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Flexible, Hybrid Electronics by Micro-Transfer-Printing
Christopher A. Bower, X-Celeprint
Micro Assembly Unlocks New Opportunities
for Wafer Fabricated Devices
“Micro-Transfer Printing” (µTP)
The promise of high-performance devices
anywhereWafer Fabricated Devices
Single-crystal
Fine lithography
(ICs, LEDs, Lasers, etc…)
Plastic, Glass, Ceramic, Paper
Other semiconductors
Rapid, Precise Microdevice Assembly via Printing
1. Form undercut microdevices, anchored at endpoints
2. Transfer them to a target substrate by elastomer stamp printing
3. Interconnect to form systems
Rate Dependent Adhesion
slow lift-off fast lift-off
> 10 cm/sec
Nature Materials, 5, 33 (2006)
“The adhesion between the solid objects and the stamp is rate-sensitive owing to the viscoelastic behavior of the elastomer”
“if you place the stamp on the layer of chips and peel it off quickly the chips adhere to the stamp.
Impress the stamp on the target substrate and peel it off slowly, the chips adhere to the target.” Ken Werner [http://www.displaydaily.com/display-daily/28030-the-only-disruptive-technology-at-display-week]
Precise dispersal of devices from dense arrays
Populated Stamp
Non-native “Target” Substrate
1st transfer 2nd transfer
Densely packed micro componentsDispersed micro components
Source Wafer
Printing
Patterned stamp
Precise dispersal of microscale LEDs
Stamp Fabrication
7
Silicon Master Low-Pressure Injection Molding Elastomer Stamp
Stage (x, y)
Print Head (z, θ, Tx, Ty)
Optics (x, y, z)
Automated Micro Transfer Printing
Semprius Factory, Henderson, NCRTP, NC
Semprius, Durham, NC
stamp + motion + optics
1. pick-
up,
2. print,
3. clean.
[repeat]
Tyndall National Institute, IrelandR&D Printer, imec, Ghent, Belgium
Examples of Printed LEDs
µLED Displays
10
100 µm
1 cm
0.2 mm
SID 2016
• 128RGB x 128 PMILED Display
• > 98,000 interconnections
Science 325, 977 (2009).
Plastic Display with Printed Inorganic LEDs
Active Matrix Display with Printed iLEDs and µICs
Two 180nm ASICs (> 400T)
Semi-additive Copper RDLSID 2016
Summary and Acknowledgements
Releasable high-performance microscale devices (LEDs, ICs, etc…)
+
High speed, room temperature, deterministic assembly
+
Interconnection methods compatible with plastic substrates
= a coherent technology approach to high performance plastic electronics
Thanks to the X-Celeprint team.
Thanks to the John Rogers lab at University of Illinois – Urbana-Champaign
Thanks to the technical staff at Semprius, RTI Int’l, and Tyndall Nat. Inst.
Micro Assembly Unlocks New Opportunities
for Wafer Fabricated Devices
“Micro-Transfer Printing” (µTP)
The promise of high-performance devices
anywhereWafer Fabricated Devices
Single-crystal
Fine lithography
(ICs, LEDs, Lasers, etc…)
Plastic, Glass, Ceramic, Paper
Other semiconductors