1
22 nd International Workshop on Thermal investigations of IC’s and Systems Budapest, Hungary 2123 September, 2016 Steering Committee Committee Chair: M. Rencz, BME, Hungary THERMINIC’16 committee: General Chair: C. Bailey,U Greenwich, London, UK Vice General Chair: S. Volz, CNRS, Ecole Centrale Paris Programme Chair: A. Poppe, BME Budapest Univ. of Technology and Economics, Hungary Publicity Chair: J. Parry, Mentor Graphics, UK Other Members of the Steering Committe: J. Janssen, NXP, The Netherlands W. Luiten, Philips, The Netherlands A. Napieralski, TU Lodz, Poland D. Schweitzer, Infineon, Germany B. Wunderle, TU Chemnitz, Germany V. Tsoi, Huawei, Sweden A. Ziaei, Thales, France Program committee: TBD Sponsored by: Commercial Sponsors: to be continued… Final Call for Papers The 22 nd THERMINIC Workshop will be held in the heart of Budapest, near the Danube, close to the most beautiful areas, to the main attractions and museums of the city, in a walking distance from the Royal Palace and the Castle of Buda. Thermal Phenomena, Simulation and Experiment Thermal Management of electronic component and systems Classical and modern thermometry and thermography Multiphysics simulation and field coupling Thermal interface materials Thermal modelling and investigation of packages Power Electronics High Temperature electronics Solid State Lighting / LED’s Thermal characterisation of micro and nano domains CFD modelling and benchmarking Advanced thermal materials Heat transfer on the nanoscale Thermal performance of interconnects Temperature mapping Electrothermal interactions Nanotechnology applications Flow visualisation Electronics Cooling Concepts Thermoelectric cooling Novel and advanced cooling technologies Subambient cooling Heat pipe assisted cooling 3D integration and cooling concepts Cooling concepts: air, liquid, etc Ultra low form factor air cooling ThermoMechanical Reliability Thermomechanical reliability Prognostics and Health Monitoring Lifetime modelling and prediction Damage and fracture mechanics THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical programme and exciting social events. We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics: Technical Programme will include oral talks, poster presentations, special sessions and invited talks given by prominent speakers. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results. The abstract template of THERMINIC 2016 is available: www.therminic2016.eu/wpcontent/uploads/2016/03/Therminic2016_Abstract_Template.doc.zip All abstracts will be doubleblind reviewed. Please, refer to the www.therminic.eu web page for information on past THERMINIC workshops and to the www.therminic2016.eu on THERMINIC 2016. In case you experience any problems with the submission process, please contact the local committee by at [email protected] Accepted contributions will be published in the Workshop proceedings, and archived in IEEE Xplore (provided they comply with specifications). THERMINIC papers can be searched through IEEE, Google scholar and other search engines. Final deadline for submission of abstracts: extended to 30 th May 2016 Notification of acceptance: 15 th June 2016 Submission of paper for workshop proceedings: 14 th August 2016 Vendors and Book Exhibitors are invited to offer products in the scope of the Workshop. Exhibitor space is available – please contact local committee for further details. Editors are invited to exhibit books. Venue: The workshop will take place in the (Budapest, Bem rkp. 1619, H1011, Hungary, artotels.com, Tel.: +361487 9487). Please check the Workshop website for details on hotel bookings and travel arrangements. Hotel rooms for THERMINIC attendees are offered at an approximate rate of 120 EUR/night at .

Final Call for Papers Steering Committee - THERMINICtherminic.eu/therminic/Therminic2016-CFP.pdf · Steering Committee Committee Chair ... J. Janssen, NXP, ... Damage and fracture

Embed Size (px)

Citation preview

Page 1: Final Call for Papers Steering Committee - THERMINICtherminic.eu/therminic/Therminic2016-CFP.pdf · Steering Committee Committee Chair ... J. Janssen, NXP, ... Damage and fracture

22nd International Workshop on 

Thermal investigations of IC’s and Systems

Budapest, Hungary21‐23 September, 2016 

 

Steering Committee Committee Chair: 

M. Rencz, BME, Hungary 

THERMINIC’16 committee:  General Chair: C. Bailey, U Greenwich, London, UK 

Vice General Chair: S. Volz, CNRS,  Ecole Centrale Paris 

Programme Chair: A. Poppe, BME Budapest Univ. of Technology and Economics, Hungary 

Publicity Chair: J. Parry, Mentor Graphics, UK 

Other Members of the Steering Committe: J. Janssen, NXP, The Netherlands 

W. Luiten, Philips, The Netherlands 

A. Napieralski, TU Lodz, Poland 

D. Schweitzer, Infineon, Germany 

B. Wunderle, TU Chemnitz, Germany 

V. Tsoi, Huawei, Sweden 

A. Ziaei, Thales, France 

Program committee: TBD  Sponsored by:  

 Commercial Sponsors:       to be continued… 

Final Call for Papers 

The 22nd THERMINIC Workshop will be held in the heart of Budapest, near the Danube, close to the most beautiful areas, to the main attractions and museums of the city, in a walking distance from the Royal Palace and the Castle of Buda.  

      

Thermal Phenomena, Simulation and Experiment Thermal Management of electronic component and systems  Classical and modern thermometry and thermography  Multi‐physics simulation and field coupling  Thermal interface materials  Thermal modelling and investigation of packages  Power Electronics  High Temperature electronics  Solid State Lighting / LED’s  Thermal characterisation of micro and nano domains  CFD modelling and benchmarking  Advanced thermal materials  Heat transfer on the nano‐scale  Thermal performance of interconnects  Temperature mapping  Electro‐thermal interactions 

Nanotechnology applications  Flow visualisation Electronics Cooling Concepts  Thermo‐electric cooling  Novel and advanced cooling technologies  Sub‐ambient cooling  Heat pipe assisted cooling  3D integration and cooling concepts  Cooling concepts: air, liquid,  etc  Ultra low form factor air cooling Thermo‐Mechanical Reliability  Thermo‐mechanical reliability   Prognostics and Health Monitoring  Lifetime modelling and prediction  Damage and fracture mechanics 

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special  occasion with  a  high  quality  technical  programme  and  exciting  social  events. We  invite  delegates  to consider submitting abstracts that are related to, but not limited to, the following topics: 

 

 

 

 

 

 

 

 

 

 

 Technical  Programme will  include  oral  talks,  poster  presentations,  special  sessions  and  invited  talks  given  by prominent speakers. Authors are invited to submit an abstract describing recent work.  Abstracts must detail the objectives of the work presented and demonstrate new results.  The abstract template of THERMINIC 2016 is available: www.therminic2016.eu/wp‐content/uploads/2016/03/Therminic2016_Abstract_Template.doc.zip   

All abstracts will be double‐blind reviewed. Please, refer to the www.therminic.eu web page for information on 

past THERMINIC workshops and to the www.therminic2016.eu on THERMINIC 2016. In case you experience any problems with the submission process, please contact the local committee by at [email protected]  

Accepted contributions will be published in the Workshop proceedings, and archived in IEEE Xplore (provided they comply with specifications). THERMINIC papers can be searched through IEEE, Google scholar and other search engines.  

Final deadline for submission of abstracts:                extended to 30th May 2016 Notification of acceptance:                                             15th June 2016 Submission of paper for workshop proceedings:        14th August 2016 

Vendors and Book Exhibitors are invited to offer products in the scope of the Workshop. Exhibitor space is available – please contact local committee for further details. Editors are invited to exhibit books. 

Venue: The workshop will take place in the   (Budapest, Bem rkp. 16‐19, H‐1011, Hungary, artotels.com, 

Tel.: +36‐1‐487 9487). Please check the Workshop website for details on hotel bookings and travel arrangements. 

Hotel rooms for THERMINIC attendees are offered at an approximate rate of 120 EUR/night at  .