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Sun™ SPOT Main Board Technical Datasheet Rev 8.0 Revision 8 manufactured after October 2010 Sun Labs October 2010 Oracle America, Inc. 16 Network Circle Menlo Park, CA 94025 Document Revision 2.0.1

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Sun™ SPOTMain Board Technical DatasheetRev 8.0 Revision 8 manufactured after October 2010

Sun LabsOctober 2010

Oracle America, Inc.16 Network CircleMenlo Park, CA 94025Document Revision 2.0.1

Page 2: eSPOT8ds

Copyright © 2010, Sun Microsystems, Inc. All rights reserved.

Copyright © 2010, Oracle and/or its affiliates. All rights reserved.

This software and related documentation are provided under a license agreement containing restrictions on use and disclosure and are protected by intellectual

property laws. Except as expressly permitted in your license agreement or allowed by law, you may not use, copy, reproduce, translate, broadcast, modify,

license, transmit, distribute, exhibit, perform, publish, or display any part, in any form, or by any means. Reverse engineering,disassembly, or decompilation of

this software, unless required by law for interoperability, is prohibited.

The information contained herein is subject to change without notice and is not warranted to be error‐free. If you find any errors, please report them to us in

writing.

If this is software or related software documentation that is delivered to the U.S. Government or anyone licensing it on behalf of the U.S. Government, the

following notice is applicable:

U.S. GOVERNMENT RIGHTS. Programs, software, databases, and related documentation and technical data delivered to U.S. Government customers are

ʺcommercial computer softwareʺ or ʺcommercial technical dataʺ pursuant to the applicable Federal Acquisition Regulation and agency‐specific supplemental

regulations. As such, the use, duplication, disclosure, modification, and adaptation shall be subject to the restrictions and license terms set forth in the applicable

Government contract, and, to the extent applicable by the terms of the Government contract, the additional rights set forth in FAR 52.227‐19, Commercial

Computer Software License (December 2007). Oracle America, Inc., 500 Oracle Parkway, Redwood City, CA 94065.

This software or hardware is developed for general use in a variety of information management applications. It is not developed or intended for use in any

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and its affiliates disclaim any liability for any damages caused by use of this software or hardware in dangerous applications. 

Oracle and Java are registered trademarks of Oracle and/or its affiliates. Other names may be trademarks of their respective owners.

AMD, Opteron, the AMD logo, and the AMD Opteron logo are trademarks or registered trademarks of Advanced Micro Devices. Intel and Intel Xeon are

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International, Inc. UNIX is a registered trademark licensed through X/Open Company, Ltd.

This software or hardware and documentation may provide access to or information on content, products, and services from third parties. Oracle Corporation

and its affiliates are not responsible for and expressly disclaim all warranties of any kind with respect to third‐party content, products, and services. Oracle

Corporation and its affiliates will not be responsible for any loss, costs, or damages incurred due to your access to or use of third‐party content, products, or

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                                                                                                                                                                                                                                                                                                ______________________________________________________________________________________________________________________________________________

Copyright © 2010, Sun Microsystems, Inc. Tous droits réservés.

Copyright © 2010, Oracle et/ou ses affiliés. Tous droits réservés.

Ce logiciel et la documentation qui l’accompagne sont protégés par les lois sur la propriété intellectuelle. Ils sont concédés sous licence et soumis à des

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ce soit. Par ailleurs, il est interdit de procéder à toute ingénierie inverse du logiciel, de le désassembler ou de le décompiler, excepté à des fins d’interopérabilité

avec des logiciels tiers ou tel que prescrit par la loi.

Les informations fournies dans ce document sont susceptibles de modification sans préavis. Par ailleurs, Oracle Corporation ne garantit pas qu’elles soient

exemptes d’erreurs et vous invite, le cas échéant, à lui en faire part par écrit.

Si ce logiciel, ou la documentation qui l’accompagne, est concédé sous licence au Gouvernement des Etats‐Unis, ou à toute entité qui délivre la licence de ce

logiciel ou l’utilise pour le compte du Gouvernement des Etats‐Unis, la notice suivante s’applique :

U.S. GOVERNMENT RIGHTS. Programs, software, databases, and related documentation and technical data delivered to U.S. Government customers are

ʺcommercial computer softwareʺ or ʺcommercial technical dataʺ pursuant to the applicable Federal Acquisition Regulation and agency‐specific supplemental

regulations. As such, the use, duplication, disclosure, modification, and adaptation shall be subject to the restrictions and license terms set forth in the applicable

Government contract, and, to the extent applicable by the terms of the Government contract, the additional rights set forth in FAR 52.227‐19, Commercial

Computer Software License (December 2007). Oracle America, Inc., 500 Oracle Parkway, Redwood City, CA 94065.

Ce logiciel ou matériel a été développé pour un usage général dans le cadre d’applications de gestion des informations. Ce logiciel ou matériel n’est pas conçu nin’est destiné à être utilisé dans des applications à risque, notamment dans des applications pouvant causer des dommages corporels. Si vous utilisez ce logiciel

ou matériel dans le cadre d’applications dangereuses, il est de votre responsabilité de prendre toutes les mesures de secours, de sauvegarde, de redondance et

autres mesures nécessaires à son utilisation dans des conditions optimales de sécurité. Oracle Corporation et ses affiliés déclinent toute responsabilité quant aux

dommages causés par l’utilisation de ce logiciel ou matériel pour ce type d’applications.

Oracle et Java sont des marques déposées d’Oracle Corporation et/ou de ses affiliés.Tout autre nom mentionné peut correspondre à des marques appartenant à

d’autres propriétaires qu’Oracle.

AMD, Opteron, le logo AMD et le logo AMD Opteron sont des marques ou des marques déposées d’Advanced Micro Devices. Intel et Intel Xeon sont des

marques ou des marques déposées d’Intel Corporation. Toutes les marques SPARC sont utilisées sous licence et sont des marques ou des marques déposées de

SPARC International, Inc. UNIX est une marque déposée concédée sous licence par X/Open Company, Ltd.

Ce logiciel ou matériel et la documentation qui l’accompagne peuvent fournir des informations ou des liens donnant accès à des contenus, des produits et des

services émanant de tiers. Oracle Corporation et ses affiliés déclinent toute responsabilité ou garantie expresse quant aux contenus, produits ou services émanant

de tiers. En aucun cas, Oracle Corporation et ses affiliés ne sauraient être tenus pour responsables des pertes subies, des coéts occasionnés ou des dommages

causés par l’accès à des contenus, produits ou services tiers, ou à leur utilisation.

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The Basestation and Free Range SPOT

Features• 400 MHz ARM 926ej-S Processor AT91SAM9G20• 8Mbytes Flash Memory (4M x 16)• 1Mbytes SRAM Memory (512K x 16)• 802.15.4 Radio Transceiver (CC2420)• USB 2.0 Full Speed• 770mAhr Li-Ion Rechargeable Battery

DescriptionThe Sun SPOT platform is the main processor board, eSPOT, running the Java “Squawk” VMand is an IEEE 802.15.4 wireless network node. An application board can be attached to theeSPOT main board

The eSPOT has flexible power management and can draw from the rechargeable battery orthe USB host, or be externally powered.

The Sun SPOT is designed to be a flexible development platform, capable of hosting widelydiffering application modules. The Sun SPOT development kit, as supplied, contains twodifferent configurations. One of the configurations includes a demonstration applicationmodule, the eDemo board.

The configurations supplied in the kit are:

● Basestation SPOT - The basestation has an eSPOT main board without a battery or anapplication board. Power is supplied by a USB connection to a host workstation. Thebasestation serves as a radio gateway between other Sun SPOTs (and theoretically other802.15.4 devices) and the host workstation.

● Free Range SPOT - This unit contains the main board with a rechargeable LI-IONprismatic battery and an example of an eSPOT daughterboard, the eDEMO board.

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Block Diagram

Signal Description

J2 Hirose DF17 Receptacle

Pin Signal Name Signal Type Description

1,2 V_EXT Power +5V +/-5% at 500mA input power to the SPOT

3 USB_HOST_P Bidirectional USB Host Data Differential – Positive

4 MISO1 Input SPI MISO (Master In Slave Out) data Channel 1

5 USB_HOST_N

Bidirectional USB Host Data Differential – Negative

6 SCLK1 Output SPI SCLK (Clock) Channel 1

7 I2C_CLK Output I2C SCK (Clock)

8 MOSI1 Output SPI MOSI (Master Out Slave In) data Channel 1

9 I2C_DATA Bidirectional I2C SDA (Data)

10 EXT_INn Input External Interrupt (Active low)

11 VSTBY Power +3V at 35ma output power from the SPOT (always on)

12 CS_A0 Output SPI Address A0. Address range 0 to 7. Must be stable

10/30/10 Oracle – SPOT Datasheet -5-

3.7V 770mAh Li-ion battery

16.000MHz ChipconCC24202.4GHz

Transceiver

AtmelATmega168V

Power Controller

TITPS797303.0V LDO

AtmelAT91SAM9G20

18.432MHz

NumonyxM29W640GB704M x 16 Flash

AnalogADG819Switch

Top Connector

ESDProtectionUSB

Mini-B

SPI 0

BALUN

Vstby

USB Host

I2C

I2S

USART

GPIO

3.0V

VstbyVext

3.0V

Vstby

VusbVext

3.0V

32.000KHz

PowerIndicator

Status LED

Attention

1.0V

SPI 1

Alliance MemoryAS6C8016-55

512K x 16 SRAM

USB Device

SPI 1

US

B C

ontr

olP

ower

Con

trol

LinearLTC2487

16-bit ADC

TIREF30252.5V Ref

LinearLTC3455

Charger/Reg

I2C

Adr, Data, RW, CS

Cur

rent

Sen

se

Bat

tery

Vol

tage

3.0V 1.0V

0.1

IRQ1

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Pin Signal Name Signal Type Description

prior to BD_SELx.

13 P13 Multifunction Can be programmed as GPIO (PB4), UART (TXD0) orEthernet (EMDIO).

14 CS_A1 Output SPI Address A1. Address range 0 to 7. Must be stableprior to BD_SELx.

15 P15 Multifunction Can be programmed as GPIO (PB5), UART (RXD0).

16 CS_A2 Output SPI Address A2. Address range 0 to 7. Must be stableprior to BD_SELx.

17 VCC Power +3V at 400mA output power from the SPOT (on whenrunning, pulled to 0V during deep sleep)

18 BD_SEL1n Output SPI board select 1 active low.

19 P19 Multifunction Can be programmed as GPIO (PB30), UART (PCK0),Ethernet (EMDC or SSC (PCK0).

20 BD_SEL2n Output SPI board select 2 active low.

21 P21 Multifunction Can be programmed as GPIO (PA18), UART (TXD2),Ethernet (ERXER) or Timer (TCLK0)

22 P22 Multifunction Can be programmed as GPIO (PA19), UART (SCK0),Ethernet (ETXCK), Timer (TIOA0) or SSC (TF0)

23 P23 Multifunction Can be programmed as GPIO (PA15), UART (RXD2),Ethernet (ERX1), SD Card (MCCK) or SSC (RF0)

24 P24 Multifunction Can be programmed as GPIO (PA16), UART (SCK2),Ethernet (ETXEN), SD Card (MCCDA), Timer (TIOB0)or SSC (TK0)

25 P25 Multifunction Can be programmed as GPIO (PA14), UART (TXD3),Ethernet (ERX0), SD Card (MCDA3) or SSC (RK0)

26 P26 Multifunction Can be programmed as GPIO (PA12), UART (SCK3),Ethernet (ETX0), SD Card (MCDA0) or SSC (TD0)

27 P27 Multifunction Can be programmed as GPIO (PA17), UART (RXD3),Ethernet (ERXDV) or SC Card (MCDA2)

28 P28 Multifunction Can be programmed as GPIO (PA13), UART (PCK1),Ethernet (ETX1), SC Card (MCDA1) or SSC (RD0)

29,30 GND Power Ground Return

Pin numbers are for the Hirose DF17 interboard connector on the SPOT main board andconnects to an application board like the eDEMO. The pin numbering for the signals ismirrored from the main board to the bottom mating connector of the application board.

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Theory of Operation

The eSPOT main board is host to a 32bit 400MHz ARM9 processor running a Java VM,2.4GHz network radio transceiver and power management circuitry. The PC board measures1.5" wide and 2.5" high. It is an eight layer 47mil thick FR4 board built to RoHS-6 compliance.It contains 244 components, 91 on top and 153 on bottom.

Main Processor The main processor is the Atmel AT91SAM9G20 in a 247 pin fine pitch ball grid array. Theprocessor is an ARM926ej-s and its package is 10mm x 10mm with 0.5mm ball pitch. TheARM9 processor core voltage is 1V and I/O voltage is 3V. It has 64K internal ROM which isnot used and two internal 16K SRAM that are used. Peripherals actively used are USB 2.0device, dual USART, three timer/counters, dual SPI interface, TWI (I2C) interface, JTAG TAPcontroller and external bus interface (EBI). The 133MHz EBI connects over a 16 bit data busto an 8 megabyte Flash memory (4M x 16) and a 1 megabyte SRAM (512K x 16). TheEthernet MAC, USB 2.0 host, 10 bit ADC (3 channels) and SD/MMC interface are connectedbut not used. The SDRAM controller, image sensor controller, and watchdog timer are notused nor are all GPIO, ADC, or UART pins used. Two GPIO lines control a user-definable bi-color LED nearest to the USB connector. Green LED is controlled by Port A bit 27 (PA27) andRed LED is controlled by Port C bit 7 (PC7). Power is removed from the ARM9 during deepsleep and does not use the battery back up/real time clock portion of the internal powermanagement module.

The 8Mbyte Flash memory is Numonyx M29W640GB70 organized as 4M x 16 bits with70nsec access time and 30nsec page access time (4 word pages). It is in a 6mm x 8mm 48pin fine pitch ball grid array package. It is powered with 3V and shut down during deep sleepmode. The first 64KBytes are write protected externally from the power controller. There are128 bytes of customer lockable extended block (one time writable) which is programmed withthe 64-bit IEEE extended unique identifier by the factory. The IEEE EUI is read-only and is aconcatenation of a 24-bit company code (OUI) with a 40-bit extension unique for each SPOT.

The 1Mbyte SRAM is an Alliance Memory AS6C8016 with 55nsec access time. The SRAM isin 6mm x 8mm 48 pin fine pitch ball grid array package. It is powered by 3V at all times andwill retain all memory contents during deep sleep.

The basic memory map for the ARM9 is :

Start End Description

0x00200000 0x00203FFF 16Kbyte Internal SRAM1

0x00300000 0x00303FFF 16Kbyte Internal SRAM2

0x10000000 0x107FFFFF 8Mbyte External Flash (CS0)

0x20000000 0x200FFFFF 1Mbyte External SRAM (CS1)

0xF0000000 0xFFFFFFFF Internal Peripheral IO

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Power CircuitryThe SPOT can be powered by a rechargeable battery, USB power or externally connected 5Vsupply. USB power and/or externally connected power can charge the battery and run the restof the SPOT. Most of the circuitry can be shut down for long periods of time to preservebattery (deep sleep). During deep sleep, the SRAM is kept powered to retain state so theSPOT can be woken up quickly and resume where the program left off.

The SPOT uses a Linear Technology LTC3455 integrated battery charger and dual switcherin a 4mm x 4mm 24 pin quad flat package(QFN). The current mode step down switchers runinternally at 1.5MHz and output 3.0V at 500mA max current (USBHP enabled) and the 1Vcore voltage at 200mA max current. The 3V switching regulator is similar to the LTC3406switcher and the 1V core voltage switcher similar to the LTC3405 switcher. The 3V switchercan be turned off with the ON2 signal and the 1V switcher can be turned off using an externalMOSFET connected to the switcher 1 feedback line through a 43.2K resistor and Vstby. TheSPOT can go into deep sleep shutting off the switchers while still powered through USB tocharge the battery.

A low quiescent current (1.2uA) low dropout regulator (LDO), TI TPS79730 regulates thebattery voltage to 3V for the always-on standby power, Vstby. An Analog Devices ADG819SPDT solid state SPDT switch switches between the high current 3V switcher during run timeand the 3V low current standby power from the LDO during deep sleep. The LDO has a powergood line which goes low if the output voltage drops below 2.7V. Power good deasserted willhold the power controller in reset to prevent it from malfunctioning at low voltages.

The SPOT battery is an external prismatic lithium-ion Sanyo LP523436D battery with 770mAhcapacity and a nominal voltage output of 3.7V. It measures 38.5mm wide x 41.5mm high and6.9mm thick. The battery is equipped with a Nexcon RPOPJ800 protection circuit and protectsfor over voltage (4.275V), over current (3A), and under voltage (2.3V). The battery connectsthrough a Molex 51021-0200 two pin inline connector to a pigtail. The battery positive terminalis the red wire and negative terminal is the black wire. The black wire is not ground ratherpasses through a low side current sense resistor to ground. The mating battery connector isMolex 51047-0200.

The power is managed by the power controller, an 8-bit 8MHz Atmel ATmega168microcomputer powered by 3V standby voltage (Vstby). The power controller has a 32KHzcrystal for real time clock providing date and time at millisecond accuracy (64bit Javamillisecond time). The power controller communicates with the ARM9 over a SPI interface,SPI1 which is shared with the external SPI connection. This SPI interface is buffered by74LVC3G34 which isolates the ARM9 from the active circuitry during deep sleep. Theinterrupt button connects to the power controller and is used to shutdown, wake-up andinterrupt the ARM9. A bicolor LED (red/green) indicates power state of the ARM9. The powercontroller internal analog to digital converter (ADC) monitors switcher voltages, externalvoltage and USB voltage. It indicates a fault condition if they are more than 5% out of range.

A Linear Technology LTC2487, an external 16-bit 4 channel ADC, is used to monitor batteryvoltage, current and ambient temperature. The ADC has a TI REF3025 as an external 2.5Vreference with 0.2% accuracy. The reference and battery voltage divider can be switched off

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(REF_EN) by the power controller to minimize current. The LTC2487 interfaces to the powercontroller over I2C (TWI) and sleeps when I2C is inactive. The ADC uses a low side currentsense resistor to measure the current into and out of the battery. The power controllermonitors the health and state of the battery using this ADC. The battery ADC is read every200ms cycling between current, voltage and temperature measurements. Voltage andtemperature measurements are taken every 1.6 seconds and current measurements taken forall other 200ms intervals.

The power controller sets the USB suspend (USB_ENn) and USB high power (USBHP) on theLTC3455 through instructions from the ARM9.

The power controller must sequence power for the ARM9 on wake-up and shutdown. Duringdeep sleep state, the power controller goes to sleep except for the real time clock counter. It iswaken up by external interrupts like the pushbutton and every 256 milliseconds for updatingthe real time clock. On wake-up, the power controller temporarily delays external interrupts,turns on the switchers and watches 3V switcher (VCC) to become stable. Once VCC is stable,it enables back up voltage to the ARM9 and that causes the ARM9 to issue a power oninternal reset. The external reset on the ARM9 is not used. Once power is stable and theinternal ARM9 reset is active, the power controller enables its own SPI channel and externalinterrupts.

On power off, the power controller notifies the ARM and waits a period of time so it can teardown any peripheral before shutting down. The tear-down time can be extended up to 32seconds or terminated immediately. There is no tear-down for deep sleep. After tear-down,the backup voltage and switchers are shut off, and signals which might cause sneak paths,like FIQ, are shut down.

The power controller manages a 32bit watchdog counter with 256ms ticks. The watchdog canbe set between 256ms and about 34 years. If the watchdog is not reset at a regular intervalfrom the ARM9, it will shutdown the ARM9, wait 150ms and restart it as a cold boot. Thepower controller does self test and fault analysis. While running, it continually scans voltageand current for out of range values.

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Symbol Target Error states

VCC 3.0V ±10% < 2.7V or > 3.3V power fault

Vcore 1.8V ±10% < 1.62V or > 1.98V power fault

Vusb 5.0V ±10% < 4.5V or > 5.5V power fault

Vext 5.0V ±10% < 4.5V or > 5.5V power fault

Idischarge < 500ma > 500ma power fault

Vbatt > 3.25V < 3.25V indicates low battery

Vbatt > 3.05V < 3.05V indicates dead battery

Icharge < 5ma > 5ma indicates charging

Network RadioThe wireless network communications uses an integrated radio transceiver, the TI CC2420(formerly ChipCon). The CC2420 is IEEE 802.15.4 compliant and operates in the 2.4GHz to2.4835GHz ISM unlicensed bands. Regulations for these bands are covered by FCC CFR47part 15 (USA), ETSI EN 300 328 and EN 300 440 class 2 device (Europe) and ARIB STD-T66(Japan). Please check with country statutes for appropriate operation.

The IC contains a 2.4GHz RF transmitter/receiver with digital direct sequence spreadspectrum (DSSS) baseband modem with MAC support. Other features include separate TXand RX 128 byte FIFOs, AES encryption (currently not supported), received signal strengthindication (RSSI) with 100dB sensitivity and transmit output power setting from -24dBm to0dBm. Effective bit rate is 250kbps and chip rate is 2000kChips/s. Receive sensitivity is-90dBm.

The digital control and data communications with the CC2420 use PIO port bits and the SPIchannel. The CC2420 is a slave SPI bidirectional device addressed when RF_CS (PCS2) isasserted active low. PIO ports reset the CC2420 (RF_RST), power it down (RF_PWDOWN),or check the status of the receive FIFO (FIFO and FIFOP), clear channel assessment (CCA)and start of frame (SFD).

There are 33 configuration and status registers, 15 command registers and two 8-bit registersfor the separate transmit and receive FIFOs. The first byte sent to the CC2420 is the addressmade up of 6-bit address, RAM/Register select (Bit 7) and Read/Write select (Bit 6). Followingbytes are data read from or written to the CC2420.

The CC2420 is housed in a 7mm x 7mm 48pin quad leadless package (QLP or QFN). It ispowered with +3.0V VCC supply. The CC2420 has an internal 1.8V low drop out regulator forpowering the internal RF and analog circuitry. It consumes 20ma during receive operation and18ma for 0dBm transmit. The frequency generation uses an accurate 16MHz crystal with±10ppm accuracy, ±10ppm stability and ±1ppm aging. The entire RF section is enclosed in anupper and lower RF shield and has modular FCC approval.

802.15.4 channel assignments are shown in the tables below.

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Channel Center Frequency Channel Center Frequency

11 2405MHz 19 2445MHz

12 2410MHz 20 2450MHz

13 2415MHz 21 2455MHz

14 2420MHz 22 2460MHz

15 2425MHz 23 2465MHz

16 2430MHz 24 2470MHz

17 2435MHz 25 2475MHz

18 2440MHz 26 2480MHz

The output power can be adjusted by the PA_LEVEL register, a 6 bit field.

PA_Level and output power are shown in the tables below.

PA_LEVEL OutputPower

PA_LEVEL OutputPower

31 0dBm 15 -7dBm

27 -1dBm 11 -10dBm

23 -3dBm 7 -15dBm

19 -5dBm 3 -25dBm

For more information, see the CC2420 data sheet on the www.ti.com (RF/IF Components)The 802.15.4 standard can be retrieved from standards.ieee.org.

AntennaThe antenna is an inverted-F antenna printed on the top layer of the printed circuit board. It istuned to 2450MHz and has a characteristic input impedance of 115 unbalanced. This is afolded monopole 1/4 wave with reasonable omnidirectional radiation. The antenna is matchedto the balanced RF output of the CC2420 using a lumped-LC network. The RF output is alsobiased by the TXRX_SWITCH output of the CC2420 through a RF blocking filter.

The antenna section of the eSPOT should be kept away from all metal objects. If mounted ona motherboard, there should be no PCB traces or power planes under or around the antennasection. If possible, the eSPOT should be mounted so that the antenna is located on the edgeof the board.

The FCC certification does not allow an external antenna to be connected to the eSPOT.

10/30/10 Oracle – SPOT Datasheet -11-

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MechanicaleSPOT main board 1.50” wide x 2.50” length x 0.325” deptheSPOT basestation 1.67” wide x 2.80” length x 0.71” deptheSPOT freerange 1.67” wide x 2.80” length x 0.92” deptheSPOT basestation weight: 30geSPOT freerange weight: 62g

Operating Characteristics

Absolute Maximum RatingsOperating Temperature with battery charging 0°C to 45°COperating Temperature with battery discharging -20°C to 60°COperating Temperature without battery -20°C to +75°CStorage Temperature with battery -20°C to +35°CStorage Temperature without battery -40°C to +85°CeSPOT DC Current per I/O pin 8.0maMaximum External/USB voltage 6.0V

DC CharacteristicsSymbol Description Condition Min Typ Max Units

Vext External Voltage 4.5 5.0 5.5 V

Vbatt Battery Voltage 3.1 3.7 4.2 V

Vusb USB Voltage 4.5 5.0 5.5 V

Iusb USB Current Limit Vusb = 5.0V, USBHP = '1' Vusb = 5.0V, USBHP = '0

44060

47580

500100

mAmA

Iext External Current Vext = 5.0V, no eDemo Vext = 5.0V, with eDemo

300

500

mAmA

Ibatt Battery Current - noattached board

Deep SleepIdle Normal

55

20

65TBD50

75

144

µA mAmA

Icharge Charge Current Vusb = 5.0V, USBHP = '1' Vusb = 5.0V, USBHP = '0' Vext = 5.0V 425

400 50 500

470 90 575

mA mA mA

Vlow_batt Low battery indication 3.25 V

Istby_max Externally availablestandby current

J2-11 Vstby = 3.0V 25 mA

ICC Attached board current VCC = 3.0V 380 mA

VOL Output low level voltage IOL= 0 to 8ma 0.2 0.3 0.4 V

VOH Output high level voltage IOH= 0 to 8ma 2.6 2.7 2.8 V

10/30/10 Oracle – SPOT Datasheet -12-

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Symbol Description Condition Min Typ Max Units

VIL Input low level voltage -0.3 0.8 V

VIH Input high level voltage 2.0 2.7 V

AC Characteristics

Module Min Nom Max Units

SPI0 1000 Kbps

SPI1 to LED Controller 500 Kbps

SPI1 to external/power controller 263 Kbps

TWI 100 Kbps

USART 127 115200 8332800 Baud

Flash Memory (tcycle) 75 nsec

SRAM (tcycle) 60 nsec

USB 4.09 Mbps

The AC characteristics are measured values from the SPOT running default software. Forspecific AC characteristics, please consult the individual component datasheets.

10/30/10 Oracle – SPOT Datasheet -13-

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BATTERY WARNING

Do not short-circuit battery. A short-circuit may cause fire, explosion, and/or severe damage tothe battery.

Do not drop, hit or otherwise abuse the battery as this may result in the exposure of the cellcontents, which are corrosive.

Do not expose the battery to moisture or rain. Keep battery away from fire or other sources ofextreme heat. Do not incinerate.

Exposure of battery to extreme heat may result in an explosion.

No other battery substitutions or different chemistry batteries should be used.

Do not bypass the battery protection circuit.

Dispose of batteries properly. Do NOT throw these batteries in the trash. Recycle yourbatteries, if possible.

10/30/10 Oracle – SPOT Datasheet -14-

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Federal Communications Commission ComplianceNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to providereasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed andused in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particularinstallation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouragedto try and correct the interference by one or more of the following measures: Reorient or locate the receiving antenna. Increase the separation between the equipment and receiver.Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

The Sun SPOTs are supplied with a shielded USB cable. Operation with a nonshielded cable could cause the Sun SPOTs to not be in compliance with the FCC approval for thisequipment. The antenna used with this transmitter must not be colocated or operated in conjunction with any other antenna or transmitter; to do so could cause the Sun SPOTs to not be incompliance with the FCC approval for this equipment. Any modifications to the Sun SPOTs themselves, unless expressly approved, could void your authority to operate this equipment.

FCC Declaration of Compliance:Responsible Party: Oracle America, Inc., 500 Oracle Parkway, Redwood Shores, CA 94065; Phone: US +1.650.506.7000; International +1.650.506.7000FCC IDENTIFIER: UDM3011This device complies with Part 15 of the FCC Rules. Operation is subject to the following conditions: this device may not cause harmful interference and this device must accept anyinterference received, including interference that may cause undesired operation.

This device can be used as is (stand-alone) or as a module (part of a final host product). If the device will be used a module these rules must be followed:Caution: Exposure to Radio Frequency Radiation.To comply with FCC RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this device and all persons. This device must notbe co-located or operating in conjunction with any other antenna or transmitter.Module 3011 and antenna tested with must be integrated in the end product in such a way that the end user cannot access the either the module, cables or antennas.The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population;consult Safety Code 6, obtainable from Health Canada's website www.hc-sc.gc.ca/rpb.

Integrator must place a label outside their product similar to the example show below:

OEM Manufacturer name

Contains transmitter moduleFCC ID: UDM3011UPN: 1894B-3011Model: 3011

10/30/10 Oracle – SPOT Datasheet -15-

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Sunspot Wireless Network Processor Project

8.2.2

9/16/2010 1:41:41 PM

Title

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Sheet ofTime:

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(C) 2010 Oracle Corporation

Micro / Memory

Micro_Memory.SchDoc

Radio Chip

Radio.SchDoc

Power Supply

Power_Supply.SchDoc

I/O Connector

IO_Connector.SchDoc

eSPOT

Rev 8.2.2

ATMega

ATMega.SchDoc

USB

USB.SchDoc

Micro / Power

Micro_Power.SchDoc

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Micro / Memory

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9/16/2010 1:41:41 PM

Title

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(C) 2010 Oracle Corporation

R48

10K

C390.1uF

1000mA

FB8

600 C401.0uF

C410.1uF 1000mA

FB9

600 C421.0uF

VCC

VSRAM

R36 10K

R43 10KJTAGSEL

R39 10KVCC TMS

R40 10KVCC TCK

R41 10KVCC TDO

R42 10KVCC TDI

R58 10KVCC MISO1

R57 10KVCC BD_SEL1

R56 10KVCC BD_SEL2

R53 10KRF_PDOWN

R52 10KVCC RF_CS

R50

270

R49

270VCC

LED1

LED2

A

C1

C2

RG

LED2

RED/GRN LED

R71 100K

R38 NL

R74 NL

R75 NLBD_REV0

BD_REV1

BD_REV2

A1A2A3A4A5A6A7A8A9A10A11A12A13A14A15A16A17A18A19A20A21

WE

OE

CS_ROM

VDDBU_EN

A22

WP

D0D1D2D3D4D5D6D7D8D9D10D11D12D13D14D15

VCC

A7D4

LBA1

WEG5

A8H2

A11H5

A3B3

A6C4

UBB2

CEB5

A12G3

A15F4

A2A5

A5C3

A18H1

A9H3

A13G4

A1A4

A4B4

A17D3

A10H4

A14F3

A0A3

VSS D1

DQ1C5

DQ6 F6

A16E4

OEA2

DQ9 C1

DQ3 D5DQ4 E5

DQ13 F2

DQ15G1

DQ0 B6

DQ10 C2

VCC D6

VCC E1

DQ12 E2

DQ7 G6

VSS E6

DQ8 B1

DQ2 C6

DQ11 D2

DQ5 F5

DQ14 F1

U12 512K x 16 SRAM

A1A2A3A4A5A6A7A8A9A10A11A12A13A14A15A16A17A18A19

WE

OE

BS0

BS1

D0D1D2D3D4D5D6D7D8D9D10D11D12D13D14D15

C1090.1uF

CS_RAM

VDDBU_ENVSRAM

VCCBUSY BUSY

C1120.1uF

VDDBU_EN = LOW -> Y = HIGH

VDDBU_EN = HIGH -> Y = CS_RAMIN11

IN26

GND 2

VCC 5

IN03 Y 4

U11

74AUP1G57

M29W640GB70

AS6C8016 55ns

VCC_FLASH

VCC_SRAM

C1181.0uF

C1171.0uF

D0D1D2D3D4D5D6D7D8D9D10D11D12D13D14D15

BS1

BS0

WEOE

CS_ROMCS_RAM

A1A2A3A4A5A6A7A8A9A10A11A12A13A14A15A16A17A18A19A20A21

TRSTTMSTCKTDOTDI

JTAGSEL

USB_DEV_PUSB_DEV_NUSB_HOST_PUSB_HOST_N

SCLK0MOSI0MISO0

I2C_CLKI2C_DATA

CS_A0CS_A1CS_A2

BD_SEL1

RF_RSTRF_PDOWNFIFO

FIFOP

CCA

SFD

RF_CS

BD_SEL2

ARM_FIQ

VCC

BD_REV3

BD_REV1BD_REV0

A22

PC24 / D24 K1PC25 / D25 L3PC26 / D26 L2PC27 / D27 N4PC28 / D28 P4PC29 / D29 R3PC30 / D30

P3PC31 / D31 M2

PC8 / CFCS0 / CS4 B16PC9 / CFCS1/ CS5 C11PC13 / FIQ / CS6 B13PC12 / IRQ0 / CS7 C12PC15 / IRQ1 / WAIT G1

PC0 / AD0 T3PC1 / AD1 T4PC2 / AD2 U3PC3 / SPI_CS3 / AD3 U4

PC7 B11

PC6 A16

PA0 / SPI0_MISOR10 PA1 / SPI0_MOSIP11 PA2 / SPI0_SCLKT9PA3 / SPI0_CS0P12 PA4 / RTS2R11 PA5 / CTS2R12 PA6 / MCDA0T10 PA7 / MCCDA

P13 PA8 / MCCKT11 PA9 / MCDA1P14 PA10 / ETX2 / MCDA2R13 PA11 / ETX3 / MCDA3T12PA12 / ETX0U9 PA13 / ETX1U10 PA14 / ERX0U11 PA15 / ERX1U12 PA16 / ETXENU15PA17 / ERXDVU14 PA18 / ERXERU16 PA19 / ETXCKU13 PA20 / EMDCT14 PA21 / EMDIO

R14 PA22 / ETXER / ADTRGT16 PA23 / TWDR15 PA24 / TWCKR16 PA25 / TCLK0P16PA26 / TIOA0P15 PA27 / TIOA1T17 PA28 / TIOA2L14 PA29 / SCK1R17 PA30 / RXD4 / SCK2N15PA31 / TXD4 / SCK0N14

PB0 / SPI1_MISON16 PB1 / SPI1_MOSIM14 PB2 / SPI1_SCLKM15 PB3 / SPI_CS0M16 PB4 / TXD0K14 PB5 / RXD0P17 PB6 / TXD1N17

PB7 / RXD1M17 PB8 / TXD2L16 PB9 / RXD2L15 PB10 / TXD3T5 PB11 / RXD3P5PB12 / TXD5R5 PB13 / RXD5P6 PB14 / DRXDL17 PB15 / DTXDK17 PB16 / TK0

J17 PB17 / TF0K15 PB18 / TD0H17 PB19 / RD0J15 PB20 / RK0U5PB21 / RF0U6 PB22 / DSR0T6

JTAGSELF16

TDIJ16 TDOJ14 TCKH15 TMSG17TRSTH16

RSTG15

PB23 / DCD0R6 PB24 / DTR0P7 PB25 / RI0U7PB26 / RTS0R8 PB27 / CTS0U8 PB28 / RTS1R9 PB29 / CTS1T8

HDMAE15 HDPAE14 DDMD13 DDPC13

BS0 / A0 A2WR2 / BS2 / A1 A3A2 C4A3 B5A4 C5A5 D5A6 A4A7 B6A8 A5A9 C6A10 D7

SDA10B4

A11A6A12 B7A13 A7A14 C7A15 B8

BA0 / A16 A8BA1 / A17 C8A18 A9A19 C9A20 B9A21 A10A22 A11SPI1_CS2 / PC4 / A23 A17SPI1_CS1 / PC5 / A24 A15CFW / PC10/ A25

B12

CS0 A14SDCS / CS1 B3PC11 / CS2 B14PC14 / NANDCS / CS3 B15

CFOE / RDA13CFWE / WE / WR0 A12CFIOR / BS1 / WR1 B2CFIOW / BS3 / WR3 A1

SDCKB1SDCKEG3

RASD3 CASC3 SDWEF2

D0 D4D1 C2D2 D2D3E3D4 E4D5 E2D6 F3D7 G2

D8 C1D9 D1D10 E1D11 H4D12 H3D13 F1D14 H2D15 K3

SPI0_CS2 / PC16 / D16J4SPI0_CS3 / PC17 / D17 J2SPI1_CS1 / PC18 / D18 H1SPI1_CS2 / PC19 / D19 J1SPI1_CS3 / PC20 / D20 K2

PC21 / D21 K4PC22 / D22 M4PC23 / D23 N3

HDPBD14

HDMBC14

PB30 / PCK0P9 PB31 / PCK1P10

NANDWE B10

RTCKG16

NANDOE C10

WKUP B17

SHDN C17

U7A

AT91SAM9G20

ARM_MISOARM_MOSIARM_SCLK

P13P15TXD1RXD1

AVR_CS

P13P19

P21P22

P22

P23

P23

P24

P24

P24

P24

P25

P25

P25

P26

P26

P26

P27

P27

P27

P28

P28

P28

P26

LED1

LED2

BD_REV2

P19P28

P22P23

P21

P22

P23

P24

P25P27

R61 0BD_REV3 R65

10K

WP

A3A1

A7A2

READY / BUSY A3

WEA4

A9A5

A13A6

A4B1

A17B2

VPP / WPB3

RESETB4

A8B5

A12B6

A2C1

A6C2

A18C3

A21C4

A10C5

A14C6

A1D1

A5D2

A20D3

A19D4

A11D5

A15D6

A0E1 DQ0 E2

DQ2 E3

DQ5 E4

DQ7 E5

A16E6

VSS H1

CEF1

DQ8 F2

DQ10 F3

DQ12 F4

DQ14 F5

OEG1

DQ9 G2

DQ11 G3

VCC G4

DQ13G5

DQ15 G6

VSS H6

DQ1 H2

DQ3 H3DQ4 H4

DQ6 H5

BYTE F6

U8

4M x 16 FLASH

RTCK

(IRQ0)

17

U13ASN74LVC3G34

35

U13BSN74LVC3G34

6 2

U13CSN74LVC3G34

VCC

MISO1

MOSI1

SCLK1 ARM_SCLK

ARM_MOSI

ARM_MISO

SCLK1

MOSI1

MISO1

C810.1uF

ARM_RST

TP

TP

SPARE1

R68 10KVCC TRST

(RESET)

(RESET)

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Chipcon CC2420 Transceiver

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C5 22pF

C6 22pF

C15

0.01uF

C2

0.5pF

L15.6nH

C40.5pF

VC

O_G

UA

RD

1

AV

DD

_V

CO

2

AV

DD

_P

RE

3

AV

DD

_R

F1

4

GND5

RF_P 6

TXRX_SWITCH 7

RF_N 8

GND9

AV

DD

_S

W10

AV

DD

_R

F2

14

AV

DD

_IF

215

AV

DD

_A

DC

17

DV

DD

_AD

C18

DGND_GUARD19

DG

UA

RD

20

RESET21

DGND22

DSUB_PADS23

DSUB_CORE24

DV

DD

3.3

25

DV

DD

1.8

26

SFD27 CCA28 FIFOP29 FIFO30

CS31

SCLK32 SI33 SO34

DV

DD

_RA

M35

AV

DD

_X

OS

C37

XOSC16_Q2 38

XOSC16_Q1 39

DIE_PAD49

VREG_EN41

VR

EG

_OU

T42

VR

EG

_IN

43

AV

DD

_IF

144

R_BIAS45

ATEST246 ATEST147

AV

DD

_C

HP

48

U1CC2420

C16

10uF

100mA

FB3

600 C7

0.01uF

C8

0.01uF

C9

0.01uF

100mA

FB2

600

C10

0.01uF

C11

0.01uF

C12

0.01uF

C13

0.01uF

C14

0.01uF1%

R22

C18

10uF

C17

0.01uF

100mA

FB1

600

L27.5nH

C1

5.6pF

L3

7.5nH

C3

5.6pF

1%

R1

43.2K

VCC

16 MHz +/- 10 ppmY1

TSX-3225

ANT1

F ANT

RF_PDOWN

RF_CSRF_RST

SCLK0MOSI0MISO0

SFDCCA

FIFOPFIFO

RF_PDOWN

RF_RSTRF_CS

FIFOFIFOPCCASFD

MISO0MOSI0SCLK0 GND

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C88

10uFC89

0.1uF

USB_DEV_P

USB_DEV_N

USB_DEV_P

USB_DEV_N

USB_PWR_MON

V_USB

1%

R66

3.32K

12345

J3

USB Mini Type B

16

25

4 3

U9

STF202

1%

R673.32K

USB_PWR_MON

R55

1

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1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

J2

DF17-30-R

TOP CONNECTOR

VSTBY

VCC

V_EXT V_EXT

USB_HOST_N

USB_HOST_P

I2C_CLK

I2C_DATA

TDO

TCK

TDI

TMS

AVR_RES

TRST

TXD1

RXD1

TXD1

RXD1

I2C_CLK

I2C_DATA

USB_HOST_P

USB_HOST_N

VCC

PAD1

PAD2

PAD3

PAD4

PAD5

PAD6

PAD7

PAD8

PAD9

PAD10

PAD11

PAD12

PAD13

PAD14

PAD15

TCK

TDI

TDO

TMS

V_EXT

TS1SMF5.0

PAD16

PAD17

V_EXT

V_USB

TRST

AVR_RES

FID1Fiducial

FID2Fiducial

FID3Fiducial

FID4Fiducial

FID1

FID2

FID3

FID4

P15

P27

P13

P19

P23

P25

P21

P27

P25

P23

P21

P19

P13

P15

SCLK1

MOSI1

MISO1

EXT_INT

CS_A0

CS_A1

CS_A2

P24

P26

P28

BD_SEL1

P22

BD_SEL2

P22

P24

P26

P28

MISO1

MOSI1

SCLK1

EXT_INT

CS_A0

CS_A1

CS_A2

BD_SEL2

BD_SEL1

SCLK1

MOSI1

MISO1 MISO1

MOSI1

SCLK1

SCL PAD19SCL

PAD18SDA SDA

SPARE_PAD1

SPARE_PAD2

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R25

270

C350.1uF

C360.1uF 100mA

FB7600

VSTBY

AVR_CS

PWRON

100mA

FB6600

C340.1uF

AVR_RES

EXT_INT

SDA

SCL

C31

0.1uF

C30 22pF

C32 22pF

Active High

AVR_CS

3.0V 10mA

V_IN4

GND2 PG 1

V_OUT 5U6

TPS79730

C370.1uF

C381.0uF

BATT

VSTBY

R28 1K

ARM_FIQ

VCORE

EXT_PWR_MON

R22

270VSTBY

R2310K

VSTBY

VSTBY

VCC

VSRAM

R26100K

C3310uF

USB_PWR_MON

(3.0V)

EN_SWITCHERS

Normally Low

Y232.000 KHz

VCC

1%

R321.00K

1%

R343.32K

A

C1

C2

RG

LED1

RED/GRN LED

S28

D 1

S12

GND 3

VDD 4

IN6

U10

ADG819

C910.1uF

C900.1uF

ARM_FIQ

R29

100K

EXT_INT

IN=0: S1 -> DIN=1: S2 -> D

AVR_RES

SW1EVQ-P7C01K

VCC_MON

USB_PWR_MON

EXT_PWR_MON

PWRON

EN_SWITCHERS

R45

10KVSTBY

R51 NLVSTBY

D2

BAT43W

V_MAX

D3

BAT43W

C9810uF

LDO_PWR

AVR_RES

(BATT_MON_EN)

HIGH = ONLOW = OFF

(TEMP)

(I_CHRG)

(I_DSCHRG)

(V_BATT)

(3V = 2.306V)

SDA

SCL

USB_EN

USB_HP

USB_EN

USB_HP

V = 0.7685*Vcc

VSTBY

SCLK1

MOSI1

MISO1

MOSI1

MISO1

SCLK1 VDDBU_ENVDDBU_EN

(SLUG) GND 0

INT1 / PD3 1

T0 / XCK / PD4 2

GND 3

VCC 4

GND 5

VCC 6

PB6 / XTAL17

PB7 / XTAL28

T1 / PD5 9

AIN0 / PD6 10

AIN1 / PD7 11

PB0 / ICP112

PB1 / OC1A13

PB2 / SS14

PB3 / MOSI / ISP_SDI15

PB4 / MISO / ISP_SDO16

PB5 / SCK / ISP_CLK17

AVCC 18

ADC619

AREF 20

GND 21

ADC722

PC0 / ADC023

PC1 / ADC124

PC2 / ADC225

PC3 / ADC326

PC4 / ADC4 / SDA27

PC5 / ADC5 / SCL28

PC6 / RESET29

RXD / PD0 30

TXD / PD1 31

INT0 / PD2 32

U5

ATmega168V

AT91SAM9G20 Startup Sequence:

Set PWRON = HighSet EN_SWITCHERS = High

Wait 150 us for RC clock to startSet VDDBU_EN = HighWait for 1.0V and 3.0V to stabilize

VDDBU_EN

REF_ENREF_EN

WP WP

Active High

Active High

C821000pF

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16 Network CircleMenlo Park, CA 94025

8

AT91RM9200 Power

8.2.2

9/16/2010 1:41:42 PM

Title

Size: Number:

Date:

Revision:

Sheet ofTime:

B

(C) 2010 Oracle Corporation

R69

10K

C670.1uF

100mA

FB15600 VCC

VCC

1000mA

FB10600 VCORE

C760.1uF

1000mA

FB16600

C690.1uF

C720.1uF

C660.1uF

C520.1uF

C550.1uF

C580.1uF

C560.1uF

C590.1uF

VCC

1000mA

FB11600

C8633pF

C8733pF

Y318.432 MHz

C620.1uF

C600.1uF

VDD_IOM

VDD_IOP

VDD_CORE

C7710uF

C5110uF

C5310uF

VDD_IOMD11

GNDD6

VDD_CORE D9

GNDD8

VDD_IOMG4

GNDF4

VDD_PLL N2

GND_PLL T2

XO

UT

P1

XIN

N1

GND_ANAR2

XO

UT

32E

17

XIN

32D

17

VDD_PLL P2

GND_PLL U1

VDD_IOPP8

GNDG14

VDD_IOPU17

GNDH8

VDD_CORE M1

GNDH9

GNDH10

GNDJ8

GNDJ9

TST F17

VDD_CORE T13

GNDJ10

GNDK8

VDD_IOMJ3

GNDK9

GNDK10

VDD_CORE H14

GNDK16

GNDL1

GNDM3

GNDR7

GNDT7

GNDT15

GND_BUE16

GND_USB D10

GND_USB D12

VDD_BUD16

VDD_ANAR4

AD_VREFU2

VDD_OSC L4

NC C15

NC D15

NC R1

NC T1

VDD_USB C16

BMS F15

OSCSEL F14

U7B AT91SAM9G20

BMS

C610.1uF

C650.1uF

R761

C744.7uF

C710.01uF

C790.1uF

100mA

FB14600

R701

C734.7uF

C700.01uF

C780.1uF

C630.1uF

C640.1uF

100mA

FB12600VCC

R621

C544.7uF

C570.01uF

C500.1uF

R64

10K

C480.1uF

C490.1uF

C800.1uF

VCORE

VDDBU_EN

Q4BSS138

1000mA

FB13600

C6810uF

C750.1uF

VCC

R63

10K

R54

10K

VCOREVDD_PLL

XO

UT

32

XIN

32

TP TP

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16 Network CircleMenlo Park, CA 94025

8

Power Supply / Battery Charger

8.2.2

9/16/2010 1:41:42 PM

Title

Size: Number:

Date:

Revision:

Sheet ofTime:

B

(C) 2010 Oracle Corporation

C2010uF

USB8

SUSPEND6

USBHP5

V_MAX 10

MODE 21

ON2 19

CHRG 4

WALLFB11

TIMER3

GND (SLUG)25

PROG2

AO 17

SW1 7

FB1 1

HSI 13

SW2 12

FB2 18

HSO 14

HSON 15

PBSTAT 23

ON24

RST 20

PWRON22

VBAT9

AI16

U2

LTC3455

C2410uF1%

R14226K

C2210pF

1%

R1580.6K

C2810uF1%

R1825.5K

C2710pF

1%

R21102K

R1010K

1%

R12

2.49K

C23

0.1uF

C2110uF

R81

V_USB

R2010K

C2610uF

USB_EN

USB_HP

VCC

C2910uF

1000mA

FB5

600

VCORE

PWRON

C2510uF

1000mA

FB4

600

V_USB

R11

10K

USB_HP

USB_EN

R910K

VCC

C1910uF

R51

V_EXT

V_EXT

1%

R33.32K

1%

R61.24K

EXT_PWR_MON

D1MBR130

1.0V 200mA

3.0V 500mA

3.0V = 512mA

1%

R43.32K

1%

R73.32K

R7210K

R44NL

V_MAX

R3543.2KQ1

IRLML6402

VSTBY

EN_SWITCHERS

EN_SWITCHERS

HIGH = ONLOW = OFF

BATT

R171K

L4

4.7uH

L5

4.7uH

1

3

J1

eSPOT PWR

BATT

Q2IRLML6402

Q32N7002

R33100K

R37100K

1%

R4610.2K

1%

R473.4K

Fo 1

CA1 3

CA0 2

SCL 4

SDA 5

GN

D6

COM7

CH08

CH19

CH210

CH311

Vcc

12

RE

F+

13

RE

F-

14

SLU

G15

IN+

IN-

Temp

Sensor

4 Ch

Mux16 BIT ADC

U4LTC2487

SDA

SCL

1% 100ppm

R160.1

C4610uF

C470.1uF

Battery +

Battery -

BATT

VBATT

VBATT

BATT_RET

VBATT

SDA

SCL

R5910K

R6010K

R24 1K

2.5V 0.15%

V_IN1

GND3

V_OUT 2U3

REF3025

C430.1uF

C441.0uF

C450.1uF

R30 1K

V_REF

R27 1K

10.2K/3.4K is 4:1 ratio (0.25*Vbatt)FS = 1.25V FS Battery = 5V

REF_EN

R31 1K

Differential Input Range: (Vref / Gain) * 0.5Vref = 2.5Gain = 16Input Range = 0.07813VIma = ADC_value * 781.3 / 65535

CHRG

VSTBY

PAD20

PAD21

ORACLE

LOGO1

PCB LOGO

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