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Date: November, 2007 / Issue 1.0
Serv
ice M
an
ual
Mo
del : U
990/K
U990
Service ManualU990/KU990
Internal Use Only
- 3 -
1. INTRODUCTION.................................. 51.1 Purpose ...................................................... 5
1.2 Regulatory Information ............................... 5
2. PERFORMANCE ..................................72.1 System Overview.........................................7
2.2 Usable environment.....................................8
2.3 Radio Performance......................................8
2.4 Current Consumption.................................16
2.5 RSSI BAR ..................................................17
2.6 Battery BAR ...............................................17
2.7 Sound Pressure Level ...............................18
2.8 Charging ....................................................18
3. TECHNICAL BRIEF............................193.1 General Description ...................................19
3.2 GSM Mode.................................................21
3.3 UMTS Mode...............................................25
3.4 LO generation and distribution circuits ......27
3.5 Off-chip RF Components ...........................27
3.6 Digital Baseband (DBB/MSM6280) ...........37
3.7 Subsystem(MSM6280) ..............................40
3.8 Power Block...............................................48
3.9 External memory interface.........................53
3.10 H/W Sub System .....................................55
3.11 Feature List..............................................72
3.12 Multimedia Chip Interface ........................78
3.13 Touch Screen Interface ...........................85
3.14 Main Features..........................................86
4. TROUBLE SHOOTING.......................934.1 RF Component ..........................................93
4.2 SIGNAL PATH ...........................................94
4.3 Checking VCTCXO Block ..........................96
4.4 Checking Front-End Module Block ............98
4.5 Checking UMTS Block.............................101
4.6 Checking GSM Block...............................106
4.7 Power on trouble......................................112
4.8 SIM detect trouble....................................117
4.9 Key sense trouble ( KEYPAD ) ................118
4.10 Keypad backlight trouble .......................120
4.11 Micro SD trouble ....................................122
4.12 Audio trouble..........................................123
4.13 Camera trouble ......................................136
4.14 Main LCD trouble...................................142
4.15 Bluetooth trouble....................................145
4.16 Bluetooth RF Test..................................146
4.17 Touch Screen trouble ............................147
5. DOWNLOAD.....................................1485.1 Introduction ..............................................148
5.2 Downloading Procedure ..........................148
5.3 Troubleshooting Download Errors ..........161
5.4 Caution ....................................................166
6. BLOCK DIAGRAM ...........................1676.1 GSM & UMTS RF Block ..........................167
6.2 Interface Diagram ....................................169
7. CIRCUIT DIAGRAM..........................171
8. BGA IC PIN MAP..............................183
9. PCB LAYOUT ...................................191
10. Calibration......................................19910.1 Usage of Hot-Kimchi..............................199
11. EXPLODED VIEW & REPLACEMENTPART LIST ..................................... 203
11.1 EXPLODED VIEW ................................ 203
11.2 Replacement Parts<Mechanic component> ....................... 205<Main component> ............................... 208
11.3 Accessory ............................................. 226
Table Of Contents
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 4 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 5 -
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download thefeatures of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,persons other than your company’s employees, agents, subcontractors, or person working on yourcompany’s behalf) can result in substantial additional charges for your telecommunications services.System users are responsible for the security of own system.There are may be risks of toll fraud associated with your telecommunications system. System usersare responsible for programming and configuring the equipment to prevent unauthorized use. Themanufacturer does not warrant that this product is immune from the above case but will preventunauthorized use of commoncarrier telecommunication service of facilities accessed through orconnected to it. The manufacturer will not be responsible for any charges that result from suchunauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as long asrepair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If thesechanges could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the userto take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorizedagent. The user may not make any changes and/or repairs expect as specifically noted in this manual.Therefore, note that unauthorized alternations or repair may affect the regulatory status of the systemand may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by localregulatory agencies. In accordance with these agencies, you may be required to provide informationsuch as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference fromunsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.• Use a suitable, grounded soldering iron.• Keep sensitive parts in these protective packages until these are used.• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
- 6 -
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
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2.1 System Overview
2. PERFORMANCE
Item Specification
Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset
Size 103.5 X 54.4 X 14.8 mm
Weight Under 112 g (with 1000mAh Battery)
Power 3.7 V normal, 1000 mAh Li-Ion
Talk Time Over 170 min (WCDMA, Tx=10 dBm, Voice)
with 1000mAh) Over 200 min (GSM, Max Tx-29dBm, Voice)
Standby Time Over 250 Hrs (WCDMA, DRX=1.28)
(with 1000mAh) Over 250 Hrs (GSM, Paging period=5)
Antenna Internal type
LCD Main 3” TFT, WQVGA, 262K
LCD Backlight White LED Back Light
Camera 5.0 Mega pixel + VGA Video Call Camera
Vibrator Yes (Coin Type)
LED Indicator No
MIC Yes
Receiver Yes
Earphone Jack Yes (18 pin)
Connectivity Bluetooth, USB
External Memory Yes(Micro SD)
I/O Connect 18 Pin
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2.2 Usable environment
1) Environment
2) Environment (Accessory)
* CLA : 12 ~ 24 V(DC)
2.3 Radio Performance
1) Transmitter - GSM Mode
* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910
2. PERFORMANCE
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Item Specification
Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]
Operation Temp -20 ~ +60°C
Storage Temp -30 ~ +80°C
Humidity 85 % (Max)
Reference Spec. Min Typ. Max Unit
TA Power Available power 100 220 240 Vac
No Item GSM DCS & PCS
100k~1GHz -39dBm9k ~ 1GHz -39dBm
MS allocated 1G~[A]MHz -33dBm
Channel1G~12.75GHz -33dBm
[A]M~[B]MHz -39dBm
Conducted [B]M~12.75GHz -33dBm
1 Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm
Emission 880M~915MHz -62dBm 880M~915MHz -62dBm
Idle Mode915M~1GHz -60dBm 915M~1GHz -60dBm
1G~[A]MHz -50dBm 1G~[A]MHz -50dBm
[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm
[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
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** In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910
No Item GSM DCS & PCS
30M ~ 1GHz -36dBm30M~1GHz -36dBm
MS allocated 1G~[A]MHz -30dBm
Channel1G ~ 4GHz -30dBm
[A]M~[B]MHz -36dBm
Radiated [B]M~4GHz -30dBm
2 Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm
Idle Mode915M~1GHz -57dBm 915M~1GHz -57dBm
1G~[A]MHz -47dBm 1G~[A]MHz -47dBm
[A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm
[B]M~4GHz -47dBm [B]M~4GHz -47dBm
3 Frequency Error ±0.1ppm ±0.1ppm
4 Phase Error±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error RA250 : ±200Hz RA250: ±250Hz
5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz
Interference Condition TU50 : ±100Hz TU50: ±150Hz
TU3 : ±150Hz TU1.5: ±200Hz
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -33dB
Due to 400kHz -60dB 400kHz -60dB
Output RFmodulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
6 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dBSpectrum
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB
Due to400kHz -19dB 400kHz -22dB
Switching600kHz -21dB 600kHz -24dB
transient1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
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No Item GSM DCS & PCS
Frequency offset 800kHz
7 Intermodulation attenuation –Intermodulation product should
be Less than 55dB below the
level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
Level (dBm) (dB) Level (dBm) (dB)
5 33 ±3 0 30 ±3
6 31 ±3 1 28 ±3
7 29 ±3 2 26 ±3
8 27 ±3 3 24 ±3
9 25 ±3 4 22 ±3
10 23 ±3 5 20 ±3
8 Transmitter Output Power 11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9 Burst timing Mask IN Mask IN
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
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2) Transmitter - WCDMA Mode
No Item Specification
1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
Group (10 equel command group)
+1 +8/+12 +16/+24
5 Minimum Output Power -50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7 Transmit OFF Power -56dBm(3.84MHz)
8 Transmit ON/OFF Time Mask±25us
PRACH,CPCH,uplinlk compressed mode
±25us
9 Change of TFCPower varies according to the data rate
DTX : DPCH off
(minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
12 Spectrum emission Mask-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3)Receiver - GSM Mode
2. PERFORMANCE
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No Item Specification
13 Adjacent Channel Leakage Ratio(ACLR)33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
14Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW
(*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
15 Transmit Intermodulation-31dBc@5MHz,Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude (EVM)17.5%(>-20dBm)
(@12.2K, 1DPDCH+1DPCCH)
17 Transmit OFF Power-15dB@SF=4.768Kbps, Multi-code
transmission
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
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3) Transmitter - HSDPA Mode
No Item Specification
1 Maximum Output PowerSub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
Sub-test Power Start of Ack/Nack Power Transmitter
in table step boundary step power step
C.10.1.4 size, P tolerance
2 HS-DPCCH [dB] [dB]
1 Start of Ack/Nack 6 +/- 2.3
52 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
4 End of CQI 5 +/- 2.3
3 Spectrum Emission Mask Sub-Test : 1=1/15, 2=12/15, 3=13/15,
4=15/8, 5=15/7, 6=15/0
Frequency offset Minimum Measurement
from carrier ∆f requirement Bandwidth
2.5 ~ 3.5 MHz -35-15(∆f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1(∆f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10(∆f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
4 Adjacent Channel Leakage Sub-Test : 1=1/15, 2=12/15, 3=13/15,
Power Ratio (ACLR) 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
5 Error Vector Magnitude 3GPP Not Complete
- 14 -
2. PERFORMANCE
4)Receiver - GSM Mode
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Item GSM DCS & PCS
1 Sensitivity (TCH/FS Class II) -105dBm -105dBm
2Co-Channel Rejection
C/Ic=7dB Storage -30 ~ +85(TCH/FS Class II, RBER, TU high/FH)
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
Wanted Signal :-98dBm 1st Wanted Signal :-96dBm 1st
4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-44dBm 2nd
interferer:-45dBm interferer:-44dBm
5Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm
(TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency
- 15 -
2. PERFORMANCE
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5) Receiver - WCDMA Mode
No Item Specification
1 Reference Sensitivity Level -106.7 dBm(3.84 MHz)
-25dBm(3.84MHz)
2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
3 Adjacent Channel Selectivity (ACS)33dB
UE@+20dBm output power(Class3)
-56dBm/3.84MHz@10MHz
4 In-band Blocking UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
UE@+20dBm output power(Class3)
-30dBm/3.84MHz@f=2025~2050 and
5 Out-band Blocking 2230~2255MHz
UE@+20dBm output power(Class3)
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
UE@+20dBm output power(Class3)
6 Spurious Response-44dBm CW
UE@+20dBm output power(Class3)
-46dBm CW@10MHz
7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz
UE@+20dBm output power(Class3)
-57dBm@f=9KHz~1GHz, 100K BW
8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
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6) Receiver - HSDPA Mode
2.4 Current Consumption
1) KU990/U990 Current Consumption
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT TestCondition : Speaker off, LCD backlight On)
Stand by Voice Call VT
WCDMAUnder 4.00 mA Under 350 mA Under 550mA
(DRX=1.28) (Tx=10dBm) (Tx=10dBm)
Under 4.00 mA Under 300 mA
GSM Paging=5 period (Tx=29dBm)
No Item Specification
1 Maximum Input Level Sub-Test : 1=1/15, 2=12/15, 3=13/15,
(BLER or R), 16QAM Only 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2.5 RSSI BAR
2.6 Battery BAR
2. PERFORMANCE
- 17 -
Indication Standby
Bar 4 Over 3.81 ± 0.03V
Bar 4 → 3 3.80 ± 0.03V
Bar 3 → 2 3.70 ± 0.03V
Bar 2 → 1 3.61 ± 0.03V
Bar 1 → Empty 3.49 ± 0.03V
Low Voltage, 3.49 ± 0.03V (Stand-by) / 3.49 ± 0.03V (Talk)
Warning message+ Blinking [Interval : 3min(Stand-by) / 1min(Talk)]
Power Off3.20 ± 0.03V (Stand-by)
3.10 ± 0.03V (Talk)
Level Change WCDMA GSM
BAR 4 → 3 -88 ± 2 dBm -90 ± 2 dBm
BAR 3 → 2 -98 ± 2 dBm -95 ± 2 dBm
BAR 2 → 1 -108 ± 2 dBm -100 ± 2 dBm
BAR 1 → 0 -112 ± 2 dBm -106 ± 2 dBm
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 18 -
2.7 Sound Pressure Level
2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 600 mA
• Normal Battery Capacity : 1000 mAh
• Charging Time : Max 3 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 80 mA
• Cut-off voltage : 3.20 V (Stand-By), 3.10V (Talk)
No Test Item Specification
1 Sending Loudness Rating (SLR) 8 ±3 dB
2 Receiving Loudness Rating (RLR)Nor -4 ± 3 dB
Max -15 ± 3 dB
3 Side Tone Masking Rating (STMR) Min 17 dB
4 Echo Loss (EL) Min 40 dB
5 Idle Noise-Sending (INS) Max -64 dBm0p
6 Idle Noise-Receiving (INR)Nor Under -47 dBPA
Max Under -36 dBPA
7 Sending Loudness Rating (SLR) 8±3dB
8 Receiving Loudness Rating (RLR)Nor -1 ±3 dB
Max -12 ±3 dB
9 Side Tone Masking Rating (STMR) Min 25 dB
10 Echo Loss (EL) Min 40 dB
11 Idle Noise-Sending (INS) Max -55 dBm0p
12 Idle Noise-Receiving (INR)Nor Under -45 dBPA
Max Under -40 dBPA
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
13
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ± 3dB
MS/Headset RLR : -15 ± 3dB/-12dB
(SLR/RLR : Mid-value setting)
MS
Headset
MS and
HeadsetMax Under -62 dBm
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 19 -
3.1 General Description
The U990 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 basedGSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IFarchitecture to eliminate intermediate frequencies, directly converting signals between RF andbaseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offsetphase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
3. TECHNICAL BRIEF
[Fig 1.1] Block diagram of RF part
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
A generic, high-level functional block diagram of U990 is shown in Figure 1-1. One antenna collectsbase station forward link signals and radiates handset reverse link signals. The antenna connects withreceive and transmit paths through a FEM(Front End Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter thattranslate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rxanalog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rxbaseband outputs share the same inputs to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSMdevice) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. TheRTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and thenamplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emergefrom the RTR6275 transceiver.
In the GSM receive path, the received RF signals are applied through their band-pass filters anddown-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs areshared with the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency,is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulatedsignal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar poweramplifier from a DAC within the MSM
U990 power supply voltages are managed and regulated by the PM6650 Power Management IC. Thisversatile device integrates all wireless handset power management, general housekeeping, and userinterface support functions into a single mixed signal IC. It monitors and controls the external powersource and coordinates battery recharging while maintaining the handset supply voltages using lowdropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit formonitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chipvariables such as temperature, RF output power, and battery ID. Various oscillator, clock, and countercircuits support IC and higher-level handset functions. Key parameters such as under-voltage lockoutand crystal oscillator signal presence are monitored to protect against detrimental conditions.
3. TECHNICAL BRIEF
- 20 -
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
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3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U990’s receiver functions are split between the three RFICs as follows:
• GSM-900, DCS-1800, PCS-1900 and UMTS-2100 modes both use the RTR6275 IC only. Eachmode has independent front-end circuits and down-converters, but they share common basebandcircuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters.
RF Front end consists of antenna, antenna switch module (LSHS-M090UH) which includes three RXsaw filters (GSM-900, DCS-1800 and PCS-1900). The antenna switch module allows multipleoperating bands and modes to share the same antenna. In U990, a common antenna connects to oneof six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800, PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requiressimultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer thatseparates receive and transmit signals. GSM900, DCS1800, and PCS1900 operation is time divisionduplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is notrequired.
Control Logic (L : 0 ~ 0.1V, H : 2.6 ~ 2.8V)
L/H : L and H are acceptable
2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The ApplicationProgramming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSSSoftware documentation for details.
Vc3 Vc2 Vc1 Vdd
GSM900 Tx L H H H
DCS1800/PCS1900 Tx L L H H
UMTS Tx/Rx H L H H
GSM 900 Rx L L/H L H
DCS 1800 Rx H L/H L H
PCS 1900 Rx L L/H L H
[Table 1.1] Antenna Switch Module Control logic
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
The GSM900, DCS1800, and PCS1900 receiver inputs of RTR6275 are connected directly to thetransceiver front-end circuits(filters and antenna switch module). GSM900, DCS1800, and PCS1900receiver inputs use differential configurations to improve common-mode rejection and second-ordernon-linearity performance. The balance between the complementary signals is critical and must bemaintained from the RF filter outputs all the way into the IC pins
Since GSM900, DCS1800, and PCS1900 signals are time-division duplex (the handset can onlyreceive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequencyduplexers - this is accomplished in the switch module.
The GSM900, DCS1800, and PCS1900 receive signals are routed to the RTR6275 through bandselection filters and matching networks that transform single-ended 50-Ωsources to differentialimpedances optimized for gain and noise figure. The RTR input uses a differential configuration toimprove second-order inter-modulation and common mode rejection performance. The RTR6275 inputstages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. Thedownconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filtercircuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6280 ICfor further processing (an interface shared with the RFR6275 UMTS receiver outputs)
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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[Fig 1.2] RTR6275 RX feature
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3.2.2 GSM Transmitter
The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT) include on-chip output matchinginductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. Thecapacitor value may be optimized for specific applications and PCB characteristics based on pass-bandsymmetry about the band center frequency, the suggested starting value is shown in Figure1.3.
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This designguideline shows a tri-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load Presentedto the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filterto remove noise-spurious components and noise that would be amplified by the PA and appear in theGSM Rx band
3. TECHNICAL BRIEF
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91Ω91Ω
6pF
120Ω120Ω
68Ω
5pF 51Ω
[Fig 1.3] GSM Transmitter matching
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3. TECHNICAL BRIEF
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3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rxinput is provided with an on-chip LNA that amplifies the signal before a second stage filter that providesdifferential downconverter. This second stage input is configured differentially to optimize second-orderintermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier andthe UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamicrange of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-tobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpassfilters having passband and stopband characteristics suitable for UMTS Rx processing. These filtercircuits allow DC offset corrections, and their differential outputs are buffered to interface shared withGSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 isdownconverting GSM signals and on when the UMTS is operating.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. Theseanalog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. TheAGC output is filtered and applied to the driver amplifier; this output stage includes an integratedmatching inductor that simplifies the external matching network to a single series capacitor to achievethe desired 50-Ω interface.
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairlyhigh-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexerto the antenna through the switch module.The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chiploop filter components and the VC-TCXO. This provides a simplified design for multimode applications.The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digitallogic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signalsfor nine different frequency converters. The UMTS transmitter also employs the ZIF architecture totranslate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 ICdesign achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS2100/1900 and UMTS 850 mode transmitting.This design guideline shows only UMTS 2100 applications.
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3. TECHNICAL BRIEF
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[Figure 1.4] RTR6275 IC functional block diagram
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3.4 LO generation and distribution circuits
The integrated LO generation and distribution circuits are driven by internal VCOs to support variousmodes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS bandupconverters and downconverters; with the help of these LO generation and distribution circuits, truezero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate thesignal directly from RF to baseband and from baseband to RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within theRTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM850,GSM900, DCS1800, and PCS1900. The second synthesizer (PLL2) provides the LO for the UMTS2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizerfrequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integratesmost of PLL loop filter components onchip except two off-chip loop filter series capacitors, andsignificantly reduces off-chip component requirement. With the integrated fractional-N PLLsynthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time,and low-integrated phase error.
3.5 Off-chip RF Components
3.5.1 UMTS PAM (U105: AWT6277R)
The UMTS PA output power is monitored by power detector circuits (U101 : RTR6275) . This detectorvoltage can be used for transmitter calibration and monitor to meet RF system specification.
3. TECHNICAL BRIEF
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[Figure 1.5] UMTS PAM, Duplexer, Coupler
20dB
8 dB
NAC165
100pC163C160
22u
51R124
L122NA
100R126
2
45
31
Q100
KRX102E
C1620.01u
15nHL123
2RFIN
RFOUT8
VCC1110
VCC2
4VMODE
VREF5
AWT6277R
U105
GND13
GND267
GND3
9GND4
GND511
5.6pC169
C161
56p
SCDY0003403
50O
HM
4 3C
OU
P2
IN
1O
UT
C173100p
U104
R123
68
C159
8.2p
1.8p
C170
L1284.7nH
L124
3.3nH
L1268.2nH
EFCH1950TDF1FL104
G1
2
G2
3
G3
5
IN1O1
4
R125100
1uC164
FL103 AN
T2 1
GN
D1
GN
D2
4 8G
ND
3G
ND
49
GN
D5
6G
ND
637
RX
5T
X
SAYZY1G95EB0B00WCDMA_2100_TX_OUT
PA_ON
VREG_TCXO_2.85V
+VPWR
PA_R1
PWR_DET
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3.5.2 VCTCXO (X100 : TG-5010LH(19.2M))
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides thereference frequency for all RFIC synthesizers as well as clock generation functions within theMSM6280 IC. The oscillator frequency is controlled by the MSM6280 IC.s TRK_LO_ADJ pulse densitymodulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RClowpass filter is recommended on this control line.
The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-upinterval before other circuits are turned on. This warm-up interval (as well as other TCXO controllerfunctions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated outputvoltage is used to power the VCTCXO and is enabled before most other regulated outputs.Any GSM mode power control circuits within the MSM6280 IC require a reference voltage for properoperation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6275 ICGSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF lowfrequency filter near to MSM side, and isolate from digital logic and clock traces with ground on bothsides, plus ground above and below if routed on internal layers.
3.5.3 Front-End Module (FL100 : LSHS-M090UH)
This equipment uses a single antenna to support all handset operating modes, with an antenna switchmodule select the operating frequency and band. UMTS operation requires simultaneous receptionand transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive andtransmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10],and GPIO[11]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and ANT_SEL2respectively.
3. TECHNICAL BRIEF
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[Table 1.2] Front End Module control logic
Vc3 Vc2 Vc1 Vdd
GSM900 Tx L H H H
DCS1800/PCS1900 Tx L L H H
UMTS Tx/Rx H L H H
GSM 900 Rx L L L H
DCS 1800 Rx H L L H
PCS 1900 Rx L L L H
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3. TECHNICAL BRIEF
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3.5.4 PMIC Functional Block Diagram (U501 : PM6650-2M)
• Input power management
- Valid external supply attachment and removal detection- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources- Supports lithium-ion main batteries- Trickle, constant current, constant voltage, and pulsed charging of the main battery- Supports coin cell backup battery (including charging)- Battery voltage detectors with programmable thresholds- VDD collapse protection- Charger current regulation and real-time monitoring for over-current protection- Charger transistor protection by power limit control- Control drivers for two external pass transistors and one external battery MOSFET MOSFET is optional- Voltage, current, and power control loops- Automated recovery from sudden momentary power loss
• Output voltage regulation
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA
(or second MSMC) supply voltages- Supports dynamic voltage scaling (DVS) for MSMC and PA- Eleven low dropout regulator circuits with programmable output voltages, implemented using three
different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to powerMSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits.
- All regulators can be individually enabled/disabled for power savings- Low power mode available on MSMA and MSMP regulators- All regulated outputs are derived from a common bandgap referenceclose tracking
• Integrated handset-level housekeeping functions reduces external parts count, size, cost
- Analog multiplexer selects from 8 internal and up to 18 external inputs- Multiplexer outputs offset and gain are adjusted, increasing the effective ADC resolution- Adjusted multiplexer output is buffered and routed to an MSM device ADC- Dual oscillators -32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock- Crystal oscillator detector and automated switch-over upon lost oscillation- Real time clock for tracking time and generating associated alarms- On-chip adjustments minimize crystal oscillator frequency errors- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal- TCXO buffer control for optimal QPH/catnap timing- Three-stage over-temperature protection (smart thermal control)
• Integrated handset-level user interfaces
- Four programmable current sinks recommended as keypad backlight, LCD backlight,camera flash, and general-purpose drivers- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments- Speaker driver with programmable gain, turn-on time, and muting; differential operation
(drives external 8 Ω speakers with volume controlled 500 mW)
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• IC-level interfaces- MSM device-compatible 3-line SBI for efficient initialization, status, and control- Supports the MSM devices interrupt processing with an internal interrupt manager- Many functions monitored and reported through real-time and interrupt status signals- Dedicated circuits for controlled power-on sequencing, including the MSM devices reset signal- Several events continuously monitored for triggering power-on/power-off sequences- Supports and orchestrates soft resets- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to
computers as a USB peripheral, or connecting the MSM device to other peripherals- RUIM level translators enable MSM device interfacing with external modules
• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or currentsinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, anLED driver, and a reference voltage buffer.
• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electricalground, mechanical stability, and thermal relief
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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[Figure 1.7] PM6650 Block Diagram
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3.5.5 GSM PAM (U101:TQM7M5003)
The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. Thismodule has been optimized for excellent EDGE efficiency and Pout in a Polar Loop environment atEDGE class E2+ operation while maintaining high GSM/GPRS efficiency.The small size and high performance is achieved with high-reliability 3 rd generation InGaP HBTtechnology. With 50ߟ and output, no external matching or bias components are required.The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller.Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Qpassives technology for optimal performance. The CMOS controller implements a fully integratedpower control within the module for GSM operations, and serves as the AM/AM path in EDGEoperations. This eliminates the need for any external couplers, power detectors, current sensing etc.,to assure the output power level. The module has Tx enable and band select inputs. Moduleconstruction is a low-profile overmolded landgrid array on laminate.
3. TECHNICAL BRIEF
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[Figure 1. 8] GSM PAM Schematic
HIGH
MODE
LOW
GSM_PA_BAND
10 dB
GSM
DCS/PCSPQ
8 dB
C138
NA
33uC135
120R119
120R118
51
R114
91R112
R117 2.2K
C142
0.75p
8pC136
91R113
1uC137
L113
14GND6
GN
D7
1617G
ND
8
7GSM_IN
9GSM_OUT
3TX_EN
VBATT4
12VCC
VRAMP6
4.7nH
TQM7M5003U101
2BS
DCS_PCS_IN1
DC
S_P
CS
_OU
T15
5GND1
GND28
10GND3
11GND4
13GND5
2
G1
3
G2
5G3 1
IN
4O1
EFCH897MTDB1
FL10115nH
L112
C146 10p68pC143
68
R111
GSM_PA_BAND
+VPWR
DCS_PCS_TX
GSM_TX
GSM_PA_RAMP
GSM_PA_EN
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3. TECHNICAL BRIEF
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3.5.6 UMTS Duplexer(FL103:SAYZY1G95EB0B00)
A UMTS duplexer splits a single operating band into receive and transmit paths. Importantperformance requirements include;
• Insertion loss, this component is also in the receive and transmit paths ; In the U990 typical losses : UMTS2100_ Tx = 1.5 dB, UMTS2100_ Rx = 1.8 dB
• Out-of-band rejection or attenuation, the duplexer provides input selectivity for the receiver, outputfiltering for the transmitter, and isolation between the two. Rejection levels for both paths arespecified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiverperformance:
• Rx-band isolation, the transmitter is specified for out-of-band noise falling into the Rx band. Thisnoise leaks from the transmit path into the receive path, and must be limited to avoid degradingreceiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels andRx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7dB.
• Tx-band isolation, the transmit channel power also leaks into the receiver. In this case, the leakage isoutside the receiver passband but at a relatively high level. It combines with Rx band jammers tocreate cross-modulation products that fall in-band to desensitize the receiver. The required Tx-bandisolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimumduplexer Tx-band isolation value is about 51.7dB.
• Passband ripple, the loss of this fairly narrowband device is not flat across its passband. Passbandripple increases the receive or transmit insertion loss at specific frequencies, creating performancevariations across the band.s channels, and should be controlled.
• Return loss, minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
• Power handling, high power levels in the transmit path must be accommodated without degradedperformance. The specified level depends on the operating band class and mobile station class (perthe applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristicsdepend upon its source and load impedances. QUALCOMM strongly recommends an isolator beused between the UMTS PA and duplexer to assure proper performance.
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3.5.7 UMTS Rx RF filter (FL102 : EFCH2140TDE1)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as criticalas losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from thelast band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, stillpresents a cross-modulation threat in combination with Rx-band jammers. The RF filter mustprovide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters thatmay deliver significant power levels to the receiver input.
3. TECHNICAL BRIEF
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[Table 1.3] UMTS Rx SAW Filter Specification
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3. TECHNICAL BRIEF
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3.5.8 Bluetooth (M800 : LBRQ-2B43A)
The MSM6280 includes BT baseband embedded BT 1.1 compliant baseband core, so the otherbluetooth components are bluetooth RF module and Antenna. Figure1.9 shows the bluetooth systemarchitecture in the U990.
[Figure 1.9] Bluetooth system architecture
- 36 -
3. TECHNICAL BRIEF
3.5.9 FM Radio (U103 : TEA5766UK)
This FM Module is a single chip, electronically tuned, FM stereo radio with RDS/RBDS demodulatorand decoder for low voltage applications, with fully integrated IF selectivity and demodulation. Thisequipment tunes the European, US, and Japanese FM bands. Figure1.10 shows the FM Radio system architecture in the U990.
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[Figure 1.10] FM Radio system architecture in the U990
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3. TECHNICAL BRIEF
3.6 Digital Baseband (DBB/MSM6280)
3.6.1 General Description
A. Features (MSM6280)
• Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS/EDGE
• Support for HSDPA downlink up to 7.2Mbps (initial commercial release will support 3.6Mbps
• HSDPA. Later releases will have support for 7.2 Mbps HSDPA)
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps
• High-performance ARM926EJ-S running at up to 225 MHz (later at 270 MHz for 7.2 Mbps HSDPA)
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets
• QDSP4000 high-performance DSP cores
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals
• QcameraTM with 15 fps QVGA viewfinder resolution, and support for 4 MP camera sensors
• Direct interface to digital camera module with video front end (VFE) image processing
• True 3D graphics for advanced wireless gaming
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEIintegrity. Support for Q-fuse.
• Audio on par with portable music players
• Vocoder support (AMR, FR, EFR, HR)
• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology
• SD/SDIO hardware support
3. BB Technical Description
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3. TECHNICAL BRIEF
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Figure. Simplified Block Diagram of Baseband
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3. TECHNICAL BRIEF
- 39 -
Figure. Simplified Block Diagram of RF
- 40 -
3. TECHNICAL BRIEF
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3.7 Subsystem(MSM6280)
3.7.1. ARM Microprocessor Subsystem
The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,through the system software, controls most of the functionality for the MSM, including control of theexternal peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through aQUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls thefunctionality of the RTR6275, RFR6275 and PM6650 devices.
3.7.2 WCDMA R99 features
The MSM6280 device supports release 99 June 2004 of the W-CDMA FDD standard, including thefollowing features:
All modes and data rates for W-CDMA frequency division duplex (FDD), with the followingrestrictions:
The downlink supports the following specifications:- Up to four physical channels, including the broadcast channel (BCH), if present- Up to three dedicated physical channels (DPCHs)- Spreading factor (SF) range support from 4 to 256- The following transmit diversity modes are supported:
Space time transmit diversity (STTD)Time-switched transmit diversity (TSTD)Closed-loop feedback transmit diversity (CLTD)
The uplink supports the following specifications:
The uplink provides the following UE support:- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary- A maximum data rate of 384 kbps
Full SF range support from 4 to 256
SMS (CS and PS)
PS data rate - 384 kbps DL / 384 kbps UL
CS data rate - 64 kbps DL / 64 kbps UL
AMR (all rates)
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3. TECHNICAL BRIEF
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3.7.3 HSDPA features
The MSM6280 device supports the HSDPA release 5 standard:
Supports HS-DSCH (HS-SCCH, HS-PDSCH and HS-DPCCH) in addition to the R99 transportchannels as defined in 3GPP specifications.
Supports a maximum of four simultaneous HS-SCCH channels as defined in 3GPP specifications.
Supports a maximum of 10 HS-PDSCH channels and supports both QPSK and 16 QAM modulation.It supports UE category 6 in SW release 2.0 and category 8 in SW release 4.0.
Supports CQI, and ACK/NACK on HS-DPCCH channel as defined in 3GPP specifications.
Supports all incremental redundancy versions for HARQ, as defined in 3GPP specifications.
Can switch between HS-PDSCH and DPCH channel resources, as directed by the network.
Can be configured to support any of the two power classes 3 or 4 as defined in 3GPP R5specifications (25.101).
Supports network activation of compressed mode by SF/2 or HLS on the DPCH for conducting inter-frequency or inter-RAT measurements when the HS-DSCH is active.
Supports STTD on both associated DPCH and HS-DSCH simultaneously.
Supports CLTD mode 1 on the DPCH when the HS-PDSCH is active.
Supports STTD on HS-SCCH when either STTD or CLTD Mode 1 are configured on the associatedDPCH.
Supports TFC selection limitation on the UL factoring in the transmissions on the HS-DPCCH asrequired in TS 25.133.
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3. TECHNICAL BRIEF
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3.7.4 GSM features
The following GSM modes and data rates are supported by the MSM6280 device hardware. Supportmodes conform to release '99 specifications of the sub-feature.
Voice features
FR EFR AMR HR A5/1, A5/2, and A5/3 ciphering
Circuit-switched data features
9.6k 14.4k Fax Transparent and non-transparent modes for CS data and fax No sub-rates are supported.
3.7.5 GPRS features
Packet switched data (GPRS)
DTM (Simple Class A) operation Multi-slot class 12 data services CS schemes: CS1, CS2, CS3, and CS4 GEA1, GEA2, and GEA3 ciphering
Maximum of four Rx timeslots per frame
3.7.6 EDGE features
EDGE E2 power class for 8 PSK
DTM (simple Class A), multi-slot class 12
Downlink coding schemes - CS 1-4, MCS 1-9
Uplink coding schemes - CS 1-4, MCS 1-9
BEP reporting
SRB loopback and test mode B
8-bit, 11-bit RACH
PBCCH support
1 phase/2 phase access procedures
Link adaptation and IR
NACC, extended UL TBF.
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3. TECHNICAL BRIEF
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3.7.7 MSM6280 device audio processing features
Integrated wideband stereo CODEC
16-bit DAC with typical 88 dB dynamic range Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path
VR- Voice mail + voice memo
Acoustic echo cancellation
Audio AGC
Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8(G2)
Internal vocoder supporting AMR, FR, EFR, and HR
3.7.8 MSM6280 microprocessor subsystem
Industry standard ARM926EJ-S embedded microprocessor subsystem
16 kB instruction and 16 kB data cache Instruction set compatible with ARM7TDMI® ARM version 5TEJ instructions Higher performance 5 stage pipeline, Harvard cached architecture Higher internal CPU clock rate with on-chip cache
Java hardware acceleration
Enhanced memory supportPlease note that NOR/PSRAM will not be supported on MSM6280.
75 MHz and 90 MHz bus clock for SDRAM 32-bit SDRAM Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed
peripherals (EBI2) such as LCD panels 1.8 V or 2.6 V memory interface support (excluding EBI1) NAND FLASH memory interface
- 8/16-bit data I/O width NAND flash support- 1- or 4-bit ECC- 512-byte/2KB page-size support- 2 chip selects supported for NAND Flash
Boot from NAND Low-power SDRAM (LP-SDRAM) interface
Internal watchdog and sleep timers
- 44 -
3. TECHNICAL BRIEF
3.7.9 Supported interface features
USB On-the-Go core supports both slave and host functionality
Three universal asynchronous receiver transmitter (UART) serial ports
USIM controller (via UART)
Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards
Parallel LCD interface
General-purpose I/O pins
External keypad interface
3.7.10 Supported multimedia features
Provide additional general purpose MIPS by using:
Two QDSP4000s Dedicated hardware accelerators and compression engines
Improve Java, BREW, and game performance
Integrated Java and 2D/3D graphics accelerator with Sprite engine
Enable various accessories via USB host connectivity.
Integrated USB host controller functionality
Enable compelling visual and audio applications.
QcameraTM
High-quality digital camera processing, supporting CCD or CMOS image sensors up to 4-megapixelwith 15 fps capture rate
15 fps QVGA viewfinder
QtvTM
Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.
Audio Codecs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows® Audio v9,RealAudio® v8
Integrated stereo wideband Codec for music/digital clips
CMX
Video Codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10
Video telephony services: QvideophoneTM
A two-way mobile video conferencing solution that delivers 15 fps @ QCIF
Video Codecs supported: MPEG-4 and H.263
Audio Codecs supported: AMR-NB.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 45 -
3. TECHNICAL BRIEF
QcamcorderTM
Real time mobile video encoder
Video Codecs supported: MPEG-4, H.263.H.264
Audio Codecs supported: AMR-NB, AAC
Recording performance: 15 fps @ QVGA, 384 kbps
gpsOneTM
Integrated gpsOne processing
Standalone gpsOne mode in which the handset acts as a GPS receiver
CMXTM (MIDI and still image, animation, text, LED/vibrate support)
72 simultaneous polyphonic tones
44 kHz sampling rate
512 kB wave table
Support of universal file formats
Standard MIDI Format (SMF) SP-MIDI SMAF Audio playback (MA-2, MA-3, MA-5) XMF/OLS MFil (requires Docomo license)
PNG decoder
Pitch bend range support
LED/vibrate support
Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)
MLZ decoder
Integrated PNG/SAF A.T.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 46 -
3. TECHNICAL BRIEF
3.7.11 Serial Bus Interface(SBI)
The MSM6280 device’s SSBI is designed specifically to be a quick, low pin count control protocol forQUALCOMM’s RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275,and PM6650 devices can be configured for different operating modes and for minimum powerconsumption, extending battery life in Standby mode. The SSBI also controls DC baseband offseterrors.
3.7.12 Wideband CODEC
The MSM6280 device integrates a wideband voice/audio CODEC into the mobile station modem(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, onesingle-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates themicrophone and earphone amplifiers into the MSM6280 device, reducing the external componentcount to just a few passive components. The microphone (Tx) audio path consists of a two-stageamplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet theITU-G.712 requirements for digital transmission systems.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 47 -
3. TECHNICAL BRIEF
3.7.13 Vocoder SubsystemThe MSM6280 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 hasmodules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rxvolume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSealEcho Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable,13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6280 device’s integrated ARM9TDMIprocessor downloads the firmware into the QDSP4000 and configures QDSP4000 to support thedesired functionality.
3.7.14 ARM Microprocessor subsystemThe MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,through the system software, controls most of the functionality for the MSM device, including control ofthe external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices.
Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls thefunctionality of the RFR6275, RTR6275, and PM6650 devices.
3.7.15 Mode Select and JTAG InterfacesThe mode pins to the MSM6280 device determine the overall operating mode of the ASIC. The optionsunder the control of the mode inputs are Native mode, which is the normal subscriber unit operation,ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6280device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be usedto test digital interconnects between devices within the mobile station during manufacture.
3.7.16 General-Purpose Input/Output InterfaceThe MSM6280 device has general-purpose bidirectional input/output pins. Some of the GPIO pinshave alternate functions supported on them. The alternate functions include USB interface, additionalRAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The functionof these pins is documented in the various software releases.
3.7.17 UARTThe MSM6280 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3share multiplexed pins.
UART1 for data
UART2 (can be used for USIM interface)
UART3 for data
3.7.18 USBThe MSM6280 device integrates a universal serial bus (USB) controller that supports bothunidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheralcommunicating with the USB host.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 48 -
3. TECHNICAL BRIEF
3.8 Power Block
3.8.1 General
MSM6280, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power ofMSM6280, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :
PM6650 : Phone power supplyAAT3169 : LCD Backlight/Flash charge pump
3.8.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The powermanagement portion accepts power from all the most common sources - battery, external charger,adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriatehandset electronics. It monitors and controls the power sources, detecting which sources are applied,verifying that they are within acceptable operational limits, and coordinates battery and coin cellrecharging while maintaining the handset electronics supply voltages. Eight programmable outputvoltages are generated using low dropout voltage regulators, all derived from a common trimmedvoltage reference.A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimentalconditions.MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI)supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interfacecircuit monitors multiple trigger events and controls the power-on sequence.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 49 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 1-1. PM6650 Functional Block Diagram
- 50 -
3. TECHNICAL BRIEF
3.8.3 Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits forthe charging current. The external supply typically connects directly to pin (VCHG). The voltage on thispin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied ornot. For additional accuracy or to capture variations over time, this voltage is routed internally to thehousekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER andICHARGE pins to determine which supply should be used and when to switch between the twosupplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of thepass transistor respectively.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.2V~3.81V100~70 (%)
3.80V~3.71V69~45 (%)
3.70V~3.62V44~20 (%)
3.61V~3.50V19~3 (%)
3.49V~3.28V2~0 (%)
KU990 Battery Bar Display(Stand By Condition)
- 51 -
3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is providedby the PM6650 IC, The trickle charger is on-chip programmable current source that supplies currentfrom VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, withits performance specified below (3.2V). The charging current is set to 80mA.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
- 52 -
3. TECHNICAL BRIEF
Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger passtransistor and the battery transistor. The constant current charging continues until the battery reachesits target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end ofconstant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 1000mAh
• Charger Voltage : 5.1V
• Charging time : Max 3h (Except time trickle charging)
• Full charge indication current (icon stop current) : 100mA
• Low battery POP UP : Idle - 3.49V, Dedicated(GSM/WCDMA) - 3.49V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.20V(idle), 3.1V(call)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 53 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.9 External memory interface
The MSM6280 device was designed to provide two distinct memory interfaces. EBI1 was targeted forsupporting high speed synchronous memory devices. EBI2 was targeted towards supporting slowerasynchronous devices such as LCD, NAND flash, SRAM, etc. In addition, MSM6280 provide SD businterface. KU990 supports 512MByte free user memory using SD interface.
• EBI1 Features
- 16 bit static and dynamic memory interface- 32 bit dynamic memory interface- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select- Synchronous burst memories supported (burst NOR, burst PSRAM)- Synchronous DRAM memories supported- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).- 2Mbytes of memory per chip select.- Support for 8 bit/16bit wide NAND flash.- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).
• 2Gb NAND(16bit, Large Block ) flash memory + 1Gb SDRAM (32bit)
• 1-CS(Chip Select) are used.
• The SD bus allows the dynamic configuration of the number of data line from 1 to 4 Bidirectional datasignal. After power up by default, the Device will use only DAT0. After initialization, host can changethe bus width.
Interface Spec
Device Part Name Maker Read Access Time Write Access Time
NAND TYA000BC00DOGG Toshiba 50 ns 30 ns
SDRAM TYA000BC00DOGG Toshiba 15 ns 15 ns
Table#1. External memory interface
- 54 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. Simplified Block Diagram of Memory Interface
MSM6280SDRAM
1Gbit
(512M x 2)
NAND
2Gb
(256MB)
DATA[31:0]
ADDRESS[14:0]
WE*
CS*
CAS*
RAS*
CLK_EN
CLK
DQM[3:0]
NAND_CS*
NAND_RE*
NAND_WE*
NAND_CLE
NAND_WP*
NAND_ALE
NAND_READY
DATA[15:0]
EBI1 EBI2
- 55 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10 H/W Sub System
3.10.1 RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6280 controls RF part(RTR6275) using these signals.
• SBST : SSBI I/F signals for control Sub-chipset
• PA_ON1 : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
• DAC_REF : Reference input to the MSM Tx data DACs
(WCMDA 2100 PAM Enable)
R213
NA
33nFC223
R211 2K
0R215
AA1XMEM1_CS_N1_GPIO76
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77Y6
XMEM2_CS_N2_GPIO35W15
AA15XMEM2_CS_N3_GPIO36
H6UART2_DP_RX_DATA_GPIO89
L25UART3_RFR_N_GPIO87
USB_RX_DATA_GPIO29N19
B6SYNTH2_GPIO65
TCKD16
TCXO_EN_GPIO94F19
TDID15
TDOA17
TMSF15
TRK_LO_ADJL13
H15TRST_N
H13TX_AGC_ADJ
TX_ON_GRFC10H12
F18SYNTH0_GP_PDM0_GPIO92
RTCKH16
SBDT1_GPIO1
SBST1_GPIO93H18
PA_ON0F17
PA_ON1_GPIO2H11
AA25Q_IM_CH0
Q_IM_CH1W23
Y25Q_IP_CH0
Q_IP_CH1V23
B12Q_OUT
A12Q_OUT_N
AE13LCD_EN_GPIO37
A22
AB25I_IM_CH0
V25I_IM_CH1
AC25I_IP_CH0
I_IP_CH1W25
I_OUTB13
I_OUT_NA13
D17GP_PDM2_PA_RAN_GE1
B8GRFC0_GPIO3
A8GRFC1_AUX_SBDT_GPIO4
D9GRFC2_GPIO5GRFC3_GPIO6
F10GRFC4_AUX_SBCK_GPIO7
H10
D11GRFC5_AUX_SBST_GPIO8
GRFC7_GPIO10T23
B4GRFC8_GPIO11
D5GRFC9_GPIO12
GRFX6_GPIO9T19
F8GPIO66
GP_PDM1_PA_RAN_GE0H17
F12DAC_REF
A6GPIO28
H9GPIO43
R19BT_DATA_GPIO20
E26BT_SBCK_GPIO23BT_SBDT_GPIO22
E25
F23BT_SBST_GPIO24
BT_TX_RX_N_GPIO21H21
CAMCLK_PO_GP_MN_GPIO13J21
AUX_PCM_CLK_GRFC14_GPIO80K19
N21AUX_PCM_DIN_GRFC13_GPIO14
G4AUX_PCM_DOUT_GRFC12_GPIO103AUX_PCM_SYNC_GRFC11_GPIO102
J8
G23BT_CLK_GPIO25
MMP_INT_N
RMT_INT
CAM_MCLK
LCD_RESET_N
VGA_CAM_RESET_N
CAM_SELECT_N
MICROSD_DETECT
VGA_CAM_PWDN
BT_DATA
BT_SBDTBT_SBCKBT_SBST
BT_TX_RX_N
BT_CLK
MMP_HPCM_FSYNC
LCD_LDO_EN
MMP_HPCM_DIMMP_HPCM_CLK
MMP_HPCM_DO
RX_IMRX_IP
RX_QMRX_QP
DAC_REF
PA_ONTCXO_EN
TRK_LO_ADJTX_AGC_ADJ
LIN_INVERTER
HOOK_SENSE_N
LCD_IF_MODE
CAM_MODE1_N
CAM_MODE3_N
HP_AMP_EN
TX_QM
TX_IM
GSM_PA_EN
TX_QP
TX_IP
ANT_SEL2
GSM_PA_BAND
FM_INTX
TX_ON
PA_R1
ANT_SEL0ANT_SEL1
FM_BUSEN
USB_SELECT_N
LIN_PWM_MAG
LIN_MOTOR_EN
Figure. Schematic of RF Interface of MSM6280
- 56 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON : WCDMA(2100) TX Power Amp Enable
• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
- 57 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10.2 MSM Sub System
3.10.2.1. USIM Interface
SIM interface scheme is shown in Figure.And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
3.10.2.2 UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
MSM6280PM6650 USIM
USIM CLK
USIM Reset
USIM Data USIM Data
USIM Reset
USIM CLK
VREG_UIM 2.85V
Figure. SIM Interface
GPIO_Map Name Note
GPIO_96 UART_RXD Data_Rx
GPIO_95 UART_TXD Data_Tx
Table. UART Interface
- 58 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10.2.3 USB
The MSM6280 device contains a Universal Serial Bus (USB) interface to provide an efficientinterconnect between the mobile phone and a personal computer (PC). The USB interface of theMSM6280 was designed to comply with the definition of a peripheral as specified in USB Specification,Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USBSpecification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by theMSM6280.
Name Note
USB_DAT Data to/from MSM
USB_SE0 Data to/from MSM
USB_OE_N Out-Put Enable of Transceiver
USB_VBUS USB_Power From Host(PC)
USB_D+ USB Data+ to Host
USB_D USB Data- to Host
Table. USB Signal Interface
Figure. Schematic of USB block(MSM6280 Side & PM6650 Side)
US
B_D
AT
_VP
N26
N25
US
B_O
E_T
P_N
US
B_S
E0_
VM
N23
M16
MM
C_C
LK
_SD
CC
MM
C_C
MD
_GP
IOH
14
L14
MM
C_D
AT
A_S
DC
GP
IO40
D6
D7
GP
IO42
PM
_IN
T_N
PS
_HO
LD
US
B_S
E0
US
B_D
AT
US
B_O
E_N
ICR
OS
D_C
MD
OS
D_D
AT
A[0
]M
ICR
OS
D_C
LK
USB_CTL_N
USB_VBUS16
USB_DAT17
USB_D_P18
19USB_SE0
USB_D_M20
GP1_DRV_N(M21
4.7u
C54
0
47K
R51
4
USB_VBUS
USB_DATMSM_USB_D+
USB_SE0MSM_USB_D-
- 59 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10.3 HKADC(House Keeping ADC)
The MSM6280 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended todigitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RFpower levels. The MSM6280 device has six analog input pins which are multiplexed to the input of theinternal HKADC.
Figure. MSM6280HKADC Block diagram
Table. HKADC channel table
PCB Version CheckPCB_Rev_ADCHKADC4
ADC Reference voltageREF_ADCHKADC2
Ear jack Detection for TTYTTY_ADC_DETHKADC3
Battery Temperature Check
Battery voltage level
RF PAM Temperature Check
Note
Battery_THERM
VBATT_SENSE
AMUX_OUT
Signal
HKADC5
HKADC1
HKADC0
Channel
3.10.4 Key Pad
There are 5 key buttons. Shows the Key Matrix & Keypad circuit.‘END’ Key is connected to PMIC(PM6650).
- 60 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Table. Key Matrix Mapping Table
Figure. Main Keypad Circuit
CLRSENDROW(2)
AFROW(1)
CaptureLockROW(0)
COL(1)COL(0)
CLRSEND
R70
1
51K
701700
VA
702
EV
LC
14S
0205
0
VA
701
EV
LC
14S
0205
0
EV
LC
14S
0205
0V
A70
3
KEY_ROW[2]
VREG_MSMP_2.7V
KEY_COL[0]
KEY_COL[1]
- 61 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. Side Keypad Circuit
LOCK KEY
FOCUS
CAMERA
SW1100
KEY_ROW[1]
KEY_ROW[0]
KEY_COL[0]KEY_COL[1]
1100
Figure. END Keypad Circuit
END
ON_SW KEY
EV
L14
K02
200
VA
700
END
PM_ON_SW_N
3.10.5 Camera Interface
U990 Installed a 5M Pixel and 0.3Mega Camera.Below figure shows the camera board to board connector and camera I/F signal.
- 62 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. Camera PCB Board to Board Connector
GB042-30S-H10-E3000
1u
CAM_VDD_SA_2.7V
CAM_VDD_IO_2.7V
C60
8
C6050.1u
10pC610
30
1718192021222324
1415
23456789
16
2526272829
CN6001
10111213
0.1u
C612
C606
10p
R601 10
R607
33
0.1uC607
10pC611
CAM_VDD_AF_2.7V
CAM_VDD_CORE_1.2V
VA
601
ICV
L05
1810
0Y50
0FR
VA
602
C614
EV
LC
18S
0201
5 0.1u
C6010.1u
ICV
L05
1810
0Y50
0FR
VA
600
10uC600
R604 10
CAM_VDD_SD_1.8V
10R603
10pC613
C60
90.
1u
R608 10
C6021u
R602 10
STROBE_TRIGGER
MMP_CAM_PCLK
5M_CAM_DATA[0] 5M_CAM_DATA[1]5M_CAM_DATA[2] 5M_CAM_DATA[3]5M_CAM_DATA[4] 5M_CAM_DATA[5]5M_CAM_DATA[6] 5M_CAM_DATA[7]
MMP_CAM_RESET_N MMP_CAM_INTMMP_CAM_HSYNCMMP_CAM_VSYNC
MMP_I2C_SDAMMP_I2C_SCL
5M_CAM_MCLK
10R719
VGA_VDD_2.7V
R725 1010R724
16
252627282930
1718192021222324
1
101112131415
23456789
CN701
C7110.1u 10p
C713
R718 10
EV
LC
18S
0201
5V
A71
5
R72
9
NA
resi
sto
r
10pC715
10
R717
VA
714
ICV
L05
1810
0Y50
0FR
10R720
C71210p
EV
LC
18S
0201
5V
A71
3
C709
0.1u
VGA_VDD_1.8V
C71410p0.1u
C710
VGA_CAM_DATA[2]VGA_CAM_DATA[3]VGA_CAM_DATA[4] VGA_CAM_DATA[7]
I2C_SDAI2C_SCL
MMP_CAM_VSYNCMMP_CAM_HSYNC
VGA_CAM_RESET_N
RCV+RCV-
MOTOR+MOTOR- x+
x-Y+
Y-
VGA_CAM_DATA[6]
VGA_CAM_PWDN
VGA_CAM_DATA[5]
VGA_CAM_MCLK
MMP_CAM_PCLKVGA_CAM_DATA[0]VGA_CAM_DATA[1]
- 63 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
The MEGA Camera module is connected to Main PCB with 30pin Board to Board connector Itsinterface is dedicated camera interface port in Multimedia chip. The camera port supply 13MHz masterclock to camera module, vertical sync signal, horizontal sync signal, reset signal and 8bits data fromcamera module. The camera module is controlled by I2C port from Multimedia chip.
[ Pin Description ]
Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)
The VGA Camera module is connected to FPCB with 20pin Board to Board connector (AXK720147G).Its interface is dedicated camera interface port in MSM6280. The camera port supply 13.MHz masterclock to camera module and receive 13MHz pixel clock (15fps), vertical sync signal, horizontal syncsignal, reset signal and 8bits data from camera module. The camera module is controlled by I2C portfrom MSM6280.
[ Pin Description ]
- 64 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Table. Interface between VGA Camera Module and FPCB (in camera module)
Camera I/O PowerIVREG_CAM_2.8V20
Camera I/O PowerIVREG_MSMP_2.8V19
Camera reset signalICAM_RESET_N18
I2C ClockII2C_SCL17
GNDGNDGND15
I2C ClockII2C_SCD16
GNDGNDGND3
Clock for Camera Data Out(13M)OCAM_PCLK4
DataOCAM_DATA(0)5
DataOCAM_DATA(1)6
DataOCAM_DATA(2)7
DataOCAM_DATA(3)8
DataOCAM_DATA(4)9
DataOCAM_DATA(5)10
Horizontal SyncOCAM_HSYNC14
Vertical SynchOCAM_VSYNC13
DataOCAM_DATA(7)12
DataOCAM_DATA(6)11
Master Clock(24M)ICAM_MCLK2
Camera power downiCAM_PWDN1
NotePortNameNo
- 65 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10.6 LCD Module (LS030B3UX01 : SHARP)
- The IM220DBN2A model is a Color TFT Main supplied by SHARP.This LCD Module has a 3.0 inch diagonally measured active display area with 240(RGB)X400resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged invertical stripes.
* Features
- Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors
- LCD Driver IC: LS030B3UX01(Magnachip)
- Driving Method : A-Si TFT Active Matrix
- 16 bit CPU interface Parallel
Figure. LCD Module Block Diagram
EBI2_OE_N
EBI2_WE_N
EBI2_ADDR[11]
EBI2_DATA[0:15]
MMP_CS_N
LCD_RESET_N
LCD_MAKER_ID
LCD_IF_MODE
MMP_LCD_CS_N
MMP_LCD_RD_N
MMP_LCD_WE_N
MMP_LCD_ADS
MMP_LCD_DATA[0:15]
MSM6280
Multimedia
Chip
LCD 3.0î
TFT(WQVGA)
- 66 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10.7 Display
LCD module is connected to Main PCB with 40 pin B TO B connector The LCD module is controlled by16-bit EBI2 in MSM6280 via Multimedia Chip.
OTP Program Pin
ENBY00360011.0T, Socket
GB042-40S-H10-E3000
7INOUT_B3
INOUT_B46
FL301 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
C32
222
p
C32
322
p
R315 51
22p
C32
5
VA300
ICVN0505X150FR
2526272829
9
21
30313233343536373839
22
40
2324
1213141516171819
2
20
345678
CN3001
1011
VA301
51R314
NAC320
C32622p
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL303
5G
110
51R316
R318 0
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL300
51R317
22p
C32
4
0.1uC321
6
FL302 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
LCD_VDD_2.8V
LCD_VSYNC_OUT
LCD_MAKER_ID
MMP_LCD_WE_NMMP_LCD_VSYNC_OUT
WLED_PWR
WLED_2
WLED_4WLED_5
MMP_LCD_VSYNC_IN
LCD_IF_MODE
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[14]LCD_DATA[15]
LCD_DATA[8]LCD_DATA[9]
LCD_DATA[10]LCD_DATA[11]LCD_DATA[12]LCD_DATA[13]
WLED_1
WLED_3
MMP_LCD_ADSMMP_LCD_CS_NLCD_RESET_NMMP_LCD_RD_N
MMP_LCD_DATA[9]MMP_LCD_DATA[10]MMP_LCD_DATA[11]
MMP_LCD_DATA[12]MMP_LCD_DATA[13]MMP_LCD_DATA[14]MMP_LCD_DATA[15]
LCD_DATA[12]LCD_DATA[13]LCD_DATA[14]LCD_DATA[15]
MMP_LCD_DATA[0]MMP_LCD_DATA[1]MMP_LCD_DATA[2]MMP_LCD_DATA[3]
MMP_LCD_DATA[4]MMP_LCD_DATA[5]MMP_LCD_DATA[6]MMP_LCD_DATA[7]
MMP_LCD_DATA[8]
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]
LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[8]LCD_DATA[9]LCD_DATA[10]LCD_DATA[11]
- 67 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.10.7.1 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path.The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signaland then transmits it to DBB Chip (MSM6280).This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset.The downlink path amplifies the signal from DBB chip (MSM6280) and outputs it to receiver (orspeaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliaryoutput. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) aredifferential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive aheadset speaker.The microphone interface consists of two differential microphone inputs, one differential auxiliary inputand a two-stage audio amplifier.
Figure. Audio Interface Detailed Diagram(MSM6280)
- 68 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure . Audio part schematics
MSM6280 Audio CODEC pins
0.1u
C23
5C
236
0.1u
L200
100nH
NA
C20
3
C200
10p
SDCC_DATSDCC DAT2
MIC
1NA
F20
MIC
1PA
E20
AF
21M
IC2N
AF
22M
IC2P
MIC
BIA
ST
15
LIN
E_L
_IN
AC
21
AC
22L
INE
_L_I
P
AC
18L
INE
_ON
LIN
E_O
PA
C17
AC
20L
INE
_R_I
NL
INE
_R_I
PA
C19
HP
H_L
W17
AA
17H
PH
_R
HP
H_V
RE
FA
A19
EA
R1O
NA
E18
EA
R1O
PA
F18
CC
OM
PA
A20
AF
19A
UX
INA
E19
AU
XIP
AU
XO
UT
AA
18
HP
_RH
P_L
MIC
1PM
IC1N
MIC
2P
RC
V+
RC
V-
MIC
BIA
S
SP
K_L
SP
K_R
- 69 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure . Audio part schematics
MIC
10u
C563
C568 22n
C569NA
C56447p
2G1
3G2
1O
4P
SPM0204HE5-PB-3
MIC500
33pC575
10pC576
C567 22n
MICBIAS
MIC1P
MIC1N
Headset Hook Switch
R905
10K
VREG_MSMP_2.7VR907
5.1KC9050.1u
100K
R90
61M
R90
4
2GND
1OUT
VCC
5
3VIN+
VIN- 4
U902NCS2200SQ2T2G
HOOK_SENSE_NEAR_MIC_P
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 70 -
AUDIO DAC/ADC, AMP etc. (WM8983)
Figure . Audio part schematics
FB501
FB500
NAC550
0.1uC514
C535 1u
C532 1u
R2_GPIO36
RIN54
RIPROUT1
29
ROUT223
16SCLKSDIN
17
27VMIDDACDAT
10
DBVDD14
DCVDD13 12
DGND
L2_GPIO23
LIN21
LIP
LOUT130
25LOUT2
7LRC
11MCLK
MICBIAS32
18MODE
OUT32221
OUT4
33PGND
U502
ADCDAT9
28AGND1
24AGND2
AUXL19
AUXR20
31AVDD1AVDD2
26
8BCLK
15CSB_GPIO1
4.7uC520
WM8983
C533
4.7n
R511
18K
R533
0
10uC525
C53
41u
10uC513
100K
R51
9
4.7n
C542
NAC531
1K
R516
R510
1K
C541
1u
1u
C549
1uC548
C536 1u
C5184.7u
C53
91u
12nC547
C5240.1u
NAC544
C5190.1u
C551NA
C5210.1u
C543NA
12nC530
18K
R517
C5164.7u
C5170.1u
MIC_PWRMMP_A_MCLK
CODEC_I2C_SCLCODEC_I2C_SDA
HP_R
HP_L
HP_EAR_L
MIC2P
HP_EAR_R
MID_MICPSPK_L
SPK_R
FM_AUDIO_L
FM_AUDIO_R
MMP_A_BCLK
MMP_ADO_DACDAT
MMP_A_LRCLK
MMP_ADI_ADCDAT
SPK_OUT-
SPK_OUT+
VREG_5V
VREG_WM_2.7V
VREG_MSME_1.8V
MIDI_3.3V
19
2
21
34567
CN500
1
R52
810
0K
FB504
VREG_MSMP_2.7V2.2uHL504
TV_OUTEAR_MIC_P
RMT_INT-USB_D+
FM_ANT
MIDI_EAR_LMIDI_EAR_R
3.10.7.2 Audio Mode
There are three audio modes (Voice call, speaker phone, MIDI/MP3).
Audio & Sound Main ComponentThere are 8 main components in KU990.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 71 -
Table. Audio Mode
Table. Audio main component list
Headset MP3Headset
Headset MIDI BellHeadset
Speaker MP3Loud Mode
MP3
Speaker MIDI BellLoud Mode
MIDI
Speaker PhoneLoud Mode
Headset Voice CallHeadset
Speaker PhoneLoud ModeSpeaker phone
Receiver Voice Call
Description
Receiver Mode
Voice Call
DeviceMODE
-42 dB microphoneSPOB-413S42-RC3310BC
CAM MIC7
32 ohm receiverEMR0906SPReceiver5
8 ohm SpeakerEMS1634APB1Speaker4
-42 dB microphoneSPM0204HE5-PBMain MIC6
Ear MICHC-MQD-LG059Ear MIC8
Analog Switch for MIC BIASNC7SB3157L6XAnalog Switch3
ADC/DAC, AB class SPK AMP
Base-Band Modem
Note
WM8983
MSM6280
Maker Part No.
Audio Codec
MSM6280
Component
2
1
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 72 -
# Multimedia Chip
3.11 Feature List
3.11.1 IC Characteristics
• MCP with Internal SDRAM, no need for external memory.
• Package: 180-pin TFBGA (8 x 8 mm)
• 90nm process
• Core voltage - 1.0 V
• IO voltage - Eleven strips, separate voltage between 1.8 and 3.3 V
3.11.2 Multimedia Performance
• Digital Still Camera support with ISP on chip up to 5M pixel.
- Photo-album and photo-editing capabilities.
- Superior quality, (e.g. including lens shading).
- Camera controls for flash, optical zoom,focus, shutter and iris.
• Camcorder operation as a DivX recorder /player at 30 fps CIF, VGA resolution.AVI file format with MP3 audio.
• Player for general DivX content, up to 30 fps CIF resolution. MP3 or WMA audio.
• 3GPP MMS compliant video clip recorder, supporting CIF/QCIF H.263, MPEG4 recording with AMRvoice or AAC audio.
• Player for 3GPP MMS / streaming video clips, up to 30 fps CIF H.263, MPEG4, and H.264 with AMRvoice or AAC/Enhanced AACPlus audio.
• 3GPP-compliant videophone, with H.263 or MPEG4 video at QCIF 15 fps (full-duplex).
• MIDI player (for ring tones, melodies).Compliant with 3GPP standards, includingsupport for Mobile XMF for melodies with custom instruments.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 73 -
• Audio stereo recorder player MP3/WMA
• ID3 tags display
• Spectral bars
• Lyrics display
• Equalizer
• 3D Surround Audio
3.11.3 DRM
• MDTV Conditional access compliant to JSR-177 (AES and TDES)
• Key exchange support
• True RNG (Random Number Generator)
3.11.4 3D Graphics
• 3D hardware + software accelerator targeting VGA 30 fps games with PlayStationTM-1 enhancedquality.
- Setup and viewport transforms
- Bilinear and Trilinear texturing
- Multi-texturing
- Flat and Gourard shading
- 24-bit ARGB support
- Compressed textures (2 bits/texel)
- Mipmaping
- Full scene anti-aliasing (x4 / x16)
- 16-bit Z-buffer
- 4-bit stencil buffer
- Fog
- Alpha blending
- Dot3 bump mapping
• Fill rate: 120M pixels/sec
• Polygon rate 0.8M triangles/sec
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 74 -
3.11.5 Image Sensor
• 10/12/14/16-bit RGB - Bayer Grid
- CMOS up to 5MP
- CCD up to 5MP
- Pixel clock - Up to 90 MHz.
- Active pixel rate - up to 75M pixels/sec:
- 15fps @ 5MP
- 25fps @ 3MP
- 30fps @ 2MP
- Black-level evaluation and correction
- Defective pixel correction
- Auto exposure and White-balance
- Edge enhancement and auto focus.
- Lens shading correction
- Polyphase image scaling.
- Digital zoom up to X4 in 16 steps
- 8/16-bit YCbCr - 4:2:2
- Input streaming bus - as CCIR601
- Progressive (CMOS/CCD sensors) or interlaced (PAL/NTSC decoders) mode
- Pixel clock - Up to 120 MHz (8-bit), 60Mhz (16-bit)
- Input resolution - Up to 5M pixels
- Auto focus
- Polyphase image scaling
- Digital zoom up to X4 in 16 steps
3.11.6 LCD Port
• Output resolution - up to VGA
• Supports dual-panels (two LCDs)
• Bypass from Host port to LCD CPU bus
• Up to 18-bit color depth (262K colors)
• CPU bus 8/9/16/18 bit compliant to all known vendors.
• RGB bus 3/6/18 bit up to 30Mhz clock
3.11.7 TV-out Port
• Composite analog interface
- NTSC-M
- PAL-B,D,G,H,I
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 75 -
3.11.8 Video and Graphics Postprocessing
• Handles Video (YUV) and Graphic (RGB)
• Video de-blocking
• Blending of video and graphics - up to 256 levels of blending
• Resizing (upscale and downscale) using quality polyphase filter
• Rotation and flip - 90, 180 and 270 degrees
• Picture brightness, contrast, and saturation control
• Display gamma adjustment
• Color space reduction
3.11.9 Serial Audio Ports
• ZR3453X has two audio/voice ports: one port is used for host bypass connection, and another forconnecting to a codec or to a Bluetooth voice port.
- PCM master/slave
- I2S master/slave (5 lines including clock)
- AC’97 master (5 lines including AC-Link reset)
- Audio output master clock (I2S), up to 48 MHz
- Supports sample rates of 8, 11.025, 16, 22.05, 24, 32, 44.1 or 48 kHz
3.11.10 Serial Data Ports
• I2C Multiple device support 100 and 400 kHz
• UART with flow control up to 3Mb/sec
• SPI port with Bit clock up to 40 MHz
- (Motorola, National microwire, TI synchronous serial interface )
3.11.11 Mass Storage
• High-speed SD/MMC I/F
• NAND-flash storage
• SPI-flash
• CE-ATA HDD.
• SDIO peripherals
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.11.12 USB
• USB 2.0 High speed/full speed
• USB On The Go
• USB applications:
- USB mass storage
- PictBridge
- Webcam
3.11.13 Host Port
• Two flavors:
- Generic interface 8/16-bit Intel style.Connects as memory map (4-bit address)
- LCD like 8/9/16 bit multiplexed bus. Connects as an LCD (1-bit address)
3.11.14 Clocks
• Main clock input frequency, 10 to 31 MHz:
- Directly from system PMU main clock and bypass its control
- Embedded crystal oscillator (12Mhz)
- Optional GPS TCXO
• Four configurable clock-out pins to drive external components:(e.g. Audio codec, Sensor, PWM)
3.11.15 Boot
• Host boot
• Standalone boot
3.11.16 Debug
• JTAG for code debug
• UART for fast system ramp up
3.11.17 Power
• Very low power consumption, smaller than150mW for all intense multimedia applications.
• Low power sleep mode 100 µW
- Host can control display audio and peripherals via bypass
• Light sleep mode 500uW
- Specifically for GPS accurate off-line tracking
3. TECHNICAL BRIEF
- 76 -
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 77 -
Figure 1-1 presents a typical multimedia cellular phone system where ZR3453X is used as a co-coprocessor. In this system, ZR3453X is connected to the following devices:
• Baseband chip (the host)
• CCD/CMOS Image Sensor for capturing video and still
• LCD panel(s)for displaying video
• Audio CODEC (A2D, D2A) for capturing voice and playing voice/music
• Media Flash (SmartMedia, NANDFlash, MMC or SD) to store media data (two active I/F, e.g. oneNAND and one SD)
• Connector to TV
[ Figure 1-1 ]
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.12 Multimedia Chip Interface
3.12.1 Host Interface
3.12.1.1 Host Interface
The HOST interface connects the ZR3453X and the host processor (a handset basebandchip) in two optional modes:• On the host memory bus.
• On the host LCD bus.
3. TECHNICAL BRIEF
- 78 -
VREG_MSMP_2.7V
M13NCSN
L13
HGINTNA7
B7HRDNHWRN
B9
HD0D12
HD1C10
B12HD10
A12HD11HD12
B11A11
HD13HD14
C9B10
HD15
HD2C12C13
HD3C14
HD4HD5
B14
HD6C11B13
HD7A14
HD8HD9
A13
A10HA11HA12
A9C8
HA13C7
HA14
HCS0NB8
HCS1NA8
10K
R310 R311 0NAR313
NA
R309
MMP_CS_N
MMP_INT_N
MMP_LCD_BYPASS_CS_N
NAND_ALE
EBI2_ADDR[11]
EBI2_ADDR[13]EBI2_ADDR[14]
EBI2_DATA[0:15]
EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]
EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]
EBI2_ADDR[12]
EBI2_OE_NEBI2_WE_N
[ Block Diagram ]
[ Schematics ]
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 79 -
3.12.2 Host - LCD - Bypass mode
The Host-LCD Bypass bypasses the host interface pins to the LCD pins.This means that the bus transactions performed by the host are transferred to the LCD pins, enablingthe host to have full control over one or two LCD panels, even when the ZR3453X is in sleep mode.This is the default mode.
3.12.3 Camera interface
ZR3453X connects with the CCD or CMOS Image Sensor (CIS) via its image sensor port.ZR3453X supports several system configurations:• CCD bayer 10,12,14,16 bit (ZR34532 only)
• CMOS bayer 10,12,14,16 bit
• YCbCr 8 bit
• YCbCr 8 bit with pixel valid
• YCbCr 16 bit
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.12.4 LCD Interface
The ZR3453X LCD port supports mobile LCD panels of upto VGA size and upto 60fps refresh rate.There are various bus formats and color depth up to 18-bit (262K colors).
3. TECHNICAL BRIEF
- 80 -
[ Block Diagram ]
M9VIDP
VIDHP11N12
VIDIN7
VIDJVIDK
L8P13
VIDLL9
VIDMVIDN
N13
VIDOM11
E3LVS
C4LWRN
LD12C1
LD13C2C5
LD14LD15
C6D3
LD16LD17
D1
B6LD2LD3
B4
LD4A4C3
LD5A3
LD6LD7
A2A1
LD8LD9
B2
E4LHS
LRDND5
D4LA0
LACTE2
LCKE1
A6LCS0NLCS1N
D2
LD0B5A5
LD1
LD10B1B3
LD11
TP301TP300
MMP_LCD_CS_N
MMP_LCD_ADS
MMP_LCD_RD_NMMP_LCD_WE_N
MMP_LCD_VSYNC_INMMP_LCD_VSYNC_OUT
MMP_LCD_DATA[15]
MMP_CAM_DATA[7]MMP_CAM_DATA[6]MMP_CAM_DATA[5]MMP_CAM_DATA[4]MMP_CAM_DATA[3]MMP_CAM_DATA[2]MMP_CAM_DATA[1]MMP_CAM_DATA[0]
MMP_LCD_DATA[0]MMP_LCD_DATA[1]MMP_LCD_DATA[2]MMP_LCD_DATA[3]MMP_LCD_DATA[4]MMP_LCD_DATA[5]MMP_LCD_DATA[6]MMP_LCD_DATA[7]MMP_LCD_DATA[8]MMP_LCD_DATA[9]MMP_LCD_DATA[10]MMP_LCD_DATA[11]MMP_LCD_DATA[12]MMP_LCD_DATA[13]MMP_LCD_DATA[14]
[ Schematics ]
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 81 -
3.12.5 TV out Interface
The display data is converted to video with video-encoder according to CCIR-601 and sampled by 10-bit DAC and transmitted over an analog pad as a composite video signal.This mode is used in a system where ZR3453X is connected gluelessly to a TV screen that requiresreal-time display data. ZR3453X generates TV signal according to the NTSC and PAL standards.The TVDATA pin can drive a full video level signal directly into a 75 terminated TV cable.
[ Block Diagram ]
392ohm 1%
330pC335
E13
VE
NB
YP
IN
TVDATAG14
TVREFF13
22p
C331
R33
9
390
330pC334
R33
8
75
2.2uH
L300TV_OUT
[ Schematics ]
- 82 -
3. TECHNICAL BRIEF
3.12.6 Audio Interface
In this configuration ZR3453X is connected to an external audio codec.There are three possible configurations:• Audio/Voice codec with two ports: PCM and I2S
• Audio/Voice codec with one port: I2S
• Audio/voice/data codec with one port: AC97
In all configurations ZR3453X connects its external audio ports to the codec single or twoports.The host uses its internal voice codec for voice communication. There is no bypass of voice.The host controls the codec configuration via I2C bus directly. The host codec analog audio output isconnected to the external audio codec and muxed with the codec audio path from the ZR3453X on theway is to the speaker.The microphone is connected to the external audio codec and the baseband internal codec.ZR3453X appears in Figure 3-35 as a master on the bit clock and frame sync. This is only one of thepossible configurations. In external audio configuration ZR3453X can run all the Audio/voiceapplications including conversation recording .
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 83 -
3. TECHNICAL BRIEF
3.12.7 USB interface
ZR3453X is a USB 2.0 Device or On-the-Go dual-role device (OTG) with the followingcharacteristics:• Complies with USB (Universal Serial Bus) 2.0 specifications
• Complies with On-the-Go Supplement 1.0a
• Integrated 45-ohm termination, 1.5Kilohm pull-up and 15-Kilohm pull-down resistors.
• Supports 480-Mbps high-speed, 12-Mbps full-speed and 1.5Mbps low-speed (Host mode only) datatransmission rates.
• Control + 4 endpoints:
- EP0 - two-way Control- 2-input , 2-output - Bulk, INT or ISO
• Suspend, resume, reset and SOF signaling
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.4K1%
UDNP4P3
UDP
P6UID
URSETM7
J4UVBUS
L5
AG
ND
_US
BC
K5
AG
ND
_US
BT
F12
AG
ND
_VD
AC
R34
0
3.3K
R335 0
MMP_USB_D+MMP_USB_D-
VREG_5V
+VPWR
100K
R34
5
U304
D+3
D-5
GND4
1HSD1+
7HSD1-
2HSD2+
HSD2-6
SEL10
9VCC
8_OE
FSUSB30UMX
0.01uC336
USB_SELECT_N
MSM_USB_D-
MMP_USB_D-
USB_D+
USB_D-
MSM_USB_D+
MMP_USB_D+
- 84 -
3. TECHNICAL BRIEF
3.12.8 MMC interface
ZR3453X has a dedicated port for multimedia cards. It can support SD (Secure Digital) cards andSecureMMC (standard multimedia cards with security functions).The same port can be used for HDD CE_ATA connection or SDIO to peripheral devices (e.g.; MDTV front-end).
MMC• MMC v4
• Dual voltage (separate IO power domain, host GPIO control)
• 1 or 4 bit cards
• Multiple cards support (if dual-voltage or high-speed interface are not used)
• Up to 43 MHz bit clock
SD• 1 or 4 bit bus support
• High-Speed SD, up to 43 MHz bit clock
3.12.9 Power Domain
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
VMCLKP12P10
VPCLK
VVSK12M12
VHREF
SCLKG1H2
SCMD
SDAT0F1
SDAT1F2
SDAT2E5F3
SDAT3
G3SWP
R312 33
MMP_CAM_MCLK
MMP_CAM_HSYNCMMP_CAM_PCLK
MMP_CAM_VSYNC
MMP_MICROSD_CLK
MMP_MICROSD_DATA[3]MMP_MICROSD_DATA[2]MMP_MICROSD_DATA[1]MMP_MICROSD_DATA[0]
MMP_MICROSD_CMD
- 85 -
3. TECHNICAL BRIEF
3.13 Touch Screen Interface
The TSC2007 device has a 12-bit analog-to-digital resistive touch screen converter including driversand the control logic to measure touch pressure. The TSC2007 device is controlled by I2C port fromMSM6280.
Touch Screen interface scheme is shown in Figure.And, there control signals are followed• TOUCH_I2C_SCL : I2C CLOCK
• TOUCH_I2C_SDA : I2C DATA
• TOUCH_PENIRQ_N : DETECT
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. Touch Screen Interface
TP
200
G6
UA
RT
2_C
TS
_N_G
PIO
90U
AR
T2_
DP
_TX
_DA
TA
_GP
IO88
E4
UA
RT
2_R
FR
_N_G
PIO
91F
4
L23
UA
RT
3_C
TS
_N_G
PIO
86M
21U
AR
T3_
DP
_RX
_DA
TA
_GP
IO85
UA
RT
3_D
P_T
X_D
AT
A_G
PIO
84M
19
F14
GP
IO64
GP
IO39
F7
GP
IO40
D6
D7
GP
IO44
D8
VG
A_C
AM
_PW
R_E
N
UA
RT
_TX
D
TO
UC
H_I
2C_S
CL
TO
UC
H_P
EN
IRQ
_N
TO
UC
H_I
2C_S
DA
CA
M_M
OD
E2_
N
US
IM_D
AT
A
PM
_IN
T_N
US
IM_C
LK
US
IM_R
ST
_N
0
R70
0
A0
A1C2
A1AUX
GNDD2
PENIRQ-B1 D1
SCL
C1SDA
VDD_REFA2A3
X+C3
X-
B3Y+
D3Y-
TSC2007IYZGRU700
B2
0.1u
LCD_VDD_2.8V
C701
R70
3
2.7K
NA
R70
2C700
1u
2.7K
R70
4
X-Y-
Y+X+
TOUCH_PENIRQ_N TOUCH_I2C_SCL
TOUCH_I2C_SDA
- 86 -
3. TECHNICAL BRIEF
3.14 Main Features
1. Main features of KU990
- BAR Type
- WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode
- Main LCD: 240x400/3.0”/262K TFT
- 5.1M Pixel AF Camera
- VGA CMOS Camera
- φ16 module speaker
- Stereo Headset
- Video telephony in WCDMA with camera
- HSDPA up to 3.6 Mbps
- Loud Speaker phone(in GSM and WCDMA)
- 64 Poly Sound
- Audio: MP3, AAC, AAC+,AAC++, WMA, WAV
- MPEG4 encoder/decoder and play/save
- H.263 decoder
- Video Recording: VGA 30 fps
- JPEG en/decoder
- Support Bluetooth, USB
- FM Radio
- touch screen, touch feedback
- 103 x 54 x 15.6 mm
- 1000mAh soft pack
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 87 -
3. TECHNICAL BRIEF
2. Main Components of KU990
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LCD
MAIN Bottom SideMAIN Top Side
5M cameraVGA camera
VGA Camera FPCB
Intenna Strobe Flash
Sub PCB
5M Camera FPCB
- 88 -
3. TECHNICAL BRIEF
2.1 Main Top Side
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Switch IC for 5M VT CallU607U602
U604MicroSD Select MSM and MMP IC
U400
VGA CAM LDO ICU6005M CAM LDO IC
U601
LCD Backlight Charge Pump IC
U301Over Voltage Protection ICU505
Touch Screen Driver ICU700U401
U300Switch IC for USB2.0U304
Side Key FPCBSideKeyAudio AMP LDOU503
LCD LOD ICU303USB/REMOCON SEL ICU507
End KeyENDCAM/HP MIC SEL ICU506
Clear Key701Headphone AMP ICU504
Send Key700FM Radio ICU103
DescriptionReferenceDescriptionReference
U103
U504
U506U503
U507U304U505U601U602
U400
U401
701
700 END
SideKey
U303U300
U301
U600
U607
U604
U700
- 89 -
3. TECHNICAL BRIEF
2.2 Main Bottom Side
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
PAM IC for GSMU101USIM ConnectorJ400
Memory ICU402MSM6280 Modem ICU200
Antenna Switching ModuleFL100RF SwitchSW100
PAM IC for WCDMAU10527Mhz Crystal OscillatorX300
Duplexer IC for WCDMAFL103RTR6275 RF ICU100
Main Intenna Connection PADANT PADMICMIC500
Battery Connector PADOUT PADDC-DC Converter ICU701
19.2MHz Crystal Oscillator for TCXOX100ZR3453 DSP ICU302
Charging ICU500LCD ConnectorCN300
PM6650 PMICU5015M CAM FPCB ConnectorCN600
32.768KHz Crystal OscillatorX500Strobe Flash ConnectorCN601
Main-Sub B-to-B ConnectorCN603Linear Motor Driver ICU606
WM8983 Audio DAC/ADC AMP ICU502Mode SwitchSW600
TA and USB ConnectorCN500VGA CAM FPCB ConnectorCN701
DescriptionReferenceDescriptionReference
SW600
CN701
U606
CN300
CN601
CN600
U701
U200
U302
X300
J400
MIC500
SW100
U100
FL100
ANT PAD
U101
FL103U105
X100
U402
OUT PAD
U500
X500
U501
CN603
CN500
U502
- 90 -
3. TECHNICAL BRIEF
2.3 Sub PCB
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Main-Sub B-to-B Connector
CN801Wheel Switch ConnectorCN800
Backup BatteryBAT900Headset Hook Switch ICU902
Bluetooth Driver ICM8005MP Camera Power ICU900
T-Flash ConnectorS800CAM MICMIC900
Module SpeakerSPEAKERBluetooth Antenna PADBT PAD
DescriptionReferenceDescriptionReference
S800
SPEAKER
CN800
U902
U900
BT PAD
MIC900
CN801
BAT900
M800
- 91 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2.4 VGA Camera FPCB
Vibrator PADVibrator
Touch Window ConnectorCN102VGA_CAMERA ConnectorCN100
Main B-to-B Connector (FPCB to Main PCB)
CN101Receiver PADReceiver
DescriptionReferenceDescriptionReference
CN100
CN101
Receiver
Vibrator
CN102
- 92 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
2.5 5M Camera FPCB
Main PCB Connector (FPCB to Main PCB)
CN6025M Camera Module
ConnectorCN601
DescriptionReferenceDescriptionReference
CN602
CN601
- 93 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.1 RF Component
Reference Description Reference Description
U100 GSM/UMTS Transceiver (RTR) X100 VCTCXO(19.2MHz)
FL103 UMTS Duplexer FL104 UMTS TX SAW
FL102 UMTS RX SAW U105 UMTS PAM
FL100 Front -End-Module U104 Coupler
SW100 RF Antenna Connector FL101 GSM900 TX SAW
U101 GSM/EDGE PAM
FL100
SW100
FL102
FL103
U100
U101
FL101
U104
U105
FL104
X100
- 94 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.2 SIGNAL PATH
4.2.1 UMTS PATH
COMMON TX/RX PATH
UMTS TX PATH
UMTS RX PATH
4.2.2 GSM PATH
- 95 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
COMMON TX/RX PATH
DCS/PCS TX PATH
GSM TX PATH
GSM RX PATH
PCS RX PATH
DCS RX PATH
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.3 Checking VCTCXO BlockThe reference frequency (19.2MHz) from X100 (VCXO) is used UMTS TX part, GSM part and BB part.
4. TROUBLE SHOOTING
- 96 -
TCXO
0.1uC139
C147 1000p
100ohmR115
1000pC145
0.01uC141
8200pC148
1000pC140
X1002
GNDOUT3
VCC4
VCONT1
19.2MHz
R120 100K
TC7SH04FSU102
C144 1000p
TRK_LO_ADJVREG_TCXO_2.85V
TCXO_BT
VREG_BT_2.85V
TCXO_PM
RTR6275_TCXO
TP1
TP2 TP3
TP4
Schematic of the TCXO Block
Test Point of the TCXO Blcok
TP1 TP2
TP4
TP3
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 97 -
Check TP1 VCC of VCXO
VCC ≥ 2.8V
Check TP2 TRK_LO_ADJ
3V≥ Voltage≥ 0V
Check TP3, TP4 With Oscilloscope
19.2MHz Signal
VCXO is OK Check other part
Check PMIC
Check MSM
Check soldering and components
Yes
Yes
Yes
No
No
No
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.4 Checking Front-End Module Block
4. TROUBLE SHOOTING
- 98 -
Schematic of the Front-End Module Block
Test Point of Front-End Module Block
47pC109
C11547p47p
C113
12GND5
14GND6GND7
15
GND81718
GND9
NC7
PCS_RX122
PCS_RX221
25PGND1
26PGND2
8UMTS_TX_RX
VC154
VC2VC3
3VDD
6
ANT10
DCS_PCS_TX13
DCS_RX12019
DCS_RX2
EGSM_RX12423
EGSM_RX2
EGSM_TX16
1GND1
2GND2GND3
911
GND4
LSHS-M090UH
47pC114
VREG_RF_SMPS
ANT_SEL2
ANT_SEL0ANT_SEL1
TP1 TP2TP3
TP4
TP1 TP3
TP4
TP2
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 99 -
- UMTS Tx/Rx - GSM900 Tx
- DCS1800/PCS1900 Tx - GSM Rx / PCS1900 Rx
Logic Table of the FEM
Vc3 Vc2 Vc1 Vdd
GSM900 Tx L H H H
DCS1800/PCS1900 Tx L L H H
UMTS Tx/Rx H L H H
GSM 900 Rx L L/H L H
DCS 1800 Rx H L/H L H
PCS 1900 Rx L L/H L H
TP2 (Vc2)
TP3 (Vc3)
TP1 (Vc1)
TP2 (Vc2)
TP3 (Vc3)
TP1 (Vc1)
TP2 (Vc2)
TP3 (Vc3)
TP1 (Vc1)
TP2 (Vc2)
TP3 (Vc3)
TP1 (Vc1)
- 100 -
4. TROUBLE SHOOTING
- DCS1800 Rx
Checking Switch Block power source
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check SolderingANT_SEL0, 1, 2 High Level
2.5V < Voltgae < 3.0VCheck VDD
TP4 VREG_RF_SMPS
Check the Logic in each mode
YES
NO
TP2 (Vc2)
TP3 (Vc3)
TP1 (Vc1)
- 101 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.5 Checking UMTS Block
4.5.1 Checking TX level
Schematic of the WCDMA Tx Block
Test Point of the WCDMA Tx Block
NAL102
A CG1
G2
KMS-518
SW100
120pC101
12GND5
14GND6GND7
15
GND81718
GND9
NC7
PCS_RX122
PCS_RX221
25PGND1
26PGND2
8UMTS_TX_RX
VC154
VC2VC3
3VDD
6
ANT10
DCS_PCS_TX13
DCS_RX12019
DCS_RX2
EGSM_RX12423
EGSM_RX2
EGSM_TX16
1GND1
2GND2GND3
911
GND4
FL100
LSHS-M090UH
PQ
20dB
8 dB
NAC165
L1251.2nH
100pC163
L1212.2nH
C16022u
51R124
L122NA
100R126
C168
2
45
31
56p
Q100
KRX102E
C1620.01u
15nHL123
2RFIN
RFOUT8
VCC1110
VCC2
4VMODE
VREF5
AWT6277R
U105
GND13
GND267
GND3
9GND4
GND511
C167
56p
5.6pC169
C161
56p
SCDY0003403
50O
HM
4 3C
OU
P2
IN
1O
UT
C173100p
U104
R123
68
C159
8.2p
C1523.9p
1.8p
C170
L1284.7nH
L124
3.3nH
L1268.2nH
EFCH1950TDF1FL104
G1
2
G2
3
G3
5
IN1O1
4
R125100
1uC164
C15
6
2.2p
FL103 AN
T2 1
GN
D1
GN
D2
4 8G
ND
3G
ND
49
GN
D5
6G
ND
637
RX
5T
X
SAYZY1G95EB0B00WCDMA_2100_TX_OUT
PA_ON
VREG_TCXO_2.85V
+VPWR
PA_R1
PWR_DET
TP1
TP2
TP3
TP4
TP1
TP2
TP3
TP4
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 102 -
For testing, Max power of UMT 2100 is needed.
Run a FTM program set RF mode to IMT set uplink freq. To
9750 click Tx on and WCDMA set PA range R1 on set Tx AGC to
410
Check Tx SAWFilter
FL104
Check PAM blockU105
Check coupler U104
Check Duplexer FL103
Check FEM FL100
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 103 -
4.5.2 Checking UMTS PAM Control Block
• PAM control signal1. PWR_DET : UMTS Tx Power Detected value (Check R123)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. VREG_TCXO_2.85V : UMTS PAM enable (about 2.85V)
4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)
5. PA_ON : Turns the PA on and off
6. PA_R1 : Control signals that step the active PA mode and bias
+VPWR
VREG_TCXO_2.85V R123
UMTS2100
Coupler
- 104 -
4. TROUBLE SHOOTING
4.5.3 Checking RX level
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
TP1
TP2
TP3
TP4
Vbias
PQ
C104
1.2p
ANT101
NAL102
A CG1
G2
KMS-518
SW100
120pC101
FL100
ANT100
0
L100
C102
12nH
L101
4.7nH
ANT102
TP1
- 105 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
PQ
PQ
20dB
8 dB
NAC165
L1251.2nH
1nH
L118
C14922p
1.5nHL114
100pC163
L1212.2nH
C16022u
51R124
100R126
C168
2
45
31
56p
Q100
KRX102E
C1620.01u
15nHL123
C153
56p
2RFIN
RFOUT8
VCC1110
VCC2
4VMODE
VREF5
AWT6277R
U105
GND13
GND267
GND3
9GND4
GND511
C167
56p
5.6pC169
L119
1nH
C161
56p
SCDY0003403
50O
HM
4 3C
OU
P2
IN
1O
UT
C173100p
U104
R123
68
0.5pC155
C159
8.2p
C154
56pC1523.9p
1.8p
C170
L116
1nH
L1284.7nH
L124
3.3nH
L1268.2nH
FL102EFCH2140TDE1
G1
2
G2
5
IN1
O1
3
O2
4
EFCH1950TDF1FL104
G1
2
G2
3
G3
5
IN1O1
4
R125100
L1171.8nH
L115
1nH
1uC164
C15
6
2.2p
FL103 AN
T2 1
GN
D1
GN
D2
4 8G
ND
3G
ND
49
GN
D5
6G
ND
637
RX
5T
X
SAYZY1G95EB0B00
PA_ON
VREG_TCXO_2.85V
+VPWR
PA_R1
WLNA_OUT
WCDMA_MIX_IN_M
WCDMA_MIX_IN_P
VDD_RX
RX_WCDMA_2100
PWR_DET
Check Vbias over 2V?
Check the RF S/W
Check FEMFL100
Check the DuplexerFL103
Check the RTR6275U100
Check TP2Signal exist?
Check TP3Signal exist?
Check TP4Signal exist?
TP2
Vbias
TP4
TP3
- 106 -
4. TROUBLE SHOOTING
4.6 Checking GSM Block
4.6.1 Checking Front-End Module
Refer to chapter 3.4
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
2
3
- 107 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.6.2 Checking RF Tx Level
PQ
C104
1.2p
ANT101
C11547p47p
C113
NAL102
A CG1
G2
KMS-518
SW100
120pC101
12GND5
14GND6GND7
15
GND81718
GND9
NC7
PCS_RX122
PCS_RX221
25PGND1
26PGND2
8UMTS_TX_RX
VC154
VC2VC3
3VDD
6
ANT10
DCS_PCS_TX13
DCS_RX12019
DCS_RX2
EGSM_RX12423
EGSM_RX2
EGSM_TX16
1GND1
2GND2GND3
911
GND4
FL100
LSHS-M090UH
47pC114
ANT100
0
L100
C102
12nH
L101
4.7nH
ANT102
ANT_SEL2
ANT_SEL0ANT_SEL1
PQ
C138
NA
C142
0.75p
8pC136
L113
14GND6
GN
D7
1617G
ND
8
7GSM_IN
9GSM_OUT
3TX_EN
VBATT4
12VCC
VRAMP6
4.7nH
TQM7M5003U101
2BS
DCS_PCS_IN1
DC
S_P
CS
_OU
T15
5GND1
GND28
10GND3
11GND4
13GND5
15nH
L112
C146 10p
Schematic of the GSM Tx Block
Test Point of GSM Tx Block
TP1 TP2
TP3
TP1
TP2
TP3
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 108 -
START
Check TP1If GSM over 31 dBm?
If DCS/PCS over 28dBm?
Check TP2, TP3If TP2 over 29dBm?If TP3 over 25dBm?
Check PAM Block OK?Refer to chapter 3.6.3
Check Soldering of PAM (U101)If problem still exist,
replace the PAM
Change the Board
Problem resolved ?
Yes
Yes
Yes
Yes
No
No
No
No
GSM/DCS/PCS Tx is OKCheck other part
Check Front-End Module
Refer to chapter 3.4
Check the RTR6275
GSM/DCS/PCS Tx is OK
- 109 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.6.3 Checking PAM Block
HIGH
MODE
LOW
GSM_PA_BAND
10 dB
GSM
DCS/PCS
8 dB
33uC135
120R119
120R118
51
R114
91R112
R117 2.2K
91R113
1uC137
14GND6
GN
D7
1617G
ND
8
7GSM_IN
9GSM_OUT
3TX_EN
VBATT4
12VCC
VRAMP6
TQM7M5003U101
2BS
DCS_PCS_IN1
DC
S_P
CS
_OU
T15
5GND1
GND28
10GND3
11GND4
13GND5
2
G1
3
G2
5G3 1
IN
4O1
EFCH897MTDB1
FL101
68pC143
68
R111
GSM_PA_BAND
+VPWR
DCS_PCS_TX
GSM_TX
GSM_PA_RAMP
GSM_PA_EN
TP1
TP2
TP3
Test Point Net name Description
TP1 GSM_PA_RAMP Power Amp Gain Control. Typically, 0.2 ~1.6V
TP2 GSM_PA_EN Power Amp Enable (ON : >2.5V, OFF : <0.7V)
TP3 +VPWR PAM Supply Voltage (Vcc > 3V)
Schematic of PAM Block
Test Point of PAM Block
TP1
TP2 TP3
- 110 -
4. TROUBLE SHOOTING
4.6.4 Checking RF Rx Level
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Schematic of GSM-900, DCS-1800, PCS-1900 Rx Block
Test Point of Rx Block
DCS
GSM
PCS
15nHL104
47pC109
5.6nHL103
15nHL107
NAL102
A CG1
G2
KMS-518
SW100
L109 22nH
120pC101
12GND5
14GND6GND7
15
GND81718
GND9
NC7
PCS_RX122
PCS_RX221
25PGND1
26PGND2
8UMTS_TX_RX
VC154
VC2VC3
3VDD
6
ANT10
DCS_PCS_TX13
DCS_RX12019
DCS_RX2
EGSM_RX12423
EGSM_RX2
EGSM_TX16
1GND1
2GND2GND3
911
GND4
FL100
LSHS-M090UH
5.6nHL105
5.6nHL106
22nHL110
L111 22nH
L108 5.6nH
VREG_RF_SMPS
TP1 TP2 TP3
TP3
TP2
TP1
- 111 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
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4.7 Power on trouble
Power on sequence of KU990 is :
PWR key press → PM_ON_SW_N go to low (VA700, PM6650-2M KPDPWR_N pin#24) → PM6650-2M Power Up → VREG_MSMC_1.2V(C560), VREG_MSME_1.8V(R520), VREG_MSMP_2.7V(R513),VREG_MSMA_2.6V(R508), VREG_TCXO_2.85V(C510) power up → PON_RESET_N assert to MSM→ Phone booting & PS_HOLD(D500) assert High to PMIC(PM6650-2M)
Start
Battery voltg. higher than 3.2V?
Press PWR keyKeypad LED on?
VA700 high to lowwhen key press?
VREG_MSMC_1.2V,VREG_MSMP_2.7V, VREG_MSME_1.8V
VREG_TCXO_2.85V,VREG_MSMA_2.6V power up?
Is clock ok?X100 : 19.2MX500 : 32.768Khz
Change the Main board
Change or charging the Battery
Follow the LED trouble shoot
Check open Pattern of power buttonCheck Dome Sheet
Change the Main board
Check the TXCO and SLEEP CRYSTAL
NO
YES
YES
YES
YES
YES
NO
NO
NO
NO
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 113 -
VREG_MSMC_1.2V(C560)
VREG_MSME_1.8V(R520)
TCXO ( 19.2MHz )
VREG_MSMP_2.7V(R513)
VREG_MSMA_2.6V(R508)
VREG_TCXO_2.75V(C510)
SLEEP CRYSTAL(32.768KHz)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 114 -
PM_ON_SW_N (D700)
RESET_IN_N(R208)
PS_HOLD(D500)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 115 -
4.7.1 USB trouble
USB Initial sequence of KU990 is :
USB connected to KU990 → USB_VBUS(C540) go to 5V
→ USB_D+(VA202) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work
Start
USB_VBUS is aboutto 5V?
USB_D+ is about to 3.3V?
48MHz is run?
Change the Main board
Check C540, R514,U500USB cable
Check VA500,U507,U304
Check X200
NO
YES
YES
YES
NO
NO
Cable is insert?
YES
Cable insertNO
X200(48MHz)
C540(USB_VBUS)
U507(USB_D+)
R514(USB_VBUS)
U500(USB_VBUS)
VA500(USB_D+)
U304(USB_D+)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 116 -
4.7.2 UMS(USB MASS STORAGE) trouble
UMS Initial sequence of KU990 is :
USB connected to KU990 → VREG_5V(R335, UMS) go to 5V → VREG_USB_3.3V(R301) go to 3.3V→ USB_DATA is triggered → USB work
Start
VREG_5V is aboutto 5V?
VREG_USB_3.3V isabout to 3.3V?
MICRO SD function OK?
Change the Main board
Check R335, D501
Check R301,C529, USB CABLE
Follow the micro sd trouble
NO
YES
YES
YES
NO
NO
Cable is insert?
YES
Cable insertNO
C529 (VREG_USB_3.3V)D501(VREG_5V)
< TOP SIDE >
R335(VREG_5V)
R301(VREG_USB_3.3V)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
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4.8 SIM detect trouble
USB Initial sequence of KU990 is :
VREG_USIM_3.0V(C552 of PM6650) go to 3.0V → USIM clock, reset and data triggered → USIM IF
work (Schematic and place are refer to SIM technical brief)
Start
Work well?
VREG_USIM_3.0V is 3.0V?USIM_P_CLK is run?
Change the Main board
End
Check J400, D400,C552
Yes
No
YES
NO
Re-insert the SIM card
Change SIM card
Work well? EndYes
No
USIM_P_RST_N
C552(VREG_USIM_3.0V)J400
USIM_P_CLK
USIM_P_DATA
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 118 -
4.9 Key sense trouble ( KEYPAD )
Key Sense sequence of KU990 is :Default condition ROW(0-2) is 2.7V → Press the key → Corresponding ROW(x) and COL(x) go to 0V→ Scan pulse( Col => Row ) → MSM sense what key pressed.
Check the R701,R705,R706 with no key press
Change the Main board
Yes
NO
Change the DOME SHEET
Check the R701,R705,R706 with key press
ROW(0-2) is 2.7V?Check R701,R705,R706
NO
YesROW(0-2),COL(0-1) is 0V?
Work well?
End
START
Check VA700~ VA707, R707~R710
NO
YESNO
Change SIDE KEY
Work well?
NO
Work well?
YES
YES
NO
Dome sheet
Side Key
Change the Main board
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 119 -
Schematic of key sense part
CLRSEND
R70
1
51K
701700
VA
702
EV
LC
14S
0205
0
VA
701
EV
LC
14S
0205
0
EV
LC
14S
0205
0V
A70
3
KEY_ROW[2]
VREG_MSMP_2.7V
KEY_COL[0]
KEY_COL[1]
END
ON_SW KEY
EV
L14
K02
200
VA
700
END
PM_ON_SW_N
VA702(COL0)
SEND
VA703(COL1)
VA701(ROW2)
CLR END
SIDE KEY
470R709R710 470
470R708
51K
R70
6
VA
704
EV
LC
14S
0205
0
51K
R70
5
VREG_MSMP_2.7V
R707 470
EV
LC
14S
0205
0V
A70
7
EV
LC
14S
0205
0V
A70
6
VA
705
EV
LC
14S
0205
0
5
CN7001234
KEY_ROW[0]KEY_ROW[1]
KEY_COL[1]KEY_COL[0]
LOCK
SHOT
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
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4.10 Keypad backlight trouble
Key Pad Back Light is on as below :Key pressing → PM6650 KYPD_LED_EN go to Low → LED On (Key Pad LED controlled by PM6650)
Start
Check device short : LD700~705 and R711~716 (Main)
NO
Yes
Key press
Signal KYPD_LED_ENis Low?
+VPWR is OK?
Change the main boardNO
Yes
YesCheck device open :
LD700~705 and R711~716 (Main)NO
Some LED is not work?
Work well?
Yes
Change the main boardNO
End
LD700~705 (Main)
LD703 (+VPWR)
VA708 (KYPD_LED_EN)R711~716 (Main)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 121 -
(GREEN)
Rev. 1.1
(WHITE) (RED)
R71
147
LD
701
SS
C-F
R10
4-II1
R71
220
0 SS
C-F
R10
4-II1
200
R71
4L
D70
3
EVL14K02200
VA708
SS
C-T
WH
104-
HL
LD
704
R71
547 S
SC
-TW
H10
4-H
L
R71
347
LD
700
LE
GG
-S14
G
LD
702
LD
705
LE
GG
-S14
G
47R
716
KYPD_LED_EN
+VPWR
LD700~705 and R711~716 (Main)
VA708 (KYPD_LED_N)
LD703 (+VPWR)
Schematic of keypad backlight part
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 122 -
4.11 Micro SD trouble
Micro SD is worked as below :Micro SD insertion → MICROSD_DETECT(R804) goes to low → go working
MICROSD_DETECT(R804))is low ?
Insert the Micro SD Card
Start
End
Check VREG_MMC_3.0V is over 2.85V?
Work well?
YES
NO
SOCKET
R804(DETECT)
YES
Change the SUB board
Work well?
YES
NO
NO
Change the MAIN board
YES
NO
C807(VREG_MMC_3.0V)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 123 -
4.12 Audio trouble
4.12.1 Receiver path
Voice Receiver path as below:MSM6280 Ear1ON/Ear1OP → CN701(VGA CAM FPCB connector) → Receiver
Start
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Can you hear the tone?
YES
END
Check connector pinor change the VGA CAM FPCB
YESChange the Receiver
Hear the tone to the receiver?
NO
END
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 124 -
VGA CAM FPCB
connector
Receiver Receiver pads
MSM6280
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 125 -
4.12.2 Voice path for headset
Voice path for Head_Set as below:MSM6280 HPH_R, HPH_L → C548,C549 U502(audio codec) → C578,C562 → R529,C522 →U504(Headset AMP) → FB502, FB503 → R525, R524 → #4, #5 pin of CN500 headset Jack
Start
The sine wave appear at C548,C549 ?
Change the Main boardNO
Connect the phone to networkEquipment and setup call
Setup 1KHz tone outAnd insert head_Set
The sine wave appear at C578,C562 ?
YES
Check the U502or change the Main bíd
NO
Can you hear the tone?NO
YES
YES
END
Headset insertion detection in the Main LCD Display OK?
Check #8 pin of CN500or change the Main bíd
NO
YES
Check the CN500 or change the Main bíd
The sine wave appear at R525,R524 ?
YES
Check the U504or change the Main bíd
NO
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 126 -
CN500
R524R525
891213
19
2
21
34567 CN
500
11011
R528 100K
FB
504
TV
_OU
TE
AR
_MIC
_P
RM
T_P
WR
_ON
_N
RM
T_IN
T-U
SB
_D+
RM
T_A
DC
-US
B_D
-
VB
AT
T
FM
_AN
T
MID
I_EA
R_L
MID
I_EA
R_R
EA
R_S
EN
SE
_N
Schematic of voice path
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 127 -
C548 C549
U502
FB501
FB500
NAC550
0.1uC514
C535 1u
C532 1u
R2_GPIO36
RIN54
RIPROUT1
29
ROUT223
16SCLKSDIN
17
27VMIDDACDAT
10
DBVDD14
DCVDD13 12
DGND
L2_GPIO23
LIN21
LIP
LOUT130
25LOUT2
7LRC
11MCLK
MICBIAS32
18MODE
OUT32221
OUT4
33PGND
U502
ADCDAT9
28AGND1
24AGND2
AUXL19
AUXR20
31AVDD1AVDD2
26
8BCLK
15CSB_GPIO1
4.7uC520
WM8983
C533
4.7n
R511
18K
R533
0
10uC525
C53
41u
10uC513
100K
R51
9
4.7n
C542
NAC531
1K
R516
R510
1K
C541
1u
1u
C549
1uC548
C536 1u
C5184.7u
C53
91u
12nC547
C5240.1u
NAC544
C5190.1u
C551NA
C5210.1u
C543NA
12nC530
18K
R517
C5164.7u
C5170.1u
MIC_PWRMMP_A_MCLK
CODEC_I2C_SCLCODEC_I2C_SDA
HP_R
HP_L
HP_EAR_L
MIC2P
HP_EAR_R
MID_MICPSPK_L
SPK_R
FM_AUDIO_L
FM_AUDIO_R
MMP_A_BCLK
MMP_ADO_DACDAT
MMP_A_LRCLK
MMP_ADI_ADCDAT
SPK_OUT-
SPK_OUT+
VREG_5V
VREG_WM_2.7V
VREG_MSME_1.8V
MIDI_3.3V
Schematic of voice path
U502
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 128 -
Schematic of voice path
FB502FB503
U504
C562R522
C578R529
PQ
PQ
R524
68SVSS
16_S
HD
N
C1N4
2C1P
INL
+15
INL
_14
7IN
R+
INR
_8
OUTL12
OUTR103
PGND
PVDD1
5P
VS
S
P_G
17
SG
ND
6
13S
VD
D1
9SVDD2
11U504
MAX9722BETE
4.7uC565
C5771u
R525
68
600FB503
FB502 600
0.22
uC
578
R52
2
15K
15K
R52
9
1uC570
PR
SB
6.8C
C57
4
C57
3
PR
SB
6.8C
1uC566
C56
20.
22u
MIDI_EAR_R
MIDI_EAR_L
MIDI_3.3V
HP_AMP_EN
HP_EAR_L
HP_EAR_R
U504
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 129 -
4.12.3 Loud speaker path (voice speaker phone/VT)
Loud speaker path as below:MSM6280 SPK_R, SPK_L → C532,C541 → R510,R516 → C533,C542 → R511,R517 →U502(audio codec) → FB500,FB501 → CN603(B’toB connector) → OUT800, OUT801 (SPK PAD) →Speaker
Start
The sine wave appear at C532,C541?
Change the Main boardNO
Connect the phone to networkEquipment and setup callSetup 1KHz tone outSet phone with speaker phone mode
The sine wave appear at FB500, FB501?
YES
Check the U502 or Change the Main board
NO
Check the CN603NO
YES
YES
Can you hear the tone? Change the speakerNO
YES
END
The sine wave appear at pads of speaker?
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 130 -
MICBIAST15
AC18LINE_ONLINE_OP
AC17
HPH_LW17
AA17HPH_R
EAR1ONAE18
EAR1OPAF18
HP_RHP_L
RCV+RCV-
MICBIAS
SPK_LSPK_R
FB501
FB500
C535 1u
C532 1u
R2_GPIO36
RIN54
RIPROUT1
29
ROUT223
16SCLK
27VMIDDACDAT
10
L2_GPIO23
LIN21
LIP
LOUT130
25LOUT2
7LRC
11MCLK
MICBIAS32
18MODE
OUT32221
OUT4
ADCDAT9
24AGND2
AUXL19
AUXR20
8BCLK
15CSB_GPIO1
C533
4.7n
R511
18K
10uC525
C53
41u
K94.7n
C542
NAC531
1K
R516
R510
1K
C541 1u
C536 1u
C53
91u
12nC547
C5240.1u
NAC544C543
NA
12nC530
18K
R517
MIC_PWRMMP_A_MCLK
CODEC I2C SCL
HP_EAR_L
MIC2P
HP_EAR_R
MID_MICPSPK_L
SPK_R
FM_AUDIO_L
FM_AUDIO_R
MMP_A_BCLK
MMP_ADO_DACDAT
MMP_A_LRCLK
MMP_ADI_ADCDAT
SPK_OUT-
SPK_OUT+
AXK740327G
VR
EG
_MM
C_3
.0V
89
3
30313233343536373839
4
40
567
1516171819
2
20 212223242526272829
CN603G1
G2
1
1011121314
VR
EG
_MS
MP
_2.7
V
+VP
WR
VR
EG
_BT
_2.8
5V
MMP_CAM_PWR_EN
SPK_OUT+SPK_OUT-
HOOK_SENSE_N
EAR_MIC_P
MICROSD_DATA[1]
MICROSD_DETECTMICROSD_CLK
MICROSD_DATA[0]MICROSD_CMD
CAM_VDD_AF_2.7V
CAM_MIC+
WHEEL_SW_LWHEEL_SW_R
CAM_VDD_SD_1.8V
V_BACK_UP
TCXO_BTBT_TX_RX_N
BT_SBST
BT_SBCKBT_SBDT
BT_CLK
BT_DATAMICROSD_DATA[3]MICROSD_DATA[2]
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 131 -
MSM
Pads of Speaker
C722
CN603
U502 (audio codec)
C532,C541
FB500, FB501
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 132 -
4.12.4 Microphone for main MIC
Main Microphone path as below:MIC → C567,C568 → MSM internal CODEC
MIC
10u
C563
C568 22n
C569NA
C56447p
2G1
3G2
1O
4P
SPM0204HE5-PB-3
MIC500
33pC575
10pC576
C567 22n
MICBIAS
MIC1P
MIC1N
10%Place nearMSM pin W18(CODEC VSS)
C20
4N
A
C238 0.1u
0.1u
C23
5C
236
0.1u
NA
C23
7
NA
C20
3
C200
10p
SDCC_DAT1_GPIO99F25
M25SDCC_DAT2_GPIO100SDCC_DAT3_GPIO101
M26
MIC
1NA
F20
MIC
1PA
E20
AF
21M
IC2N
AF
22M
IC2P
LIN
E_L
_IN
AC
21L
INE
_L_I
P
AC
20L
INE
_R_I
NL
INE
_R_I
PA
C19
CC
OM
PA
A20
AF
19A
UX
INA
E19
AU
XIP
MSMMSMMSM
MIC
1PM
IC1N
Can you scoping some sound signal at C567,C568?
Change the MIC orChange the Main B'd
NO
YES
YES
make some sound or voice to MIC
Work well? END
YES
Start
MIC_BIAS(R221) is 1.8V? Change the Main B'dNO
Make a call
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 133 -
MIC500 (MIC for Handset)
C567, C568
MSM
4.12.5 Microphone for headset
MIC for Head_Set path as below:Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6280 sense Head_Set insertion →MIC signal → U502(audio codec) → MSM6280.
Start
EAR_SENSE_N is 0V?
END
Make a call
Change the Main b'd
Change the Main b'dMIC_BIAS is 2.7V ?
YES
YES
NONO
NO
Try ch ange the head set
Can you s coping s ome sound signal at C539? Change the MIC
YES
YES
make some sound or vo ice t o MIC
Work w ell? ENDYES
Can you s coping s ome sound signal at C235,L20 0?
Check t he U502 orChange the Main Bíd
NO
NO
YES
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 134 -
89
121314151617
19
2
21
34567
CN500
1
1011
R52
810
0K
FB504
VREG_MSMP_2.7V2.2uHL504
TV_OUTEAR_MIC_P
RMT_PWR_ON_N
RMT_INT-USB_D+RMT_ADC-USB_D-
VBATT
FM_ANT
UART TXDUSB_VBUS
MIDI_EAR_LMIDI_EAR_R
EAR_SENSE_N
FB501
FB500R2_GPIO3
6
RIN54
RIPROUT1
29
ROUT223
16SCLK
27VMIDDACDAT
10
L2_GPIO23
LIN21
LIP
LOUT130
25LOUT2
7LRC
11MCLK
MICBIAS32
18MODE
OUT32221
OUT4
ADCDAT9
24AGND2
AUXL19
AUXR20
8BCLK
15CSB_GPIO1
10uC525
C53
41u
K9
NAC531
C53
91u
C5240.1u
NAC544C543
NA
MIC_PWRMMP_A_MCLK
CODEC I2C SCL
HP_EAR_L
MIC2P
HP_EAR_R
MID_MICP
MMP_A_BCLK
MMP_ADO_DACDAT
MMP_A_LRCLK
MMP_ADI_ADCDAT
SPK_OUT-
SPK_OUT+
C20
4N
A
C2
0.1u
C23
5C
236
0.1u
L200
100nH
NA
C20
3
C200
10p
SDCC_DAT1_GPIO99SDCC_DAT2_GPIO100SDCC DAT3 GPIO101
MIC
1NA
F20
MIC
1PA
E20
AF
21M
IC2N
AF
22M
IC2P
LIN
E_L
_IN
AC
21
AC
20L
INE
_R_I
NL
INE
_R_I
PA
C19
CC
OM
PA
A20
AF
19A
UX
INA
E19
AU
XIP
MIC
1PM
IC1N
MIC
2P
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 135 -
#8 pin of ear connectorto check EAR_SENSE_N
C535
MSM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 136 -
4.13 Camera trouble
Camera control signals are generated by ZORAN (Multimedia Chip)and directly connected with ZORAN.KU990 has two cameras. The one is a 5 Mega Camera, the other is VGA camera.
No
Camera is OK?
Check the camera conn. andreconnect the camera
Change the LDO (U601, U602, U701, U900, U901)
Camera is OK
Check MMP_CAM_PCLK
Change the camera
Yes
NO
NO
Yes
(CN600)
Change the Main board
EndYes
End
NO
5M START
ZORAN output signal check(MMP_CAM_RESET_N, MMP_
CAM_PWR_EN))
Yes
NO
Check master clock5M_CAM_MCLK
(CN600)
Yes
Change the Analog Switch (U604, U607)NO
YesCheck the EMI/ESD filter
(FL600, FL601)
Yes
No
Change the Filter
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 137 -
MMP_CAM_RESET_N
MMP_CAM_PWR_EN
CAM_VDD_CORE_1.2V
CAM_VDD_SA_2.7V
CAM_VDD_IO_2.7V
CAM_VDD_SD_1.8V
CAM_VDD_AF_2.7V
FL600
FL601
MMP_CAM_PCLK
5M_CAM_MCLK
U604 U607
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 138 -
GB042-30S-H10-E3000
1u
CAM_VDD_SA_2.7V
CAM_VDD_IO_2.7V
C60
8
C6050.1u
10pC610
30
1718192021222324
1415
23456789
16
2526272829
CN6001
10111213
0.1u
C612
C606
10p
R601 10
R607
33
0.1uC607
10pC611
CAM_VDD_AF_2.7V
CAM_VDD_CORE_1.2V
VA
601
ICV
L05
1810
0Y50
0FR
VA
602
C614
EV
LC
18S
0201
5 0.1u
C6010.1u
ICV
L05
1810
0Y50
0FR
VA
600
10uC600
R604 10
CAM_VDD_SD_1.8V
10R603
10pC613
C60
90.
1u
R608 10
C6021u
R602 10
STROBE_TRIGGER
MMP_CAM_PCLK
5M_CAM_DATA[0] 5M_CAM_DATA[1]5M_CAM_DATA[2] 5M_CAM_DATA[3]5M_CAM_DATA[4] 5M_CAM_DATA[5]5M_CAM_DATA[6] 5M_CAM_DATA[7]
MMP_CAM_RESET_N MMP_CAM_INTMMP_CAM_HSYNCMMP_CAM_VSYNC
MMP_I2C_SDAMMP_I2C_SCL
5M_CAM_MCLK
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
9INOUT_B1
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E070R100FR FL600
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
INOUT_A44
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL601ICVE10184E070R100FR
MMP_CAM_DATA[3]
5M_CAM_DATA[0]5M_CAM_DATA[1]5M_CAM_DATA[2]5M_CAM_DATA[3]
MMP_CAM_DATA[4]MMP_CAM_DATA[5]MMP_CAM_DATA[6]MMP_CAM_DATA[7]
5M_CAM_DATA[4]5M_CAM_DATA[5]5M_CAM_DATA[6]5M_CAM_DATA[7]
MMP_CAM_DATA[0]MMP_CAM_DATA[1]MMP_CAM_DATA[2]
U604 NC7SB3157L6X
A4
B03
1B1
2GND
6S
5VCC
0.1uC622
NC7SB3157L6XU607
4A
3B0
B11
GND2
S6
VCC5
0.1uC621
+VPWR
+VPWR
5M_CAM_MCLK
CAM_MCLKVGA_CAM_MCLK
MMP_CAM_MCLK5M_CAM_MCLK
CAM_SELECT_N
R333 NA
SCLN14
SDAP14
GPIO0P2M3
GPIO1GPIO2
P7N1
GPIO3GPIO4
P1
GPIO5M5N6
GPIO6GPIO7
M6P5
GPIO8N5
GPIO9
TP303
TP302
100K
R33
1
MMP_CAM_INT
MMP_I2C_SDAMMP_I2C_SCL
MMP_STROBE_CHARGE
MICROSD_DETECT
MMP_CAM_RESET_N
MMP_CAM_PWR_EN
Schematic of 5M camera part
C605 : CAM_VDD_CORE_1.2V
R607 : 5M_CAM_MCLK
R331 : MMP_CAM_PWR_ENFL600
FL601U607
U604
R608 : 5M_CAM_PCLK
C601 : CAM_VDD_AF_2.7V
C609 : CAM_VDD_SA_2.7V
C606 : CAM_VDD_IO_2.7V
C607 :CAM_VDD_SD_1.8V
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 139 -
Check VGA_VDD_2.7,VGA_VDD_1.8V
Camera is OK?
Check the camera & 30-pin conn. And reconnect these connectors(Main & FPCB connector)
Change the LDO (U600)
Camera is OK
Check the VGA_CAM_PCLK
Yes
NO
NO
Yes
(R718)
Change the Main board
EndYes
End
NO
VGA START
MSM6280 output signal check(VGA_CAM_RESET_N, V
VGA_CAM_PWDN)
Yes
NO
Check master clock(VGA_CAM_MCLK : R717)
Yes
Yes
Check the EMI/ESD filter Change the Filter (FL700, FL701)
NO
NO
Yes
NO
Change the camera
Yes
No
Change the Analog Switch (U604, U607)NO
Change the slider FPCB
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 140 -
VGA_CAM_PWDN
VGA_CAM_RESET_N
VGA_CAM_PCLK
VGA_CAM_PCLK
FL700, FL701 : EMI FILTER
VGA_VDD_2.7V
U604 U607
VGA_VDD_1.8V
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 141 -
10R719
VGA_VDD_2.7V
R725 1010R724
16
252627282930
1718192021222324
1
101112131415
23456789
CN701
C7110.1u 10p
C713
R718 10
EV
LC
18S
0201
5V
A71
5
R72
9
NA
resi
sto
r
10pC715
10
R717
VA
714
ICV
L05
1810
0Y50
0FR
10R720
C71210p
EV
LC
18S
0201
5V
A71
3
C709
0.1u
VGA_VDD_1.8V
C71410p0.1u
C710
VGA_CAM_DATA[2]VGA_CAM_DATA[3]VGA_CAM_DATA[4] VGA_CAM_DATA[7]
I2C_SDAI2C_SCL
MMP_CAM_VSYNCMMP_CAM_HSYNC
VGA_CAM_RESET_N
RCV+RCV-
MOTOR+MOTOR- x+
x-Y+
Y-
VGA_CAM_DATA[6]
VGA_CAM_PWDN
VGA_CAM_DATA[5]
VGA_CAM_MCLK
MMP_CAM_PCLKVGA_CAM_DATA[0]VGA_CAM_DATA[1]
6
5G
110
G2
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
ICVE10184E070R100FR
FL701
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
FL700
ICVE10184E070R100FR
MMP_CAM_DATA[0]MMP_CAM_DATA[1]MMP_CAM_DATA[2]MMP_CAM_DATA[3]
VGA_CAM_DATA[0]VGA_CAM_DATA[1]VGA_CAM_DATA[2]VGA_CAM_DATA[3]
MMP_CAM_DATA[4]MMP_CAM_DATA[5]MMP_CAM_DATA[6]MMP_CAM_DATA[7]
VGA_CAM_DATA[4]VGA_CAM_DATA[5]VGA_CAM_DATA[6]VGA_CAM_DATA[7]
U604 NC7SB3157L6X
A4
B03
1B1
2GND
6S
5VCC
0.1uC622
NC7SB3157L6XU607
4A
3B0
B11
GND2
S6
VCC5
0.1uC621
+VPWR
+VPWR
5M_CAM_MCLK
CAM_MCLKVGA_CAM_MCLK
MMP_CAM_MCLK5M_CAM_MCLK
CAM_SELECT_N
Schematic of VGA camera part
R717 : VGA_CAM_MCLK
VA713 : VGA_VDD_2.7VVA713 : VGA_VDD_2.7V
FL700 FL701
U604
U607
VA713 : VGA_CAM_PWDN C709 : VGA_VDD_1.8V
R718 : VGA_CAM_PCLK
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 142 -
4.14 Main LCD trouble
Main LCD control signals are generated by MSM6280. Those signal’s path are :MSM6280 → Z ORAN (Multimedia Chip) -> 40-pin connector(CN300 in Main PCB) -> 40-pin connector(in LCD Module)
The LCD works
START
Press END keyto turn the power on
Is the circuit powered? Follow the Power ONtrouble shooting
LCD display OK?
Check LCD_VDD_2.8V, LCD_RESET_N,LCD_DATA[0~15] in Main BD
No
Yes
Yes
No
Disconnect and reconnect40-pin B to B connector
Change the Main BD
No
End
Yes
Display OK?Yes
Change the LCD module
No
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 143 -
Main BD
SUB BD
LCD_NRESET
LCD_VDD_2.8V
LCD_DATA[0~15]
- 144 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
OTP Program Pin
ENBY00360011.0T, Socket
GB042-40S-H10-E3000
7INOUT_B3
INOUT_B46
FL301 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
C32
222
p
C32
322
p
R315 5122
pC
325
VA300
ICVN0505X150FR
2526272829
9
21
30313233343536373839
22
40
2324
1213141516171819
2
20
345678
CN3001
1011
VA301
51R314
NAC320
C32622p
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL303
5G
110
51R316
R318 0
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL300
51R317
22p
C32
4
0.1uC321
6
FL302 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
LCD_VDD_2.8V
LCD_VSYNC_OUT
LCD_MAKER_ID
MMP_LCD_WE_NMMP_LCD_VSYNC_OUT
WLED_PWR
WLED_2
WLED_4WLED_5
MMP_LCD_VSYNC_IN
LCD_IF_MODE
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[14]LCD_DATA[15]
LCD_DATA[8]LCD_DATA[9]
LCD_DATA[10]LCD_DATA[11]LCD_DATA[12]LCD_DATA[13]
WLED_1
WLED_3
MMP_LCD_ADSMMP_LCD_CS_NLCD_RESET_NMMP_LCD_RD_N
MMP_LCD_DATA[9]MMP_LCD_DATA[10]MMP_LCD_DATA[11]
MMP_LCD_DATA[12]MMP_LCD_DATA[13]MMP_LCD_DATA[14]MMP_LCD_DATA[15]
LCD_DATA[12]LCD_DATA[13]LCD_DATA[14]LCD_DATA[15]
MMP_LCD_DATA[0]MMP_LCD_DATA[1]MMP_LCD_DATA[2]MMP_LCD_DATA[3]
MMP_LCD_DATA[4]MMP_LCD_DATA[5]MMP_LCD_DATA[6]MMP_LCD_DATA[7]
MMP_LCD_DATA[8]
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]
LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[8]LCD_DATA[9]LCD_DATA[10]LCD_DATA[11]
Schematic of LCD part
C321 : LCD_VDD_2.8V
C326 : LCD_VDD_2.8VFL300
FL301
FL302
FL303
- 145 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.15 Bluetooth trouble
Bluetooth supplied voltages are generated by the PM6650.Those signal’s path are : PM6650 → VREG_MSMP_2.7V and VREG_BT_2.85V is asserted →TCXO_BT 19.2MHz is asserted → Bluetooth ON → BT_TX_RX_N is High → BT serial interfacecontrol is operated (SBST / SBCK / SBDT)
BLUETOOTHLG INNOTEK
TP802TP801
10K
R80
9
C8041u
C802 1000p
0R807
C8031u
C800 NA
0R
800
BT_ANT
C814
2.2u
C811100p
C8120.1u
GN
D3
GN
D4
1517P
GN
D1
PG
ND
21819
PG
ND
3P
GN
D4
20
RX_BB_TX_BB13
SBCK1112
SBDT
SBST4
5SYNC_DET_TX_EN
3VCC_OUT
14VDD_BAT
VDD_INT2
VDD_MSM10
7XTAL_IN
M800LBRQ-2B43A
AN
T16
9CLK_REF
1G
ND
1G
ND
268
BT_GND
100pC813
C801
NAL800
1000p
VREG_BT_2.85VVREG_MSMP_2.7V
TP800
10K
R80
8
BT_DATA
BT_CLKBT_SBCK
BT_SBDT
BT_SBST
BT_TX_RX_N
TCXO_BT
TCXO
0.1uC139
C147 1000p
100ohmR115
1000pC145
0.01uC141
8200pC148
1000pC140
X1002
GNDOUT3
VCC4
VCONT1
19.2MHz
R120 100K
TC7SH04FSU102
C144 1000p
TRK_LO_ADJVREG_TCXO_2.85V
TCXO_BT
VREG_BT_2.85V
TCXO_PM
RTR6275_TCXO
Figure. Schematic of Bluetooth Interface
4.16 Bluetooth RF Test
TC-3000A (Bluetooth Tester)1. Set phone to bluetooth test-mode.
- Enter Test Mode(3845#*990#) → Module Test Set → BT DUT → BT DUT ON2. Insert a phone in a TEMSELL (in case of radiation test)3. Set ‘discover’ after push menu button of the tester and select the link analyzer .4. After ‘set test mode’, confirm the connection state.5. Measure the power of full channel after hopping mode is selected to ‘ON’6. You can select wanted test cases after getting an optimized power
- 146 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
M800
BT_ANT
BT Antenna
TP800TP801
TP802
BT_GND
R800
Set the bluet ooth ON
VREG_BT_2.85V and
VREG_MSMP_2.7V is asserted?
Check P MIC(U501) Pin#64
XTAL_IN is asserted?
Check Os ci llator(X100)
AndCheck Buffer
(U102)
CLK_REF is asserted?
Check sol deringof BT( M800)
No
No
No
Yes
Yes
Yes
SYNC_DET_TX_EN is asserted?
Check sol deringof BT( M800)
No
Yes
SBST/SBCK/SBDT is asserted?
Check TP800/TP801/ P802
No
Yes
Bluetoot h is work well?Change
the main board
END
No
Yes
- 147 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.17 Touch Screen trouble
Touch Initial sequence of KU990 is:LCD_VDD_2.8V(C701) goes to 2.8V → TOUCH_PENIRQ_N(R702),TOUCH_I2C_SCL(R703) &TOUCH_I2C_SDA(R704) go to high Touch operation of KU990 is :A finger is touching on the screen -> TOUCH_PENIRQ_N is low -> I2C is connected -> A finger istook off from the Screen -> TOUCH_PENIRQ_N is high -> I2C is not connected.
Start
Work well?
Connector Is insert?
Replace the Main board
End
Insert Connector, again
Yes
No
YES
NO
Touchpad Calibration
Replace the Folder
Work well? EndYes
No
R702 (TOUCH_PENIRQ_N)
R704(TOUCH_I2C_SDA)
U700
R703 (TOUCH_I2C_SCL)
C701 (LCD_VDD_2.8V) Touch Window Connector
VGA FPCB Connector
- 148 -
5. DOWNLOAD
5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is adownload tool with capabilities to upload image files to the handset. LGMDP is designed to be simpleto use and easy enough for the beginner to upload executable images to the handset. LGMDPsupports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.
5.2 Downloading Procedure
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Beforegetting started, set up LGMDP preferences from the Preferences of the file menu the way you want.Click on the File menu and select Preferences.
Play a success soundIt will be played a .wav file when the download has been completed. To enable this simply check thebox.
Always on TopCheck if LGMDP always appears at the top of the window so that user can monitor it all the time.
Automatically run Select Port When LGMDP startsWhen LGMDP starts, it will automatically select Select Port button to download new image file.
5. DOWNLOAD
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 149 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable forthe port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.)
• The status Ready is displayed when the application is ready for downloading. While the images aretransmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.
- 150 -
5. DOWNLOAD
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 151 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
1) Image Folder indicates loot path where all image files are placed. To change location of the defaultimage path, select Browse... button. The edit box shows the file path where images are located.Please note that all images should be located in a selected folder.
2) Click on the Browse... button to select image files to be downloaded on the handset.
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.Backup the NV data and restore the backed up NV data automatically.
1)
2)
3) 6)4)5)
7)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 152 -
4) Reset database & Contents:User related data including the setting data on the EFS is reset in the handset. The user contents inthe handset will be erased. If you want to reset all the user data back to the way they were beforeyou started downloading new images, check the option.
Erase_EFS:
The calibration data, user contents, media, and module are erased. Only calibration data is kept whenNV backup/restore is checked. The user contents and file system physically are wiped out.
Keep All Contents
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a newS/W images. User data stated above are maintained if this option is selected.
5) Additional Options:Display Information is defaultly not selected and user cannot choose. Override partition table is also also defaultly not selected and user cannot choose.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 153 -
5.2.2 Choosing image files
• Select the image folder, where all the image files are located, by clicking on the Browse.... (The folder name shall be different from that of the folder name in the snapshot. The folder nameindicates the path where the image files are located.)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 154 -
Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automaticallyload images accordingly. Also you can select images by manually. For instance, select the path ofAMSS Modem Image file by clicking on the Browse... button. The selected AMSS image will bedownloaded to the handset from the path directory in the PC. Make sure that you have chosencorrect file. In case of wrong AMSS Modem file is selected, the phone may not work.(The file name shall be different from that of the file name in the snapshot.)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 155 -
• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose thedesired NV file to be downloaded on the handset. To enable this simply check the box or select theNV file from the LGMDP installation directory by clicking on the Browse... button.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 156 -
Click on the START button to start downloading. A summary of the selected images and optioninformation window will be displayed. Click on the No button if this is not the setting you aredownloading for. Otherwise click on the Yes button to continue downloading selected image file withoptions.
NoYes
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 157 -
• This message box informs that a new file for
NV backup will be created in the displayed
file name in the LGMDP installation
directory.
• Backing up NV data and backed up NV data
will be stored in the LGMDP installation
directory.
• Erasing the existing directories and files
before the Module image is downloaded.
• Downloading the AMSS modem image
5.2.3 Downloading
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 158 -
• Rebooting the handset and re-establishing
the connection
• Restoring NV data which backed up in the
Backing up process. User can also restore
NV data using NV Default image selection.
• Rebooting the handset and re-establishing
the connection
• Erasing the existing directories and files
before downloading the selected Media
image
- 159 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
• Downloading Media image in progress
• Downloading Module image in progress
• Downloading process has completed
successfully
5.2.4 Tools
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager isdesigned to monitor USB connectivity and check where the COM has been installed . Select DeviceManager from the Tools of the file menu.
- 160 -
5. DOWNLOAD
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 161 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.3 Troubleshooting Download Errors
5.3.1 When the phone does not work
• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) andthen try to download all the images up to AMSS. In the emergency mode, you can not downloadmedia or module image.The phone supports a special mode called emergency mode. In this mode, minimum units fordownloading is running so that users can download the images again in case of emergencysituation. (AMSS modem, Media, and Module images can not be running in this mode.)
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.Click on the Connect button to continue.
• Choose Image file after clicking on the Browse... button. Make sure that you have chosen the rightimage file. After choosing valid images, then click on the Start button to start downloading selectedimages. The selected image will be downloaded to the handset from the path directory in the PC.After downloading images successfully, it will boot to normal mode.
- 162 -
5. DOWNLOAD
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 163 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.3.2 NV Restore Error
• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.
• Connect the handset and Press the Connect button in the Select Port window.(Enable state in the window indicates that the Phone has been detected and is ready to download.)
- 164 -
5. DOWNLOAD
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 165 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
• Click on Browse... . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) willbe shown. These nv files were saved every time NV Backup option was selected, and the name ofthe nv file is determined based on the time when NV Backup was done. Choose the desired NV fileto be downloaded on the handset, and click on Start.
5.4 Caution
1) Multi-downloading using the USB hub is not recommendable.2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image
(media and module) download.3) The NV data saved at LGMDP folder as following format.
4) Recommended that the Module and Media Image have to be downloaded at the same time.5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.
- 166 -
5. DOWNLOAD
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
D:\LGMDP\004400-01-429926\_COM14_
LGMDP folder nameIMEI number Port number
- 167 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
6.1 GSM & UMTS RF Block
[Figure 2.1] UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram
- 168 -
6. BLOCK DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
[Table 2.1] RF Block Component
Block Ref. Name Part Name Function Comment
FL100 LSHS-M090UH Front End Module ASM+Rx Saw
SW100 KMS518 Test Connector Calibration, etc
X100 TG-5010LH_19_2M VCTCXO 19.2MHz
Common
U100 RTR6275 RF Transceiver IC TRX
M800 LBRQ-2B43A BT RF Transceiver BT TRX Bluetooth
FL103 SAYZ1G95EB0B00 Duplexer TRX
FL102 EFCH2140TDE1 RX SAW Filter RX
FL104 EFCH1950TDF1 TX SAW Filter TX
U105 AWT6277R TX PAM TX
UMTS
U104 CP0402A1950DNTR Coupler TX
U101 TQM7M5003 TX Dual PAM TX GSM
FL101 EFCH897MTDB1 Tx SAW Filter Tx
- 169 -
6. BLOCK DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
6.2 Interface Diagram
[Figure 2.2] U990 Interface Diagram
- 170 -
6. BLOCK DIAGRAM
Main RF signal
Control signal
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Main RF signal Description Comment
GSM 900 TX GSM 900 TX RF Signal
DCS TX DCS TX RF Signal
PCS TX PCS TX RF Signal
W- TX UMTS2100 TX RF Signal
GSM 900 RX GSM 900 RX RF Signal
DCS RX DCS RX RF Signal
PCS RX PCS RX RF Signal
W- RX UMTS2100 RX RF Signal
TX_I/Q I/Q for Tx of RF
RX_I/Q I/Q for Rx of RF
Control signal Description Comment
UMTS PA_CTL signal
PA_R1 UMTS Tx High/Low Power Control
PA_ON Power Amp. Enable
GSM PA_CTL signal
GSM_PA_BAND DCS or PCS /GSM Mode Selection
GSM_PA_EN Power Amp. Gain Control Enable
GSM_PA_RAMP Power Amp. Gain Control
RF Tranceiver_CTL signal
TX_ON RF Enable Signal
SSBDT_RTR Bidirectional SSBI Data
TX_AGC_ADJ UMTS Transmit Gain Control
FEM_CTL signal
ANT_SEL 0,1,2 Ant Switch Module Mode Selection
UMTS,
GSM900Tx/Rx,
DCS Tx/Rx,
PCS Tx/Rx
- 171 -
6 1110
Thermistor circuit deleted
B
HIGH
D
8
F
4
WCDMA
GSM 850/GSM 900 TX
HIGH
H
MODE
D
WCDMA
ANTENNA SWITCH MODULE LOGIC
G
A
PQ
PQ
DCS
LOW
10
1
ANT_SEL1 ANT_SEL2
5
A
11
SMPS circuit for RF
20dB
HIGH
C
9
GSM 1900 RX
GSM_PA_BANDGSM
(1%)
8
B
F F
VTUNE-Connected directly to GND
CC
LOW
LOW
D
LOW
5
4 6 11 12
4
LOW
9
2
HIGH
G
8 dB
11
GSM 1800/GSM 1900 TX
LOW
B
E
GSM
1 7
E
2
TCXO
10 dB
PCS
HIGH
9
126
GSM 900 RX
GSM 1800 RX
(1%)
HIGH
near to 48pin
G
103
HIGH
7
1
A
F
GSM
HIGH
H
3
D
5
H
ANT_SEL0
DCS/PCS
LOW
E
LOW
3
PQ
PQ
2
H
5
LOW
7
C
127
B
GSM 850 RX
LOW
HIGH
8
E
2
8 dB
HIGH
6 8 129
G
LOW
LOW
10
A
FM RADIO
Rev. 1.1
43
1
LOW
C138
NA
56pC105
NA
33uC135
C104
C165
1.2p
22pC133
L1251.2nH
0.1uC139
15nHL104
1nH
120R119
0.1u
L118
C12
1
C149
0.1u
22p
C12
2
C147 1000p
C12
30.
1u
1.5nH
C117
L114
47nH
L120
22p
100p
100ohmR115
C163
C12822p
VDDA51516
VDDA619
VDDA7VDDA8
2028
VDDA9
VD
DM
17
VTUNE1518
VTUNE2
26WLNA_IN
WL
NA
_OU
T29 35
WM
IX_I
NN
WM
IX_I
NP
34
7TCXO
21TEST
TX_IN50
TX_IP51
52TX_QNTX_QP
53
VCONTROL56
4VDDA1
VDDA104145
VDDA11VDDA12
4748
VDDA13VDDA14
49
6VDDA2VDDA3
89
VDDA4
GPCS_INN3736
GPCS_INP
HB_RF_OUT146
HB_RF_OUT244
43LB_RF_OUT1LB_RF_OUT2
42
PG
ND
57
40PWD_DET_IN
24RF_ON
13RX_INRX_IP
12
RX_QN1110
RX_QPR_BIAS13
R_BIAS227
SBDT14 U100
CAL_INN2322
CAL_INP
54DAC_REF
DCS_INN3938
DCS_INP
EGSM_INN3332
EGSM_INP
1ENV_LNNENV_LNP
2ENV_OUT
55
GCELL_INN30
GCELL_INP31
25G
ND
47pC109
RTR6275
100nHL127
L121
0.01u
2.2nH
VCC
VCCVCOA5
VDDD1
VREFDIGE3
C151
DGND1
D3DGND2
FREQINC1
B2INTX
ISSD5
LO1A3
LO2A4
LOOPSWA2 E4
MPXOUT
RFGNDC5
RFIN1B6
C6RFIN2
SWPORTB1
D6TMUTE
VAFLE5
VAFRE6
A6
U103 TEA5766UK
B5AGND
C2BUSEN
E2CLOCK
A1CPOUT
E1DATA
D2
C16022u
1000pC145
120R118
51R124
L122NA
100R126
0.1u
C168
C1502
45
31
56p
Q100
KRX102E
C1620.01u
0.01uC141
15nHL123
5p
51
R114
C108
5.6nHL103
1000pC112
C153
ANT101
C115
56p
27p
47p
2RFIN
RFOUT8
VCC1110
VCC2
4VMODE
VREF5
C172AWT6277R
U105
GND13
GND267
GND3
9GND4
GND511
C167
56p
91R112
5.6pC169
47pC113
C12
40.
1u
15nH
R117 2.2K
L107
0.1u
C11
9
L119
C142
0.75p
8pC136
1nH
8200pC148
C161
56p
SCDY0003403
50O
HM
4 3C
OU
P2
IN
1O
UT
TP103
C173100p
U104
NAL102
TP102
100p
3300p
C131
C111
R10
9
10
R123
1000pC134
68
91
0.1u
R113
C129
1000pC140
0.5pC155
C159
8.2p
1uC137
A CG1
G2
L113
KMS-518
SW100
14GND6
GN
D7
1617G
ND
8
7GSM_IN
9GSM_OUT
3TX_EN
VBATT4
12VCC
VRAMP6
4.7nH
TQM7M5003U101
2BS
DCS_PCS_IN1
DC
S_P
CS
_OU
T15
5GND1
GND28
10GND3
11GND4
13GND5
L109 22nH
X1002
GNDOUT3
VCC4
VCONT1
R107 2.7
2
G1
3
G2
5G3 1
IN
4O1
19.2MHz
EFCH897MTDB1
FL101
120pC101
C154
56pC1523.9p
C127100p
12GND5
14GND6GND7
15
GND81718
GND9
NC7
PCS_RX122
PCS_RX221
25PGND1
26PGND2
8UMTS_TX_RX
VC154
VC2VC3
3VDD
6
ANT10
DCS_PCS_TX13
DCS_RX12019
DCS_RX2
EGSM_RX12423
EGSM_RX2
EGSM_TX16
1GND1
2GND2GND3
911
GND4
15nH
FL100
LSHS-M090UH
L112
47pC114
680R101
1.8p
180pC100
C170
C110180p
C146 10p
L116
1nH
ANT100
L1284.7nH
TP101
C157
0.1u
R120
C1581u
100K
C107
12pC116
180p
180pC103
L124
3.3nH
L1268.2nH
C17156p
5.6nHL105
R102
0
C1251u
100K
R12
2
FL102EFCH2140TDE1
G1
2
G2
5
IN1
O1
3
O2
4
EFCH1950TDF1FL104
G1
2
G2
3
G3
5
IN1O1
4
C12622p
R125100
L1171.8nH
L115
1nH
NAR103
68pC143
0
L100
R10012K
5.6nHL106
TC7SH04FS
C13022u
U102
1uC164
C15
6
2.2p
TP100
22nHL110
5.1R104
C166
100p
C102
12nH
L101
4.7nH
22uC118
FL103 AN
T2 1
GN
D1
GN
D2
4 8G
ND
3G
ND
49
GN
D5
6G
ND
637
RX
5T
X
SAYZY1G95EB0B00
68
R111
ANT102
C144
L111 22nH
1000p
0.01uC132
C12
00.
1u
10K
R12
1
L108
6pC106
5.6nH
TX_AGC_ADJ
DAC_REF
WCDMA_MIX_IN_M
WLNA_OUT
RX_WCDMA_2100
VREG_MSMP_2.7V
VDD_RX
VREG_RF_SMPS
VREG_SYNTH_2.6V
VREG_RF_SMPS
TX_QP
TX_QM
TX_IP
TX_IM
RTR6275_TCXO
SSBDT_RTR
RX_QPRX_QM
RX_IPRX_IM
TX_ON
PWR_DET
VREG_RF_SMPS
ANT_SEL2
WCDMA_2100_TX_OUT
I2C_SDA
I2C_SCL
FM_INTX
SLEEP_CLK
GSM_PA_BAND
+VPWR
WCDMA_MIX_IN_P
PA_ON
VREG_TCXO_2.85V
+VPWR
WCDMA_2100_TX_OUT
DCS_PCS_TX
GSM_TX
DCS_PCS_TX
GSM_TX
PA_R1
WLNA_OUT
WCDMA_MIX_IN_M
WCDMA_MIX_IN_P
VDD_RX
ANT_SEL0ANT_SEL1
TRK_LO_ADJVREG_TCXO_2.85V
TCXO_BT
VREG_BT_2.85V
TCXO_PM
RTR6275_TCXO
FM_ANT
VREG_MSMP_2.7V
VREG_MMC_3.0V
FM_BUSEN
FM_AUDIO_R
FM_AUDIO_L
RX_WCDMA_2100
PWR_DET
GSM_PA_RAMP
GSM_PA_EN
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 172 -
D12(VDDA1) and F12(DAC_REF)
D
E
10%Place near
1
this pin can be grounded as in MSM6275
E
1
D
Near to B18 (VDD_PLL)
PMIC_AUXIN[1]
7
3 9 1 05 6
F
PMIC_AUXIN[2] - PA_THERM
2
B
8-bit, NAND boot
11 12
E
C
10 122
H
w18 (Analog VSS guard ring for CODEC)
MSM pin W18
G
7
0 0 0
6
MODE
( +/- 2500ppm for USB Peripheral )
G
Normal boot
BOOT_MODE3
0
( Default Pull-Down)
9
(CODEC VSS)
5
11
42
84
1
Trusted boot
(VD
D_D
AC
_RE
F)
AA
for VSS_THERMAL
MSM pin AD26
8
G
(CAD : 10uF=>Input MSMA_2.6V)
BOOT_MODE2 BOOT_MODE
10%
If you are not Qfuse (security),
B
C
8 12
B
D
A
B
5
H
E
Native, MSM JTAG
6 9
0 1
10
D
F
1 1
F
11
F
NOR boot HKADC[4] - PCB_Rev_ADC
H
7
HKADC[0] - AMUX_OUTHKADC[1] - VBATT_SENSEHKADC[2] - HDET1
16-bit, NAND boot
43
72
10%
1
G
11
10
9
43
ADC
6
HKADC[3] - REMOTE_ADC
1%
Native, ARM JTAG
MODE2 MODE1 MODE0
Place near
(WCMDA 2100 PAM Enable)
3 5
C
(PLLOUT_TEST)
1
0 1 0
12
1%
2200p cap => place between
H
A
8
PCB_Rev_ADC
USB 48M CLK
X 0HKADC[5] - VBATT_TEMP
C
0.01u0.01uC219 C220C217
1000p
R201
470K
51R
207
C230
VR
EG
_MS
MP
_2.7
V
0.1u
4.7uC239
0.1uC228
C20
4N
A
VREG_MSMA_2.6V
R213
NA
VREG_MSMP_2.7V
0.01uC214
2200pC222
R20
551
K
C2150.1u
0.1u
VREG_MSMP_2.7V
C232
R202
150K
C238 0.1u
1M
R200
100K
R20
6
1000pC226
48MHz13
2
X200ICRT20S48M0X514CR
33nF
C211
C223
0.01u C2160.1u
0.1u
VR
EG
_MS
ME
_1.8
V
VREG_MSMP_2.7V
C23
5
C2310.01u
1u
R210 0
C225
C2210.01u
R20
9N
A
0.01u
VREG_MSMC_1.2V
C213
C23
60.
1u
R211 2K
NA
R20
3
NA
C23
7
R20
451
K
2.2K
R217
L200
100nH
TP
200
R218
2.2K
VREG_MSMA_2.6V
VR
EG
_MS
MP
_2.7
V
0.01u
0.1u
C210
C229
100K
R20
8
1uC234
NA
C20
3
C2120.1u
1000pC218
1000p
0R215
C227C224
C200
1u
VR
EG
_MS
MP
_2.7
V
10p
A24VSS_DIG_9
VSS_PAD1_0F1
VSS_PAD1_1K1
M1VSS_PAD1_2
R1VSS_PAD1_3
U1VSS_PAD1_4
VSS_PAD2_0AF6
AF11VSS_PAD2_1
AF15VSS_PAD2_2
VSS_PAD3_0R26
B17VSS_PAD3_1VSS_PAD3_2
A15
VSS_PAD3_3A9
VREG_MSME_1.8V
VSSA7V26
W16VSSA8
W18VSSA9
VSS_DIGAC23
VSS_DIG_0C1
VSS_DIG_1H1
A14VSS_DIG_10VSS_DIG_11
A11
VSS_DIG_12A5
W1VSS_DIG_2VSS_DIG_3
AC1
VSS_DIG_4AF8
VSS_DIG_5AF16
VSS_DIG_6T26
G26VSS_DIG_7
D26VSS_DIG_8
VS
S7
B25
B26
VS
S8
VS
S9
D4
A18VSSA1
VSSA10W26
VSSA11AB26
AC16VSSA12VSSA13
AC26
AD25VSSA14
AF23VSSA15
AF24VSSA16
VSSA2A21
D13VSSA3
D19VSSA4VSSA5
P26
VSSA6U19
VS
S36
T16 W8
VS
S37
W19
VS
S38
VSS39AA6
A26
VS
S4
AC4VSS41VSS43
AE1
AE2VSS44VSS45
AE25
AE26VSS46
AF1VSS47
AF2VSS48VSS49
AF25
VS
S5
B1
AF26VSS50
B2
VS
S6
M14
VS
S21
VS
S22
M15
N12
VS
S23
VS
S24
N13
N14
VS
S25
VS
S26
N15
P12
VS
S27
VS
S28
P13
P14
VS
S29
VS
S3
A25
P15
VS
S30
R12
VS
S31
VS
S32
R13
R14
VS
S33
VS
S34
R15
T11
VS
S35
VD
D_P
AD
3_3
B9
VD
D_P
AD
4_0
A3
B18
VD
D_P
LL
VS
S1
A1
D23
VS
S10
F6
VS
S11
VS
S12
F21
VS
S13
H8
H19
VS
S14
K10
VS
S15
L11
VS
S16
L16
VS
S17
VS
S18
M11
M12
VS
S19
A2
VS
S2
VS
S20
M13
T25
VD
D_D
IG_6
VD
D_D
IG_7
G25
VD
D_D
IG_8
D25
B24
VD
D_D
IG_9
VD
D_M
DD
IB
21
F2
VD
D_P
AD
1_0
K2
VD
D_P
AD
1_1
VD
D_P
AD
1_2
M2
VD
D_P
AD
1_3
R2
VD
D_P
AD
1_4
U2
AE
6V
DD
_PA
D2_
0A
E11
VD
D_P
AD
2_1
AE
15V
DD
_PA
D2_
2
R25
VD
D_P
AD
3_0
K25
VD
D_P
AD
3_1
VD
D_P
AD
3_2
B15
U25
VD
DA
3V
DD
A4
U26
VD
DA
5Y
26
VD
DA
6A
A26
AE
23V
DD
A7
VD
DA
8A
E24
VD
DA
9A
A16
C2
VD
D_D
IG_0
H2
VD
D_D
IG_1
B14
VD
D_D
IG_1
0B
11V
DD
_DIG
_11
VD
D_D
IG_1
2B
5
VD
D_D
IG_2
W2
VD
D_D
IG_3
AC
2
VD
D_D
IG_4
AE
8
VD
D_D
IG_5
AE
16
U200-2MSM6280_B
AA21NC
C26RESERVED
VD
DA
1D
12
AF
17V
DD
A10
VD
DA
2P
23
R16
VD
D_E
F_U
SE
AE
17W
DO
G_E
N
WDOG_STB_SBCK1_GPIO0H25
U8
WE
1_N
_SD
RA
M1_
WE
_N
WE2_NAF4
XM
EM
1_C
S_N
0W
6
AA1XMEM1_CS_N1_GPIO76
Y4
XM
EM
1_C
S_N
2_S
DR
AM
1_C
S_N
0
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77Y6
XM
EM
1_H
WA
IT_N
AA
2X
ME
M1_
LW
AIT
_N_S
DR
AM
1_C
AS
_NK
8
XMEM2_CS_N0W14
XMEM2_CS_N1AC15
XMEM2_CS_N2_GPIO35W15
AA15XMEM2_CS_N3_GPIO36
G6
UA
RT
2_C
TS
_N_G
PIO
90
H6UART2_DP_RX_DATA_GPIO89
UA
RT
2_D
P_T
X_D
AT
A_G
PIO
88E
4
UA
RT
2_R
FR
_N_G
PIO
91F
4
L23
UA
RT
3_C
TS
_N_G
PIO
86M
21U
AR
T3_
DP
_RX
_DA
TA
_GP
IO85
UA
RT
3_D
P_T
X_D
AT
A_G
PIO
84M
19
L25UART3_RFR_N_GPIO87
UB
1_N
_SD
RA
M1_
DQ
M1
M6
UB2_NAF10
US
B_D
AT
_VP
N26
N25
US
B_O
E_T
P_N
USB_RX_DATA_GPIO29N19
US
B_S
E0_
VM
N23
US
B_X
TA
L48
_IN
A10
B10
US
B_X
TA
L48
_OU
T
SY
NT
H1_
GP
IO41
H23
B6SYNTH2_GPIO65
TCKD16
TC
XO
D18
TCXO_EN_GPIO94F19
TDID15
TDOA17
TMSF15
TRK_LO_ADJL13
H15TRST_N
H13TX_AGC_ADJ
TX_ON_GRFC10H12
P16
UA
RT
1_C
TS
_N_G
PIO
97U
AR
T1_
DP
_RX
_DA
TA
_GP
IO96
M23
UA
RT
1_D
P_T
X_D
AT
A_G
PIO
95L
26
P21
UA
RT
1_R
FR
_N_P
A_P
OW
ER
_CT
L_M
_GP
IO98
K6SDRAM1_D11
J1SDRAM1_D12SDRAM1_D13
K4
L8SDRAM1_D14SDRAM1_D15
L6
SDRAM1_D2AB2
D1SDRAM1_D3
AB4SDRAM1_D4
J6SDRAM1_D5
G2SDRAM1_D6SDRAM1_D7
H4
P4SDRAM1_D8SDRAM1_D9
J4
A16
SL
EE
P_X
TA
L_I
NB
16S
LE
EP
_XT
AL
_OU
T
F18SYNTH0_GP_PDM0_GPIO92
RIN
GE
R_G
PIO
18L
19
G1
RO
M1_
AD
V_N
_SD
RA
M1_
RA
S_N
AB
1R
OM
1_C
LK
_SD
RA
M1_
CL
K
RTCKH16
L21
SB
CK
J23
SB
DT
F26SBDT1_GPIO1
H26
SB
ST
SBST1_GPIO93H18
SDCC_DAT1_GPIO99F25
M25SDCC_DAT2_GPIO100SDCC_DAT3_GPIO101
M26
N4
SD
RA
M1_
CL
K_E
N
E2SDRAM1_D0
D2SDRAM1_D1
J2SDRAM1_D10
T21
MO
DE
2
T14NAND2_FLASH_READY_GPIO33
OE
1_N
V2
AF7OE2_N
PA_ON0F17
PA_ON1_GPIO2H11
P25
PA
_PO
WE
R_C
TL
AA25Q_IM_CH0
Q_IM_CH1W23
Y25Q_IP_CH0
Q_IP_CH1V23
B12Q_OUT
A12Q_OUT_N
RE
SIN
_NF
13
RE
SO
UT
_NF
11
AA
4R
ES
OU
T_N
_EB
I1
MD
DIH
_DA
TN
B19
B20
MD
DIH
_DA
TP
MD
DIH
_ST
BN
A19
A20
MD
DIH
_ST
BP
MDP_VSYNC_PRIMARY_GPIO105AD2
AE3MDP_VSYNC_SECONDA_GPIO104
MIC
1NA
F20
MIC
1PA
E20
AF
21M
IC2N
AF
22M
IC2P
MIC
BIA
ST
15
M16
MM
C_C
LK
_SD
CC
_CL
K_G
PIO
31
MM
C_C
MD
_GP
IO30
H14
L14
MM
C_D
AT
A_S
DC
C_D
AT
0_G
PIO
32
MO
DE
0Y
23M
OD
E1
U23
KE
YS
EN
SE
3_N
_GP
IO47
R23
U21
KE
YS
EN
SE
4_N
_GP
IO48
LB
1_N
_SD
RA
M1_
DQ
M0
L2
LB2_N_A2_0AE10
LCD_CS_N_GPIO38AF14
AE13LCD_EN_GPIO37
LIN
E_L
_IN
AC
21
AC
22L
INE
_L_I
P
AC
18L
INE
_ON
LIN
E_O
PA
C17
AC
20L
INE
_R_I
NL
INE
_R_I
PA
C19
MDDIC_DATNA23
A22MDDIC_DATP
MDDIC_STBNB23
MDDIC_STBPB22
Y21
HK
AIN
4H
KA
IN5
AB
23
HP
H_L
W17
AA
17H
PH
_R
HP
H_V
RE
FA
A19
N16
I2C
_SC
L_G
PIO
27
K21
I2C
_SD
A_G
PIO
26
AB25I_IM_CH0
V25I_IM_CH1
AC25I_IP_CH0
I_IP_CH1W25
I_OUTB13
I_OUT_NA13
R21
KE
YS
EN
SE
0_N
_GP
IO62
KE
YS
EN
SE
1_N
_GP
IO63
P19
KE
YS
EN
SE
2_N
_GP
IO46
D14
D17GP_PDM2_PA_RAN_GE1
B8GRFC0_GPIO3
A8GRFC1_AUX_SBDT_GPIO4
D9GRFC2_GPIO5GRFC3_GPIO6
F10GRFC4_AUX_SBCK_GPIO7
H10
D11GRFC5_AUX_SBST_GPIO8
GRFC7_GPIO10T23
B4GRFC8_GPIO11
D5GRFC9_GPIO12
GRFX6_GPIO9T19
GS
M_P
A_D
AC
_RE
FA
D26
HK
AIN
0V
21
HK
AIN
1A
A23
W21
HK
AIN
2H
KA
IN3
V19
F9
GP
IO49
GP
IO50
B7
GP
IO51
A7
GP
IO52
D10
L12
GP
IO53
F14
GP
IO64
F8GPIO66
GPIO_67U6
V4GPIO_68GPIO_69
R11GPIO_70
E1
Y1GPIO_71GPIO_72
Y2GPIO_73
V6
W4GPIO_74
GP_PDM1_PA_RAN_GE0H17
D2_6AF5
D2_7AC7
D2_8AA8
D2_9W9
F12DAC_REF
EA
R1O
NA
E18
EA
R1O
PA
F18
GP
IO17
K26
G21
GP
IO19
A6GPIO28
GP
IO39
F7
GP
IO40
D6
D7
GP
IO42
H9GPIO43
GP
IO44
D8
A4
GP
IO45
CA
MIF
_HS
YN
C_G
PIO
15E
23
CA
MIF
_PC
LK
_GP
IO82
K23
CA
MIF
_VS
YN
C_G
PIO
16B
3
CC
OM
PA
A20
D2_0AC5
AF3D2_1
AC8D2_10
AE7D2_11D2_12
AA9
W10D2_13D2_14
AC9D2_15
AA10
D2_2AE4
AC6D2_3
AE5D2_4
AA7D2_5
R19BT_DATA_GPIO20
E26BT_SBCK_GPIO23BT_SBDT_GPIO22
E25
F23BT_SBST_GPIO24
BT_TX_RX_N_GPIO21H21
CAMCLK_PO_GP_MN_GPIO13J21
CA
MIF
_DA
TA
0_G
PIO
83J2
5
J26
CA
MIF
_DA
TA
1_G
PIO
81
CA
MIF
_DA
TA
2_A
UX
_TR
ST
_N_G
PIO
54D
21C
AM
IF_D
AT
A3_
AU
X_T
CK
_GP
IO55
C25
CA
MIF
_DA
TA
4_A
UX
_TM
S_G
PIO
56D
22J19
CA
MIF
_DA
TA
5_A
UX
_TD
I_G
PIO
57C
AM
IF_D
AT
A6_
AU
X_T
DO
_GP
IO58
L15
CA
MIF
_DA
TA
7_G
PIO
59D
20
F16
CA
MIF
_DA
TA
8_G
PIO
60
F20
CA
MIF
_DA
TA
9_G
PIO
61
AA11A2_5A2_6
AC11
T12A2_7
W12A2_8A2_9
AA12
AF
19A
UX
INA
E19
AU
XIP
AU
XO
UT
AA
18
AUX_PCM_CLK_GRFC14_GPIO80K19
N21AUX_PCM_DIN_GRFC13_GPIO14
G4AUX_PCM_DOUT_GRFC12_GPIO103AUX_PCM_SYNC_GRFC11_GPIO102
J8
AE
21B
OO
T_M
OD
EB
OO
T_M
OD
E2
AE
22
AD
1B
OO
T_M
OD
E3
G23BT_CLK_GPIO25
N1
A1_
9
AE9A2_1
AC12A2_10A2_11
AE12A2_12
AF12
AA13A2_13A2_14
AC13A2_15
W13A2_16
AE14
AC14A2_17A2_18
T13A2_19
AA14
AF9A2_2
AF13A2_20_GPIO34
A2_3W11
AC10A2_4
T1A1_17A1_18
T2
R8A1_19
L4
A1_
2
T4A1_20A1_21
T6
T8A1_22
U4
A1_
23_S
DR
AM
1_D
QM
2_G
PIO
78
V1
A1_
24_G
PIO
79
V8
A1_
25_S
DR
AM
1_D
QM
3_G
PIO
75
M8
A1_
3M
4A
1_4
A1_
5N
11
N8
A1_
6A
1_7
N6
A1_
8N
2
MSM6280_A
L1
A1_
1
P1
A1_
10A
1_11
P2
A1_
12P
6
P8
A1_
13A
1_14
P11
R4A1_15A1_16
R6
C23310u
U200-1
VG
A_C
AM
_PW
R_E
N
MMP_INT_N
HP
_RH
P_L
MMP_LCD_BYPASS_CS_N
RMT_INT
RM
T_A
DC
WH
EE
L_S
W_R
WH
EE
L_S
W_L
CAM_MCLK
LCD_RESET_N
VGA_CAM_RESET_N
CAM_SELECT_N
MICROSD_DETECT
UA
RT
_TX
DU
AR
T_R
XD
VGA_CAM_PWDN
BT_DATA
BT_SBDTBT_SBCKBT_SBST
BT_TX_RX_N
BT_CLK
TO
UC
H_I
2C_S
CL
TO
UC
H_P
EN
IRQ
_N
MMP_HPCM_FSYNC
LCD_LDO_EN
MMP_HPCM_DIMMP_HPCM_CLK
MM
P_R
ES
ET
_IN
_N
MMP_PWR_EN
CO
DE
C_I
2C_S
CL
CO
DE
C_I
2C_S
DA
WM
_EN
MMP_HPCM_DO
RX_IMRX_IP
RX_QMRX_QP
DAC_REF
PA_ONTCXO_EN
TRK_LO_ADJTX_AGC_ADJ
LIN_INVERTER
HOOK_SENSE_N
LCD_VSYNC_OUT
LCD_IF_MODE
EBI2_ADDR[13]EBI2_ADDR[14]
EBI2_ADDR[12]EBI2_ADDR[11]
EA
R_S
EN
SE
_N
LCD_MAKER_ID
TO
UC
H_I
2C_S
DA
MSM_MICROSD_DATA[3]MSM_MICROSD_DATA[2]MSM_MICROSD_DATA[1]
CAM_MODE1_N
CAM_MODE3_N
CA
M_M
OD
E2_
N
MM
C_S
EL
EC
T_N
HP_AMP_EN
US
B_X
TA
L_O
UT
RE
SO
UT
_NR
ES
ET
_IN
_N
MIC
1PM
IC1N
MIC
2P
AM
UX
_OU
T
VB
AT
_TE
MP
VB
AT
_SE
NS
E
RC
V+
RC
V-
MIC
BIA
S
SP
K_L
SP
K_R
TX_QM
TX_IM
GSM_PA_EN
TX_QP
TX_IP
ANT_SEL2
GSM_PA_BAND
FM_INTX
TX_ON
PA_R1
ANT_SEL0ANT_SEL1
LIN
_PW
M_F
RE
Q
GS
M_P
A_P
WR
_CT
L_R
EF
GS
M_P
A_R
AM
P
SDRAM_ADDR[0:14]
SD
RA
M_A
DD
R[0
]S
DR
AM
_AD
DR
[1]
SD
RA
M_A
DD
R[2
]S
DR
AM
_AD
DR
[3]
SD
RA
M_A
DD
R[4
]S
DR
AM
_AD
DR
[5]
SD
RA
M_A
DD
R[6
]S
DR
AM
_AD
DR
[7]
SD
RA
M_A
DD
R[8
]S
DR
AM
_AD
DR
[9]
SD
RA
M_A
DD
R[1
0]S
DR
AM
_AD
DR
[11]
SD
RA
M_A
DD
R[1
2]S
DR
AM
_AD
DR
[13]
SD
RA
M_A
DD
R[1
4]
SD
RA
M_C
LK
SD
RA
M_R
AS
_NS
DR
AM
_CL
K_E
N
SD
RA
M_C
AS
_N
SD
RA
M_D
QM
[0]
SD
RA
M_D
QM
[1]
SD
RA
M_D
QM
[2]
SD
RA
M_W
E_N
SD
RA
M_D
QM
[3]
SD
RA
M_C
S_N
US
B_X
TA
L_I
N
SL
EE
P_C
LK
BU
FF
_TC
XO
US
IM_D
AT
A
KE
Y_C
OL
[1]
PM
_IN
T_N
PS
_HO
LD
US
IM_C
LK
US
IM_R
ST
_N
KE
Y_C
OL
[0]
SS
BD
T_R
TR
I2C
_SC
LI2
C_S
DA
SS
BD
T_P
M
US
B_S
E0
US
B_D
AT
KE
Y_R
OW
[2]
KE
Y_R
OW
[1]
KE
Y_R
OW
[0]
US
B_O
E_N
MS
M_M
ICR
OS
D_C
MD
MS
M_M
ICR
OS
D_D
AT
A[0
]M
SM
_MIC
RO
SD
_CL
K
MM
P_C
AM
_DA
TA
[6]
MM
P_C
AM
_DA
TA
[2]
MM
P_C
AM
_VS
YN
C
MM
P_C
AM
_DA
TA
[4]
MM
P_C
AM
_DA
TA
[1]
LC
D_B
L_C
TR
L
MM
P_C
AM
_DA
TA
[7]
MM
P_C
AM
_DA
TA
[5]
MM
P_C
AM
_DA
TA
[0]
MM
P_C
AM
_PC
LK
MM
P_C
AM
_HS
YN
C
MM
P_C
AM
_DA
TA
[3]
SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]SDRAM_DATA[0]
EBI2_DATA[0:15]
EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]
NAND_ALENAND_READY
NAND_CLE
EBI2_WE_NEBI2_OE_N
NAND_CS_N
MMP_CS_N
USB_XTAL_OUT
USB_XTAL_IN
DAC_REF
FM_BUSEN
USB_SELECT_N
LIN_PWM_MAG
LIN_MOTOR_EN
SDRAM_DATA[0:31]
SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]SDRAM_DATA[18]SDRAM_DATA[17]SDRAM_DATA[16]SDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]SDRAM_DATA[9]SDRAM_DATA[8]
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 173 -
4
LCD BACKLIGHT CHARGE PUMP
8
E
G
3.4K
7
H
5
F
H
12
9
LCD INTERFACE
6
G
12
C
3 4
A
117 9
10
1 8
F
H
3
E
1 119
SWITCH FOR USB2.0
7
D
8
E
10
D
F
1 2
OTP Program Pin
392ohm 1%
3
A
72
10
B
G
B
1 6
D
F
2
ENBY0036001
LCD connector change : 35pin ZIF -> 40pin BTB
6 11
5
9
C
27Mhz XTAL
3 4
A
1%
12
LCD LDO
5
12
8
D
1.0T, Socket
C
2
A
E
H
5 11
G
150mA
64
B
GB042-40S-H10-E3000
B
C
10
C3100.1u
330pC335
7INOUT_B3
INOUT_B46
0R
308
FL301 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
+VPWR
C3130.1u
R327 NA
C328
1u
100K
R33
6
7C2+
8C2-
D11112
D2D3
13
D414
D51
D62
3EN_SET
GND10
IN9
6OUTCP
15PGND
U301 AAT3169IFO-T14
C1+
C1-5
MM
P_V
DD
_1.9
V
C32
222
p
R333 NA
C32
322
p
10K
R31
9
VREG_MSMP_2.7V
LCD_VDD_2.8V
FB
301
1u
1KR
321
C31
7
0.1u
M9VIDP
VMCLKP12P10
VPCLK
VVSK12
H14
XT
AL
IN
XT
AL
OU
TJ1
4
MM
P_V
DD
_US
B_3
.3V
C306
M12VHREF
P8VIDA
N8VIDB
P9VIDCVIDD
M10N10
VIDEN9
VIDFVIDG
N11
VIDHP11N12
VIDIN7
VIDJVIDK
L8P13
VIDLL9
VIDMVIDN
N13
VIDOM11
VD
DC
OR
E1
D8
VD
DC
OR
E2
F4
VD
DC
OR
E3
J11
VD
DC
OR
E4
L7
VD
DQ
1L
6V
DD
Q2
D7
VD
D_C
ISM
8
VD
D_G
EN
ER
AL
H4
D9
VD
D_H
OS
T
D6
VD
D_L
CD
G2
VD
D_M
MC
K10
VD
D_N
AN
D
D10
VD
D_P
MU
G4
VD
D_S
ER
IAL
E13
VE
NB
YP
INV
EN
BY
PO
UT
E11
E12
TD
I
D13
TD
O
F14
TE
ST
E14
TM
SD
14T
RS
TN
TVDATAG14
TVREFF13
UARTCTSL1
UARTRTSM1
UARTRXN3
UARTTXM4
UDNP4P3
UDP
P6UID
URSETM7
J4UVBUS
NWENK13
RE
SE
TN
G13
SCLN14
SCLKG1H2
SCMD
SDAP14
SDAT0F1
SDAT1F2
SDAT2E5F3
SDAT3
SPICLKN2K3
SPICS
SPIDIJ3
SPIDOL2
G3SWP
D11
TC
K
E3LVS
C4LWRN
NALEM13L12
NCLE
NCSNL13
L14ND0
L10ND1
ND15K11
ND2J12H12
ND3ND4
K14G12
ND5J13
ND6H13
ND7
NRBNM14
NRENL11
LD12C1
LD13C2C5
LD14LD15
C6D3
LD16LD17
D1
B6LD2LD3
B4
LD4A4C3
LD5A3
LD6LD7
A2A1
LD8LD9
B2
E4LHS
LRDND5
HGINTNA7
HPCMCLKH3
HPCMDIJ1J2
HPCMDO
H1HPCMFS
B7HRDNHWRN
B9
D4LA0
LACTE2
LCKE1
A6LCS0NLCS1N
D2
LD0B5A5
LD1
LD10B1B3
LD11
HD0D12
HD1C10
B12HD10
A12HD11HD12
B11A11
HD13HD14
C9B10
HD15
HD2C12C13
HD3C14
HD4HD5
B14
HD6C11B13
HD7A14
HD8HD9
A13
GPIO0P2M3
GPIO1GPIO2
P7N1
GPIO3GPIO4
P1
GPIO5M5N6
GPIO6GPIO7
M6P5
GPIO8N5
GPIO9
A10HA11HA12
A9C8
HA13C7
HA14
HCS0NB8
HCS1NA8
F6
GN
D1
GN
D10
H7
GN
D11
H8
GN
D12
H9
GN
D13
J6 J7G
ND
14J8
GN
D15
GN
D16
J9F7
GN
D2
F8
GN
D3
GN
D4
F9
GN
D5
G6
G7
GN
D6
GN
D7
G8
G9
GN
D8
H6
GN
D9
ABCLKM2
ADIL3K1
ADOAFS
K2
L5
AG
ND
_US
BC
K5
AG
ND
_US
BT
F12
AG
ND
_VD
AC
AMCLKN4
AV
DD
_PL
LE
10
L4
AV
DD
_US
BC
AV
DD
_US
BT
K4
H11
AV
DD
_VD
AC
IG
11A
VD
D_V
DA
CP
AV
SS
_PL
LF
11
10p
U302ZR3453
22p
C315
C331
R315 51
C31
60.
1u
100K
100K
R32
0
R34
5
X300FA-238_27MHz_9PF
1 2
34
CA
M_V
DD
_IO
_2.7
V
27MHz
C31
80.
1u
0.1uC314
22p
C304
+VPWR
C32
5
0.1u
R329
33
1uC337
C329
1u
VA300
ICVN0505X150FR
0R
300
2526272829
CA
M_V
DD
_IO
_2.7
V
9
21
30313233343536373839
22
40
2324
1213141516171819
2
20
345678
CN3001
1011
VA301
R34
0
3.3K
CAM_VDD_IO_2.7V
10pC311
TP303
C3398p
CA
M_V
DD
_IO
_2.7
V
51R314
R33
9
390
NA
VREG_MMC_3.0V
C320
C3331u
C327
1u
1uTP302
LCD_VDD_2.8V
C330
VR
EG
_MM
C_3
.0V
C32622p
C30710p
C3050.1u
10K
R310
U304
D+3
D-5
GND4
1HSD1+
7HSD1-
2HSD2+
HSD2-6
SEL10
9VCC
8_OE
0.1u
FSUSB30UMX
C312
1u
MMP_VDD_1.9V
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
MMP_VDD_CORE_1.0V
C338
ICVE10184E150R500FRFL303
5G
110
R311 0
TP301
NAR313
CA
M_V
DD
_IO
_2.7
V
51R316
330pC334
R318 0
10u
100K
TP300
C308
R33
1
R312 33
0.1u
VREG_MSMP_2.7V
C303
FB
300
0.01uC336
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
VR
EG
_US
B_3
.3V
BGND6
GND2
5SEL
1STBY
3VIN
4VOUT
ICVE10184E150R500FRFL300
U300 BH28PB1WHFV
NA
R309
51R317
VR
EG
_MS
MP
_2.7
V
1 3VOUT
+VPWR
R1114D191D-TR-FU303
CE6
2GND1
5GND2
4NC
VDD
LCD
_VD
D_2
.8V
R33
8
75
0R325
MMP_VDD_1.9V
VREG_USB_3.3V
R335 0
0R326
22p
C32
4
0
C301
R30
1
0.1u
0.1u
R324 0
C321
10uC300
8pC340
6
R32
21K
FL302 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
1u
C332
10uC309
MM
P_V
DD
_CO
RE
_1.0
V
C3020.1u
2.2uH
L300
1u
LCD_VDD_2.8V
MM
P_R
ES
ET
_IN
_N
MMP_HPCM_DI
MMP_HPCM_CLKMMP_HPCM_FSYNC
MMP_HPCM_DO
MMP_A_MCLK
WLED_1
MMP_CAM_INT
MMP_STROBE_READY
MMP_PWR_EN
C31
9
USB_SELECT_N
MMP_CS_N
LCD_VSYNC_OUT
MMP_CAM_MCLK
MMP_LCD_CS_N
MMP_LCD_ADS
MMP_LCD_RD_NMMP_LCD_WE_N
LCD_MAKER_ID
WLED_2WLED_3WLED_4WLED_5
LCD_BL_CTRL
WLED_PWR+VPWR
LCD_LDO_EN
MMP_LCD_WE_NMMP_LCD_VSYNC_OUT
WLED_PWR
WLED_2
WLED_4WLED_5
MMP_INT_N
MMP_I2C_SDAMMP_I2C_SCL
MMP_STROBE_CHARGE
MMP_CAM_HSYNC
MMP_ADI_ADCDATMMP_ADO_DACDAT
MMP_A_BCLKMMP_A_LRCLK
MMP_LCD_VSYNC_INMMP_LCD_VSYNC_OUT
MMP_LCD_VSYNC_INMMP_LCD_BYPASS_CS_N
MICROSD_DETECT
MSM_USB_D-
MMP_USB_D-
USB_D+
USB_D-
MSM_USB_D+
MMP_USB_D+
TV_OUT
MMP_CAM_RESET_N
MMP_LCD_DATA[15]
NAND_ALE
MMP_CAM_PCLKLCD_IF_MODE
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[14]LCD_DATA[15]
LCD_DATA[8]LCD_DATA[9]
LCD_DATA[10]LCD_DATA[11]LCD_DATA[12]LCD_DATA[13]
WLED_1
WLED_3
MMP_LCD_ADSMMP_LCD_CS_NLCD_RESET_NMMP_LCD_RD_N
MMP_LCD_DATA[9]MMP_LCD_DATA[10]MMP_LCD_DATA[11]
MMP_LCD_DATA[12]MMP_LCD_DATA[13]MMP_LCD_DATA[14]MMP_LCD_DATA[15]
MMP_CAM_VSYNC
MMP_CAM_DATA[7]MMP_CAM_DATA[6]MMP_CAM_DATA[5]MMP_CAM_DATA[4]MMP_CAM_DATA[3]MMP_CAM_DATA[2]MMP_CAM_DATA[1]MMP_CAM_DATA[0]
MMP_CAM_PWR_EN
MMP_MICROSD_CLK
MMP_MICROSD_DATA[3]MMP_MICROSD_DATA[2]MMP_MICROSD_DATA[1]MMP_MICROSD_DATA[0]
MMP_XTAL_IN
MMP_XTAL_OUT
MM
P_X
TA
L_I
N
MM
P_X
TA
L_O
UT
MMP_USB_D+MMP_USB_D-
VREG_5V
LCD_DATA[12]LCD_DATA[13]LCD_DATA[14]LCD_DATA[15]
EBI2_ADDR[11]
EBI2_ADDR[13]EBI2_ADDR[14]
MMP_MICROSD_CMD
MMP_LCD_DATA[0]MMP_LCD_DATA[1]MMP_LCD_DATA[2]MMP_LCD_DATA[3]MMP_LCD_DATA[4]MMP_LCD_DATA[5]MMP_LCD_DATA[6]MMP_LCD_DATA[7]MMP_LCD_DATA[8]MMP_LCD_DATA[9]MMP_LCD_DATA[10]MMP_LCD_DATA[11]MMP_LCD_DATA[12]MMP_LCD_DATA[13]MMP_LCD_DATA[14]
MMP_LCD_DATA[0]MMP_LCD_DATA[1]MMP_LCD_DATA[2]MMP_LCD_DATA[3]
MMP_LCD_DATA[4]MMP_LCD_DATA[5]MMP_LCD_DATA[6]MMP_LCD_DATA[7]
MMP_LCD_DATA[8]
EBI2_DATA[0:15]
EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]
EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]
EBI2_ADDR[12]
EBI2_OE_NEBI2_WE_N
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]
LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[8]LCD_DATA[9]LCD_DATA[10]LCD_DATA[11]
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 174 -
2
12
8
9
B
6
7
H
1
F
11
2
E
F F
1
E
6
H
A
F
7 1110
95 6
D
93
MEMORY (2Gbit 70n NAND FLASH + 1Gbit SDRAM)
D
5 11
3
GG G
B
5
D
2
C
32
41
6
E
G
A
H
12
4
8 129
A
B
C
3
MICRO SD SELECT MSM AND MMP
H
E
8
1
4
A
7
USIM
B
8
7
10
10
C
4 11
5
10
D
C
12
C40
80.
1u
0.1u
C40
5
C411
0.1u
_WPL6
1uC402
F7VSS2
G2VSS3
G13VSS4
L13VSS5
P2VSS6VSS7
P13R8
VSS8VSS9
U2
E6_CAS
_CEM9
E5_CS1_CS2
D7
D5_RAS
M10_RE
D6_WED
K6_WEN
NC
98T
3
NC
99T
7
M2RY__BY
C7VCCD1VCCD2
D2
VCCD3D13V3
VCCD4VCCD5
V8
VCCD6V12
K12VCCN2
VCCQD1V4V9
VCCQD2
C6VSS1
VSS10U6
VSS11U10U13
VSS12
NC
83N
3
NC
84N
4N
5N
C85
N6
NC
86N
C87
N9
N10
NC
88N
11N
C89
B1NC9
NC
90N
12N
13N
C91
NC
92P
7P
8N
C93
NC
94R
2R
7N
C95
NC
96R
9T
2N
C97
K5NC69
A13NC7
NC70K10K11
NC71NC72
K13K14
NC73L1
NC74NC75
L2
NC76L3L4
NC77NC78
L5L14
NC79
A14NC8
NC80M5M6
NC81NC82
N2
NC
54H
5H
6N
C55
NC
56J2 J3
NC
57J4
NC
58N
C59
J5
NC6A12
NC
60J6 J10
NC
61N
C62
J11
J12NC63NC64
J13
NC65K1K2
NC66K3
NC67NC68
K4
A4NC4
F11
NC
40N
C41
F12
F13
NC
42G
3N
C43
G4
NC
44G
5N
C45
NC
46G
6G
7N
C47
NC
48G
8G
9N
C49
A11NC5
NC
50G
10 H2
NC
51N
C52
H3
H4
NC
53
E7
NC
25N
C26
E8
E9
NC
27N
C28
E10
E11
NC
29
NC3A3
NC
30E
12E
13N
C31
NC
32F
2F
3N
C33
NC
34F
4F
5N
C35
NC
36F
6
NC
37F
8F
9N
C38
NC
39F
10
Y12
NC
121
NC
122
Y13
Y14
NC
123
B11NC13
B12NC14NC15
B13B14
NC16NC17
C1C2
NC18C5
NC19
A2NC2
C13NC20
C14NC21
D1
NC
22N
C23
D14 E1
NC
24
NC
107
V14
W1
NC
108
W2
NC
109
B3NC11
NC
110
W3
W4
NC
111
NC
112
W11
W12
NC
113
NC
114
W13
W14
NC
115
NC
116
Y1
Y2
NC
117
Y3
NC
118
Y4
NC
119
B4NC12
NC
120
Y11
L10IO3
L12IO4
J9IO5
H12IO6
H10IO7IO8
G12
IO9M12
A1NC1
B2NC10
T13
NC
100
U1
NC
101
NC
102
U3
U14
NC
103
V1
NC
104
NC
105
V2
NC
106
V13
U7DQ7DQ8
T9T10
DQ9
U8DQM0DQM1
T8V7
DQM2U9
DQM3
M11IO1
IO10L9
IO11L11
IO12K9
H13IO13IO14
H11
IO15H9
IO16G11
M13IO2
P5DQ20DQ21
R5
DQ22P6R6
DQ23P9
DQ24P10
DQ25DQ26
R10
DQ27P11
DQ28R11P12
DQ29
V5DQ3
DQ30R12R13
DQ31
DQ4U5
DQ5T6V6
DQ6
D8CKE
M4CLE
C8CLK
DQ0U4
DQ1T4
DQ10V10T11
DQ11DQ12
U11V11
DQ13DQ14
T12U12
DQ15DQ16
P3
DQ17R3
DQ18P4R4
DQ19
DQ2T5
C3A0
D3A1
E4A10
D9A11A12
C9
E3A2
E2A3
D12A4
C12A5
D11A6
C11A7
D10A8
C10A9
M3ALE
C4BA0
D4BA1
TYA000BC00HOGG
U402
R402
100K
1NC1
NC25
NC39
13NC4
15NO1
3NO2
NO37
NO411
17PGND
V+14
U401 MAX4701ETE+T16
COM1
COM24
8COM3
COM412
GND6
2IN1_IN2
10IN3_IN4
33pC401
10K
R403
0.01uC412
C40
60.
1u
VREG_USIM_3.0V
VREG_MSMP_2.7V
C410
0.01u
C4130.01u
C40033p
0.1u
C40
7
GND3910
GND4
0.1u
C40
9
J4001
C12
C2C3
3
4C5C6
5
C76
GND178
GND2
0.1u
C40
4
R401
100K
+VPWR
0R404
VREG_MSMP_2.7V
VREG_USIM_3.0V
+VPWR
2NO1
10NO2VCC
1
SLAS4717EPMTR2GU400
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
0.1u
15KR400
VREG_MSME_1.8V
C40
3
1
2
34
5
6
D400
PLR0504F
MSM_MICROSD_DATA[0]
MMP_MICROSD_DATA[0]
MSM_MICROSD_DATA[1]
MMP_MICROSD_DATA[1]
MSM_MICROSD_DATA[2]
MMP_MICROSD_DATA[2]MICROSD_DATA[2]
USIM_P_RST_N
USIM_P_DATA USIM_P_CLK
MSM_MICROSD_CLK
MSM_MICROSD_CMD
NAND_READY
RESOUT_N
MMP_MICROSD_DATA[3]
MSM_MICROSD_DATA[3]
USIM_P_DATA
USIM_P_RST_NUSIM_P_CLK
SDRAM_CLK
SDRAM_WE_N
SDRAM_ADDR[14]SDRAM_ADDR[13]SDRAM_CLK_EN
NAND_CLENAND_ALE
NAND_CS_NEBI2_OE_N
EBI2_DATA[8]EBI2_DATA[9]EBI2_DATA[10]EBI2_DATA[11]EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
MMC_SELECT_N
MMP_MICROSD_CMD
MICROSD_CLK
MICROSD_CMD
MMP_MICROSD_CLK
MMC_SELECT_N
MICROSD_DATA[3]
MICROSD_DATA[1]
MICROSD_DATA[0]
SDRAM_DATA[26]SDRAM_DATA[27]
SDRAM_DATA[29]SDRAM_DATA[30]SDRAM_DATA[31]
SDRAM_DATA[16]SDRAM_DATA[17]
SDRAM_DATA[22]
SDRAM_DATA[18]SDRAM_DATA[19]
SDRAM_DATA[23]
SDRAM_DATA[20]SDRAM_DATA[21]
SDRAM_DATA[0:31]
SDRAM_ADDR[1]SDRAM_ADDR[2]
SDRAM_ADDR[4]SDRAM_ADDR[3]
SDRAM_ADDR[9]
SDRAM_ADDR[5]
SDRAM_ADDR[8]SDRAM_ADDR[7]SDRAM_ADDR[6]
SDRAM_ADDR[10]SDRAM_ADDR[11]SDRAM_ADDR[12]
SDRAM_ADDR[0]
SDRAM_ADDR[0:12]
SDRAM_CS_N
EBI2_WE_N
SDRAM_CAS_N
SDRAM_RAS_N
SDRAM_DQM[0]SDRAM_DQM[1]SDRAM_DQM[2]SDRAM_DQM[3]
EBI2_DATA[0:15]EBI2_DATA[0]EBI2_DATA[1]EBI2_DATA[2]EBI2_DATA[3]EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]
SDRAM_DATA[1]SDRAM_DATA[0]
SDRAM_DATA[6]
SDRAM_DATA[2]
SDRAM_DATA[8]SDRAM_DATA[7]
SDRAM_DATA[3]
SDRAM_DATA[12]
SDRAM_DATA[10]SDRAM_DATA[9]
SDRAM_DATA[5]SDRAM_DATA[4]
SDRAM_DATA[13]
SDRAM_DATA[11]
SDRAM_DATA[15]SDRAM_DATA[14]
SDRAM_DATA[24]SDRAM_DATA[25]
SDRAM_DATA[28]
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 175 -
8
C
A
VDD_MAIN : 0.1uF
109
4
8
H
B
1
USB/REMOCON_SEL
PMIC
10
CHARGINGVSW_5V : 4.7uF
6
1608
F
4
H
7
A
VDD_RUIM : 0.1uF
MMI 18Pin CONNECTOR
E
1608
VDD_MSMC : 4.7uF
Rev. 1.0
12
9
1608
11
1608
VDD_WLAN : 0.1uF
A
VDD_ANA : 0.1uF
--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
OVP
D
10
10
7
F
E
G
D
4
1608
H
651
Rev. 1.1
7
11
2012
113
G
12
3
G
1608
HEADPHONE AMP
E
2
VDD_MSM : 0.1uF
3 5
1608
8
2 7
A
8
3
F
C
VDD_MSME : 4.7uF
PMIC VPWR BYPASS
21
4
G
AUDIO DAC/ADC, AMP etc. (WM8983)
PQ
PQ
11
E
1
(1%)
9
H
F
B
CAM/HP MIC SEL
1608
1212
VDD_PA : 4.7uF
2
Power Line --> Route carefully!!!!!
MIC
9
Draw the Artwork_line thickly !!!!!
U505NUS3065MUTAG
CNTRL3
4DRAIN
DRAIN_THERMAL9
GATE6
2GND
IN1
7OUT
5SRC
8VCC
2.2u
C51
1
R524
68
EV
LC
14S
0205
0
C50
4
+VPWR
VA
505
SVSS16
_SH
DN
4.7u
C1N4
2C1P
INL
+15
INL
_14
7IN
R+
INR
_8
OUTL12
OUTR103
PGND
PVDD1
5P
VS
S
P_G
17
SG
ND
6
13S
VD
D1
9SVDD2
11U504
MAX9722BETE
R520 0
VREG_MSMP_2.7V
0.1
R50
4
FB501
4.7uC565
R505
VREG_MSMC_1.2V
470K
10u
FB500
C555
C5771u
RB
521S
-30
D50
1
80R
EF
_OU
T(M
PP
8)
VR
EG
_SY
NT
81A
MU
X_O
UT
82V
DD
_MA
IN83
VR
EG
_TC
XO
84G
ND
_SL
UG
85
PON_RESET_N9
VR
EG
_RF
TX
7374S
PK
R_B
YP
75S
PK
R_O
UT
_P
SP
KR
_IN
_P76
VD
D_S
PK
R77
SP
KR
_IN
_M78
SP
KR
_OU
T_M
79
FLSH_DRV_N8
CB
L1P
WR
_N(M
PP
4)66
VR
EG
_RF
RX
267
CB
L0P
WR
_N(M
PP
3)6869
VR
EG
_RF
RX
1
BAT_FET_N7
AM
UX
_IN
1(M
PP
1)70
VD
D_R
F71
AM
UX
_IN
2(M
PP
2)72
MSM_INT_N59
VBAT6
VCOIN60
61REF_ISET
REF_GND62
REF_BYP63V
RE
G_W
LA
N64
VD
D_W
LA
N65
SBST51
VDD_MSM52
TCXO_OUT53
54VDD_ANA
TCXO_EN55
VREG_MSMA56
PS_HOLD57
TCXO_IN58
XTAL_IN44
SLEEP_CLK45
46XTAL_OUT
SBDT47
VBACKUP48
SBCK49
ISNS_M5
VREG_MSMP50
VS
W_M
SM
E37
RU
IM_C
LK
(MP
P10
)38 39
VR
EG
_MM
C
CHG_CTL_N4
RU
IM_M
_RS
T(M
PP
5)40
VD
D_R
UIM
41
VR
EG
_RU
IM42
RUIM_RST(MPP6)43
ISNS_P3
RU
IM_M
_IO
(MP
P11
)30 31
VS
W_M
SM
C
VR
EG
_MS
MC
32
VD
D_M
SM
C33
RU
IM_M
_CL
K(M
PP
9)34
VD
D_M
SM
E35
VR
EG
_MS
ME
36
LC
D_D
RV
_N22
KP
D_D
RV
_N23 24
KP
DP
WR
_N
VIB
_DR
V_N
25
RU
IM_I
O(M
PP
12)
26
VS
W_P
A27
VR
EG
_PA
28
VD
D_P
A29
USB_CTL_N15
USB_VBUS16
USB_DAT17
USB_D_P18
19USB_SE0
VCHG2
USB_D_M20
GP1_DRV_N(MPP7)21
ADC_BYP1
VREG_USB10
11USB_ID
VREG_5V12
USB_OE_N13
VSW_5V14
NC7SB3157L6X
A4
B03
1B1
2GND
6S
5VCC
U501PM6650-2M
SD
12T
1GD
502
U506
VBATT
10u
C563
NA
+VPWR
C550
121K
C58047p
R506
1uC529
4.7uHL503
0.1uC514
C5094.7u
+VPWR
VREG_MSMA_2.6V
R525
68
1000pC557
C535
EV
LC
14S
0205
0V
A50
4
1u
600FB503
C532 1u
0.1u
C50
2 VG
A_V
DD
_1.8
V
R2_GPIO36
RIN54
RIPROUT1
29
ROUT223
16SCLKSDIN
17
27VMID
+VPWR
DACDAT10
DBVDD14
DCVDD13 12
DGND
L2_GPIO23
LIN21
LIP
LOUT130
25LOUT2
7LRC
11MCLK
MICBIAS32
18MODE
OUT32221
OUT4
33PGND
U502
ADCDAT9
28AGND1
24AGND2
AUXL19
AUXR20
31AVDD1AVDD2
26
8BCLK
15CSB_GPIO1
4.7uC520
WM8983
C568 22n
0.1u
FB502 600
C559
4.7u
C561
0.1u
C54
033uC500
C533
4.7n
R511
18K
0.22
u
10K
R50
7
C57
8
BASE18
BASE27
3COLLECTOR
DRAIN5
1EMITTER1
EMITTER22
6GATE
9P_COLLECTORP_DRAIN
10
SOURCE4
X50
0
32.7
68K
Hz
12
NUS3116MTR2GU500
R509
VR
EG
_TC
XO
_2.8
5V
51
C58
747
p
2.2u
C51
5
R533
0
R52
2
15K
4.7u
C50
8
VA
508
PR
SB
6.8C
VA
501
UL
CE
0505
C01
5FR
10uC579
10uC525
C50
30.
1u
10pC588
VREG_MSMP_2.7V
1uC572
VREG_5V
C5711u
4.7u
C538
SEL10
9VCC
8_OE
C50
64.
7u
FSUSB30UMX U507
D+3
D-5
GND4
1HSD1+
7HSD1-
2HSD2+
HSD2-6
15K
R52
9
C584
VBATT
0.1u
C53
4
EV
LC
14S
0205
0
1u
VA
503
MIDI_3.3V
0.01uC581
C528
C50
7
4.7u
VR
EG
_BT
_2.8
5V
0.1u
10uC513
1uC570
VREG_USB_3.3V
4.7u
C558
R515
51K
1uC512
C569NA
VR
EG
_SY
NT
H_2
.6V
C51
01u
C537
4.7u
L500
100K
R51
9
smd_2520h1_6_r
4.7uH
4.7n
C542
C560
NAC531
4.7u
C56447p
0.1u
C50
5
1K
R516
0.1u
C50
1
C556
VA
500
UL
CE
0505
C01
5FR
47K
R51
4
0.1u
89
12131415161718
19
2
20
21
22
34567
CN500
1
1011
R510
1K
C541
1u
+5V_PWR
1u
C549
1uC54810K
R518
C536 1u
4.7uHL502
TP500
C553
C5184.7u
2.2u
R52
810
0K PR
SB
6.8C
C57
4
VA
502
EV
LC
14S
0205
0
+VPWR
C59
02.
2u
VR
EG
_WM
_2.7
V
C53
91u
2G1
3G2
1O
4P
0
R508
SPM0204HE5-PB-3
MIC500
D500
RB521S-30
22pC546
12nC547
33pC575
C5240.1u
+VPWR
10p
C522 0.1u
ind_2x1_6h1_r
C58
3
4.7uHL501
0.1u
C52
7
USB_VBUS
+VPWR
NAC544
10pC576
EV
LC
14S
0205
0
C519
VA
506
C57
3
VBATT
+5V_PWR
VBATT
0.1u
C552
PR
SB
6.8C
USB_VBUS
VREG_USIM_3.0V
2.2u
C551NA
VREG_MSME_1.8V
C5210.1u
C567 22n
+VPWR
VA
507
PR
SB
6.8C
R1180D331B
CE_OR_NC6
2GND1
5GND2
NC4
VDD1
VOUT3
47p
U503
C58
6
22pC545
C543NA
R513
FB504
0
51KR512
2.2K
R53
0
C58
9
VREG_MSMP_2.7V
12n
33p
C530
C58
51u
18K
R517
2.2uHL504
R52
1
NA
1uC523
MMP_VDD_USB_3.3V
1uC566
VREG_MMC_3.0V
C56
2
VREG_5V
0.22
u
22uC554
1uC
526
C5164.7u
C5170.1u
MIDI_EAR_R
MIC_PWR
MID_MICP
WM_EN
MIC_PWR
TV_OUT
ICHARGE
EAR_MIC_P
RMT_PWR_ON_N
MMP_A_MCLK
EAR_SENSE_NCAM_MIC+
EAR_MIC_P
CODEC_I2C_SCLCODEC_I2C_SDA
MICBIAS
HP_R
HP_L
MIDI_EAR_L
HP_EAR_L
MIC2P
HP_EAR_R
MID_MICPSPK_L
SPK_R
FM_AUDIO_L
FM_AUDIO_R
MMP_A_BCLK
MMP_ADO_DACDAT
MMP_A_LRCLK
MMP_ADI_ADCDAT
SPK_OUT-
SPK_OUT+
VREG_5V
VREG_WM_2.7V
VREG_MSME_1.8V
MIDI_3.3V
RMT_INT-USB_D+RMT_ADC-USB_D-
VBATT
+5V_PWR RMT_INT
RMT_ADC
EAR_SENSE_N
USB_D+
USB_D-
RMT_INT-USB_D+
RMT_ADC-USB_D-
FM_ANT
UART_TXD
MIDI_3.3V
HP_AMP_EN
HP_EAR_L
HP_EAR_R
GSM_PA_PWR_CTL_REF
AMUX_OUT
RESET_IN_N
BUFF_TCXO
PS_HOLD
FLSH_DRV_N
ICHARGEOUT
CHG_CNT_N
USB_CNT_N
BATT_FET_N
MIC1P
MIC1N
VREG_RF_SMPS
USB_VBUS
UART_RXD
MIDI_EAR_LMIDI_EAR_R
EAR_SENSE_N
USB_OE_N
USB_CNT_N
USB_DATMSM_USB_D+
USB_SE0MSM_USB_D-
KYPD_LED_ENPM_ON_SW_N
USIM_P_DATA
ICHARGE
USIM_DATAUSIM_CLKUSIM_P_CLK
CHG_CNT_N
USIM_RST_N
USIM_P_RST_N
SLEEP_CLK
SSBDT_PM
ICHARGEOUT
TCXO_EN
JTAG_PS_HOLD
TCXO_PMPM_INT_N
V_BACK_UP
RMT_PWR_ON_N
BATT_FET_N
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 176 -
PWRURXDUTXD
3G2.5G
GNDRXTX
VCHARON_SW
VBAT
C
H
F
D
H
AXK714247G
1
5
2
G
E
2
B
12
C
E
6
F
A
GB042-30S-H10-E3000
H
2
931
4
54 10
E
G
C
D
7
150mA
10
ESSY0004701
1
11
1111
7
MODE SWITCH
3
9
10
B
H
5
8
D
5MP CAM LDO
6
7
Strobe(Xenon Lamp) Flash Interface
10 12
4
8
JTAG CONNECTOR
FOR NEST JIG
5
D
MODE1
PCB ARRAY TP
2
(BATTERY PAD 1.5 X 3.4)
G
12
8
3
F
C
MAIN - SUB B to B Conn.
8
A
96
F
9
4
3
5M CAMERA INTERFACE
6 12
MODE3
11
E
7
1608
1
SWITCH FOR 5M VT CALL
MODE2
VGA CAM LDO
150mA
G
AXK740327G
LINEAR MOTOR DRIVER ( AUDIO AMP )
1uC603
1u
CAM_VDD_SA_2.7V
VR
EG
_MM
C_3
.0V
CAM_VDD_IO_2.7V
P2 P3 P4
C60
8
SSP-132MHT
SW600
G1
G2
G3
G4
P1
R61
351
K
C605
VBATT
0.1u
C6151u
OUT611
1uC
619
EV
LC
14S
0205
0V
A60
4
10pC610
30
1718192021222324
1415
23456789
16
2526272829
CN6001
10111213
TP602
VREG_MSMP_2.7V
0.1u
U603 TC7SZ86FU
GND32
IN_A
1IN_B
4OUT_Y
VCC5
C623
OJ603
U604 NC7SB3157L6X
A4
B03
1B1
2GND
6S
5VCC
0.1u
C612
C606
10p
R601 10
0.1u
C626
R615 100K
0.1uC622
U600 BH28PB1WHFV
BGND6
GND2
SEL51
STBY
VIN3 4
VOUT
C620
89
2200p
3
30313233343536373839
4
40
567
1516171819
2
20 212223242526272829
CN603G1
G2
1
1011121314
OJ602
CAM_VDD_SA_2.7V
0
R626
1uC617
R607
33
TP600
1uC604
VA
603
EV
LC
14S
0205
0
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
9INOUT_B1
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E070R100FR FL600
U602 R1114D271D
CE_OR_NC6
2GND1
5GND2
NC4
VDD1
VOUT3
NC7SB3157L6XU607
4A
3B0
B11
GND2
S6
VCC5
0.1uC621
VGA_VDD_2.7V
TP604
OUT608
OJ604
100KR611
INS
TP
AR
0.1u
D60
0P
SD
05-L
F
+VPWR
C607
10pC611
TP603
GND12
GND25
4NC
1VDD
3VOUT
VR
EG
_MS
MP
_2.7
V
+VPWR
CAM_VDD_AF_2.7V
R1114D271DU6016
CE_OR_NC
CAM_VDD_CORE_1.2V
OJ601
0.1u
C627
51K
R61
2
+VPWR
100KR619
470K
R621
VA
601
ICV
L05
1810
0Y50
0FR
1u
7 8
9
10
11
12
13
14
C616
CN6011
2
3
4
5
6
2200p
VA
602
TP601
C624
C614
EV
LC
18S
0201
5 0.1u
C601
CTS12
DSR10
1GND
NC14
7NC2
NC389
NC4
5ON_SW
11RTS
RX23
TX
VBAT6
0.1u
C625
+VP
WR
CN602
10u
C618
+VPWR
ICV
L05
1810
0Y50
0FR
VA
600
10u
1u
C600
R610 100K
VR
EG
_BT
_2.8
5V
VA
605
EV
LC
14S
0205
0
CAM_VDD_IO_2.7V
VREG_5V
80.6K
OJ600
R622
R604 10
VREG_MSMP_2.7V
OUT614
CAM_VDD_SD_1.8V
10R603
10p
VREG_MMC_3.0V
+VPWR
C613
C60
90.
1u
R608 10
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
INOUT_A44
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
GND32
IN_A
1IN_B
4OUT_Y
VCC5
FL601ICVE10184E070R100FR
VREG_MMC_3.0V
U605 TC7SZ86FU
5VO+
8VO-
_SHUTDOWN1
680K
R623
U606 TPA6205A1DRBR
2BYPASS
7GND
IN+3
4IN-
9PGND
VDD6
C6021u
R602 10
VGA_CAM_PWR_EN
+5V_PWR
R61
451
K
MMP_CAM_DATA[3]
5M_CAM_DATA[0]5M_CAM_DATA[1]5M_CAM_DATA[2]5M_CAM_DATA[3]
MMP_CAM_DATA[4]MMP_CAM_DATA[5]MMP_CAM_DATA[6]MMP_CAM_DATA[7]
5M_CAM_DATA[4]5M_CAM_DATA[5]5M_CAM_DATA[6]5M_CAM_DATA[7]
VBATT
UART_TXDUART_RXD
PM_ON_SW_N
MSM_USB_D+MSM_USB_D-
USB_VBUS
MMP_CAM_PWR_EN
SPK_OUT+SPK_OUT-
VBATT
HOOK_SENSE_N
EAR_MIC_P
5M_CAM_MCLK
CAM_MCLKVGA_CAM_MCLK
STROBE_TRIGGER
PM_ON_SW_NUART_RXDUART_TXD
MMP_CAM_PCLK
5M_CAM_DATA[0] 5M_CAM_DATA[1]5M_CAM_DATA[2] 5M_CAM_DATA[3]5M_CAM_DATA[4] 5M_CAM_DATA[5]5M_CAM_DATA[6] 5M_CAM_DATA[7]
MMP_CAM_RESET_N MMP_CAM_INTMMP_CAM_HSYNCMMP_CAM_VSYNC
MMP_I2C_SDAMMP_I2C_SCL
5M_CAM_MCLK
VREG_MSMP_2.7V
CAM_MODE3_N
CAM_MODE2_NCAM_MODE1_N
MMP_CAM_DATA[0]MMP_CAM_DATA[1]MMP_CAM_DATA[2]
MICROSD_DATA[1]
MICROSD_DETECTMICROSD_CLK
MICROSD_DATA[0]MICROSD_CMD
CAM_VDD_AF_2.7V
CAM_MIC+
WHEEL_SW_LWHEEL_SW_R
CAM_VDD_SD_1.8V
V_BACK_UP
MMP_CAM_MCLK5M_CAM_MCLK STROBE_TRIGGER
FLSH_DRV_N
VBAT_SENSE
VBAT_TEMP
CAM_SELECT_NLIN_PWM_MAG
LIN_INVERTERLIN_PWM_FREQ
LIN_MOTOR_EN
MOTOR-
MOTOR+
TCXO_BTBT_TX_RX_N
BT_SBST
BT_SBCKBT_SBDT
BT_CLK
BT_DATA
MMP_STROBE_CHARGE
MMP_STROBE_READY
MMP_CAM_PWR_ENMMP_CAM_PWR_EN
+VPWR
MICROSD_DATA[3]MICROSD_DATA[2]
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 177 -
2
12
D
96
KEY PCB BACKLIGHT LEDs
G
D
2 4 5
C
12
2
TOUCH SCREEN DRIVER IC
F
8
4
E
12
11
KEY
A
10
F
10
H
F
C
H
73 11
END
E
G
E
G
12
SIDE KEY
F
C
1
5
D
7
A
98
CLR
H
6
E
103 9
2
3
3
B
1 4
ON_SW KEY
11
(GREEN)
Rev. 1.1
(WHITE) (RED)PQ
6
105 8
D
Touch Driver IC change : TSC2003 -> TSC2007
4
9
8
B
1
H
5 7
G
11
SEND
6
7
C
1
R71
147
470R709R710 470
470R708
LD
701
SS
C-F
R10
4-II1
0
R70
0
10R719
51K
R70
6
4.7uHL700
R70
1
CAM_VDD_CORE_1.2V
VA
712
EV
LC
14S
0205
0
VGA_VDD_2.7V
51K
R71
2
6
200
5G
110
G2
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B4
100p
ICVE10184E070R100FR
FL701
701
C704
EV
LC
14S
0205
0V
A70
9
R725 10V
A70
4E
VL
C14
S02
050
C702 100p
10R724
EV
LC
14S
0205
0V
A71
1
700
A0
A1C2
A1AUX
GNDD2
PENIRQ-B1 D1
SCL
C1SDA
VDD_REFA2A3
X+C3
X-
B3Y+
D3Y-
VA
702
TSC2007IYZGRU700
B2
EV
LC
14S
0205
0
2.2u
C70
6
51K
R70
5
0.1u
LCD_VDD_2.8V
C701
16
252627282930
1718192021222324
1
101112131415
23456789
CN701
SS
C-F
R10
4-II1
200
R71
4L
D70
3
VREG_MSMP_2.7V
R73
156
K
R707 470
L701 4.7uH
C7110.1u
R70
3
2.7K
10pC713
EVL14K02200
VA708
EV
L14
K02
200
VA
700
R718 10
56K
R73
0
4.7u
C70
5
EV
LC
18S
0201
5
VA
701
EV
LC
14S
0205
0
VA
715
R728 56K
SS
C-T
WH
104-
HL
LD
704
R71
547
R72
9
+VPWR
NA
resi
sto
r
10pC715
EV
LC
14S
0205
0V
A70
7
EV
LC
14S
0205
0V
A70
6
10
R717
VA
714
ICV
L05
1810
0Y50
0FR
SS
C-T
WH
104-
HL
R71
347
LD
700
4.7u
NA
R70
2
C703
LE
GG
-S14
G
LD
702
VA
705
10R720
EV
LC
14S
0205
0
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
END
C712
FL700
ICVE10184E070R100FR
5
10p
CN7001234
C700
1u
EV
LC
18S
0201
5V
A71
3
C709
0.1u
2.7K
R70
4
C70
82.
2u
MMP_VDD_CORE_1.0V
LD
705
LE
GG
-S14
G
VA
710
EV
LC
14S
0205
0
47R
716
VGA_VDD_1.8V
39KR726
C71410p0.1u
C710
FB25
GN
D1
3 6G
ND
2
LX111
8LX2
PG
ND
17 10
PG
ND
2
12VIN1
9VIN2
AAT2510IWP-AA-T1U701
13B
GN
D
EN11
4EN2
2FB1
4.7u
C70
7
X-
KEY_ROW[0]KEY_ROW[1]
KEY_COL[1]KEY_COL[0]
KYPD_LED_EN
+VPWR
EV
LC
14S
0205
0V
A70
3
VGA_CAM_DATA[2]VGA_CAM_DATA[3]VGA_CAM_DATA[4] VGA_CAM_DATA[7]
I2C_SDAI2C_SCL
MMP_CAM_VSYNCMMP_CAM_HSYNC
VGA_CAM_RESET_N
RCV+RCV-
MOTOR+MOTOR- x+
x-Y+
Y-
MMP_CAM_PWR_EN
MMP_PWR_EN
VGA_CAM_DATA[6]
Y-
Y+X+
KEY_ROW[2]
PM_ON_SW_N
VREG_MSMP_2.7V
KEY_COL[0]
KEY_COL[1]TOUCH_PENIRQ_N TOUCH_I2C_SCL
TOUCH_I2C_SDA
MMP_CAM_DATA[0]MMP_CAM_DATA[1]MMP_CAM_DATA[2]MMP_CAM_DATA[3]
VGA_CAM_DATA[0]VGA_CAM_DATA[1]VGA_CAM_DATA[2]VGA_CAM_DATA[3]
MMP_CAM_DATA[4]MMP_CAM_DATA[5]MMP_CAM_DATA[6]MMP_CAM_DATA[7]
VGA_CAM_DATA[4]VGA_CAM_DATA[5]VGA_CAM_DATA[6]VGA_CAM_DATA[7]
VGA_CAM_PWDN
VGA_CAM_DATA[5]
VGA_CAM_MCLK
MMP_CAM_PCLKVGA_CAM_DATA[0]VGA_CAM_DATA[1]
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 178 -
E
B
8
F
5 9
116
7
F
A
2 6 8 10
F
117
MAIN - SUB B to B Conn.
12
BLUETOOTHLG INNOTEK
B
D
C
A
C
9
Micro SD
SPEAKER +/-
G
D
5 108
WHEEL CONNECTOR
10
114
A
E
2
6
F
126
C
12
D
7
H
Header
BB
AXK840225WG
10
D
5
G
9
E
3 11
SPEAKER PAD
54 73
H
1
8
1
12
A
C
E
9
VR
EG
_MM
C_3
.0V
C81
033
p
TP802
VREG_MSMP_2.7V
TP801
10K
R80
9
R80
110
0K
VR
EG
_MS
MP
_2.7
V10
0K
R80
4
C8041u
3536373839
4
40
56789
20 212223242526272829
3
3031323334
G1
G2
1
10111213141516171819
2
C802
CN801
1000p
CN8001
2
3
45
6
7
OUT801
0R807
C803
VR
EG
_MS
MP
_2.7
V
VR
EG
_BT
_2.8
5V
1u
C800 NA
0R
800
BT_ANT
VR
EG
_MM
C_3
.0V
C814
2.2uC
807
C811100p
1u
R80
310
0K
100K
R80
2
33p
R81
0
C8120.1u
GN
D3
GN
D4
1517P
GN
D1
PG
ND
21819
PG
ND
3P
GN
D4
20
RX_BB_TX_BB13
SBCK1112
SBDT
SBST4
5SYNC_DET_TX_EN
3VCC_OUT
14VDD_BAT
VDD_INT2
VDD_MSM10
7XTAL_IN
M800LBRQ-2B43A
AN
T16
9CLK_REF
1G
ND
1G
ND
268
33p
C80
6
C80
5
C80
833
p
33p
+VP
WR
BT_GND
VDD
VSS
100K
R80
5
CD_DAT3_CS
CLK_SCLK
CMD_DI
COMMON
DAT0_DO
DAT1_RSV
DAT2_RSV
DETECT
DUMMY1
DUMMY2
100pC813
S800 SCHA1B0102 C801
NAL800
1000pR80
610
0K
33p
R81
1
VREG_BT_2.85V
C80
933
p
OUT800
VREG_MSMP_2.7V
TP800
10K
R80
8
BT_SBDTBT_SBCK
BT_SBSTBT_TX_RX_N
TCXO_BT
MMP_CAM_PWR_EN
WHEEL_SW_LWHEEL_SW_RCAM_MIC+
MICROSD_DATA[3]MICROSD_DATA[2]MICROSD_DATA[1]MICROSD_DATA[0]MICROSD_CMD
MICROSD_DETECTMICROSD_CLK
SPK_OUT+SPK_OUT-
HOOK_SENSE_N
EAR_MIC_P
BT_DATA
BT_CLK
MICROSD_DETECT
MICROSD_CLK
MICROSD_CMD
V_BACK_UP
CAM_VDD_SD_1.8VCAM_VDD_AF_2.7V
BT_DATA
BT_CLK WHEEL_SW_L
WHEEL_SW_R
SPK_OUT+
SPK_OUT-
MICROSD_DATA[2]
MICROSD_DATA[1]MICROSD_DATA[0]
MICROSD_DATA[3]BT_SBCK
BT_SBDT
BT_SBST
BT_TX_RX_N
TCXO_BT
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 179 - LGE Internal Use Only
D
H
76
G
11
F
52
G
12
E
10
1
B
5
4
2
150mA
D
6
B
E
A
7
F
A
11
150mA
6
3 6
42
F
B
8
H
D
1 8
4
97
G
H
12
D
9
B
3
H
10
C
A
111 3
7
1
C
12
8 10
5MP CAMERA POWER
10
Headset Hook Switch
F
4
C C
A
8
CAM MIC
93
2
5
E
12
E
11
G
5
BACK_UP BATTERY
9
(VDD_SD)
1u
BAT900
C900
R1114D271DU9016
CE_OR_NC
GND12
GND25
4NC
1VDD
3VOUT
1u1uC904
CAM_VDD_SD_1.8V
C903C9011u
R905
10K
+VPWR
VREG_MSMP_2.7VR907
5.1KC9050.1u
100K
R90
61M
R90
4
2GND
1OUT
VCC
5
3VIN+
VIN- 4
1u
U902NCS2200SQ2T2G
6CE
GND12
GND25
NC4
1VDD VOUT
3
C902
CAM_VDD_AF_2.7V
U900 R1114D181D
INSTPARPLW0501H-LF
ZD900
MIC900
SPOB-413S42-RC3310BC
12
+VPWR
V_BACK_UP
CAM_MIC+
MMP_CAM_PWR_EN
MMP_CAM_PWR_EN
HOOK_SENSE_NEAR_MIC_P
7. CIRCUIT DIAGRAM
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 180 -
LGMC
8 9 111
2
D
F
G
A
12
D
A
4 6
B
11 121 2
H
G
D
112 10
11
75 6 12
C
A
7
F
3 12
CONNECT TO CAMERA MODULE
C
AXT628124-Header
B
3
2
E
10
D
E
8
G
1
F
10
4 5 8
H
5
B
5
4
C
8 9
6
B
7
10
H
A
9
3 4
C
1
3 6 7
H
GB042-30P-H1--E3000
ENBY0041601
CONNECT TO MAIN PCB
E
F
CAMERA FPCB CONNECTOR
G
9
E
30
3132
4
5
6
7
8
9
17
18
19
2
20
21
22
23
24
25
26
27
28
29
3
CN1001
1
10
11
12
13
1415
16
CAM_VDD_SA_2.7V CAM_VDD_AF_2.7V
CAM_VDD_SD_1.8VCAM_VDD_IO_2.7V
CAM_VDD_IO_2.7V
CAM_VDD_SA_2.7V
TP1003
CAM_VDD_CORE_1.2V
CAM_VDD_AF_2.7V
TP1002
2021222324
TP1000TP1001
456789
16
252627282930
171819
1
101112131415
23
CAM_VDD_SD_1.8V CAM_VDD_CORE_1.2V
CN1000
STROBE_TRIGGER
MMP_CAM_PCLK
MMP_CAM_INT
5M_CAM_DATA[7]
5M_CAM_DATA[5]
5M_CAM_DATA[3]
5M_CAM_DATA[1]
MMP_CAM_RESET_NMMP_CAM_HSYNCMMP_CAM_VSYNC
MMP_I2C_SDAMMP_I2C_SCL
MMP_CAM_MCLK
5M_CAM_DATA[0]5M_CAM_DATA[2]5M_CAM_DATA[4]5M_CAM_DATA[6]STROBE_TRIGGER
MMP_CAM_PCLK
MMP_CAM_INT
5M_CAM_DATA[7]5M_CAM_DATA[5]5M_CAM_DATA[3]5M_CAM_DATA[1]
MMP_CAM_MCLK
MMP_I2C_SCL
MMP_I2C_SDA
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_RESET_N
5M_CAM_DATA[6]
5M_CAM_DATA[4]
5M_CAM_DATA[2]
5M_CAM_DATA[0]
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 181 - LGE Internal Use Only
LGMC
D
GB042-30P-H10-E3000
A
H
1 5
F
64 7
1 5 7
82
D
7
E
8 10
6 8 9
E
B
1 2 12
B
6
CC
3 9
H
7
F
G
H
E
C
4
11
F
AXK720147G
G
H
4
F
5
D
3
RECEIVER +/-
RECEIVER PAD
D
E
G
1062 5 123 8
2
MOTOR +/-
B
101
11
10
94
3
C
B
G
A
9
VGA_VDD_2.7V
VGA_VDD_1.8V
171819220
3456789
CN12001
10 111213141516
1 102345 6
789
G1 G2
G3 G4
CN1202
OUT1203
OUT1201
OUT1202
OUT1200
VGA_VDD_2.7V
282930
1718192021222324
VGA_VDD_1.8V
12131415
23456789
16
252627
CN12011
1011
VGA_CAM_DATA[7]VGA_CAM_DATA[6]
MOTOR-
RCV- Y-x-Y+x+
VGA_CAM_PWDN
CAM_PCLK
VGA_CAM_MCLK
I2C_SDA
CAM_VSYNC
VGA_CAM_RESET_N
CAM_HSYNC
I2C_SCL
x+
Y+
RCV+
RCV-
MOTOR+
MOTOR-
x-
Y-
VGA_CAM_DATA[4]VGA_CAM_DATA[3]VGA_CAM_DATA[2]VGA_CAM_DATA[1]VGA_CAM_DATA[0]
CAM_PCLK
VGA_CAM_MCLKVGA_CAM_RESET_NI2C_SCL
I2C_SDA
CAM_HSYNCCAM_VSYNCVGA_CAM_DATA[7]VGA_CAM_DATA[6]VGA_CAM_DATA[5]
VGA_CAM_PWDN
MOTOR+
RCV+
VGA_CAM_DATA[5]
VGA_CAM_DATA[0]VGA_CAM_DATA[1]VGA_CAM_DATA[2]VGA_CAM_DATA[3]VGA_CAM_DATA[4]
7. CIRCUIT DIAGRAM
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 182 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGMC
8
F
G
H
7 8 9 10
1 2 3 4 5 6 7
LOCK KEY
FOCUS
5 6
2 3 4 5 6 7 8 9 10 11 12
A
9 1 0 11 12
A
B
C
D
CAMERA
H
B
C
D
E
F
G
D
E
C
41 2 3 4 5 6 7 8 9 101 2 3
1
B
C
D
E
F
G
H
B
E
F
G
H
2345
CN11001
SW1100
KEY_ROW[1]
KEY_ROW[0]
KEY_COL[0]KEY_COL[1]
KEY_ROW[0]KEY_ROW[1]KEY_COL[0]KEY_COL[1]
1100
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 183 -
8. BGA IC PIN MAP
1. MSM6280
(Top View)
8. BGA IC PIN MAP
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 184 -
8. BGA IC PIN MAP
1. MSM6280
(Top View)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Not used
Used
- 185 -
8. BGA IC PIN MAP
2. MCP (Top View)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 186 -
8. BGA IC PIN MAP
2. MCP (Top View)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Not used
Used
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
- 187 -
8. BGA IC PIN MAP
3. PM6650-2 (PMIC)
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 188 -
8. BGA IC PIN MAP
4. WM8983 (Audio codec)
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 189 -
8. BGA IC PIN MAP
5. FM RADIO
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
A
B
C
D
E
1 2 3 4 5 6
- 190 -
8. BGA IC PIN MAP
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
6. ZORAN(ZR3453)
A
B
C
D
E
F
G
H
J
K
L
M
N
1 2 3 4 5 6 7 8 9 10 11 12 13 14
P
- 191 - LGE Internal Use Only
9. PCB LAYOUT
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
<LDO IC>- 1.0V, 1.2V power supply
<Xtal>- Check the frequency (27MHz)
<Multi media IC>- Camcorder, Camera operation
<RF IC>- GSM, WCDMA TX/RX operation
<UMTS RX SAW filter>- WCDMA RX operation
<RF SW>
<Baseband and RF IC>- Check the battery voltage andOutputs of LDOs-Rx operation <Charging IC>
- Check the TA and bettery
<Audio Codec>- Headset, speaker operation
<Memory IC>- Check S/Wdownload
<Xtal>- Check the frequency(19.2MHz)
<GSM900 TX SAW filter>- GSM900 TX operation
<UMTS Duplexer>- WCDMA RX,TX separation
<GSM PAM>- GSM TXamplifier operation
<FEM>- RX, TXswitching selection
<PM IC>- Power management
- 192 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
9. PCB LAYOUT
<FM radio IC>- FM radio operation
<Headphone AMP>- Headset operation
<OVP IC>- Over voltage protection
<Charge Pump>- LCD backlight charge pump
- 193 - LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
9. PCB LAYOUT
- 194 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
9. PCB LAYOUT
- 195 - LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
9. PCB LAYOUT
- 196 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
9. PCB LAYOUT
- 197 - LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
9. PCB LAYOUT
- 198 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
10. Calibration
- 199 -
10. Calibration
10.1 Usage of Hot-Kimchi
10.1.1 Calibration
• Procedure
1. Click SETTING in menu, and logic operation in sub-menu.
Choose “1” in LOGIC MODE (means calibration alone)
2.Select the model name which you want in list box
3.Click Start button to calibrate a phone
Model Name
Calibration only
- 200 -
10. Calibration
10.1.2 Basic Setting
• Contents
√ Click SETTING in menu, and logic operation in sub-menu.
√ You can select how to control AT comm, Testset, and Power supply in DLL Operating Mode.
√ You can set UART Port and logic mode. (mode 1 : Calibration alone)
√ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is saved in a run -
time.
√ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.)
√ You can set the path of HOTKIMCHI program.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 201 -
10. Calibration
10.1.3 Log of Calibration and Test
• Contents
√ On Running, Log window is created in center area. It displays logs of command, and measurements
of Calibration or Autotest.
√ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”, or
“~janghee\debug\CalAuto”.
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 202 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 203 -
1 2 87 4 90 4 6 7 8 9 14 15 201918
23
21
17
24 25 29 30 31 32 33 36 37 38 39 40 41
42
3534
28
2726
22131211
10
16
575654535251
89
71 72 7374
82
8385
84
55 59 60 65 66 67 68 69 70
5048
863
46
49
47
43
4544
58 61 62 63 64
88
75 76 77 78 79 8180
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 204 -LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
A
B
C
D
ASS'Y EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 205 -
11.2 Replacement Parts<Mechanic component>
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LevelLocation
No.Description Part Number Spec Color Remark
1 IMT,BAR/FLIP TIMT0000711 Black
2 AAAY00 ADDITION AAAY0260102 Without Color
3 WSAY00 SOFTWARE,APPLICATION WSAY0113601 ; , , ,WORLD WIDE , ,
3 MCCL00 CAP,BOX MCCL0001103 BOX, TW, , , , , Without Color
3 MCJZ00 COVER MCJZ0049101 BOX, TW, , , , , Without Color
3 MLAC00 LABEL,BARCODE MLAC0004501 Export(105*40) Without Color
3 MLAJ00 LABEL,MASTER BOX MLAJ0004401 LABEL,MASTER BOX(for C1300i NEW_CGR) Without Color
3 MLAP00 LABEL,UNIT MLAP0001115 Reliance Seal Label Without Color
3 MPAA00PACKING,BLISTER(LOWER)
MPAA0002003 PRESS, PB, , , , , Without Color
3 MPAB00PACKING,BLISTER(UPPER)
MPAB0001603 PRESS, PB, , , , , Without Color
3 MPCY00 PALLET MPCY0011201 PALLET(for G5400 O2U 1200x1000_Wooden) Silver
2 APEY00 PHONE APEY0415111 Black
3 ACGK00 COVER ASSY,FRONT ACGK0093401 Without Color
4 ACGZ00 COVER ASSY ACGZ0013901 UPPER Without Color
5 MCJZ00 COVER MCJZ0046501 MOLD, PC LUPOY SC-1004A, , , , , Black 5
6 MICA01 INSERT,FRONT MICA0013901 2.2X4.0 Without Color 9
5 MFBB00 FILTER,RECEIVER MFBB0023201 COMPLEX, (empty), , , , , Without Color 4
5 MPBM00 PAD,RECEIVER MPBM0019201 COMPLEX, (empty), , , , , Without Color 7
5 MTAF TAPE,MOTOR MTAF0006001 Without Color 6
5 MTAK00 TAPE,CAMERA MTAK0002501 COMPLEX, (empty), , , , , Without Color 8
4 ACHA00 COVER SUB ASSY,FRONT ACHA0001801 Without Color
5 MBJL00 BUTTON,SIDE MBJL0042701 MOLD, ABS MP-211, , , , , Silver 27
5 MCCC00 CAP,EARPHONE JACK MCCC0045901 COMPLEX, (empty), , , , , Black `4
5 MCJK00 COVER,FRONT MCJK0073001 MOLD, PC LUPOY SC-1004A, , , , , Black 22
6 MICA00 INSERT,FRONT MICA0019901 M1.4 D2.2 L1.5 Gold 34
5 MDAG00 DECO,FRONT MDAG0028401 MOLD, PC LUPOY SC-1004A, , , , , Black 17
5 MKBZ00 KNOB MKBZ0002101 MOLD, PC LUPOY SC-1004A, , , , , Black 25
5 MLEA00 LOCKER,BATTERY MLEA0039301 MOLD, PC LUPOY SC-1004A, , , , , Black 18
5 MPBT00 PAD,CAMERA MPBT0044701 COMPLEX, (empty), , , , , Without Color 33
5 MSDC00 SPRING,LOCKER MSDC0010601 Without Color 19
5 MSIY00 SHAFT MSIY0001201 CUTTING, STS, , , , , Silver 29
5 MTAA00 TAPE,DECO MTAA0142501 COMPLEX, (empty), , , , , Without Color 23
5 MTAA01 TAPE,DECO MTAA0142601 COMPLEX, (empty), , , , , Without Color 21
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 206 -
LevelLocation
No.Description Part Number Spec Color Remark
5 MTAA02 TAPE,DECO MTAA0142701 COMPLEX, (empty), , , , , Without Color 20
5 MTAA03 TAPE,DECO MTAA0142801 COMPLEX, (empty), , , , , Without Color 16
5 MTAA04 TAPE,DECO MTAA0146601 COMPLEX, (empty), , , , , Without Color 26
5 MTAB00 TAPE,PROTECTION MTAB0185401 COMPLEX, (empty), , , , , Without Color 28
5 MTAC00 TAPE,SHIELD MTAC0057901 COMPLEX, (empty), , , , , Without Color 32
5 MTAC01 TAPE,SHIELD MTAC0058101 COMPLEX, (empty), , , , , Without Color 31
5 MTAZ00 TAPE MTAZ0193901 COMPLEX, (empty), , , , , Black 11
5 MTAZ01 TAPE MTAZ0195701 COMPLEX, (empty), , , , , Without Color 12
5 MTAZ02 TAPE MTAZ0195801 COMPLEX, (empty), , , , , Without Color 15
5 MTAZ03 TAPE MTAZ0195901 COMPLEX, (empty), , , , , Without Color 24
4 MKAG00 KEYPAD,MAIN MKAG0000901 MOLD, PC LUPOY SC-1004A, , , , , Black 35
4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White
4 MPBG00 PAD,LCD MPBG0065101 COMPLEX, (empty), , , , , Black
4 MPBG01 PAD,LCD MPBG0068901 COMPLEX, (empty), , , , , Without Color
4 MPBT00 PAD,CAMERA MPBT0044901 COMPLEX, (empty), , , , , Without Color 38
4 MPBZ00 PAD MPBZ0193801 COMPLEX, (empty), , , , , Without Color
4 MTAB00 TAPE,PROTECTION MTAB0182801 COMPLEX, (empty), , , , , Without Color 1
4 MTAB01 TAPE,PROTECTION MTAB0182901 COMPLEX, (empty), , , , , Without Color 3
4 MTAC00 TAPE,SHIELD MTAC0058201 COMPLEX, (empty), , , , , Without Color
4 MTAD00 TAPE,WINDOW MTAD0072001 COMPLEX, (empty), , , , , Without Color
4 MWAC00 WINDOW,LCD MWAC0083101 COMPLEX, (empty), , , , , Without Color
4 SACY00 PCB ASSY,FLEXIBLE SACY0063001
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0057301
6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM
SACC0036101
7 ENBY00CONNECTOR,BOARD TOBOARD
ENBY0018601 10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET
6 SACD00PCB ASSY,FLEXIBLE,SMTTOP
SACD0047101
7 ENBY00CONNECTOR,BOARD TOBOARD
ENBY0019501 20 PIN,.4 mm,ETC , ,H=1.5, Socket
7 ENBY01CONNECTOR,BOARD TOBOARD
ENBY004060130 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT,MALE ,SMD ,R/TP , ,
6 SPCY00 PCB,FLEXIBLE SPCY0106101 POLYI ,0.4 mm,Mutil-5,VGA-CAM ,; , , , , , , , , ,
4 SJMY00 VIBRATOR,MOTOR SJMY00085023 V,1.0 A,10*3.6T ,2.0Vrms 175HZ linear motor 1.5G ,;,3V , , ,1.5G , , , ,
36
4 SURY00 RECEIVER SURY0012801 37
4 SVCY00 CAMERA SVCY0014601 CMOS ,MEGA ,5M AF, Sony 1/2.8", HPCB 39
4 SVCY01 CAMERA SVCY0014001 CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4"
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 207 -
LevelLocation
No.Description Part Number Spec Color Remark
4 SVLM00 LCD MODULE SVLM0025501MAIN ,240*400 ,45.08*75*2.2 ,262k ,TFT ,TM ,DACIC(Sharp) ,
10
3 ACGM00 COVER ASSY,REAR ACGM0094701 Without Color
4 ENZY00 CONNECTOR,ETC ENZY0019901 3 PIN,3 mm,STRAIGHT , , 70
4 ESQY00 SWITCH,ROTARY ESQY00012016 V,0.005 A,HORIZONTAL ,0.04 G,KU990 Wheel Switch,; ,2C2P ,6VDC ,0.5MA ,HORIZONTAL ,
81
4 MCJN00 COVER,REAR MCJN0069201 MOLD, PC LUPOY SC-1004A, , , , , Black 75
4 MDAD00 DECO,CAMERA MDAD0032801 PRESS, Al, 0.3, , , , Black 80
4 MFBC00 FILTER,SPEAKER MFBC0033001 COMPLEX, (empty), , , , , Without Color 64
4 MFBD00 FILTER,MIKE MFBD0025301 COMPLEX, (empty), , , , , Without Color 74
4 MFBD01 FILTER,MIKE MFBD0025401 COMPLEX, (empty), , , , , Black 62
4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White
4 MPBH00 PAD,MIKE MPBH0032201 COMPLEX, (empty), , , , , Without Color 57,71
4 MPBH01 PAD,MIKE MPBH0032301 COMPLEX, (empty), , , , , Without Color
4 MPBH02 PAD,MIKE MPBH0032401 COMPLEX, (empty), , , , , Without Color 72
4 MPBM00 PAD,RECEIVER MPBM0019401 COMPLEX, (empty), , , , , Without Color 59
4 MPBT00 PAD,CAMERA MPBT0044801 COMPLEX, (empty), , , , , Without Color
4 MPBU00 PAD,CONNECTOR MPBU0007601 COMPLEX, (empty), , , , , Without Color 56
4 MPBU01 PAD,CONNECTOR MPBU0007701 COMPLEX, (empty), , , , , Without Color 68
4 MPBZ00 PAD MPBZ0187301 COMPLEX, (empty), , , , , Without Color 76
4 MPFZ01 PLATE MPFZ0029901 COMPLEX, (empty), , , , , Without Color 82
4 MSDD00 SPRING,PLATE MSDD0006701 PRESS, Bs, 0.15, , , , Gold 66
4 MSDD01 SPRING,PLATE MSDD0006901 PRESS, Bs, , , , , Gold 63
4 MTAA00 TAPE,DECO MTAA0142901 COMPLEX, (empty), , , , , Without Color 79
4 MTAC00 TAPE,SHIELD MTAC0058301 COMPLEX, (empty), , , , , Without Color 69
4 MTAD00 TAPE,WINDOW MTAD0072101 COMPLEX, (empty), , , , , Without Color 77
4 MTAJ00 TAPE,FLEXIBLE PCB MTAJ0001701 COMPLEX, (empty), , , , , Without Color 60
4 MTAZ00 TAPE MTAZ0194001 COMPLEX, (empty), , , , , Without Color 47
4 MTAZ01 TAPE MTAZ0197401 COMPLEX, (empty), 0.1, , , , Without Color 65
4 MWAE00 WINDOW,CAMERA MWAE0028001 CUTTING, Quartz Glass, , , , , Without Color 78
4 MWAE01 WINDOW,CAMERA MWAE0026401 MOLD, Polyarylamide IXEF 1032, , , , , Without Color 67
3 MLAK00 LABEL,MODEL MLAK0006901
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 208 -
LevelLocation
No.Description Part Number Spec Color Remark
4 SNGF00 ANTENNA,GSM,FIXED SNGF00271023.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL,; ,QUAD ,-2.0 ,50 ,3.0
58,73
4 SNGF01 ANTENNA,GSM,FIXED SNGF00272013.0 ,-2.0 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0,50 ,3.0
3 GMEY00 SCREW MACHINE,BIND GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK Black 84
3 SACY00 PCB ASSY,FLEXIBLE SACY0063003
4 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0057302
5 SACD00PCB ASSY,FLEXIBLE,SMTTOP
SACD0047102
6 CN601CONNECTOR,BOARD TOBOARD
ENBY004160128 PIN,0.4 mm,ETC , ,B to B ,; , ,0.40MM ,[empty] ,MALE,SMD ,BK , ,
6 ENBY01CONNECTOR,BOARD TOBOARD
ENBY004060130 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT,MALE ,SMD ,R/TP , ,
5 SPCY00 PCB,FLEXIBLE SPCY0103601 POLYI ,0.2 mm,DOUBLE ,5M-F-CAM ,; , , , , , , , , ,
3 SAFY00 PCB ASSY,MAIN SAFY0203411 44
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0075601
5 ADCA00 DOME ASSY,METAL ADCA0069301 Without Color 43
5 SPKY00 PCB,SIDEKEY SPKY0049301 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0124311
5 SAFC00PCB ASSY,MAIN,SMTBOTTOM
SAFC0091501
6 C100 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C101 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
6 C102 INDUCTOR,CHIP ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free
6 C103 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C104 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C105 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C106 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
6 C107 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C108 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C110 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C111 CAP,CERAMIC,CHIP ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP
6 C112 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C116 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C117 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C118 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
11.2 Replacement Parts<Main component>
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 209 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C119 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C120 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C121 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C122 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C123 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C124 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C125 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C126 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C127 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C128 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C130 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6 C131 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C132 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C133 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C134 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C135 CAP,TANTAL,CHIP ECTH000550133 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6 C136 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
6 C137 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C139 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C140 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C141 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C142 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C143 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C144 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C145 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C146 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C147 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C148 CAP,CHIP,MAKER ECZH0001105 8200 pF,16V ,K ,X7R ,HD ,1005 ,R/TP
6 C149 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C152 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C153 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C154 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C155 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C156 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C159 CAP,CHIP,MAKER ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 210 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C160 CAP,TANTAL,CHIP ECTH0004101 22 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C161 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C162 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C163 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C164 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C167 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C168 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C169 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C170 CAP,CERAMIC,CHIP ECCH0000178 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP
6 C173 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C200 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C214 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C218 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C219 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C222 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
6 C223 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
6 C231 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C232 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C233 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C235 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C236 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C238 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C239 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C300 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C301 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C303 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C308 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C309 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C310 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C311 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C321 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C322 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C323 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C324 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C325 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C326 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C339 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 211 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C340 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
6 C403 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C404 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C405 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C406 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C407 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C408 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C409 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C410 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C500 CAP,TANTAL,CHIP ECTH000550133 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6 C501 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C502 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C503 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C504 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C505 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C506 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C507 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C508 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C509 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C510 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C511 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C512 CAP,CHIP,MAKER ECZH0003501 1 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C513 CAP,TANTAL,CHIP ECTH000480710 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6 C514 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C515 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C518 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C519 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C522 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C523 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C524 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C525 CAP,TANTAL,CHIP ECTH000480710 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6 C526 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C527 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C528 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 212 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C529 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C530 CAP,CERAMIC,CHIP ECCH0000199 12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
6 C532 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C533 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP
6 C534 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C535 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C536 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C537 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C538 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C539 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C540 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C541 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C542 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP
6 C545 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C546 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C547 CAP,CERAMIC,CHIP ECCH0000199 12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
6 C548 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C549 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C552 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C553 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C554 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6 C555 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C556 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C557 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C558 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C559 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C560 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C561 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C586 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C587 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C589 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C590 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C600 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C601 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C602 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C613 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C619 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 213 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C620 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
6 C623 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C624 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
6 C625 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C626 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C627 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C702 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C703 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C704 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C705 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C706 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C707 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C708 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 CN300CONNECTOR,BOARD TOBOARD
ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket
6 CN500 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
6 CN600CONNECTOR,BOARD TOBOARD
ENBY004070130 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE,SMD ,R/TP ,1.0 ,
6 CN601CONNECTOR,BOARD TOBOARD
ENBY0035201 14 PIN,0.4 mm,ETC , ,H=2.0, Socket
6 CN603CONNECTOR,BOARD TOBOARD
ENBY0029501 40 PIN,0.4 mm,ETC , ,H=3.0, Socket
6 CN701CONNECTOR,BOARD TOBOARD
ENBY004070130 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE,SMD ,R/TP ,1.0 ,
6 D400 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE
6 D501 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
6 D502 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP ,
6 D600 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE
6 FB500 FILTER,BEAD,CHIP SFBH0001501 120 ohm,1608 ,
6 FB501 FILTER,BEAD,CHIP SFBH0001501 120 ohm,1608 ,
6 FB504 FILTER,BEAD,CHIP SFBH00081031000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , ,,SMD ,R/TP
6 FL100 FILTER,SEPERATOR SFAY0010002900,1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSMTRIPLE, WCDMA2100 FEM, 5X4X1.3
6 FL101 FILTER,SAW SFSY0030201897.5 MHz,1.4*1.1*0.6 ,SMD ,Pb-free_SAW_GSM900_Tx
6 FL102 FILTER,SAW SFSY00312012140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140,1.4*1.1*0.62 ,SMD ,R/TP
6 FL103 DUPLEXER,IMT SDMY00012021950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 214 -
LevelLocation
No.Description Part Number Spec Color Remark
6 FL104 FILTER,SAW SFSY00311011950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR
6 FL300 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL301 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL302 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL303 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 J400 CONN,SOCKET ENSY0018701 6 PIN,ETC , ,2.54 mm,H=1.8
6 L100 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 L101 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
6 L103 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 L104 INDUCTOR,CHIP ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
6 L105 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 L106 INDUCTOR,CHIP ELCH0005014 5.6 nH,S ,1005 ,R/TP ,
6 L107 INDUCTOR,CHIP ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
6 L108 INDUCTOR,CHIP ELCH0005014 5.6 nH,S ,1005 ,R/TP ,
6 L109 INDUCTOR,CHIP ELCH0005004 22 nH,J ,1005 ,R/TP ,
6 L110 INDUCTOR,CHIP ELCH0004711 22 nH,J ,1005 ,R/TP ,
6 L111 INDUCTOR,CHIP ELCH0005004 22 nH,J ,1005 ,R/TP ,
6 L112 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,
6 L113 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,
6 L114 INDUCTOR,CHIP ELCH0004707 1.5 nH,S ,1005 ,R/TP ,
6 L115 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 L116 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 L117 INDUCTOR,CHIP ELCH0004708 2.7 nH,S ,1005 ,R/TP ,
6 L118 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 L119 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 L121 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
6 L123 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,
6 L124 INDUCTOR,CHIP ELCH0004709 3.3 nH,S ,1005 ,R/TP ,
6 L125 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 L126 INDUCTOR,CHIP ELCH0004705 8.2 nH,J ,1005 ,R/TP ,
6 L128 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,
6 L200 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
6 L500 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L501 INDUCTOR,SMD,POWER ELCP00080044.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD,2.5X2X1MM ,11MM ,R/TP
6 L502 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L503 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 215 -
LevelLocation
No.Description Part Number Spec Color Remark
6 L700 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L701 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 MIC500 MICROPHONE SUMY0010603PIN ,42 dB,4.72*3.76*1.25 ,MEMS MIC , , , ,OMNI,1.5TO5V , ,SMD
6 Q100 TR,BJT,ARRAY EQBA0000602TESV ,200 mW,R/TP ,EPITAXIAL PLANAR NPN/PNPTRANSISTOR
6 R100 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
6 R101 RES,CHIP,MAKER ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP
6 R104 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
6 R107 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP
6 R109 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R111 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
6 R112 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP
6 R113 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP
6 R114 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R115 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R117 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R118 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP
6 R119 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP
6 R120 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R123 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
6 R124 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R125 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP
6 R126 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP
6 R200 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP
6 R201 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
6 R202 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
6 R204 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R205 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R206 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R207 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R211 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP
6 R312 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
6 R314 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R315 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R316 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R317 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R319 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 216 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R320 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R321 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R322 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R329 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
6 R340 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
6 R401 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R402 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R403 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R504 RES,CHIP,MAKER ERHZ00039010.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012,R/TP
6 R506 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP
6 R507 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP
6 R509 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R510 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R511 RES,CHIP,MAKER ERHZ0000431 18 Kohm,1/16W ,J ,1005 ,R/TP
6 R512 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R514 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R515 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R516 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R517 RES,CHIP,MAKER ERHZ0000431 18 Kohm,1/16W ,J ,1005 ,R/TP
6 R518 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R519 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R524 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
6 R525 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
6 R603 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R608 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R610 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R611 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R612 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R613 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R614 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R615 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R619 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R621 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP
6 R622 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP
6 R623 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
6 R626 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 217 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R726 RES,CHIP,MAKER ERHZ0000476 39 Kohm,1/16W ,J ,1005 ,R/TP
6 R728 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP
6 R730 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP
6 R731 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP
6 SW100 CONN,RF SWITCH ENWY0005301,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER,SMD ,R/TP ,AU , ,
6 SW600 SWITCH,SLIDE ESSY00047014 V,300 mA,HORIZONTAL , G,Slide Switch ,; ,1C3P,[empty] ,[empty] ,[empty] ,1.5N , ,TP
6 U100 IC EUSY0300502QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RFTransceiver, 8X8X0.9 ,; ,IC,Tx/Rx
6 U101 PAM SMPY0013501 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge
6 U102 IC EUSY0278501 SON5-P-0.50 ,5 PIN,R/TP ,INVERTER GATE, Pb Free
6 U104COUPLER,RFDIRECTIONAL
SCDY0003403-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP
6 U105 PAM SMPY0013301dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz,HSDPA
6 U200 IC EUSY0295601CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS/EDGE/HSDPABase Band
6 U302 IC EUSY0330701FPBGA ,180 PIN,R/TP ,5M Camera,VGA30,Multi audiocodec
6 U402 IC EUSY0333402FBGA ,225 PIN,ETC ,2G(LB/128Mx16/2.7V)NAND+1G(8Mx4x32) SDRAM ,; ,IC,MCP
6 U500 IC EUSY0332901WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET &DUAL Transistor
6 U501 IC EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree
6 U502 IC EUSY0342001QFN ,32 PIN,R/TP ,CODEC,3D, 5band equalizer,StereoHP AMP, Stereo SPKAMP ,; ,IC,Audio Codec
6 U603 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6 U605 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6 U606 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP
6 U701 IC EUSY0251501DFN33-12 ,12 PIN,R/TP,DUALDCDC_DMBpower,400mA,600mA,1Mhz
6 VA300 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 VA301 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 VA500 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA501 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA502 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA503 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA504 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA505 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA506 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA507 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 218 -
LevelLocation
No.Description Part Number Spec Color Remark
6 VA508 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 VA601 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005
6 VA603 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA604 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA605 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 X100 VCTCXO EXSK000780219.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM,2.8V , , , , ,SMD ,P/TP
6 X200 RESONATOR EXRY000240148 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,OutgoingTolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap
6 X300 X-TAL EXXY002330127 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppmat -20'C ~ +70'C, Pb Free
6 X500 X-TAL EXXY001870132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0091001
6 C109 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C113 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C114 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C115 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C150 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C151 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C157 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C158 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C166 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C171 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C172 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C210 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C211 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C212 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C213 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C215 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C216 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C217 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C220 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C221 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C224 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C225 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C226 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C227 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C228 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 219 -
LevelLocation
No.Description Part Number Spec Color Remark
6 C229 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C230 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C234 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C302 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C304 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C305 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C306 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C307 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C312 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C313 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C314 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C315 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C316 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C317 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C318 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C319 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C327 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C328 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C329 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C330 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C331 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C332 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C333 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C334 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C335 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C336 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C337 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C338 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C400 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C401 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C402 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C412 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C413 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C516 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C517 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C520 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C521 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
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11. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C562 CAP,CERAMIC,CHIP ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP
6 C563 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C564 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C565 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C566 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C567 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C568 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C570 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C571 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C572 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C573 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 C574 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 C575 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C576 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C577 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C578 CAP,CERAMIC,CHIP ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP
6 C579 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C580 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C581 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C583 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C584 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C585 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C588 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C603 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C604 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C605 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C606 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C607 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C608 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C609 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C610 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C611 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C612 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C614 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C615 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C616 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C617 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
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11. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 C618 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C621 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C622 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C700 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C701 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C709 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C710 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C711 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C712 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C713 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C714 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C715 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 D500 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
6 FB300 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
6 FB301 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
6 FB502 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
6 FB503 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
6 FL600 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 FL601 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 FL700 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 FL701 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 L120 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
6 L127 INDUCTOR,CHIP ELCH0009114 100 nH,J ,1005 ,R/TP ,coil
6 L300 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
6 L504 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
6 LD700 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
6 LD701 DIODE,LED,CHIP EDLH0007901 RED ,1608 ,R/TP ,Indicator,0.4T Red LED
6 LD702 DIODE,LED,CHIP EDLH0014501GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty],[empty] ,2P
6 LD703 DIODE,LED,CHIP EDLH0007901 RED ,1608 ,R/TP ,Indicator,0.4T Red LED
6 LD704 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
6 LD705 DIODE,LED,CHIP EDLH0014501GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty],[empty] ,2P
6 R121 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R122 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
6 R208 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R217 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 222 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R218 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R310 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R331 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R336 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R338 RES,CHIP,MAKER ERHZ0000509 75 ohm,1/16W ,J ,1005 ,R/TP
6 R339 RES,CHIP ERHY0000170 390 ohm,1/16W ,F ,1005 ,R/TP
6 R345 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R400 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
6 R505 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP
6 R522 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
6 R528 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R529 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
6 R530 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R601 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R602 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R604 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R607 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
6 R701 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R703 RES,CHIP ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP
6 R704 RES,CHIP ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP
6 R705 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R706 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R707 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R708 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R709 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R710 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
6 R711 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R712 RES,CHIP,MAKER ERHZ0000527 200 ohm,1/6W ,J ,1005 ,R/TP
6 R713 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R714 RES,CHIP,MAKER ERHZ0000527 200 ohm,1/6W ,J ,1005 ,R/TP
6 R715 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R716 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R717 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R718 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R719 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R720 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R724 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 223 -
LevelLocation
No.Description Part Number Spec Color Remark
6 R725 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 SPFY00 PCB,MAIN SPFY0151801 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , ,
6 U103 IC EUSY0335301WLCSP(Coated) ,25 PIN,R/TP ,FM Tuner(RDS),3.35*3.3, Pb Free
6 U300 IC EUSY0290701HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power SaveLDO
6 U301 IC EUSY0336502 , PIN,R/TP , ,; ,IC,Charge Pump
6 U303 IC EUSY0346001SON1612 ,6 PIN,R/TP ,1.9V 150mA Single LDO ,;,IC,LDO Voltage Regulator
6 U304 IC EUSY0338301uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF6.5ohm 1.4X1.8
6 U400 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75
6 U401 IC EUSY0271201 TQFN ,16 PIN,R/TP ,Quad Analog switch, Pb Free
6 U503 IC EUSY0333001SON1612 ,6 PIN,R/TP ,3.3V, 150mA LDO Pb-Free,Active High
6 U504 IC EUSY0303901QFN,130mW Capless Stereo Headphone Driver ,16PIN,R/TP ,Capless hp amp
6 U505 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP
6 U506 IC EUSY0175301MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1MUX/DEMUX, Pb Free
6 U507 IC EUSY0338301uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF6.5ohm 1.4X1.8
6 U600 IC EUSY0290701HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power SaveLDO
6 U601 IC EUSY0338701 SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free
6 U602 IC EUSY0338701 SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free
6 U604 IC EUSY0175301MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1MUX/DEMUX, Pb Free
6 U607 IC EUSY0175301MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1MUX/DEMUX, Pb Free
6 U700 IC EUSY0337101CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/DConverter
6 VA600 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005
6 VA602 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA700 VARISTOR SEVY0000702 14 V,10% ,SMD ,
6 VA701 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA702 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA703 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA704 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA705 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA706 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA707 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA708 VARISTOR SEVY0000702 14 V,10% ,SMD ,
- 224 -
11. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 VA709 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA710 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA711 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA712 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA713 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA714 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005
6 VA715 VARISTOR SEVY0003801 18 V, ,SMD ,
5 WSYY00 SOFTWARE WSYY0636510
3 SAJY00 PCB ASSY,SUB SAJY0024902 52
4 SAJB00 PCB ASSY,SUB,INSERT SAJB0012001
5 AFBA00 FRAME ASSY,SHIELD AFBA0007701 Without Color
6 MFEA00 FRAME,SHIELD MFEA0015601 MOLD, ABS MP-211, , , , , Without Color 50
6 MPBJ00 PAD,MOTOR MPBJ0045901 COMPLEX, (empty), , , , , Without Color 45
6 MPBU00 PAD,CONNECTOR MPBU0007801 COMPLEX, (empty), , , , , Without Color 48
6 MPBU01 PAD,CONNECTOR MPBU0007901 COMPLEX, (empty), , , , , Without Color 49
6 MPBZ00 PAD MPBZ0190001 COMPLEX, (empty), , , , , Without Color
5 MPBU00 PAD,CONNECTOR MPBU0008001 COMPLEX, (empty), , , , , Without Color 51
5 MPBZ00 PAD MPBZ0187201 COMPLEX, (empty), , , , , Without Color 46
5 SMZY00 MODULE,ETC SMZY0016801 55
5 SUSY00 SPEAKER SUSY0026002UNIT ,8 ohm,83 dB,16 mm,19.85*18.75*6.1 Module SPK,; , , , , , , ,[empty]
4 SAJE00 PCB ASSY,SUB,SMT SAJE0019001
5 SAJC00PCB ASSY,SUB,SMTBOTTOM
SAJC0017301
6 C901 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C902 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C903 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C904 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C905 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 CN800 CONNECTOR,ETC ENZY0015301 4 PIN,2.2 mm,ETC , ,H=2.3
6 MIC900 MICROPHONE SUMY0010507 UNIT ,42 dB,4*1.35 ,SMD
6 R800 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
6 R904 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R905 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R906 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP
6 R907 RES,CHIP,MAKER ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP
6 S800 CONN,SOCKET ENSY0015801 8 PIN,ETC , ,1.1 mm,H=1.9, Detect Pin
6 U900 IC EUSY0294701 SON1612-6 ,6 PIN,R/TP ,1.8V 150mA LDO Pb-Free
- 225 -
11. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part Number Spec Color Remark
6 U901 IC EUSY0338701 SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free
6 U902 IC EUSY0250501SC70 ,5 PIN,R/TP ,Comparator, pin compatible toEUSY0077701
6 ZD900 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE
5 SAJD00 PCB ASSY,SUB,SMT TOP SAJD0019601
6 BAT900 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,phi 4.8, Pb-Free
6 C801 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C802 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C803 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C804 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C805 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C806 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C807 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C808 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C809 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C810 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C811 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C812 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6 C813 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C814 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C900 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 CN801CONNECTOR,BOARD TOBOARD
ENBY0029401 40 PIN,0.4 mm,ETC , ,H=3.0
6 M800 MODULE,ETC SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module
6 R801 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R802 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R803 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R804 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R805 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R806 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R808 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R809 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R810 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 R811 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
5 SPJY00 PCB,SUB SPJY0042101 FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,
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11. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
11.3 Accessory
LevelLocation
No.Description Part Number Spec Color Remark
5 MCHZ00 COMPACT DISK MCHZ0040301 COMPLEX, (empty), , , , ,SILVERSNOW
3 MCJA00 COVER,BATTERY MCJA0047601 PRESS, Al, , , , , Black 85
3 MHBY00 HANDSTRAP MHBY0004310 COMPLEX, (empty), , , , , Without Color
3 MPHY00 PROTECTOR MPHY0011301 COMPLEX, (empty), 0.1, , , , Without Color
3 SBPL00 BATTERY PACK,LI-ION SBPL0091101
3.7 V,1000 mAh,1 CELL,PRISMATIC ,KU990(NYX)BATT, Europe Label, Pb-Free ,; ,3.7 ,1000 ,0.2C,PRISMATIC ,46x34x55 , ,BLACK ,Innerpack,Europe(Reverse insert OK)
Black
3 SGDY00 DATA CABLE SGDY0010908; ,[empty] ,[empty] ,[empty] ,18pin 6.2mm. NYX BoxPackage ,BLACK , ,N
3 SGEY00EAR PHONE/EAR MIKESET
SGEY0005546; ,10mW ,16ohm ,111dB ,20HZ ,20HZ ,[empty] ,BLACK,18P MMI CONNECTOR ,Plug Mold( Abnormal),Earphone,Stereo
3 SSAD00 ADAPTOR,AC-DC SSAD0025003100-240V ,5060 Hz,5.1 V,.7 A,CE ,England, 18pin plug,Nyx packing ,; , , , , , ,WALL 2P ,I/O CONNECTOR ,
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
Note
Note