Elektromagnetik

UK 13.3.2008UK 13.3.2008

ANSYSElectromagnetic Simulation

CADFEM GmbH

UK 13.3.2008UK 13.3.2008

Low Frequency Electromagnetics and Low

Frequency Electric

§ Low frequency magnetic§ Static magnetic (magnetostatics) § Quasistatic time-harmonic analysis (AC)§ Quasistatic time-transient analysis

§Elements§ 2-D and 3-D magnetic vector potential

(MVP) formulation, scalar potential, 3-D edge flux formulation, lumped circuit

§Materials§ Both permeable and saturable materials

§Results§ Magnetic flux density, field intensity, flux

lines, current density, eddy currents, magnetic forces and torques, etc.

§ Load transfer § Heat generation rate to a thermal/CFD

analysis§ Magnetic forces to structural/CFD analysis

Low Frequency Electromagnetics

3

Electrical Machine Analysis

§Rotating Electrical Drive Analysis§ Determine Saturation Effects in

nonlinear iron§ Maximize Torque, Torque vs. Speed § Reduce Cogging Torque§ Determine Induction Voltage (EMF) § Determine Losses

-8.00E-02

-6.00E-02

-4.00E-02

-2.00E-02

0.00E+00

2.00E-02

4.00E-02

6.00E-02

8.00E-02

0 10 20 30 40 50

Reihe3Reihe2

Cogging Torque

Brushless DC MachineMagnetic Induction Distribution

Motion Induced Eddy Currents In Permanent Magnets

ANSYS ANSYS WorkbenchWorkbench SolutionsSolutions

4

Electrical Machine Analysis§ Rotating Electrical Drive Analysis

§ 3d Transient dynamic with movement

§ Determine Eddy Currents§ Determine Losses in iron and

copper

Asynchron MaschineMagnetic Induction Distribution

Motion Induced Eddy Currents

ANSYS ANSYS MultiphysicsMultiphysics SolutionsSolutions

5

Magnetizer Analysis

§Determine Magnetic Field of a Magnetization Device§ Static Magnetic Field§ Direction of Magnetic Field§ Nonlinear iron

Magnetic field within “Magnet”Electric potential distribution

backiron

winding

core

“magnet”


6

Eddy Current Brake Analysis

§Simulation of Eddy Current Brake must account for different effects§ Torque at different rotational speed§ Eddy Currents § Skin Depth§ Nonlinear Material Properties

Motion induced eddy currents Resulting forces

Magnetic Induction Distribution


7

Magnetic Valves

§Analysis of Static or Dynamic Behavior§ Determine Saturation Effects in

nonlinear iron§ Determine force for different boundary

conditions

Magnetic Induction DistributionForce vs. Stroke Curve


8

Magnetic Sensors

§Determine Magnetic Field of Sensor§ Determine Saturation Effects in nonlinear iron§ Coupling factor of coils (Inductivity)§ Inductance vs. distance or current§ Voltage or flux vs. angle

U_IND_CUT3

-9

-8

-7

-6

-5

-4

-3

-2

-1

00 1 2 3 4 5 6 7 8 9

U_IND_CUT3

Induced Voltage vs. Rotation Angle Magnetic Induction

Model of Tacho (rev counter)


9

Low Frequency Electric Field

§ Low frequency electric§ Static electric (electrostatics)§ Quasistatic time-harmonic electric (AC)§ Quasistatic time-transient electric

§Elements§ Both charge and current based electric scalar potential

§Material properties§ Resistivity (resistive loss)§ Permittivity – harmonic and transient§ Loss tangent – harmonic analysis only (dielectric loss)

§Results§ Electric field plots, conduction current densities, Joule heating,

electrostatic force and capacitance calculations§ Load transfer § Heat generation rate to a thermal analysis§ Electrostatic forces to structural analysis§ Conduction current density to a magnetic analysis

UK 13.3.2008UK 13.3.2008

High Frequency Electromagnetics

11

Via Full wave RLCG extraction

Compliance Testing

Susceptibility Emissions

Incident

Conducted

Signal Integrity

PC Board Level

Chip & device Packages

IC / Discretes Level

Device Simulation

Radar

Optical

Antenna RF/Microwave components &

circuits

High speed electronic circuits

Supported Classes of Simulation (HF)

12

High Frequency Electromagnetics

§High frequency electromagnetics§ Modal and time-harmonic analysis

§Tangential vector finite element technology§ 2D and 3D formulations

§Material properties§ Isotropic materials§ Anisotropic materials (full 3x3 tensor)

§Results§ Electromagnetic field results§ Electric and magnetic fields, Poynting vector and current

density§ Network parameters (S/Y/Z) and conversion§ Equivalent SPICE model and Touchstone file

§ Near and far electromagnetic field extension§ Antenna parameters

§ Load transfer§ Heat generation to thermal analysis§ Lossy dielectrics, resistive conductors

13

Microstrip Interconnect

§Multi-layer microstrip interconnect§ S-parameter calculation

Ground Plane

Three Layer Interconnect

SubstratePort

Port

14


§Electric field and Poynting vector results§ 6.5 GHz

15


§Scattering parameters § Can also output to Touchstone file

S12 - Microstrip Interconnect

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

00 2 4 6 8 10

Frequency (GHz)

S12

Mag

nitu

de (d

B)

S11 - Microstrip Interconnect

-40

-35

-30

-25

-20

-15

-10

-5

00 2 4 6 8 10

Frequency (GHz)

S11

Mag

nitu

de (d

B)

UK 13.3.2008UK 13.3.2008

Multiphysics Coupling

17

Multiphysics Coupling

§Multiphysics coupling available§ Coupled-field elements§ Multi-field solver

§Electronics/Mechatronics applications§ Joule heating§ Acoustics

UK 13.3.2008UK 13.3.2008

RLCG Lumped Parameter Extraction

19

RLCG Lumped Parameter Extraction

§ANSYS can extract the capacitance, inductance and conductivity terms of an FEA model for export to a circuit simulator (SPICE) or reduced order model.§ CMATRIX - Calculates the capacitance matrix (C)§ LMATRIX - Calculates the inductance matrix (L)§ GMATRIX - Calculates the conductance matrix (G)

G22G22

G12G12

G11G11P22P22

P12P12

P11P11

20

Capacitance Matrix Example

§Self and mutual capacitance extracted for lead frame

21

Signal Integrity Analysis for IC-Package

§Detailed Signal Integrity Analysis for IC-Package for the simulation of nearly any package, § BGA wirebond§ BGA flipchip§ Cavity down§ Package-on-Package§ System-in-Package§ IC-package-PCB co-design§ Stacked Dies

§Direct interface with Cadence APD and neutral Gerber layout database§RLCG export in SPICE, IBIS, W-Element,

SYZ parameters in touchstone format or Tabular document formats (csv, html, rtf)

276 nets (2-Layer PBGA):

Full Package Extraction takes < 1 hour on a 2 CPU, 2 GHz machine with 1.5GB RAM

276 nets (2-Layer PBGA):

Full Package Extraction takes < 1 hour on a 2 CPU, 2 GHz machine with 1.5GB RAM

SPICE Model

C1

NI1

NM1

NO1

R1 L1

BGND

C2

NI2

NM2

NO2

R2 L2

BGND

Cn

NIn

NMn

NOn

Rn Ln

BGND

Documents

Elektromagnetik