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TE
ST
CA
PAB
ILIT
IES
Op cal Inspec on and external package analysis
Scanning Acous c Microscopy (CSAM)
Live‐Time X‐ray
Curve trace / Electrical characteriza on / Leakage
Microprobing
Decapsula on: Jet‐etch and acid decapsula on
Wire bond pull tes ng
Ball shear tes ng
Die shear tes ng
Scanning Electron Microscopy (SEM)
Cross‐sec onal Analysis
Moisture sensi vity tes ng & qualifica on (MSL)
Dye and pry analysis
Fourier Transform Interferometry (FTIR)
Materials Characteriza on:
Differen al Scanning Calorimetric (DSC)
Thermal Mechanical Analysis (TMA)
Dynamic Mechanical Analysis (DMA)
Thermal Gravimetric Analysis (TGA)
Thermal Conduc vity
Microtek Laboratories offers a wide range of failure analysis and environmental services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.
Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased failure analysis performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products and improved yield.
FAILURE ANALYSIS (F/A)
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
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