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Affordable high performance FEA modeling for the engineering desktopFEMAP - WHAT’S NEW IN 11.4.1
Maya HTT announces the following enhancements to the Thermal/Flow solver in FEMAP 11.4.1:
• Updated workflows for the GUI• New solver functionality• Distributed computing to enable parallel solving
Contemporary Graphical User Interface
• Dedicated Thermal/Flow Model Info pane, analogous to FEMAP Model Info pane
• Create loads, constraints, and other simulation entities by right-clicking in Thermal/Flow Model Info pane
• Thermal/Flow analysis solution set-up analogous to NX Nastran analysis, accessed by right-clicking on Analyses node
• Persistent navigator objects for loads, constraints, and other simulation entities
• Highlighting and display symbol support
Enhanced Thermal/Flow solver functionality
• FEMAP-NX Thermal/Flow solver synchronization• Benefit from latest core NX solver enhancements
Thermal solver highlights
• Parallelized solver• Improved adaptive time stepping• Enhanced thermal couplings
[email protected] | Tel: +1-800-343-6292 (US and Canada) | Tel: +1-514-369-5706 | femap.mayahtt.com
• Initial conditions from dissimilar meshes• Thermostat and active heater controller reports• Enhanced transient end time options• Hydraulic network enhancements
• Improved duct flow advection scheme• Duct-to-3D-CFD connections• Total temperature calculations
• Enhanced Orbit Visualizer• Preview orbit, spacecraft orientation, and calcula-
tion points• Rich set of visualization option
• Expanded output options for simulation results
Flow solver highlights
• Parallelized solver• Extended two-equation turbulence models• Large Eddy Simulation (LES) turbulence model• Fractional step scheme• Enhanced second-order discretization schemes• Enhanced freeze-flow and restart options• Static pressure and convective outflow boundary con-
ditions• New capabilities
• Homogenous gas mixtures• Immiscible fluid mixtures
• Expanded output options for simulation results
• Enhanced CGNS export
Parallel processing enhancements
• Parallel processing extended to entire solution se-quence for thermal and flow runs
• Distributed Memory Parallelization (DMP) of solvers means separate access to both CPU and RAM
• Execute up to 8 processes on a compute node with Ad-vanced Thermal & Flow licenses at no extra cost
About Maya HTT:
• Industry leading software developer and provider of engineering services in CAE, Product Lifecycle Man-agement (PLM) and Datacenter Infrastructure Manage-ment (DCIM)
• Extensive experience in design, analysis, systems inte-gration and deployment
• Specializing in mechatronics, thermal, fluid and struc-tural analysis, and composites
• Technological partner, software editor, and provider of Siemens CAD/CAE/PLM solutions for more than 30 years
• Over 130 technical specialists supporting our custom-ers worldwide
For more information about FEMAP®, please visit: http://femap.mayahtt.com