12
Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Embed Size (px)

Citation preview

Page 1: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Facility meeting Nov. 2013GopalLithography Bay

Equipments:Laser writerEVG Mask alignerMJB4 mask alignerEVG Bonder

E-Line systemPioneer E-beam system

Page 2: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Raith e-Line off hrs

Raith e-Line non off hrs

Raith Pioneer off hrs

Raith Pioneer non off hrs

Used

105

131

NaN

136

196Not Used

Downtime

Unavailable

Total

50

150

250

Litho Equipments Utilization Chart.Nov.2013

Tota

l hrs

Page 3: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Laser writer (OH)

Laser writer (NOH)

EVG620 (OH)

EVG620 (NOH)

EVG501 (OH)

EVG501 (NOH)

MJB4 (TH)

Used 180 394 124 40 30 10 40

Not Used

0 146 56 320 150 350 140

Downtime

0 0 0 0 0 0 0

Un-available

0 0 0 180 0 180 540

Total 180 540 180 540 180 540 720

0100200300400500600700

Litho Equipments Utilization Chart. Nov. - 2013To

tal h

rs

Page 4: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Other Issues:• E-line- Laser resonator is replaced.•E-line was down(14,15thNov.)- Load lock switch was broken. Replaced with the spare switch got from local agent

•Bonder quartz bond glass plate got fabricated in CENTUM Local fabrication cost, about Rs.15000, EVG quoted about 1.25 lakhs. It is working….

Page 5: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Trend chart Nov. 2013 : E-line

Oct Nov Dec Jan Feb Mar Apr May Jun Jul Aug sept Oct Nov Dec0

5

10

15

20

25

30

9 10 10 1012 13 14 14 13 13 14 14

25 25

HSQ 120nm E-line

Month

CD in

nm

Page 6: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Trend chart. Nov.2013 : Pioneer

Jun Jul Aug Sept Oct Nov0

5

10

15

20

25

30

13 1315 15

25 25HSQ 120nm Pioneer

Month

CD in

nm

Page 7: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

July Aug Sep Oct Nov0

0.5

1

1.5

2

2.5

3

3.5

MJB4

1 Micron2 Micron3 Micron

Feat

ure

size

in M

icron

s

Resist: AZnLoFSpin coated at 3000rpm for 40 sec.Thickness: 2umSoft bake 1 min at 110CExposure for 8 seconds in MJB4Post exposure bake for 1 min at 110CDevelopment for 25 secs (AZ726MIF)

Trend chart: Nov.2013:

Page 8: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Trend chart : Nov.2013

Resist: AZ5214ESpin coated at 6000rpm for 40 secsThickness: 1 umSoft bake 1 min at 110CExposure 50 mJ/cm2 in EVG620Development for 18-20 secs (AZ351B 1:4)

May

JuneJuly

August

Septem

ber

October Nov

0

0.5

1

1.5

2

2.5

3

3.5

EVG 620

Series3Series5Series7

Months

Feat

ure

size

in M

icron

s

Page 9: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Laser writer trend from Nov-12 to Nov- 13

Nov Dec Jan Feb Mar Apr May June Aug Sep Oct Nov0

0.5

1

1.5

2

2.5

3

3.5

Laser Writer (Direct writing)

Series1Series3Series5

Months

Feat

ure

size

in M

icron

s

Resist: S1813Spin coated at 4000rpm for 40 secsThickness: 1.3 umSoft bake 1 min at 110CDose: Lens-5, Filter-3%, Gain-12, D-step-2, Pos speed -1Development for 38 secs (AZ351B 1:4)

Page 10: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Laser writer trend from Oct -13 to Nov- 13

Oct Nov0

1

2

3

4

5

6

2.2 2.1

3.2 3.2

5.2 5.3

Laser writer (Mask writing)

Series3Series5

Months

Feat

ure

size

in M

icron

s

Page 11: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

SEM image of Mask

Page 12: Facility meeting Nov. 2013 Gopal Lithography Bay Equipments: Laser writer EVG Mask aligner MJB4 mask aligner EVG Bonder E-Line system Pioneer E-beam system

Thanks