EXPO SCHEDULE

9am - Registration Opens

9:15am - Mith Holzer, Alpha

Assembly Solutions

10am - Expo opens

12pm - Lunch

1:45pm - Courtney Tenhover

and Johnny Vanderford, Lorain

County Community College.

3pm - Expo Closes

Inside this issue:

Mitch Holzer 2

The Discrepanc y Be-

tween Ionic Contamina-

t ion and SIR Test ing in

Predict ing E lect r ical

2

Johnny Vanderford 3

Courtney Tenhover 3

MEMS & Microelectronics De-

gree, and Talent Development 3

Expo Exhibitors 4

Note from President 5

Golf Outing Success 5

Ohio Valley Leadership

Team 6

7/18/2016 THE CONNECTOR

Expo & Tech Forum

Thursday, August 4th, 2016

www.smta.org/expos/#ohio

Complimentary: Admission, Lunch, and Technical Sessions

Exhibit

Hours

10AM-3PM

Embassy Suites Cleveland Rockside

5800 Rockside Woods Boulevard

Independence (Cleveland), OH 44131

Contact Number

952-920-7682

Join us at the Embassy Suites - Cleveland Rockside for:

2 COMPELLING TECHNICAL PRESENTATIONS,

80+ Exhibitors and a COMPLIMENTARY lunch!

Click HERE for more information

Exhibit Hours: 10:00am - 3:00pm

Free to Attend but you must Pre-Register

to save a spot and secure your lunch!

A Special Thank You To Our Breakfast Sponsor:

A Special Thank You To Our CoffeeSponsor:

Mitch is the Global Director of Customer Technical Support for Alpha Assembly Solutions based in

South Plainfield, New Jersey. He’s been with Alpha since 1998, and is a native of Kalamazoo, Michigan. Prior to the CTS position Mitch has been Alpha’s Preform Global Product Manager, as well as Wave Soldering Flux and Alpha Solder Paste GPM. After becoming Director of Product Management in 2011, he

was promoted to Global R&D Director in 2013. Mitch is an active member of the IPC A-610, J-Standard 004, 005 and 006 standards committees. He is also a member of the Society of Automotive Engineers.

Mitch graduated from Purdue University with a Bachelor’s degree in Chemistry. He was also elected to the Sigma Pi Sigma National Physics Honor Society by A.A. Strassenburg, President of Purdue Univer-

sity in 1978. While at Purdue, he also worked as a laboratory technician, synthesizing novel organobo-

rane compounds for 1979 Chemistry Nobel Laureate Herbert C. Brown’s research group. He also holds

an MBA degree in Finance from Temple University. Mitch has published over 30 articles and has spoken

at over 25 IPC Apex, SMTAI International and local SMTA Chapter events.

Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of

flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and

wave soldering flux residues are suitable for reliable electronic assemblies. The Association Connect-

ing Electronics Industries (IPC), Japanese Industry Standard (JIS), Deutsches Institut fur Normung

(DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar

variations of this measurement.

Ionic contamination testing is recognized by the IPC as a standard for evaluating the cleanliness of assemblies that have subjected to a cleaning process. IPC J-STD001F calls for a cleanliness level of <

1.56 µg/cm² NaCl equivalent after the cleaning processes. Historically, this threshold originated from

the cleanliness specifications of military and aerospace original equipment manufacturers (OEMs).

These applications used rosin-based wave soldering fluxes, such as RMA’s, and cleaned with now pres-ently banned fluorocarbon solvents. Many of these applications have subsequently implemented water soluble soldering processes. Several automotive and consumer electronic OEM’s still use this stan-

dard, to qualifying assemblies built with no-clean materials using mixed SMT and PTH assembly tech-

nologies.

IPC-TM-650 Method 2.3.25 contains standard test methods for extracting contaminants from circuit

boards using heated isopropanol (IPA) / water mixtures. Test method 2.3.25 is commonly referred to

as the ROSE (Resistivity of Solvent Extract) test. Previous work [1,2] has shown poor correlation be-tween the presence of extractable, corrosive weak organic acids and results from IPC-TM-650 2.3.25 test results, partially due to the lack of solubility of materials found in no-clean fluxes, and the higher

SIR values imparted by rosins and resins in modern no-clean soldering materials. This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-

650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the

correlation of ROSE methods as predictors of electronic assembly electrical reliability

Page 2 Presenter

The D iscrepanc y Between Ion ic Contaminat ion and SIR Tes ting in Pred ict ing

E lectr ica l Re l iabi l i ty

Mitch Holzer - Alpha Assembly Solutions

Johnny Vanderford possesses a Master of Science and Engineering Degree in Electrical Engi-

neering, with a specialization in semiconductors and electronic materials, from Northern Illi-nois University. Johnny previously worked as a Senior Process Engineer with Greenfield Solar

and held positions with the Microelectronics Research and Development Laboratory prior to

that. Johnny currently works for SMART Microsystems as a Process and Packaging Engineer

and is also the MEMS and Microelectronics Instructor and Lab Director of the Center for Mi-

croelectronic Sensor Fabrication and Hybrid Board Assembly at Lorain County Community

College.

This presentation will review the history of the MEMS and Microelectronics degree at Lorain

County Community College and discuss the current status of the MEMS degree. We will also

present a new talent innovation program, TRAIN OH, which is an earn and learn model where

students will participate in a work based learning position with a local employer and attend

school at the same time to earn an Associate Degree. Finally, we will discuss an upcoming

course that will be offered at Lorain County Community College, Technical Publication and

Presentation.

Courtney Tenhover Courtney Tenhover possesses a Master Degree in Human Resources Management and a

Master Degree in Project Management. She previously worked in Human Resources and has worked in the re-

cruiting field on the industry side. Currently, Courtney works for Lorain County Community College as a Program

Developer where she is leading the adoption of talent innovation strategies to meet the needs of advanced indus-

try companies.

Page 3

MEMS & M icroe lectronics Degree, and Ta lent Deve lopment Strategies

Courtney Tenhover - Lorain Community College

Johnny Vanderford - Lorain Community College

Presenter

A-Tek LLC

Acculogic Inc.

ACE Production Technologies

ACL Staticide, Inc.

AGI Corporation

AIM

Alpha Assembly Solutions

American Standard Circuits

Amitron Corporation

Apex Factory Automation

Ascentec Engineering

Ascentech LLC - GEN 3

ASM Assembly Systems, LLC

Aven Inc.

BEST, Inc.

Bisco Industries

Botron/Caig Laboratories

BTU International

Conductive Containers

Conecsus LLC Digitaltest, Inc.

Electronic Assembly Products

Electronic Interconnect

Electrotek Corporation

EPTAC Corporation

ERSA North America

Excel Electronics

FCT Assembly, Inc.

Finetech

Fuji America Corporation

GPD Global

GSC/CN SALES

Hi-Tek Sales

Horizon Sales

HT Global Circuits

ICAPE Group

Indium Corporation

INVENTEC Performance Chemi-

cals

Juki Automation Systems

KOKI Solder America

KYZEN Corporation

Libra Industries

Lorain County Community College

Matric Group

MET Stencil

Metcal

Micro Systems Technologies, Inc.

MicroScreen

Midwest Circuit Technology

Millennium Circuits Limited

Murray Percival Company

OC White/M.E.O

Omron Inspection Systems

PACE Worldwide

Panasonic Factory Solutions

Company of America

PARMI

PFC Flexible Circuits

Photo Etch Technology

Pillarhouse USA

Professional Sales Purex, Inc.

PVA

RBB Systems, Inc.

Rehm Thermal Systems, LLC

REStronics

Saki America Inc.

SEHO North America

Seica Inc.

Seika Machinery

Smart Splice LLC

SMT Capital, LLC

StenTech Ltd.

The W.E.W. Co., Inc.

Thermaltronics USA

Tin Technology and Refining

Trans-Tec America

Transforming Technologies

Universal Instruments Corpo-

ration

Vi Technology

Viscom, Inc.

Weller

YXLON International

ZESTRON Americas

Page 4 Exhibitors

Hello Ohio Valley!

The officers of your chapter have been working very hard this year. We are committed to bringing you solid, in depth content at our meetings. We continue to investigate the hot buttons and your needs in our industry.

One of the resources we use to bring technology and knowledge to you is our annual Expo. This year we moved the Expo to a larger facility at the Embassy Suites Hotel in Independence, OH. This allows us to get more solutions out in front of everyone. We are on track to have record number of vendors this year promoting the latest and greatest in our industry.

I hope you are able to attend this year to see what’s new, improved and network with others in our in-dustry!

Brett Crane President Ohio Valley Chapter

Thanks to the 52 Golfers that were able to join us for our 1st Member Appreciation Golf Outing.

Thank you to our sponsors

Page 5

Golf Outing Success!

Note from the Pres ident

President Brett Crane bcrane@bird-technologies.com Bird Technologies Group 440-519-2309

Vice President Jeff Waterman jwaterman@libraind.com Libra Industries 440-974-7770

Treasurer Greg Vance gjvance@ra.rockwell.com Rockwell Automation 440-646-3246

Secretary Tim McArthur tmcarthur@deltasystemsinc.com Delta Systems, Inc. 330-422-5199 Chapter Advisor Ernie Woyma emjkw23@sbcglobal.net 440-725-3061

V.P. Membership North Bill Timms bill@timmssales.com SMT Capital, LLC 330-416-6993

V.P. Membership South Larry Roy larryroy@att.net SMT Capital, LLC 513-886-4040

V.P. Social Media Clifford Rhodes crhodes@bird-technologies.com Bird Technologies Group 440-519-2309

Event Coordinator Esther Beris eberis@channelproducts.com Channel Products Inc 440-423-0113 ext. 133

Chapter Liaison Steven Sekanina steven.sekanina@isola-group.com Isola Group 603-325 2317

Ohio Valley Chapter Leadership Team