wafer Environmental Contamination Control WECC subTWG

Fab environment requirements have not been defined yet in the FI TWG

Wafer Environment Control such as Cleanroom, SMIF POD, FOUP, etc….not necessarily the cleanroom itself but wafer environment.

Number of particles (/m3) [B] ISO CL 2 ISO CL 2 ISO CL 2 ISO CL 2

Airborne Molecular Contaminants in gas phase (pptM)) [C] [H] [R]

Lithography—bases (as amine, amide, and NH3) 750 750 750 500

Gate—metals (as Cu, E=2×10–5

) [I] 0.15 0.1 0.1 0.07

Organics (molecular weight ≥ to C7H16) normalized to

hexadecane (C16H34) equivalent5000 4500 4000 3500

Salicidation contact—acids (as Cl–, E=1×10–5

) 100 100 100 10

Salicidation contact—bases (as NH3, E=1×10–6

) 1000 1000 1000 100

Dopants [E] 10 10 10 10

Airborne Molecular Contaminants, Surface Deposition Limits (for Si Witness Wafer, 24-hour Exposure to Closed FOUP, Pod, Mini-environment or Air)SMC (surface molecular condensable) organics on

wafers, ASTM 1982–99, ng/cm2 [O]

4 2 2 2

Front-end processes, bare Si, total dopants added to 24-

hour witness wafer, atoms/cm2 [E] [P]

2.00E+12 2.00E+12 2.00E+12 1.00E+12

Front-end processes, bare Si, total metals added to

witness wafer, atoms/cm2 [G] [Q]

2.00E+10 2.00E+10 2.00E+10 2.00E+10

Wafer

Wafer/Tool environment

Fabenvironment

FactoryIntegrationRoadmap

Yield Enhancement Roadmap

TechnologyRequirements

15DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Rapid Tool Install - Adapter Plate Concept

Facility Utilities Into Adapter Plate (water, gasses, etc.)

Supplier Utilities Into Process Tool

Exhaust From Tool

Exhaust To Facility

Facility Power Into Adapter Plate

Proactive Visualization Comprehensive structured P/V matrix be developed for SoC manufacturing Strategic issues be broken down and mapped into P/V matrix Solutions and needs bilaterally be traceable through P/V matrix

LMHVNew

Production Methods

Design &Manufacturing

Integration

Small order sizeShort product cycle

Varying product volume

New Foundry Business

Combinations of Solutions

solutions

New IDM

Cost DeliveryQuality Energy

Products

Factory Operation

Factory Resource Metrics Development

and Proper Targeting Needed

Pro

acti

veV

isu

aliz

atio

nP

roac

tive

Vis

ual

izat

ion

HMLV

Strategic Issues

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ITRS Factory Integration TWG 17DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Cycle Time as a function of Lot Size

25 12 6 2

25Current R/M

(Non Hot Lot)Current R/M

(Super Hot Lot)

12 Next R/M

6 Next R/M

2 Next R/M

ObjectiveLot SizeNominal

Lot Size

2005 2018

Cycle time per mask layer (days)Short cycle time will be driven by smaller lot size and

more single wafer processingSetup time reduction

ITRS Factory Integration TWG 18DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

We started discussions for next wafer size transition

9 yrs + 2 yrs delay* 9 yrs? + 2 yrs delay? 9 yrs + ?yrs delay

675mm/2021?450mm/2012?300mm/2001200mm/1990 (125/150mm - 1981)

We are here When does this happen?

ITRS Factory Integration TWG 19DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Examples of next wafer size (NWS) technology decisions that are needed

Attribute Key Technology Decisions

Wafer Material, Size, Thickness, ID, Registration, Edge Exclusion

WaferCarrier

Number of Wafers, Size, Door Type, AMHS Strategy, ID

ProductionEquipment

Single wafer vs. mini-batch, cleanliness, interface standards, productivity targets relative to 300mm (NPW usage, etc.)

Factory Factory Size, Egress, Cleanliness, Sub-Fab attributes, Clean-room height

AutomatedMaterial HandlingSystems

Direct transport concepts, carrier/wafer delivery time, overall throughput, efficient storage concepts

ManufacturingSystems

Process Control & Yield Data Standards, Carrier delivery time, Decision Making Time, Data Flow

ITRS Factory Integration TWG 20DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

2004 2005 2006 2007 2008 2009 2010 2011 2012

2004 2005 2006 2007 2008 2009 2010 2011 2012

Carrier & lot-sizedetermination

Direct TransportStandards

Production EquipmentStandards

Factory Control System Standards

Interoperability Testing& Reliability Verification

450mm waferStandards

Proposed next wafer size (NWS) transition timeline

Not final.Need Further discussions

Many technology issues in NWS need to be addressed!

FI has started to work on NWS technology challenges

ITRS Factory Integration TWG 21DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

Key Messages1. Business strategies, market demands, and process technology changes

continue to make factories difficult to integrate

2. Factory’s speed and flexibility are vital to accommodate various production technologies

High Mix, Cycle time improvement, equipment utilization, direct transport AMHS, etc.

3. Gaps in Production Equipment performance, Setup time, AMHS, Facilities and Factory operations must be improved

Metrics needed to cover versatility, productivity, agility, quality, environment compatibility

4. Key cross-TWG issues need to be addressed

Abatement, Energy requirement,

5. New technology demands tighter AMC control

6. Proactive visualization/usage of factory data is required

Delivery time, Quality, and Reliability

7. Next wafer size technical requirements need to addressed