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EI1009 – LINEAR INTEGRATED CIRCUITS AND APPLICATIONS

Dr.K.A.Sunitha

A.P(Sr.G)

EIE Department

SRM University

Slide 2 What is this subject all about?

• Title ?

• Why?

• When and where ?

Slide 3

• What is an Integrated Circuit?

• Where do you use an Integrated Circuit?

• Why do you prefer an Integrated Circuit to the circuits made

by interconnecting discrete components?

Slide 4 The Integrated Circuit (IC)

• An IC consists of interconnected electronic components in a single piece (“chip”) of semiconductor material.

The first planar IC(actual size: 0.06 in. diameter)

• In 1959, Robert Noyce (Fairchild Semiconductor) demonstrated an IC made in silicon using SiO2

as the insulator and Al for the metallic interconnects.

• In 1958, Jack S. Kilby (Texas Instruments) showed that it was possible to fabricate a simple IC in germanium.

Slide 5 From a Few, to Billions

• By connecting a large number of components, each performing simple operations, an IC that performs very complex tasks can be built.

• The degree of integration has increased at an exponential pace over the past ~40 years.» The number of devices on a chip doubles

every ~18 months, for the same price.

“Moore’s Law” still holds today.

1,000

10,000

100,000

1,000,000

10,000,000

100,000,000

1,000,000,000

1971

1973

1975

1977

1979

1981

1983

1985

1987

1989

1991

1993

1995

1997

1999

2001

2003

Intel CPU DRAM

4044 8080

8086

80486

PentiumPentiumII

8028680386

Pentium III & IV

1K 4K

16K

64K

256K

1M

4M

16M

64M

256M

1 Gb

300mm Si wafer

Intel Pentium®4 Processor

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An integrated circuit (IC) is a miniature ,low costelectronic circuit consisting of active and passivecomponents fabricated together on a single crystal ofsilicon. The active components are transistors anddiodes and passive components are resistors andcapacitors.

INTEGRATED CIRCUITS

Slide 7 Why “LINEAR” INTEGRATED CIRDUITS…?

• A linear integrated circuit (linear IC) is a solid-state analog device characterized by a theoretically infinite number of possible operating states. It operates over a continuous range of input levels. In contrast, a digital IC has a finite number of discrete input and output states.

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WHY….Advantages of integrated circuits

1. Miniaturization and hence increased equipment density.

2. Cost reduction due to batch processing.

3. Increased system reliability due to the elimination of soldered joints.

4. Improved functional performance.

5. Matched devices.

6. Increased operating speeds.

7. Reduction in power consumption

Slide 9

• Communication

• Control

• Instrumentation

• Computer

• Electronics

WHERE?

Applications of an Integrated Circuit

Slide 10 EECS 105 in the Grand Scheme

• Example electronic system: cell phone

Slide 11 EECS 105: Emphasis on Analog IC’s

• Example: 14-bit analog-to-digital converter– Y. Chiu, IEEE Int’l Solid-State Circuits Conference, 2004.

Slide 12 Text Books:

1. Linear Integrated Circuits – D. Roy Choudhury

2. Op-Amps & Linear ICs – Ramakanth A. Gayakwad.

3. Digital Fundamentals – Floyd and Jain

Slide 13 Classification

• Digital ICs

• Linear ICs

Pn junctionisolation

Hybrid circuits

Integrated circuits

Dielectricisolation

Monolithic circuits

Bipolar Uni polar

MOSFET JFET

Classification of ICs

Thick &Thin film

Slide 14 Chip size and Complexity

• Invention of Transistor (Ge) - 1947

• Development of Silicon - 1955-1959

• Silicon Planar Technology - 1959

• First ICs, SSI (3- 30gates/chip) - 1960

• MSI ( 30-300 gates/chip) - 1965-1970

• LSI ( 300-3000 gates/chip) -1970-1975

• VLSI (More than 3k gates/chip) - 1975

• ULSI (more than one million active devices are integrated on single chip)

Slide 15

SSI MSI LSI VLSI ULSI

< 100 active

devices

100-1000

active

devices

1000-

100000

active

devices

>100000

active

devices

Over 1

million

active

devices

Integrated

resistors,

diodes &

BJT’s

BJT’s and

Enhanced

MOSFETS

MOSFETS 8bit, 16bit

Microproces

sors

Pentium

Microproces

sors

Slide 16 IC Package types

• Metal can Package

• Dual-in-line

• Flat Pack

Slide 17 Metal can Packages

• The metal sealing plane is at the bottom over which the chip is bounded

• It is also called transistor pack

Slide 18 Doul-in-line Package

• The chip is mounted inside a plastic or ceramic case

• The 8 pin Dip is called MiniDIP and also available with 12, 14, 16, 20pins

Slide 19 Flat pack

• The chip is enclosed in a rectangular ceramic case

Slide 20 Selection of IC Package

Type Criteria

Metal can

package

1. Heat dissipation is important

2. For high power applications like

power amplifiers, voltage regulators

etc.

DIP 1. For experimental or bread boarding

purposes as easy to mount

2. If bending or soldering of the leads is

not required

3. Suitable for printed circuit boards as

lead spacing is more

Flat pack 1. More reliability is required

2. Light in weight

3. Suited for airborne applications

Slide 21

The metal can (TO)

Package

The Dual-in-Line (DIP)

Package

The Flat Package

Packages

Slide 22 Manufacturer’s Designation for Linear ICs

• Fairchild - µA, µAF

• National Semiconductor - LM,LH,LF,TBA

• Motorola - MC,MFC

• RCA - CA,CD

• Texas Instruments - SN

• Signetics - N/S,NE/SE

• Burr- Brown - BB

Slide 23 OPERATION AMPLIFIER

An operational amplifier is a direct coupled high gain

amplifier consisting of one or more differential amplifiers,followed by a level translator and an output stage.

It is a versatile device that can be used to amplify ac aswell as dc input signals & designed for computingmathematical functions such as addition, subtraction,multiplication, integration & differentiation

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Slide 24 OP AMP

Slide 25

OP AMP WITH FEED BACK

Slide 26 Op-amp symbol

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Non-inverting input

inverting input

0utput

+5v

-5v

2

3

67

4

Slide 27 Ideal characteristics of OPAMP

1. Open loop gain infinite

2. Input impedance infinite

3. Output impedance zero

4. Bandwidth infinite

5. Zero offset, ie, Vo=0 when V1=V2=0

6. Infinite CMRR

7. Infinite Slew Rate

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Slide 28 Inverting Op-Amp

V VR

ROUT IN

f

1

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Slide 29

INVERTING AMPLIFIER

Slide 30 Non-Inverting Amplifier

Vout= (1+Rf/R1)Vin

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Slide 31

NON - INVERTING AMPLIFIER

Slide 32 Voltage follower

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Slide 33

VOLTAGE FOLLOWER

Slide 34 DC characteristics

Input offset currentThe difference between the bias currents at the

input terminals of the op- amp is called as input offsetcurrent. The input terminals conduct a small value ofdc current to bias the input transistors. Since the inputtransistors cannot be made identical, there exists adifference in bias currents

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Slide 35 DC characteristics

Input offset voltage

A small voltage applied to the input terminals to makethe output voltage as zero when the two input terminals aregrounded is called input offset voltage

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Slide 36 DC characteristics

Input offset voltage

A small voltage applied to the input terminals to make theoutput voltage as zero when the two input terminals aregrounded is called input offset voltage

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Slide 37 DC characteristics

Input bias current

Input bias current IB as the average value of the base currents entering into terminal of an op-amp

IB=IB+ + IB

-

2

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Slide 38 DC characteristics

THERMAL DRIFT

Bias current, offset current and offset voltage changewith temperature. A circuit carefully nulled at 25oc may notremain so when the temperature rises to 35oc. This is calleddrift.

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Slide 39 AC characteristics

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Frequency Response

HIGH FREQUENCY MODEL OF OPAMP

Slide 40 AC characteristics

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Frequency Response

OPEN LOOP GAIN VS FREQUENCY

Slide 41 Need for frequency compensation in practical

op-amps

• Frequency compensation is needed when large bandwidthand lower closed loop gain is desired.

• Compensating networks are used to control the phase shiftand hence to improve the stability

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Slide 42 Frequency compensation methods

• Dominant- pole compensation

• Pole- zero compensation

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Slide 43 Slew Rate

• The slew rate is defined as the maximum rate of change of

output voltage caused by a step input voltage.

• An ideal slew rate is infinite which means that op-amp’soutput voltage should change instantaneously in response toinput step voltage

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Slide 44 Instrumentation Amplifier

In a number of industrial and consumer applications, themeasurement of physical quantities is usually done with thehelp of transducers. The output of transducer has to beamplified So that it can drive the indicator or display system.This function is performed by an instrumentation amplifier

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Slide 45 Instrumentation Amplifier

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Slide 46 Features of instrumentation amplifier

1. high gain accuracy

2. high CMRR

3. high gain stability with low temperature co-efficient

4. low dc offset

5. low output impedance

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Slide 47 Differential amplifier

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Slide 48 Differential amplifier

This circuit amplifies only the difference

between the two inputs. In this circuit thereare two resistors labeled R IN Which means thattheir values are equal. The differential amplifieramplifies the difference of two inputs while thedifferentiator amplifies the slope of an input

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Slide 49

DIFFERENTIAL AMPLIFIER

Slide 50 Summer

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Slide 51

SUMMING AMPLIFIER