ECPE, 15.01.2004, Page 1

Engineering Center for Power Electronics

Co-financed by the European Union (structural fund Ziel 2) and by High-Tech-Offensive Bavaria

ECPE, 15.01.2004, Page 2

Engineering Center for Power Electronics

The Industrial and Research Networkfor Power Electronics in Europe

Research

Education

Public relation

ECPE, 15.01.2004, Page 3

Industrial Partners of ECPE

ECPE, 15.01.2004, Page 4

Importance of Power Electronics

Up to 30% of industrial energy consumption could be saved by using optimised power electronics

in conventional driven devices

Decentralised and regenerative energy supply (wind power plant, fuel cell, microturbine, photovoltaic,...)

Automotive, Traffic and Industrial Drives(starter generator, x-by-wire, EVT,...)

Safe energy for Telecom and IT(uninterruptable power supply (USP), active filter, power factor control (PFC))

Intelligent home(AC-switch, integrated protection concepts, power saving white goods)

ECPE, 15.01.2004, Page 5

Improving the competitiveness of the European industry through:

The Vision of ECPE

Improved performance, reliability, efficiency, costs, and miniaturizationof power electronics systems,

Safety and sustainability in the power supply infrastructure“from producer to each consumer”,

Maintaining and improving design and production technologies thatthe focus remains in Europe.

Europe is taking the lead in energy saving, in the use ofenvironmentally friendly materials, and in recyclable systems.

Europe is improving the lead role in the industrial area of motion control and drives continuously.

ECPE, 15.01.2004, Page 6

ECPE Objectives

The main objective of ECPE is the promotion of research, innovation, education, publicity and technology transfer in the area of power electronics in Europe.

Measures ECPE e.V.:Representation of the interests of power electronics industry to public and politicsOrganisation of conferences and workshopsPromotion of R&D projectsPromotion of publicationsMotivation of undergraduates to study university courses related to PE Granting scholarships, financing of theses

Measures ECPE GmbH:Providing private as well as acquiring public funding for selected R&D projectsDefinition and monitoring of research projectsCreation and realisation of know-how and IP rights

ECPE, 15.01.2004, Page 7

Basic Structure and Responsibilities of ECPE

Engagement Level

Member of ECPE e.V.• 10 k€/year e.V. membership fee• no payment to research fund

Associate Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee • 5 k€ in 2004 for research fund• 10 k€ ≥ 2005 for research fund

Principal Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee• 20 k€ in 2004 for research fund• 40 k€ ≥ 2005 for research fund

Engagement Level

Member of ECPE e.V.• 10 k€/year e.V. membership fee• no payment to research fund

Associate Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee • 5 k€ in 2004 for research fund• 10 k€ ≥ 2005 for research fund

Principal Partner(e.V. member and research sponsor)• 10 k€/year e.V. membership fee• 20 k€ in 2004 for research fund• 40 k€ ≥ 2005 for research fund

ECPE e.V.• Representation of the interests of power

electronics to the public• Organisation of conferences and workshops• Promotion of publications• Promotion of R&D projects • Motivation of undergraduates to study

university courses relatingto power electronics

• Granting scholarships

membership fees

ECPE GmbH• Definition and control of research projects• Creation, providing of know-how and IP rights • Fund raising for research projects from

private / public sponsorsIP and patent licenses

research funds

Shareholder

ECPE, 15.01.2004, Page 8

ECPE Research Funds

ECPE GmbH

Principal Partners

Project Coordination Committee1 Representative / Partner

Managing Director

Research and IPAgreements

IP and Patent licenses

€Project Funds

ProjectProposal

ProjectDecision

ECPE e.V.100% Shareholder of ECPE GmbH

€ - Members

€ - HTO - -

TechnicalSocieties

Competence CentersUniversities, Research Institutes

€ Public Funds

• support• ECPE label• project coord.

ECPE, 15.01.2004, Page 9

Benefits for ECPE Members

ECPE e.V. membersPart of network for power electronicsDetermine lobby for power electronicsReceive short reports, papers, theses and dissertations produced as a result of ECPE´s Core Research program free of charge Use ECPE online course on power electronics Participate in ECPE´s annual conferenceAccess to and participation in all ECPE Education / Seminar / TrainingsOption to establish a graduate industrial fellowship for designated research Direct and continuous links to graduate and undergraduate students for future employment

ECPE, 15.01.2004, Page 10

Benefits for ECPE Partners

ECPE GmbH Industrial Partners

Principal Partner - Common realisation of pre-competitive research topics - Advanced information about research topics- R&D cost reduction through synergy effects - Avoiding financial risks in case of “emerging” technologies- Faster results by bundling of resources, increased innovation- Definition and creation of standard technology platforms- Effective technology transfer (e.g. Competence Center employees change to industrial

partners or establish “start-ups”)- IP-generation and participation in key-technologies (fast product realisation by industrial

partners based on ECPE-patents)

Associate Partner- Access to summary reports of the ECPE research projects- Right to propose research topics for ECPE projects- Option to participate in project results and IP through license

ECPE, 15.01.2004, Page 11

Research Topics

Control, Sensing

andSimulation Industrial

Power Electronics

System solutions for high-performance

applications

MechatronicsIntelligent motor concepts,

system packaging,manufacturing

techniques Advanced Power

SemiconductorDevices & ICs

Advanced Passive

Components

Automotive& Consumer

Power ElectronicsSystem solutions for

high-volumeapplicationsReliability

System and component reliability,

material science,high temperature,

benchmarking

System DesignIntegrated design

methodology, functional integration, thermal

management,EMI

Power Quality High-power electronics,

sustainable energy processing

ECPE, 15.01.2004, Page 12

Pre-competitive Topics for Joint ResearchDe

mon

stra

tor:

Inte

grat

ed M

otor

Demonstrator:

compact and low

loss

motor drive

systems

System IIAutomotive

System I

Industry

3D passive Integration

HV-

Technology

High

Tem

pera

ture

System IIIHF-PowerElectronics

Demonstrator: Power Supply (50W/cm3)

Ultra High Power Density

PE-CircuitsPE-CircuitsEl. p

assiv

e Co

mp.

Sens

oric

PE-C

ircui

tPE

-Circ

uit

Chip-C

ontactingTechnology

(high Temperature)

PFCIntegratedFilter

Syst

emPa

ckag

ing

Syst

emPa

ckag

ing PE-

Circuits

Mot

or d

esig

n fo

rel

ectro

nic

Inte

gr.

Mot

or d

esig

n fo

rel

ectro

nic

Inte

gr.

HV-IC

-

Technology

T her

mal

Man

a gem

ent

CostLife Time Reliability

RecyclingManufacturabilityHigh Temperatur

Modeling/EMV

Diagnose

Power switch

& diode

PFC

System IntegrationSi/SiC

Comp.

Innterconnects

Mechatronics

HV-IC

-Sm

art

ECPE, 15.01.2004, Page 13

Research Topics for Different ApplicationsDe

mon

stra

tor:

Inte

grat

ed M

otor

Demonstrator:

Compact and low

loss

motor drive system

s

System IIAutomotive

System I

Industry

3D passive Integration

HV-

TechnologyHi

ghTe

mpe

ratu

re

System IIIHF-PowerElectronics

Demonstrator: Power Supply (50W/cm3)

Ultra High Power Density

Research Topics:

- High Temp. Si-Components (T j ≥ 200°C)

(SOI, Si-Technology)

- Electronic Motor

- Sensor Technology

- Solder-Technology

- Cooling Technology (Chip cooling)

- Plastic, Polymer, Electrolytes (> 175 °C)

CostLife Time Reliability

RecyclingManufacturabilityHigh Temperature

Modeling/EMV

Research Topics:- HV-Technology- semicond.switch, diode

- Chip stacke solution- Circuit Topology, software

- HF-Motordrive concept- Integrated Filter- Passive Comp.

- Cooling Technology- Ultra high efficiency drive

- Cosmic Ray

Research Topics:

- 3D Passive Integration

- Interconnects/Multilayer

- Thermal Management

- No Bondwire

- SiC-Components

- Cooling Technology

- Circuit Topology (PFC)

- Avalanche

System Integration

Mechatronics