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TEST CAPABILITIES OpƟcal InspecƟon and external package analysis Scanning AcousƟc Microscopy (CSAM) LiveTime Xray Curve trace / Electrical characterizaƟon / Leakage Microprobing DecapsulaƟon: Jetetch and acid decapsulaƟon Wire bond pull tesƟng Ball shear tesƟng Die shear tesƟng Scanning Electron Microscopy (SEM) CrosssecƟonal Analysis Moisture sensiƟvity tesƟng & qualicaƟon (MSL) Dye and pry analysis Fourier Transform Interferometry (FTIR) Materials CharacterizaƟon: DierenƟal Scanning Calorimetric (DSC) Thermal Mechanical Analysis (TMA) Dynamic Mechanical Analysis (DMA) Thermal Gravimetric Analysis (TGA) Thermal ConducƟvity Microtek Laboratories offers a wide range of failure analysis and environmental services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies. Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased failure analysis performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products and improved yield. FAILURE ANALYSIS (F/A) Global Headquarters: Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A. eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com Global Leader in Test Technology and Expertise Copyright 2013 - Microtek Laboratories Scan to Learn More

Failure Analysis - 1-2013

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Page 1: Failure Analysis - 1-2013

TE

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PAB

ILIT

IES

Op cal Inspec on and external package analysis

Scanning Acous c Microscopy (CSAM)

Live‐Time X‐ray

Curve trace / Electrical characteriza on / Leakage

Microprobing

Decapsula on: Jet‐etch and acid decapsula on

Wire bond pull tes ng

Ball shear tes ng

Die shear tes ng

Scanning Electron Microscopy (SEM)

Cross‐sec onal Analysis

Moisture sensi vity tes ng & qualifica on (MSL)

Dye and pry analysis

Fourier Transform Interferometry (FTIR)

Materials Characteriza on:

Differen al Scanning Calorimetric (DSC)

Thermal Mechanical Analysis (TMA)

Dynamic Mechanical Analysis (DMA)

Thermal Gravimetric Analysis (TGA)

Thermal Conduc vity

Microtek Laboratories offers a wide range of failure analysis and environmental services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.

Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased failure analysis performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products and improved yield.

FAILURE ANALYSIS (F/A)

Global Headquarters:

Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.

eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com

Global Leader in Test Technology and Expertise

Copyright 2013 - Microtek Laboratories Scan to Learn More