Overview

ElectroFlo® is designed exclusively

for challenging electronics cooling

and design issues. It is a CFD based

package capable of solving problems

involving conduction, natural and

forced convection, radiation and

conjugate heat transfer, yet it is easy

enough to use for a non-CFD expert.

Information Technology Solutions

Powerful and Accurate ElectroFlo® is equipped with a

complete list of features allowing

modeling details and accuracy to be

determined by the analyst, not dictated

by the software.

TES INTERNATIONAL

TES has been serving the

automotive and aerospace

industries for 16 years. TES

has worked on projects for a

wide variety of companies

including: Delphi, General

Electric, General Motors, Ford,

Chrysler, Bosch, Hamilton

Sundstrand, Boeing, United

Technologies and the US Army

TARDEC.

EXPERT ENGINEERS

TES engineers specialize in

heat transfer and structural

analysis with years of

experience in aerospace,

automotive and electronics

applications.

THERMAL

CONSULTING TES International offers

thermal engineering

consulting to help you avoid

any thermal problems with

your products. Using our own

software allows us to provide

you with great value for your

analysis needs.

ElectroFlo Electronics Cooling Software

Coupled Electrical / Thermal /

CFD to Analyze Self-Heating

Effects

Embedded Liquid Cooling

Channels

User-Defined Functions or

Tables

Nonlinear Boundary Conditions

Flexibility

Easy To Use

The graphical user interface and technical

features are focused on Electronics

applications, so ElectroFlo® achieves an

unprecedented ease of use.

Copy, Move, Rotate, Translate and

Mirror PCB’s and Assemblies

Model Management using Listview

Object Oriented Modeling Approach

Component, Materials Modeling

Approach

Component, Material and Convention

Libraries

Fully Automated Meshing

ADVANTAGES OF

USING THERMAL

MANGEMENT

SOFTWARE

Thermal Management is

becoming more critical, as it

impacts safety, reliability,

performance, comfort and

energy use. This is due to

An increasing number of

heat sensitive electronics

components.

Electronic systems

requiring active thermal

management.

Ever-shirking space

allocation.

Higher electronic

densities.

Features and Benefits

Full CFD, Non-CFD or Frozen

Field Solution Modes

Extensive Error-Checking

Embedded Thermal and

Electrical Network

Patented Radiation Solver with

Automatic Viewfactor

Calculation

Multisystem Modeling allows

Co-Simulation of Existing

Models

Makes it possible to perform thermal/CFD/electrical analysis of extremely

complex models within hours.

Relieves the analyst of very tedious and

time consuming task of model clean-up and

simplification.

Significantly Reduce Modeling Time.

Low expertise needed to operate.

Makes it possible to provide customized

“Turn-Key” solutions for complex problems.

Multi-system analysis feature allows

combining existing models of boards and

electronic boxes.

Easy analysis of computer racks involving

thermal interaction of several electronic

boxes. info@tesint.com 1711A Larchwood Dr. Troy, MI 48083 +1(248)716-4837 www.tesint.com

Efficient

Fast and Stable Solver