ESP-12F WiFi module

Specifications

Version 1.0

August 23, 2015

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information in this manual is subject to change reservations. This manual only as a guide, Shenzhen

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Table of Contents

1. Product Overview …………………………………………………………………….....2

1.1 Features …………………………………………………………………………3

1.2. The main parameters ……………………………………………..…....4

2. Interface Definition ……………………………………………………………..……….5

3. The shape and size………………………………………………………………………..7

4. Functional Description …………………………………………………………….……9

4.1. MCU ……………………………………………………………………………..9

4.2 Storage Description ……………………………………………………….9

4.3. Crystal ………………………………………………………………………….9

4.4 Interface Description ……………………………………………………10

4.5. Maximum Ratings ……………………………………………………….11

4.6. The recommendations of the working environment ….11

4.7 Digital Port Characteristics ……………………………………….….11

5. RF parameters …………………………………………………………………….………12

6. Power ………………………………………………………………………………….……..13

7. tilt warming………………………………………………………………………….……..14

8. Schematic ……………………………………………………………………………………15

9. Product Trial…………………………………………………………………………………16

1. Product Overview

ESP-12F WiFi module is a security technology developed by the Letter to the module integrated core

processor ESP8266 smaller package size Tensilica L106 industry-leading ultra-low power 32-bit micro

MCU, with 16 compact mode frequency support 80 MHz and 160 MHz, supports RTOS, integrated

Wi-Fi MAC / BB / RF / PA / LNA, on-board antenna.

The module supports standard IEEE802.11 b / g / n protocol, a complete TCP / IP protocol stack. Users

can use the module for the existing equipment to add networking capabilities, you can build a

separate network controller.

ESP8266 is a high performance wireless SOC, at the lowest cost to provide maximum practicality, the

WiFi functionality into other systems offer endless possibilities.

Figure 1 ESP8266EX Chart

ESP8266EX is a complete and self-contained WiFi network solution that can run independently, it can

also be mounted as a slave to another host MCU operation. ESP8266EX when the device is mounted

as the only application should 一 Use processor can boot directly from the external flash memory.

Built-in cache system is conducive to mention high- performance and reduce memory requirements.

Also 一 species case, ESP8266EX responsible for wireless Internet access WiFi adapter undertake the

task, you can add it to any microcontroller-based design, the connection is simple and easy YES,

simply by SPI / SDIO interface or I2C / UART port can.

ESP8266EX powerful processing chip and the memory can be subjected to, it can be integrated

through the GPIO port sensors and other application-specific equipment to achieve the lowest

pre-development and operation occupy minimal system resources.

Within a highly integrated chip ESP8266EX, including the antenna switch balun, power management

converter, thus with minimal external circuitry, and the entire solution including front-end modules,

including in the design of the PCB occupied space to a minimum.

There ESP8266EX system manifested leading features are: energy in the sleep / wake quickly switch

between modes, with low-power operation of the adaptive radio bias, front-end signal processing

functions, troubleshooting and radio systems coexist characteristic for the elimination of cellular /

Bluetooth / DDR / LVDS / LCD interference.

1.1 Features

• 802.11 b / g / n

• Built Tensilica L106 ultra-low power 32-bit micro MCU, clocked at 80 MHz and supports 160 MHz,

support for RTOS

• Built-in 10 bit precision ADC

• Built-in TCP / IP protocol stack

• Built TR switch, balun, LNA, power amplifier and matching network

• Built-in PLL, voltage regulator and power management components, 802.11b mode +20 dBm output

power

The guard interval • A-MPDU, A-MSDU aggregation and 0.4 s of

• WiFi @ 2.4 GHz, supports WPA / WPA2 security mode

• Supports remote upgrade and cloud AT OTA upgrade

• Support STA / AP / STA + AP mode

• Support Smart Config function (including Android and iOS devices)

• HSPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO

• Deep sleep holding current 10 uA, shutdown current of less than 5 uA

• Within 2 ms of wake-up, connect and transfer data packets

• Standby power consumption is less than 1.0 mW (DTIM3)

• Operating temperature range: -40 - 125

1.2. The main parameters

Table 1 describes the main parameters of the module.

Table 1 Parameters Table

Category Parameters Explanation

Radio parameters

Standards Certification FCC/CE/TELEC

Wireless Standard 802.11 b/g/n

Frequency Range 2.4GHz­2.5GHz (2400M­2483.5M)

Hardware parameters

Data access UART/HSPI/I2C/I2S/Ir Remote Contorl

GPIO/PWM

Operating Voltage 3.0~3.6V（Suggested 3.3V）

Working current Mean： 80mA

Operating temperature ­40°~125°

Storage temperature At room temperature

Package Size 16mm＊24mm ＊3mm

External Connector N/A

Software parameters

Wireless Network Mode station/softAP/SoftAP+station

Security Mechanism WPA/WPA2

Encryption Type WEP/TKIP/AES

Upgrading firmware Local serial programming / Cloud Upgrade / Host Download Burn

Software Development Supports customer­defined server

To provide secondary development SDK

Network protocol IPv4, TCP/UDP/HTTP/FTP

User Profiles AT + instruction set, cloud server, Android/iOS APP

2. Interface Definition

ESP-12F received a total of 18 interfaces, Table 2 is the interface definition.

Figure 2 ESP-12F pin map

Table 2 ESP-12F pin function definitions

No. Pin Name Function Description

1 RST Reset Module

2 ADC A / D conversion result. Input voltage range of 0 ~ 1V, in the range: 0 to 1024

3 EN Chip Enable end, high effective

4 IO16 GPIO16; do wake deep sleep when receiving RST pin。

5 IO14 GPIO14; HSPI_CLK

6 IO12 GPIO12; HSPI_MISO

7 IO13 GPIO13; HSPI_MOSI; UART0_CTS

8 VCC powered by 3.3V

9 CS0 Chip Select

10 MISO Slave Master Input Output

11 IO9 GPIO9

12 IO10 GBIO10

13 MOSI Master Out Slave

14 SCLK Clock

15 GND GND

16 IO15 GPIO15; MTDO; HSPICS; UART0_RTS

17 IO2 GPIO2; UART1_TXD

18 IO0 GPIO0

19 IO4 GPIO4

20 IO5 GPIO5

21 RXD UART0_RXD; GPIO3

22 TXD UART0_TXD; GPIO1

Mode GPIO15 GPIO0 GPIO2

UART Download mode Low Low High

Flash Boot Mode Low High High

Parameters Smallest value

Typical values

Maximum Unit

Input Frequency 2412 2484 MHz

Input resistance 50 Ω

Input reflection ­10 dB

72.2 Mbps down, PA output power 14 15 16 dBm

Under 11b mode, PA output power 17.5 18.5 19.5 dBm

Sensitivity

DSSS, 1 Mbps ­98 dBm

CCK, 11 Mbps ­91 dBm

6 Mbps (1/2 BPSK) ­93 dBm

54 Mbps (3/4 64­QAM) ­75 dBm

HT20, MCS7 (65 Mbps, 72.2 Mbps) ­72 dBm

Adjacent suppression

OFDM, 6 Mbps 37 dB

OFDM, 54 Mbps 21 dB

HT20, MCS0 37 dB

HT20, MCS7 20 dB

3. The shape and dimensions

ESP-12F SMD module appearance Size inch of 16mm * 24mm * 3mm (Figure 3). The module uses a

capacity of 4MB, packaged as SOP-210 mil of SPI Flash. Modules using a 3 DBi of PCB-board antenna.

Figure 3 ESP-12F module appearances

Figure 4 ESP-12F module size view of a smooth surface

Table 5 ESP-12F Module Size Chart

Long Width Height Size PAD (bottom) Pin Foot spacing

16 mm 24 mm 3 mm 0.9 mm x 1.7 mm 2 mm

4. Functional Description

4.1. MCU

ESP8266EX built Tensilica L106 ultra-low power 32-bit micro MCU, with 16 compact mode, clocked at

80 MHz and supports 160 MHz, is compatible with the RTOS. Using the WiFi protocol stack is currently

only 20% of MIPS, the other can be used for application development. MCU chip through the

following interfaces and other parts of synergies 工 as:

1. Connect the memory controller can also be used to access external memory encoding RAM /

ROM interfaces (iBus)

2. The same connection data RAM memory controller interfaces (dBus)

3. Access register AHB interface

4.2 Storage Description

4.2.1. Built-in SRAM and ROM

Auto body built ESP8266EX chip memory controller, comprising ROM and SRAM. MCU can access the

storage controller iBus, dBus and AHB interface. These interfaces are accessible ROM or RAM unit,

memory arbiter to determine the running order in the order of arrival. Based on the current Division I

Demo SDK use SRAM, the user can remaining SRAM space: (next station mode, even after routed,

heap + data area generally available around 36KB) RAM size <36kB not programmable ROM on

ESP8266EX sheet Currently, users the program stored in the SPI Flash.

4.2.2. SPI Flash

Current ESP8266EX chip SPI interface supports external Flash, a theoretical maximum support to 16

MB of SPI flash. At present, the module is 4MB of external SPI Flash.

Recommendations Flash Capacity: 1 MB-16MB.

Supported SPI mode: Standard SPI, Dual SPI, DIO SPI, QIO SPI, and Quad SPI. Note that you need to

select the corresponding mode in the download tool when downloading firmware, or after

downloading the program will not be run correctly.

4.3. Crystal

Currently crystal 40M, 26M and 24M support, please pay attention to selecting the corresponding

type of crystals in the download tool use. Crystal input and output of the applied determination of

adjusted capacitors C1, C2 may be set to a fixed value, the value range in 6pF ~ 22pF, specific values

need to be adjusted after the system test. Based on the current market situation in the mainstream of

the crystal, the crystal 26Mhz General points added input and output capacitors C1, C2 in less than

10pF; General points 40MHz crystal input and output capacitance added 10pF <C1, C2 <22pF.

Optional precision crystal itself need to ± 10PPM. Crystal operating temperature -20 ° C- 85 ° C.

Crystal position as close to the chip XTAL Pins (traces not too long), while crystal alignment to be

wrapped up well shielded land.

Crystal input and output traces can not punch alignment, that can not cross-layer. Crystal input and

output traces can not cross, cross-layer cross too.

Crystal input and output bypass capacitors placed left and right side close to the chip, please, try not

to put 走 line.

4 layers beneath the crystal can not take the high-frequency digital signal, the best situation is below

the crystal does not go any signal lines, paved TOP crystal surface area the better. Crystal sensitive

devices around the crystal can not have magnetic induction devices, such as large inductors.

4.4. Interface Description

Table 6 Interface Description

Interface Name

Pin Function Description

HSPI Connector

IO12(MISO), IO13(MOSI), IO14(CLK), IO15(CS) External 4SPI Flash, display and MCU like.

PWM­connector IO12(R), IO15(G),IO13(B) The demo offers four PWM (to 8 users can expand their own

way), it can be used to control lights, buzzers, relays and motors.

IR­connector IO14(IR_T), IO5(IR_R) IR Remote Control4 interfaces implemented by software, interface NEC coding and modulation and demodulation, using 38KHz modulated carrier.

ADC Connector TOUT

This is useful for the detection VDD3P3 (Pin3, Pin4) supply voltage and TOUT (Pin6) input voltage (not both). It can be used for sensor applications.

I2C Connector

IO14(SCL), IO2(SDA) External sensors and displays and other

UART Connector

UART0: TXD(U0TXD),

RXD(U0RXD), IO15(RTS), IO13(CTS)

UART1: IO2(TXD)

May be devices, external UART interface.

Download: U0TXD + U0RXD or GPIO2 + U0RXD

Communication (UART0): U0TXD, U0RXD, MTDO (U0RTS), MTCK (U0CTS) Debug: UART1_TXD (GPIO2) can be used as a print debug information. UART0 default on ESP8266EX power output will be some printed information. This sensitive applications, you can use the internal UART pin swapping function in initialization time, will U0TXD, U0RXD were exchanged with U0RTS, U0CTS. Admiral MTDO MTCK hardware connected to the corresponding external MCU serial­connector to communicate.

I2S接口

I2S Enter：

IO12 (I2SI_DATA) ;

IO13 (I2SI_BCK );

IO14 (I2SI_WS); Use main audio capture, processing and transmission. I2S Export：

IO15 (I2SO_BCK );

IO3 (I2SO_DATA);

IO2 (I2SO_WS ).

4.5. Maximum Ratings

RATINGS Condition Value Unit

Storage temperature ­40 to 125

Maximum soldering temperature 260

Supply voltage IPC/JEDEC J­STD­020

+3.0 to +3.6 V

4.6. The recommendations of the working environment

Working environment Name Min Average Maximum Unit

Operating temperature ­40 20 125

Supply voltage VDD 3.0 3.3 3.6 V

4.7 Digital Port Characteristics

End­connector Typical values Min Average Maximum Unit

Input logic level low VIL ­0.3 0.25VDD V

Input logic level ADVANCED

VIH 0.75VDD VDD+0.3 V

Output logic level low VOL N 0.1VDD V

Output Logic Level ADVANCED VOH 0.8VDD N V

Note: Unless otherwise specified, the test conditions: VDD = 3.3 V, temperature is 20 .

5. RF parameters

Description Min Average Maximum Unit

Input Frequency 2400 　 2483.5 MHz

Input impedance value 　 50 　 ohm

Enter the reflectance values 　 　 ­10 dB

PA output power of 72.2 Mbps 15.5 16.5 17.5 dBm

11b mode at PA output power 19.5 20.5 21.5 dBm

Receiver sensitivity

CCK, 1 Mbps 　 ­98 　 dBm

CCK, 11 Mbps 　 ­91 　 dBm

6 Mbps (1/2 BPSK) 　 ­93 　 dBm

54 Mbps (3/4 64­QAM) 　 ­75 　 dBm

HT20, MCS7 (65 Mbps, 72.2 Mbps) 　 ­72 　 dBm

Adjacent suppression

OFDM, 6 Mbps 　 37 　 dB

OFDM, 54 Mbps 　 21 　 dB

HT20, MCS0 　 37 　 dB

HT20, MCS7 　 20 　 dB

6. Power

The following data is based on a 3.3V power supply, ambient temperature of 25 ° C, and measured

using the internal regulator.

[1] All measurements were carried out at no SAW filter, the antenna interface is complete.

[2] all transmit data based on a 90% duty cycle, continuous transmission mode at measured.

Table 11 Power

Mode Min Average Maximum Unit

Transfer 802.11b, CCK 11Mbps, POUT=+17dBm

170 mA

Transfer 802.11g, OFDM 54Mbps, POUT =+15dBm

140 mA

Transfer 802.11n, MCS7, POUT =+13dBm 120 mA

Receiving 802.11b, packet length of 1024 bytes, ­80dBm

50 mA

Receiving 802.11g, packet length of 1024 bytes, ­70dBm

56 mA

Receiving 802.11n, packet length of 1024 bytes, ­65dBm

56 mA

Modem­Sleep① 15 mA

Light­Sleep② 0.9 mA

Deep­Sleep③ 10 uA

Power Off 0.5 uA

Note ①: Modem-Sleep Use to require CPU has been in working condition, such as PWM or I2S should

use, etc. In keeping WiFi connection, if no data transmission, according to the 802.11 standard (such

as U-APSD), turn off WiFi Modem circuit power. For example, in DTIM3, each sleep 300mS, wake 3mS

received the Beacon AP packages, etc., the overall average current of about 15mA.

Note ②: Light-Sleep may be suspended for the CPU applications such as WiFi switch. In keeping WiFi

connection, if no data transmission, according to the 802.11 standard (such as U-APSD), closed circuit

and pause WiFi Modem CPU to save power. For example, in DTIM3, each sleep 300 ms, wake 3ms

received the Beacon AP packages, etc., the overall average current of approximately 0.9 mA.

Note ③: Deep-Sleep has remained without a WiFi connection, long time to send a packet of

applications, such as 一 second temperature sensor measurements every 100 seconds. For example,

every 300 s after waking need 0.3s - 1s even send data on AP, the overall average current can be far

less than 1mA.

7. tilt warming

Table 12 tilt warming

Tilt the maximum temperature TS ­TL Preheat Maximum of 3 / sec

The minimum temperature value (TS Min.) Typical temperatures (TS Typ.) Temperature value is largest (TS Max.) Time (TS)

150 175 200 60~180秒

Tilt temperature (TL to TP) Maximum of 3 / sec

Duration / temperature (TL) / time (TL) 217/60~150秒

Peak temperature (TP) Maximum temperature 260 , sustained 10 seconds

Target temperature peak (TP target) 260+0/­5

Actual peak (tP) 5 Duration 20~40秒

Tilt cooling Maximum 6 / sec

Time (t) from the desired peak temperature was adjusted to 25 Maximum 8 minutes

8. Schematic

Figure 5 ESP-12F Schematic

9. Product Trial

(1) Taobao shop: Shenzhen Shun Technology Co., Ltd. may

(2) micro-channel public number

(3) Technical Support E-mail: support@aithinker.com