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Atomistic models for gate stacks (Gavartin and Shluger, Microelectr. Engr. 84, 2412 (2007)). Realistic models: disorder dangling bonds amorphous SiO 2 suboxide SiO x layer (Giustino, Bongiorno & Pasquarello, J. Phys. Cond. Matter 17, S2065 (2005)). possibly amorphous HfO 2 sufficient thickness of each layer Estimate: need thousands of atoms Capability: hundreds of atoms Compromise: keep layers relatively thick; use idealized crystalline components stacked “epitaxially”
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Effect of Oxygen Vacancies and Interfacial Oxygen Concentration on Local Structure and Band Offsets in a Model Metal-HfO2-SiO2-Si Gate Stack
Eric Cockayne Ceramics Division, NIST, Gaithersburg
Blanka Magyari-KopeYoshio Nishi
Electrical Engineering Dept., Stanford U.
Outline Create atomistic models for layers and
interfaces in a gate stack Calculate band structures for these
models Study effect of modifying interfaces on
band offsets Study effect of defects on band offsets
Atomistic models for gate stacks
(Gavartin and Shluger, Microelectr.Engr. 84, 2412 (2007)).
Realistic models: disorder dangling bonds amorphous SiO2 suboxide SiOx layer (Giustino,Bongiorno & Pasquarello, J. Phys.Cond. Matter 17, S2065 (2005)). possibly amorphous HfO2 sufficient thickness of each layer
Estimate: need thousands of atomsCapability: hundreds of atoms Compromise: keep layers relatively thick; use idealized crystalline components stacked “epitaxially”
Strategy: find crystalline structures with similar cross sections find atomistic models for interfaces from literature if possible “splice” together the models to create complete stackRe-relax at fixed volume, using density functional theory (DFT).
metal: Pt 110 surface 0.554 nm x 0.480 nmsemiconductor: Si 001 surface 0.543 nm x 0.543 nminterfacial SiO2: cristobalite 001 surface 0.497 nm x 0.497 nmhigh-k dielectric: HfO2 monoclinic 100 surface 0.529 nm x 0.517 nmmetal: Pt 110 surface
Overall cross section: 0.545 nm x 0.500 nm
Si-SiO2: check phase interface O (Tu & Tersoff PRL 84, 4393 (2000))
SiO2-HfO2: 322 model (Sharia, Demkov, Bersuker & Lee PRB 75, 035306 (2007)).
Interface structures
HfO2-Pt (Gavrikov et al., J. Appl. Phys. 101, 014310 (1007).)
Pt-Si.
CommentsVASP usedDFT, ultrasoft pseudopotential methods, PAW formalism287 eV plane wave cutoff; 2x2x1 k-point gridDesigned with inversion symmetryRepeats “back to back”Justification: avoid metal-vacuum surface in modelStrain favors in-plane bc orientation of HfO2 (100, not 001) First full layer of O within HfO2 4-fold coordinated. HfO2-Pt interfacial O layer 4-fold coordinated type
Pt-Si-SiO2-HfO2-Pt gate stack model
Calculated band structure for stack with O occupancy 0.75
Pt Si SiO2 HfO2 Pt HfO2 SiO2 Si Pt
Comparative band structure of fully reduced and fully oxided HfO2-Pt interface
Approximately 0.009 e nm dipole moment per interfacial O
Conclusions
(Pt)-Si-SiO2-HfO2-Pt stacks can be modeled using crystalline phases, sharp interfaces, and minimal strain with a 0.55 nm x 0.50 nm cross section.
Oxidation of HfO2-Pt interface raises energies of HfO2 conduction and valence bands equally; valence band offsets change 2.3 eV from metallic to fully oxidized interface
Oxygen vacancies: at level of LDFT; gap state lies below the Fermi level (neutral vacancy)
Although vacancy formally neutral, significant band bending occurs.