EuroSimE, 18-20.04.2011, Linz, Austria

••• 1EuroSimE, 18-20.04.2011, Linz, Austria

Trends of Micro- and Nanoelectronics in the European

R&D Programme

Vesselin Dontchev

Nanoelectronics Components and Systems

Information Society & Media Directorate-GeneralEuropean Commission

Disclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission


Presentation outline

Europe 2020 – a new strategy for the EU Current EC funding of EU Research (ICT in

particular) Nanoelectronics- Examples of research

projects dealing with simulation Today’s opportunities: ICT WP 2011-12 Information on the future programme (2014+) Summary

••• 3

• Smart Growth: knowledge and innovation economy• Sustainable growth: greener and competitive economy• Inclusive growth: high employment, knowledge people and social and territorial cohesion

EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth

5 EU Targets – translated into national ones

7 Flagship initiatives – EU & national action

A new strategy - EUROPE 2020

EuroSimE, 18-20.04.2011, Linz, Austria

http://ec.europa.eu/avservices/download/photo_download_en.cfm?id=206048



••• 4

Europe 2020: 5 EU Headline Targets (translated in national and regional ones)

By 2020: • 75 % (now 69) employment rate (% of population aged 20-64 years)

• 3% (now 1,8 % only) investment in R&D (% of EU’s GDP)

• “20/20/20” 20% cut in greenhouse gas emissions (compared to 1990)20% increase in use of renewable energy

20% cut in energy consumption through improved efficiency

• < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree

• 20 million less people (now 80) should be at risk of poverty




Europe 2020 – a new strategy for the EU Current EC funding of EU Research

(ICT in particular) Nanoelectronics - Examples of research


••• 6

EUROSTARS

PEOPLE

Capacities (INFRASTRUCTURES)

IDEAS - ERC SMEs and SME Associations

ICT-FET (Flag Ships)

COOPERATION

Joint

Programming

Ageing (More Years Better Lives) Climate Knowledge (Clik-EU)Seas and OceansAntimicrobial resistanceUrban EuropeWater challenges

The EU’s research and innovation landscape

DeploymentFundamental Applied InnovationDevelopment

EC Funds

National and

Regional Funds

Eureka!ERANET+

ERANETJTI Artemis, Eniac Clean Sky, IMI, FCH Art. 169 AAL

Bonus EMRP

PPP

PPP (recovery packages)Energy Efficient BuildingsFuture of FactoriesGreen carsFuture Internet

CIP competitiveness &innovation programme

••• 7

FP7: total of 50 B€ (2007-13)

Ideas; 7510; 15%

JRC; 1751; 3%

Cooperation; 32413; 65%

People; 4750; 9%

Capacities; 4097; 8%

FP7: Council/Parliament Co-decision


5 major specific programmes:

••• 8

FP7 Cooperation Specific Programme

Socio-economic sciences and the

humanities

Security

SpaceHealth

Food, agriculture,

biotechnologyTransport

Nanosciences, nanotechnologie

s, materials, production

technologies

Environment

EnergyICT -

Information and

Communication Technologies

9.1 B€ (2007-13)

+700M€ for eInfrastructures from the Capacities programme


10 key thematic areas:

••• 9••• 9

Futu

re &

Em

ergi

ng

Tech

nolo

gies

(FET

)

1. Network and Service Infrastructures

ICT for socio-economic challenges

Bas

ic IC

T te

chno

logi

es &

in

frast

ruct

ures

~10% ~9%

~11%

International cooperation, Horizontal actions

3. Components and Systems

4. Digital Content and Languages

2. Cognitive Systems and Robotics

5. ICT for Health, Ageing, Inclusion & Gov.

~26%

~6%

~17%

~7%

~11%6. ICT for Lower-Carbon Economy

~12%

7. ICT for Manufac. & Enterprise

8. ICT for Learning & Cultural Resources

~6% ~4%

+JTIs

+AAL

PPP

2 PPPs

incl FI PPP

Challenges in the ICT programme 2011-2012 (What is the money spent on?)

••• 10

M€ 2007 2008 2009 2010 2011 2012 2013 TOTAL

FP7 ICT 1 189 1 217 1 227 1 241 1 382 1 582 1 760 9 598

CIP 58 52 105 113 120 135 149 732

Financial support – FP7: master & shape research & development– CIP: ensure wider uptake & better use of research– + Regional and Structural Funds,…

FP7-CIP/ICT Budget Profile:


2nd half of FP7 – significant increase of funding !

••• 11

• In 2011, the FP7 ICT Programme is in its 5th year of implementation

• 7 main calls have been launched and evaluated– Total number of projects ~1200

• Launch of two JTIs and AAL initiative– 4 Calls launched for ENIAC with 130 M€ (EC

contribution) 4th call is ongoing

• WP 2011-12 done, WP 2013 (1.76 B€) is in preparation

ICT in FP7: Where do we stand?


••• 12

• ICT in the FP supports collaborative R&D projects– industry - academia from at least 3 MS or AS– Project size between 3M€ and 20 M€ of funding– 4 to 20 partners per project

• Supports ~17 000 researchers and engineers/year

• During 2007-10 – ~ 5000 distinct organisations, ~14000 participations– ~ 1250 projects running (FP6 + FP7)

ICT in FP7





particular) Nanoelectronics - Examples of research



AtomicsAdvanced Front-End Technology Modeling

for Ultimate Integrated Circuits

FP6 IST programme

Consortium

BudgetTotal Cost: 4.4M€EC : 2.5 M€

OBJECTIVESDevelopment of TCAD models suitable for

a) materials (strained and unstrained SiGe alloys, strained Si, SOI, etc);

b) processes (activation and diffusion of dopants, formation of extended defects, including low-temperature and millisecond annealing, point-defect engineering)

employed at the 32 nm technology node and beyond.

MOTIVATIONTCAD can save 30% development time and costs (ITRS 2008)

ExampleDependence of dopant solubility on strain (Ahn et al. PRB 2009)

The models are- implemented in simulation software Sentaurus (Synopsys)- validated with respect to industrial needs (STM)

http://www.iisb.fraunhofer.de/en/arb_geb/atomics.htm


AtemoxAdvanced Technology Modeling

for Extra-Functionality Devices

BudgetTotal Cost: 4.1M€EC Contribution: 2.85 M€

ConsortiumObjectives - extend the capabilities of TCAD to the prediction of - leakage currents in CMOS structures- the alternative doping processes considered for a reduction of leakage currents.Key Issues• Full set of missing models for simulating leakage currents in

CMOS derivatives → providing extra functionality to the basic NE technology with sizes 22 nm CMOS transistors.

• Implementation and integration of the models into the Sentaurus TCAD platform of Synopsys.

• Evaluation of the integrated models by STMicroelectronics.

Expected impact Predictive simulations of CMOS derivatives in industrial

environments at an early stage of development. Significant reduction of development time and costs. Extending the EU knowledge and skills in NE Competitiveness of EU industry in CMOS derivatives

http://www.atemox.eu/

http://cordis.europa.eu/fp7/home_fr.html




particular) Nanoelectronics - Examples of research projects

dealing with simulation Today’s opportunities: ICT WP 2011-12 Information on the future programme (2014+) Summary

••• 17

ICT Work Programme 2011-2012

Challenge 3: Alternative Paths to Components and Systems

Objectives:3.1. Nanoelectronics 3.2 Smart components and smart systems3.3 Embedded systems 3.4 Computing Systems 3.5 Photonics3.6 Organic Electronics and Photonics

••• 18

Objective 3.1: Very Advanced Nano-electronics Components

Target outcomes:• Beyond CMOS technology• Circuit - technology solutions • Nano-manufacturing and Joint Equipment

Assessment • Coordination and Support Actions

Call 8

60M€



••• 19

Two complementary funding schemes

FET Proactive• Top-down approach• Set of novel pre-defined themes

FET Open• Bottom-up approach• Open to any research idea

Nano-electronics related topics with EU funding ~ 30M€/year:Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based ICT and Towards zero power ICT

Future & Emerging Technologies – FETSupporting high-risk transformative research in ICT



••• 20

European vision of the More Moore and More than Moore domains

More than Moore: Diversification

Moo

re’s

Law

: M

inia

turiz

atio

n

Bas

elin

e C

MO

S: C

PU, M

emor

y, L

ogic

130nm

90nm

65nm

45nm

32nm

22nm

Extended CMOS

Analog/RF Passives HV Power SensorsActuators Biochips

InformationProcessing

Digital content System-on-Chip

(SoC)

Interacting with people and environmentNon-digital content SoC & System-in-

Package (SiP)Combining SoC and SiP: Higher Value Systems

Beyond & Extended CMOS technologies need to meet the criteria of systemability, integratability and manufacturability

Nanoelectronics”Small, smaller, smarter”

- Advanced components in advanced systems enabling pervasive applications -

Beyond CMOS

••• 21

• To ensure interaction between system competences and device technology to better incorporate the device in a system to perform a given function.

• To address energy efficiency needs (e.g. for mobile applications).

• Nanoelectronics devices as system enablers should provide solutions for global challenges

• To prepare for “beyond” traditional shrinking (ITRS roadmap)

35 nmGate Length

Objective 3.1: Advanced Nanoelectronics Technology

S y s t e m a b i l i t y


••• 22

ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms.

• Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep the impact of its results on the applications and markets.

• Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures.

• Integrateability of novel technology with CMOS and their reliability become key factors.

Objective 3.1: Advanced Nanoelectronics Technology

I n t e g r a t a b i l i t y


••• 23

European equipment and material companies i) Access to nano-manufacturing and to advanced technologies positive feedback ii) Joint assessment and demonstration platform

Evidence of reproducible equipment parameters Stimulate the access to world wide equipment market

(especially important for SMEs)

Semiconductor Equipment for Wafer Bonding with Plasma Activation

EV Group, CEA-LETI, Soitec

3D Integration of Bulk Si WafersEV Group, CEA-LETI,

STMicroelectronics Crolles II

Low Energy and Dose Implant TestSEMILAB, Fraunhofer IISB,

ST Microelectronics Crolles II,NXP Crolles R&D

Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic

Device GenerationsAIXTRON, Fraunhofer IISB, Infineon

Munich

Metrology Using X-Ray TechniquesJordan Valley, CEA-LETI,

STMicroelectronics Crolles II,NXP Crolles R&D

Objective 3.1: Manufacturing and Equipment assessment


M a n u f a c t u r a b i l i t y • Concept to be taken into account at early stages of research• From prototype to a reliable manufacturing of devices with predefined

reproducible parameters.

••• 24

1. Phenomena and Effects * Quantum and atomic scale ; * Electro-thermo-mechanical* Transport (drift, diffusion ); * System integration at the nanoscale

2. New materials * Graphene; Gemanene; * CNT;* Nanowires; * Complex magneto-electric lattices.

3. Devices* New switches (+molecular) and interconnects; * Emerging memories;* Ferromagnetic logics; * Spin devices; * Nano-photonics devices and interconnects; * Carbon based; * MEMs, NEMs

4. Models for cross technology and cross IP level simulation

5. Multi-physics and multi-scale models, which can predict devices and circuits up to non-equilibrium systems.

Objective 3.1 Modelling and simulation

Modeling & Simulation – increasing importance (save costs !) models measurements (challenging due to the miniaturization)

••• 25

Dates

Open: 26 July 2011 Close: 17 January 2012 (at 17:00 Brussels local time)

Funding schemes:a) Beyond CMOS technology: STREPs b) Circuit-technology solutions: STREPs and at least 1 IPc) Nano-manufacturing and joint equipment assessment: STREPs and at least 1

IPd) Support measures: CSAs

Indicative budget distribution - 60 M€: IP/STREP 55 M€ CSA 5 M€

Objective 3.1 Information about call 8

••• 26

ICT Proposers’ Day 201119 - 20 May, Budapest

Networking for European ICT R&D

• Aim of the event:to prepare for Calls 8 and 9 (together >1 B€)– by networking and partnerships building– by first-hand information from >100 EC officials

• Structure:– thematic sessions with presentations of proposal ideas– information stands & meeting points

• Registration: free of charge, open from January 2011

http://ec.europa.eu/ictproposersdayEuroSimE, 18-20.04.2011, Linz, Austria



Europe 2020 – a new strategy for the EU? Current EC funding of EU Research (ICT in particular) Nanoelectronics - Examples of research projects dealing

with simulation Today’s opportunities: WP 2011-12 Information on the future Common Strategic

Framework (CSF) for R&I funding (2014+) Summary

••• 28

What is next?

2010 2011 2012 2013 2014

FP7ICT WP 2011-12

ICT WP 2013

FP8 + CIPII CSF(Common Strategic Framework)

Preparatory work

Strengthen, focus & simplify EIPs

KETs

Light and fast

MAFF 2014+ Externalisation

• 9 Feb Green Paper• Feb-May Consultation based on Green Paper• 10/6 Consultation ‘wrap-up’ event in Brussels• June Proposal for next MAFF• Dec Legislative proposal(s) for CSF

••• 29

Common Strategic Framework (CSF) for EU R & I funding ( 2014+ )

Three key messages

• More clarity of goals and strategy, - Higher impact on competitiveness / society,

- More EU added value

• Simplification Procedures but also of programmes/instruments

→ To attract wider constituency, smaller entities

• Work across silos– research-innovation-policy priorities– between themes and disciplines– EU-MSs, public-private


• Limited set of funding schemes - common across all activities

• Unique Rules for Participation• Simplified cost-reimbursement

approach with enhanced use of lump sums and flat rates.

••• 30

3 sets of challenges, 4 types of activities, (funding schemes)” Draft

Some first and preliminary thinking (from ICT theme)


Common Strategic Framework for EU R&I funding (2014+)

A challenge oriented R&I frameworkA shift in the drive: From means/instruments to goals

Societal challenges

Industrial leadership

Excellence in science

Roadmap based partn.

(Focus)

Open, light (be flexible)

Infrastr., skills(attract)

Piloting (test,

duffuse)

e.g. Living labs

e.g. Clean rooms,

Innovation clusters

E-Infrastruct.

Pilots

Pilots

••• 31

Summary

EUROPE 2020 - renewed emphasis on R&D&I as a basis for smart, sustainable and inclusive

growth.

MAFF 2014+, CSF 2011-2012 is key for the preparation: New opportunities for improvements and for

holistic integrated views to face grand challenges (EU and global)

Nanoelectronics has a major input to these processes

Modeling & Simulation – increasing importance

Participate in Call 8 !!!

« Time is ready. Let us profit from these exciting times and take action ---- together -----”


••• 32

THANK [email protected]

Information Society and Media:http://ec.europa.eu/information_society

http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html

European research on the web:http://cordis.europa.euhttp://www.eniac.eu

!!!! Take part in the consultation processes !!!!!!!! 2011 is a year of change, you can influence the future !!!!

http://ec.europa.eu/yourvoice/consultations/index_en.htm



••• 34

State Variable

Device

Data Representation

Architecture

Material

SETs

Molecular

Spintronics Quantum

Scaled CMOS Ferromagnetic

Quantum

Analog

Digital

Reconfigurable

Morphic

Von Neumann

Silicon

Carbon

Macro molecules

Complex metal oxides

Qubit

Spin orientationMolecular state

Electric charge Strongly correlated electron state

Phase state

Multicore

Nanostructured mat’ls

Patterns

Polarization

State Variable

Device

Data Representation

Architecture

Material

SETs

Molecular

Spintronics Quantum


Quantum

Analog

Digital

Reconfigurable

Morphic

Von Neumann

Silicon

Carbon

Macro molecules


Qubit



Phase state

Multicore


Patterns

Polarization


State Variable

Device

Data Representation

Architecture

Material

SETs

Molecular

Spintronics Quantum


Quantum

Analog

Digital

Reconfigurable

Morphic

Von Neumann

Silicon

Carbon

Macro molecules


Qubit



Phase state

Multicore


Patterns

Polarization

State Variable

Device

Data Representation

Architecture

Material

SETs

Molecular

Spintronics Quantum


Quantum

Analog

Digital

Reconfigurable

Morphic

Von Neumann

Silicon

Carbon

Macro molecules


Qubit



Phase state

Multicore


Patterns

Polarization


Systemability, integratability, manufacturability

Transversal Research ProjectsMulti-disciplinary

cooperation

-System-technology interaction-Nanofabrication-Energy efficiency-Next switch-Universal memory-3D integration-Novel architectures

- Advanced component technology + advanced system design- Beyond CMOS , Extended CMOS

For systems 2020 and beyond

Work Programme 2011-12General concepts

••• 35

Target outcomes

Beyond CMOS technology• New switches and interconnects with energy efficiency gain; • Emerging memories; • Nano-photonics devices and interconnects; • Carbon based electronic devices

Circuit-technology solutions • Architectures including energy efficiency, spin devices ferromagnetic logics, Si with molecular switches• Circuit design, methodology and tools addressing e.g. D-A-C• Technology addressing 3D integration, MtM, photon-electron integration, power dissipation, etc.• Modelling and simulation

Nano-manufacturing and Joint Equipment Assessment • Manufacturing approaches to Beyond CMOS and MtM and their integration with nanoCMOS including 3D• Metrology/inspection analysis concepts; assembly and packaging• Joint assessment of equipment/metrology, process solutions

Coordination and Support Actions • Access to training CAD tools, advanced technologies, design kits, education blocks, prototyping• Roadmap, benchmark and strategy papers• Stimulation of young people towards electronics careers, training, education• International cooperation – Japan, USA, Taiwan, Korea• Support coordination and standartisation actions, preparatory work for 450 mm

Objective 3.1: Very Advanced Nano-electronics Components

••• 36

ICT Work Programme 2013

• continuity with 2011-12 WP• effective bridge to the next CSF for R&I.

Budget: 1.53B€

Timing - three main phases: • Options and orientations: Sept.- Dec. 2011• Drafting: Jan. - March/April 2012• Decision: April/May-July 2012

••• 37


3 sets of challengesSocietal Challenges Health and wellbeing; Safe food and sustainable agriculture; Secure, clean

and efficient energy; Green transport; less congestion; Efficient use of resources & materials; Inclusive and safe society

Creating Industrial Leadership & Competitive Frameworks Leadership in enabling technologies & FET; Access to risk finance;

Integrating research, education and innovation; High potential SMEs

Excellence in the Research BaseFrontier research (ERC & FET), Skills and career development (Marie

Curie); Research infrastructures incl. eInfrastructures

A challenge oriented R&I frameworkA shift in the drive: From means/instruments to goals

••• 38

Four simplified funding schemes addressing:• Roadmap-based partnerships (focus !)

• Open, light and fast scheme (be agile, flexible! )

• R&I infrastructures, innovation clusters, skills (attract!)

• Pilot actions in real-life settings (test and diffuse!)


••• 39

• Limited set of funding schemes - common across all activities

• Unique Rules for Participation of the CSF that will provide a set of common principles applicable to all actions

• Radically simplified cost-reimbursement approach with enhanced use of lump sums and flat rates


Simplification

••• 40

Timeline

• February Green Paper• 4.02.2011 European Council devoted to research &

innovation• Feb-May Consultation based on Green Paper• 10.06.2011 Consultation ‘wrap-up’ event in Brussels• June Proposal for next MАFF• December Legislative Proposal(s) for CSF and impact

assessment


Documents

EuroSimE, 18-20.04.2011, Linz, Austria